CN111482327A - Dispensing head structure for dispensing equipment - Google Patents

Dispensing head structure for dispensing equipment Download PDF

Info

Publication number
CN111482327A
CN111482327A CN202010408394.XA CN202010408394A CN111482327A CN 111482327 A CN111482327 A CN 111482327A CN 202010408394 A CN202010408394 A CN 202010408394A CN 111482327 A CN111482327 A CN 111482327A
Authority
CN
China
Prior art keywords
wall
sleeve
annular
groove
supporting seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202010408394.XA
Other languages
Chinese (zh)
Inventor
杨昌礼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cangnan Shumeng Machinery Technology Co ltd
Original Assignee
Cangnan Shumeng Machinery Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cangnan Shumeng Machinery Technology Co ltd filed Critical Cangnan Shumeng Machinery Technology Co ltd
Priority to CN202010408394.XA priority Critical patent/CN111482327A/en
Publication of CN111482327A publication Critical patent/CN111482327A/en
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention discloses a dispensing head structure for dispensing equipment, which comprises a sleeve seat, wherein a dispensing head is formed at the lower end of the sleeve seat, a cross-shaped dispensing groove is formed in the dispensing head, a connecting sleeve is formed at the upper end of the sleeve seat and comprises a lower conical sleeve and an upper conical sleeve, a valve plate and a supporting seat are inserted in the connecting sleeve, a step hole penetrating through the lower end face of the supporting seat is formed in the supporting seat, a partition plate is fixedly inserted in the step hole, an annular table is formed on the outer wall of the supporting seat, an air groove communicating the step holes on the upper side and the lower side of the partition plate is formed in the annular table, a guide pillar is formed in the center of the lower end face of the valve plate, the lower end of the guide pillar penetrates through the supporting seat and is inserted in the step hole, an annular bulge is formed on the side wall of the lower end of the guide pillar, an annular groove is formed on the inner. The invention can reduce the dripping of the redundant epoxy resin after the dispensing is finished.

Description

Dispensing head structure for dispensing equipment
Technical Field
The invention relates to the technical field of chip packaging devices, in particular to a dispensing head structure for dispensing equipment.
Background
The current chip packaging process comprises chip pasting, silver paste curing, lead welding, optical inspection, injection molding, laser typing, high-temperature curing, flash removal, electroplating annealing, rib cutting and forming and the like. In the process of adhering and fixing the chip, the epoxy resin is required to be dripped on the upper surface of the chip, so that the chip and the wafer are fixed, and the subsequent injection molding and packaging are facilitated. The existing epoxy resin dropping is simply called as dispensing, dispensing is carried out by adopting dispensing equipment, epoxy resin in the existing dispensing equipment is generally conveyed by adopting a peristaltic pump, dispensing is completed, the peristaltic pump is closed, but after the peristaltic pump is closed, acting force still exists between the conveyed epoxy resin, and the dispensing head can also drip a small amount of epoxy resin to pollute a production line, so that the dispensing head structure is required to be improved, and dripping of redundant epoxy resin is reduced.
In view of the above-mentioned drawbacks, the present designer is actively making research and innovation to create a dispensing head structure for dispensing equipment with a novel structure, so that the dispensing head structure has more industrial utilization value.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a dispensing head structure for dispensing equipment, which can reduce the dripping of redundant epoxy resin after dispensing is finished.
The invention relates to a dispensing head structure for dispensing equipment, which comprises a cylindrical annular sleeve seat, wherein a glue outlet head with a cross-shaped section is formed at the lower end of the sleeve seat, a cross-shaped glue outlet groove communicated with an inner cavity of the sleeve seat is formed in the glue outlet head, a connecting sleeve is formed at the upper end of the sleeve seat and comprises a lower conical sleeve, an upper conical sleeve and a circular sleeve connected between the lower conical sleeve and the upper conical sleeve, a connecting pipe is formed at the upper end of the upper conical sleeve, a circular truncated cone-shaped valve plate and a cylindrical supporting seat are inserted in the connecting sleeve, the outer wall of the valve plate is abutted against the inner wall of the upper end of the upper conical sleeve, a stepped hole penetrating through the lower end surface of the supporting seat is formed in the supporting seat and comprises an upper large hole and a lower small hole, a partition plate connected with the small hole is inserted and fixed at the lower end of the large hole, and a circular truncated cone is formed on the outer wall of, an air groove communicated with the large hole on the upper side of the partition plate and the small hole on the lower side of the partition plate is formed in the annular table, the air groove is V-shaped, a guide pillar is formed in the center of the lower end face of the valve plate, the lower end of the guide pillar penetrates through the support seat and is inserted into the large hole of the step hole, an annular bulge is formed on the side wall of the lower end of the guide pillar, an annular groove is formed in the inner wall of the large hole, the annular bulge is inserted into the groove, the outer wall of the annular bulge abuts against the inner wall of the groove, a pressure spring is arranged between the annular bulge and the lower side wall of the groove, and two ends of;
An annular supporting plate is formed on the outer wall of a ring table of the supporting seat, the outer wall of the supporting plate is fixed on the inner wall of the lower conical sleeve, a plurality of communicating grooves which are uniformly distributed in an annular shape around the circle center of the supporting plate are formed in the supporting plate, a ring plate is inserted in the supporting plate in a rotating mode, and a through hole corresponding to the communicating grooves is formed in the ring plate.
By means of the technical scheme, when the novel epoxy glue dispenser is used, the peristaltic pump is started, the liquid pressure between epoxy resins can push the valve plate downwards, the epoxy resins pass through the communication groove between the valve plate and the upper conical sleeve and on the supporting plate and the glue outlet groove and come out from the glue outlet head, and the epoxy resins coming out under the action of the glue outlet groove are in a cross shape and can fix a chip; meanwhile, when the valve plate is pushed open, the guide post is driven to move downwards, the guide post drives the annular protrusion to move downwards in the groove and enables the pressure spring to compress and store elastic potential energy, when the peristaltic pump is closed, the annular protrusion, the guide post and the valve plate move upwards and reset under the action of the elastic potential energy released by the pressure spring, negative pressure is formed in a small hole at the lower end of the supporting seat under the action of a large hole, a partition plate and an air groove of the stepped hole, so that epoxy resin at the outlet end of the glue outlet head is sucked back into the glue outlet head through the glue outlet groove, and the dripping of redundant epoxy resin is reduced; in addition, the communication grooves in the supporting plate can also adjust the flow rate of the epoxy resin passing through the annular plate, specifically, the through holes in the annular plate and the communication grooves in the supporting plate are staggered by rotating the annular plate, and the amount of the epoxy resin which can flow through the communication grooves is adjusted according to the staggered degree, so that the flow rate of the epoxy resin is adjusted.
Through the scheme, the dispensing head structure for the dispensing equipment can reduce the dripping of redundant epoxy resin after dispensing is finished, and can also adjust the flow of the epoxy resin during dispensing.
Preferably, the outer walls of the annular platforms on the upper side and the lower side of the supporting plate are conical surfaces, the air grooves are provided with a plurality of channels, and the air grooves are uniformly distributed in an annular mode around the central axis of the supporting seat.
Preferably, an annular groove is formed in the lower end face of the supporting plate, the circle center of the annular groove is overlapped with the circle center of the ring plate, a toggle handle is formed on the lower end face of the ring plate, and the toggle handle penetrates out of the annular groove.
Preferably, the lower end of the support seat is inserted into the sleeve seat and located on the upper side of the glue outlet groove.
Preferably, the outer wall of the valve plate is a conical surface, and the conical angle of the conical surface of the valve plate is equal to the conical angle of the inner wall of the upper end of the upper conical sleeve.
As a preferred choice of above-mentioned scheme, the central axis of cover seat, adapter sleeve, connecting pipe, supporting seat and valve plate all is located same vertical line.
Preferably, the ring platform is formed on the outer wall of the support seat on one side of the partition plate.
Preferably, the ring platform is formed on the outer wall of the middle part of the supporting seat.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
The drawings are only for purposes of illustrating and explaining the present invention and are not to be construed as limiting the scope of the present invention. Wherein:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic cross-sectional view of FIG. 1;
FIG. 3 is a schematic sectional and bottom view of the support plate of the present invention;
Fig. 4 is a schematic structural view of the glue outlet head of the present invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
The following refers to fig. 1 to 4.
The invention relates to a dispensing head structure for dispensing equipment, which comprises a cylindrical annular sleeve seat 1, wherein a glue outlet head 11 with a cross-shaped section is formed at the lower end of the sleeve seat, a cross-shaped glue outlet groove 111 communicated with an inner cavity of the sleeve seat is formed in the glue outlet head, a connecting sleeve 12 is formed at the upper end of the sleeve seat and comprises a lower conical sleeve 121, an upper conical sleeve 122 and a circular ring sleeve 123 connected between the lower conical sleeve and the upper conical sleeve, a connecting pipe 13 is formed at the upper end of the upper conical sleeve, a circular truncated cone-shaped valve plate 2 and a cylindrical supporting seat 3 are inserted in the connecting sleeve, the lower end of the supporting seat is inserted in the sleeve seat and positioned at the upper side of the glue outlet groove 111, the outer wall of the valve plate 2 abuts against the inner wall of the upper end of the upper conical sleeve 122, a stepped hole 31 penetrating through the lower end face of the supporting seat is formed in the supporting seat 3, and comprises a large hole 311 at the upper side and a small hole 312, the lower end of the large hole is fixedly inserted with a partition plate 4 connected with the small hole, the outer wall of the support seat is formed with a ring platform 32, the ring platform is formed on the outer wall of the support seat at one side of the partition plate, the ring platform is formed on the outer wall of the middle part of the support seat, an air groove 321 which is communicated with the large hole 311 at the upper side of the partition plate 4 and the small hole 312 at the lower side of the partition plate is formed in the ring platform, the air groove is V-shaped and is provided with a plurality of air grooves, the air grooves are uniformly distributed in an annular shape around the central axis of the support seat 3, a guide pillar 21 is formed at the center of the lower end surface of the valve plate 2, the lower end of the guide pillar passes through the support seat and is inserted in the large hole 311 of the step hole 31, an annular bulge 211 is formed on the side wall of the lower end of the guide pillar, an annular groove 313 is formed on, two ends of the pressure spring are respectively abutted against the lower side walls of the annular protrusion 211 and the groove 313.
The shaping has annular backup pad 6 on the ring platform 32 outer wall of supporting seat 3, the outer wall of backup pad is fixed under on the inner wall of circular cone cover 121, and the ring platform outer wall of downside all is conical surface in the backup pad, and the shaping has a plurality of intercommunication grooves 61 that are annular evenly distributed around the centre of a circle of backup pad on the backup pad 6, and it has crown plate 7 to peg graft in the backup pad internal rotation, the shaping has on the crown plate with the via hole 71 that the intercommunication groove corresponds, the shaping has annular 62 on the lower terminal surface of backup pad 6, the centre of a circle of annular coincides with the centre of a circle of crown plate 7, and the shaping has toggle handle 72 on the lower terminal surface of crown plate, toggle handle wears out annular 62.
The outer wall of the valve plate 2 is a conical surface, the conical angle of the conical surface of the valve plate is equal to the conical angle of the inner wall of the upper end of the upper conical sleeve 122, and the central axes of the sleeve seat 1, the connecting sleeve 12, the connecting pipe 13, the supporting seat 3 and the valve plate 2 are all located on the same vertical line.
When the valve plate is used, the peristaltic pump is started, the liquid pressure between the epoxy resins can push the valve plate 2 downwards, the epoxy resins pass through the space between the valve plate and the upper conical sleeve 122, the communicating groove 61 on the supporting plate 3 and the glue outlet groove 111 and come out from the glue outlet head 11, and the epoxy resins coming out under the action of the glue outlet groove are in a cross shape and can fix a chip; meanwhile, when the valve plate 2 is pushed open, the guide post 21 is driven to move downwards, the guide post drives the annular protrusion 211 to move downwards in the groove 313 and enables the pressure spring 5 to compress and store elastic potential energy, when the peristaltic pump is closed, the annular protrusion, the guide post and the valve plate move upwards and reset under the action of the elastic potential energy released by the pressure spring, negative pressure is formed in the small hole 312 at the lower end of the supporting seat 3 under the action of the large hole 311 of the stepped hole 31, the partition plate 4 and the air groove 321, so that epoxy resin at the outlet end of the adhesive outlet 11 is sucked back into the adhesive outlet through the adhesive outlet groove 111, and the dripping of redundant epoxy resin is reduced; in addition, the communication groove 61 in the support plate 6 can also adjust the flow rate of the epoxy resin through the ring plate 7, specifically, the ring plate 7 is rotated to shift the through hole 71 in the ring plate from the communication groove 61 in the support plate 6, and the amount of the epoxy resin that can flow through the communication groove 61 is adjusted by the shift degree, so as to adjust the flow rate of the epoxy resin.
In summary, the dispensing head structure for the dispensing equipment of the present invention can reduce the dripping of the excess epoxy resin after dispensing, and can also adjust the flow rate of the epoxy resin during dispensing.
The dispensing head structure for dispensing equipment provided by the present invention is only an embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (8)

1. The utility model provides a first structure is glued to point for some adhesive deposite equipment, includes that the annular cover seat of cylinder (1), the lower extreme shaping of cover seat has play of cross-section and glues head (11) that are "ten" font, go out glue the head in the shaping have with the play gluey groove (111) of "ten" font of cover seat inner chamber intercommunication, its characterized in that: the upper end shaping of cover seat has adapter sleeve (12), the adapter sleeve includes cone sleeve (121) down, goes up cone sleeve (122) and connects ring cover (123) between cone sleeve and the last cone sleeve down, the upper end shaping of going up cone sleeve has connecting pipe (13), and it has round platform form valve plate (2) and columniform supporting seat (3) to peg graft in the adapter sleeve, the outer wall of valve plate supports and leans on the upper end inner wall of last cone sleeve (122), shaping has step hole (31) that runs through supporting seat lower extreme face in the supporting seat, the step hole includes the macropore (311) of upside and aperture (312) of downside, the macropore lower extreme grafting is fixed with baffle (4) that the aperture is connected, shaping has circular platform (32) on the outer wall of supporting seat, shaping has intercommunication the macropore of baffle upside and aperture gas tank (321) of baffle downside in the circular platform, the air groove is V-shaped, a guide pillar (21) is formed in the center of the lower end face of the valve plate (2), the lower end of the guide pillar penetrates through the supporting seat and is inserted into a large hole (311) of the stepped hole (31), an annular protrusion (211) is formed on the side wall of the lower end of the guide pillar, an annular groove (313) is formed in the inner wall of the large hole, the annular protrusion is inserted into the groove, the outer wall of the annular protrusion abuts against the inner wall of the groove, a pressure spring (5) is arranged between the annular protrusion and the lower side wall of the groove, and two ends of the pressure spring abut against the lower side walls of the annular protrusion (211) and the groove;
An annular supporting plate (6) is formed on the outer wall of a ring platform (32) of the supporting seat (3), the outer wall of the supporting plate is fixed on the inner wall of the lower conical sleeve (121), a plurality of communicating grooves (61) which are uniformly distributed in an annular shape around the circle center of the supporting plate are formed in the supporting plate, a ring plate (7) is rotatably inserted in the supporting plate, and a through hole (71) corresponding to the communicating grooves is formed in the ring plate.
2. The dispensing head structure for dispensing equipment according to claim 1, wherein: the utility model discloses a supporting plate, including backup pad (6), gas groove (321), gas groove, supporting seat (3), the annular is evenly distributed around the central axis of supporting seat (32) to the gas groove (321).
3. The dispensing head structure for dispensing equipment according to claim 1, wherein: annular (62) have been moulded on the lower terminal surface of backup pad (6), the centre of a circle of annular and the coincidence of the centre of a circle of crown plate (7), the shaping has toggle handle (72) on the lower terminal surface of crown plate, toggle handle wears out annular (62).
4. The dispensing head structure for dispensing equipment according to claim 1, wherein: the lower end of the supporting seat (3) is inserted into the sleeve seat (1) and is positioned on the upper side of the glue outlet groove (111).
5. The dispensing head structure for dispensing equipment according to claim 1, wherein: the outer wall of the valve plate (2) is a conical surface, and the conical angle of the conical surface of the valve plate is equal to that of the inner wall of the upper end of the upper conical sleeve (122).
6. The dispensing head structure for dispensing equipment according to claim 1, wherein: the central axes of the sleeve seat (1), the connecting sleeve (12), the connecting pipe (13), the supporting seat (3) and the valve plate (2) are all located on the same vertical line.
7. The dispensing head structure for dispensing equipment according to claim 1, wherein: the ring platform (32) is formed on the outer wall of the supporting seat (3) on one side of the partition plate (4).
8. The dispensing head structure for dispensing equipment according to claim 1, wherein: the ring platform (32) is formed on the outer wall of the middle part of the supporting seat (3).
CN202010408394.XA 2020-05-14 2020-05-14 Dispensing head structure for dispensing equipment Withdrawn CN111482327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010408394.XA CN111482327A (en) 2020-05-14 2020-05-14 Dispensing head structure for dispensing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010408394.XA CN111482327A (en) 2020-05-14 2020-05-14 Dispensing head structure for dispensing equipment

Publications (1)

Publication Number Publication Date
CN111482327A true CN111482327A (en) 2020-08-04

Family

ID=71792058

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010408394.XA Withdrawn CN111482327A (en) 2020-05-14 2020-05-14 Dispensing head structure for dispensing equipment

Country Status (1)

Country Link
CN (1) CN111482327A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003029641A2 (en) * 2001-09-26 2003-04-10 Henkel Loctite Deutschland Gmbh Device for valve operation and setting the valve stroke
CN102803123A (en) * 2010-01-14 2012-11-28 诺信公司 Jetting discrete volumes of high viscosity liquid
CN202962777U (en) * 2012-08-30 2013-06-05 无锡华润安盛科技有限公司 Dispensing head and dispensing device employing same
CN205701146U (en) * 2016-06-07 2016-11-23 张斌 A kind of Spin Control valve arrangement
WO2018146620A1 (en) * 2017-02-08 2018-08-16 Highcon Systems Ltd Multi-orifice nozzle and uses thereof
CN110624768A (en) * 2018-06-21 2019-12-31 苏斯微技术光刻有限公司 Dispensing nozzle for coating machine

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003029641A2 (en) * 2001-09-26 2003-04-10 Henkel Loctite Deutschland Gmbh Device for valve operation and setting the valve stroke
CN102803123A (en) * 2010-01-14 2012-11-28 诺信公司 Jetting discrete volumes of high viscosity liquid
CN202962777U (en) * 2012-08-30 2013-06-05 无锡华润安盛科技有限公司 Dispensing head and dispensing device employing same
CN205701146U (en) * 2016-06-07 2016-11-23 张斌 A kind of Spin Control valve arrangement
WO2018146620A1 (en) * 2017-02-08 2018-08-16 Highcon Systems Ltd Multi-orifice nozzle and uses thereof
CN110624768A (en) * 2018-06-21 2019-12-31 苏斯微技术光刻有限公司 Dispensing nozzle for coating machine

Similar Documents

Publication Publication Date Title
CN111482327A (en) Dispensing head structure for dispensing equipment
CN111921794B (en) Glue applying equipment for assembling LED lamp capable of adjusting glue outlet amount according to thickness of lampshade
CN219092583U (en) Shell inner wall adhesive deposite device is used in electromagnetic type buzzer production
CN111266250B (en) Dispensing head on packaging dispensing equipment
CN115923154A (en) Dispensing method
CN209599939U (en) A kind of press machine with the porous easy mold release of fixed structure
CN219129768U (en) Dispensing head for LED die bonder
CN210250123U (en) Pressure rubber punching machine for false tooth
CN208867444U (en) A kind of Glue dripping head jig easy to use
CN112122060A (en) Miniature precise dispensing valve, dispensing device and dispensing method
CN208986029U (en) A kind of battery cover board
CN117773704B (en) Lens module processingequipment
CN202722476U (en) Novel cigarette paper lapping glue gun
CN221085223U (en) Butterfly type ceramic membrane installation fixed knot constructs
CN216300230U (en) Assembly line for emergency lens manufacturing without power state
CN212734008U (en) Stable two-stage pushing structure for machining valve body
CN220420837U (en) Liquid injection device of cylindrical battery
CN208953903U (en) A kind of viscous dress embryo mode structure of diamond
CN215507585U (en) Vacuum glue pressing assembly
CN211247151U (en) Miniature accurate dispensing valve and dispensing device
CN215283452U (en) Film pressing assembly
CN212215468U (en) Positioning device of adhesive reaction kettle
CN114918103B (en) Glue injection device for injecting silica gel into LED lamp cap
CN216880186U (en) Automatic liquid level control glue box
CN215030657U (en) Automatic glue dispensing device for optical lens processing

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20200804

WW01 Invention patent application withdrawn after publication