CN111471425B - Ultraviolet light and moisture dual-curing composition, preparation method and application thereof - Google Patents

Ultraviolet light and moisture dual-curing composition, preparation method and application thereof Download PDF

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CN111471425B
CN111471425B CN202010551276.4A CN202010551276A CN111471425B CN 111471425 B CN111471425 B CN 111471425B CN 202010551276 A CN202010551276 A CN 202010551276A CN 111471425 B CN111471425 B CN 111471425B
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stirring
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acrylate
composition
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CN111471425A (en
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李海兵
关怀
刘秀棉
周为民
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GUANGDONG HENGDA NEW MATERIALS TECHNOLOGY CO LTD
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
    • C08G18/1858—Catalysts containing secondary or tertiary amines or salts thereof having carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/22—Catalysts containing metal compounds
    • C08G18/222—Catalysts containing metal compounds metal compounds not provided for in groups C08G18/225 - C08G18/26
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Abstract

The application discloses an ultraviolet and moisture dual-curing composition, a preparation method and an application thereof, wherein the composition comprises the following components in parts by weight: a is polyether polyurethane oligomer with (methyl) acryloxy and alkoxy silane functional groups, the content is 10-50 wt%; b, (methyl) acrylic ester reactive diluent, the content is 20-40 wt%; c, alkoxy silane-containing end-capped polymer with the content of 20-40 wt%; d, free radical type photoinitiator, the content is 1-5 wt%; e, moisture curing catalyst, the content is 0.01-0.5 wt%; f, auxiliary additive, the content is 0.1-5 wt%; the composition provided by the invention has the characteristics of high bonding strength, good storage stability, safety, environmental protection and the like.

Description

Ultraviolet light and moisture dual-curing composition, preparation method and application thereof
Technical Field
The application relates to the technical field of sealing materials and adhesives, in particular to an ultraviolet light and moisture dual-curing composition, a preparation method and application thereof.
Background
The ultraviolet curing technology is an efficient and environment-friendly material surface treatment technology, and has the characteristics of high curing efficiency, normal-temperature curing, excellent performance and the like. Currently, in many electronic industry areas, uv curable adhesives are commonly used to bond various substrates and components, but the complex and special designs and opaque parts of ceramics, metals, etc. create opaque shadow areas in the device that cannot be effectively or sufficiently illuminated by uv light to the opaque shadow areas in the device, making conventional uv curable adhesives unsatisfactory for practical application production. In addition, the uncured adhesive can flow or spread into the visible area, affecting the aesthetic appearance of the visible area, and even causing corrosion and degradation of the part.
In order to solve this problem, researchers have tried to combine by using multiple curing methods, such as UV-moisture dual curing, UV-thermal dual curing, etc., wherein the moisture curing method is energy-saving, does not damage parts without high temperature, and can be better applied to the electronic field. Because the organic silicon has the performances of inorganic materials and organic materials, has the excellent characteristics of good temperature resistance, low surface tension, electric insulation, no toxicity, no odor and the like, the organic silicon polysiloxane group is introduced to the light-cured oligomer, the siloxane can be crosslinked and cured with moisture, the curing efficiency is greatly improved, the performance of the cured material is improved, the energy is saved, and the pollution is reduced.
Among others, document CN201110435749.5 discloses an ultraviolet and moisture curable adhesive composition, which can be used in display screens, touch screens and optical devices; document CN201811472916.1 discloses a dual curing and adhesive composition of ultraviolet radiation and moisture and its use, wherein the main chain of the polyurethane oligomer is polyolefin and has weak adhesion to different substrates; in addition, the organic metal moisture curing catalyst adopted in the two documents is not only harmful to environmental protection, but also has limitations in some use applications; in addition, the storage performance is an important index for testing the adhesive, and the existing adhesive has serious performance loss in all aspects after being stored for a certain time.
In conclusion, the existing ultraviolet and moisture curing adhesive composition mainly has the problems of low bonding strength, environmental protection and poor storage performance; accordingly, the present application provides a novel adhesive curing composition to solve at least one of the above-described problems.
Disclosure of Invention
The composition has excellent crosslinking density and curing efficiency, and the secondary moisture curing function can overcome the defect that a shadow area cannot be cured by ultraviolet light in the application fields of optical bonding, electronic packaging and the like; in addition, the bonding strength and the storage stability of the adhesive are improved, and the environmental protection problem of the adhesive is considered.
In order to achieve the above object, the present application provides a dual uv and moisture curing composition, a method for preparing the same, and use thereof.
In a first aspect, the present application provides a dual uv and moisture curable composition, which is composed of the following components in parts by mass:
a is polyether polyurethane oligomer with (methyl) acryloxy and alkoxy silane functional groups, the content is 10-50 wt%;
b, (methyl) acrylic ester reactive diluent, the content is 20-40 wt%;
c, alkoxy silane-containing end-capped polymer with the content of 20-40 wt%;
d, free radical type photoinitiator, the content is 1-5 wt%;
e, moisture curing catalyst, the content is 0.01-0.5 wt%;
f, dehydrating agent, coupling agent and other auxiliary agents, the content is 0.1-5 wt%.
Preferably, the component C is a silane-terminated polyether polymer having an alkoxy group.
Preferably, component C comprises an alkoxysilane end group having the formula:
Figure BDA0002542600820000021
Figure BDA0002542600820000031
wherein R is1、R2、R3Is an organic compound containing 1-4 carbon atoms.
Preferably, the component a is a bifunctional polyether urethane oligomer, and the polyether backbone of the bifunctional polyether urethane oligomer can be at least one of propylene glycol, glycerol, trimethylolpropane, ethylenediamine pentaerythritol, xylitol and sorbitol.
Preferably, the component B is at least one of isobornyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, N-dimethylacrylamide, trimethylolpropane triacrylate, 2-phenoxyethyl acrylate, hydroxybutyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, and tetrahydroconstanyl (meth) acrylate.
Preferably, the component D is at least one of alpha-hydroxy ketone derivatives, benzophenone and derivatives thereof, benzil ketal, amino ketone and acyl phosphine peroxide photoinitiators.
Preferably, the component E is at least one of isopropyl titanate, titanate derivatives or chelates thereof and tetramethylguanidine.
Preferably, the coupling agent in the component F is a bifunctional compound having an acrylate functional group and an alkoxy or acyloxy silane end-capping group; the paint also comprises at least one additive of a water removing agent, a stabilizing agent and a thixotropic agent.
In a second aspect, the present application provides a method for preparing the dual-curing composition, which comprises the following specific steps:
(1) pretreating the component B, carrying out reduced pressure distillation or molecular sieve dehydration on the component B, and sealing for later use;
(2) weighing the pretreated component B, the component D and the component F, and then putting the components into a stirring kettle for stirring, wherein the stirring time is 30-50min, and the stirring speed is set to be 20-40 rpm;
(3) weighing the component A and the component C, putting the component A and the component C into a stirring kettle, stirring, vacuumizing, stirring and mixing under a vacuum condition of-100 (-95) KPa for 30-50min, setting the stirring speed at 30-50rpm, and introducing nitrogen to relieve pressure after the stirring is finished;
(4) and weighing the component E, putting the component E into a stirring kettle, vacuumizing, stirring and mixing under the vacuum condition of (-100) - (-95) KPa, stirring for 15-25min at the stirring speed of 30-50rpm, introducing nitrogen after stirring to relieve pressure, filtering and canning the mixture to obtain the ultraviolet and moisture dual-curing composition.
In a third aspect, the present application provides the use of a dual cure composition as described above for encapsulation in the field of electronics or optics; the adhesive can be used for bonding metal, glass and plastic materials.
Compared with the prior art, the beneficial effect of this application lies in:
(1) the application adopts a polyurethane oligomer with a polyether structure with (methyl) acryloxy and alkoxy silane functional groups, wherein the (methyl) acryloxy unsaturated group is polymerized under the irradiation of ultraviolet light, the alkoxy silane functional group is subjected to siloxane polycondensation crosslinking reaction under the existence of moisture, and the photocuring and moisture curing functional groups are derived from the same oligomer, so that the adhesive has excellent crosslinking density and curing efficiency; it should be noted that the polyether segment in oligomer A and the component C with alkoxysilane end-capped polymer have the same segment, which makes the compatibility between the components better, has better crosslinking density, and shows more excellent storage performance, so that the cured composition keeps the stability of the performance in a longer time range;
(2) the oligomer A in the application contains a large number of polar groups, has extremely high bonding strength to metal, plastic and glass, has the bonding strength far higher than that of the existing common double-solid adhesive of the same type, and has better storage performance;
(3) different from the existing adhesive which mostly adopts organic metallic tin moisture catalysts, the application selects proper catalysts through a plurality of tests, wherein the moisture curing catalyst is preferably selected from titanate chelate or tetramethyl guanidine.
Detailed Description
The technical scheme of the application is further described in detail by combining specific examples and comparative examples. The specific materials, amounts, data, and other conditions and details given in the examples and comparative examples are to be construed as illustrative of the present application and the scope of the present application is not limited by the examples. All simple modifications, equivalent changes and modifications made in accordance with the spirit of the present application fall within the scope of the claims of the present application.
All percentages, parts, ratios, etc. herein are by weight unless otherwise indicated.
The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise.
When an amount or other value is expressed as a range, preferred range, or upper limit of a preferred value and a lower limit of a preferred value, it is to be understood that this is to be construed as a specific recitation of any range where any pair of range upper or lower limits are combined, regardless of whether ranges are specifically disclosed.
The application discloses an ultraviolet and moisture dual-curing composition, which comprises the following components in percentage by mass:
a is polyether polyurethane oligomer with (methyl) acryloxy and alkoxy silane functional groups, the content is 10-50 wt%;
b, (methyl) acrylic ester reactive diluent, the content is 20-40 wt%;
c, alkoxy silane-containing end-capped polymer with the content of 20-40 wt%;
d, free radical type photoinitiator, the content is 1-5 wt%;
e, moisture curing catalyst, the content is 0.01-0.5 wt%;
f, dehydrating agent, coupling agent and other auxiliary agents, the content is 0.1-5 wt%.
Specifically, the component A is a polyether polyurethane oligomer with bifunctional groups, and the polyether main chain of the component A can be one of propylene glycol, glycerol, trimethylolpropane, ethylenediamine pentaerythritol, xylitol and sorbitol;
the general structural formula is as follows:
Figure BDA0002542600820000051
wherein R is1、R2、R3Is an organic compound containing 1 to 4 carbon atoms;
specifically, the component B is at least one of isobornyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, N-dimethylacrylamide, trimethylolpropane triacrylate, 2-phenoxyethyl acrylate, hydroxybutyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, and tetrahydroconstanyl (meth) acrylate.
Specifically, the component C is a silane-terminated polyether polymer with alkoxy;
in particular, component C comprises an alkoxysilane end group having the formula:
Figure BDA0002542600820000061
wherein R is1、R2、R3Is an organic compound containing 1-4 carbon atoms.
In particular, component C is an alkoxysilane-terminated polymer having dimethoxy or trimethoxy silane end groups.
Wherein, the component C can be one or more of STP E-10, STP E-15, STP E-30 and STP E-35 of Wacker company; the components listed above and selected from Wacker corporation are all polyether backbone structures; it should be noted that the component C has the same main chain structure as the component a, and all of the main chain structures are polyether main chain structures, so that the components have better compatibility, better crosslinking density and better storage performance.
The following is the chemical structural formula of STP E-10:
Figure BDA0002542600820000062
specifically, the component D is at least one of alpha-hydroxy ketone derivatives, benzophenone and derivatives thereof, benzil ketal, amino ketone and acyl phosphine peroxide photoinitiators.
Specifically, the component E is at least one of isopropyl titanate, titanate derivatives or chelates thereof and tetramethyl guanidine.
Specifically, the coupling agent in the component F is a bifunctional compound with acrylate functional groups and alkoxy or acyloxy silane end groups; it further comprises one or more additives selected from dehydrating agents, stabilizing agents, thixotropic agents and the like.
Specifically, the ultraviolet light and moisture dual-curing composition provided by the application can be used for encapsulation in the fields of optical devices, electronic products and the like; the ultraviolet curing adhesive is particularly suitable for being used in the field where the ultraviolet curing adhesive is difficult to meet the shadow risk area or needs deep curing; the curing composition provided by the application can be used for bonding materials such as metal, glass plastic and the like, and has excellent bonding strength.
When the double-curing composite is used, firstly, the double-curing composite provided by the application is coated on a part to be bonded or sealed, and ultraviolet light is used for irradiating the coated part to be primarily cured; it was then placed in a humid environment for further curing.
Further, the ultraviolet curing conditions may be: the wavelength of the light source is 200-400nm, and the radiation intensity is 100-200mW/cm2The irradiation time is 15-30 seconds;
further, the moisture curing conditions may be: the humidity of the room temperature humid environment is 30-70% RH, and the storage time is 12-72 hours.
Specifically, the preparation method of the ultraviolet light and moisture dual-curing composition provided by the application comprises the following steps:
(1) pretreating the component B, carrying out reduced pressure distillation or molecular sieve dehydration on the component B, and sealing for later use;
(2) weighing the pretreated component B, the component D and the component F, and then putting the components into a stirring kettle for stirring, wherein the stirring time is 30-50min, and the stirring speed is set to be 20-40 rpm;
(3) weighing the component A and the component C, putting the component A and the component C into a stirring kettle, stirring, vacuumizing, stirring and mixing under a vacuum condition of-100 (-95) KPa for 30-50min, setting the stirring speed at 30-50rpm, and introducing nitrogen to relieve pressure after the stirring is finished;
(4) weighing the component E, putting into a stirring kettle, vacuumizing, stirring and mixing under the vacuum condition of (-100) - (-95) KPa for 15-25min at the stirring speed of 30-50rpm, introducing nitrogen after stirring to relieve pressure, and filtering the mixture.
Specifically, the filtered cured composition is filled into a moisture-proof package through a sealed pipeline for airtight moisture-proof preservation.
The following description will be specifically made in terms of one of the component ratios:
specifically, the preparation of the various examples and comparative examples was carried out as follows:
(1) carrying out reduced pressure distillation or molecular sieve dehydration on raw materials of N, N-dimethylacrylamide, isobornyl (meth) acrylate and 2-phenoxyethyl acrylate, and sealing for later use (the water content is less than 300 PPM);
(2) weighing the three pretreated acrylate diluents, vinyl trimethoxy silane, (2,4, 6-trimethylbenzoyl) diphenyl phosphine oxide, phenyl bis (2,4, 6-trimethylbenzoyl) phosphine oxide and N-beta- (aminoethyl) -gamma-aminopropyl trimethoxy silane, then putting into a stirring kettle for stirring, wherein the stirring time is 40min, and the stirring speed is set to be 30 rpm;
(3) weighing the oligomer A and the silane-terminated polymer C (or the polymer G), putting the oligomer A and the silane-terminated polymer C (or the polymer G) into a stirring kettle, stirring, vacuumizing, wherein the vacuum condition is about-100 KPa, stirring and mixing are carried out under the vacuum condition for 40min, and the stirring speed is set to 40 rpm; finally, the uniformly mixed adhesive mixture is decompressed by nitrogen;
(4) weighing the catalyst E, putting the weighed catalyst E into a stirring kettle, vacuumizing the stirring kettle under the vacuum condition of about-100 KPa, stirring and mixing the catalyst E under the vacuum condition for about 20min, and setting the stirring speed to be 40 rpm. After stirring, nitrogen is introduced to relieve pressure, and the mixture is filtered and canned.
Specifically, please refer to table 1, wherein table 1 is the content of components between each example and the comparative example;
TABLE 1
Figure BDA0002542600820000081
Figure BDA0002542600820000091
(Polymer G is a polybutadiene urethane oligomer having acryloxy and alkoxysilane groups)
By configuring multiple sets of dual-curing compositions of examples and comparative examples according to the mixture ratio in table 1, the present application will perform multiple sets of performance tests on the multiple sets of examples and comparative examples as follows:
ultraviolet light curing: curing by ultraviolet light source (1000W electrodeless lamp) with radiation intensity of 120mW/cm and ultraviolet light with wavelength of 200-400nm2. For example, when the radiation intensity is 120mW/cm2The adhesive composition is irradiated for a period of about 20 or 30 seconds. The adhesive compositions were evaluated for cure after this uv radiation.
And (3) room temperature moisture curing: after the sample was bonded, it was placed in a constant temperature and humidity chamber at 23. + -. 2 ℃ and 50. + -. 5% RH in absolute dark. To ensure protection from light, the specimens were covered with a black cloth and the curing was observed at defined times.
And (3) hardness testing: measured with reference to ASTM D2240. The adhesive composition was cured in a flat bottom container to ensure uniform specimen thickness, no bubbles, smooth surface, and full tamping. The sample is placed on a firm plane, the pressure foot is kept parallel to the surface of the sample, the pressure pin of the hardness tester is smoothly pressed into the sample vertically without any vibration or inclination, when the bottom surface of the pressure foot of the hardness tester is just in complete stable contact with the surface of the sample, the hardness value is read within 1 second, each sample is tested for 3 times, and the average value is taken as the hardness value of the sample.
And (3) testing the bonding strength: the adhesive strength between the two base materials is endowed after the composition is fully cured, and the adhesive strength between the stainless steel test piece and the PC base material can be tested on a universal tensile testing machine according to GB/T7124-2008. And pulling the stainless steel and the PC base material which are lapped together along the parallel opposite directions, and dividing the obtained breaking load by the lapped area to obtain the bonding strength. When the sample is prepared, the base materials are ensured to be accurately aligned, and the base materials are pressed to ensure that the thickness of the glue layer is uniform and consistent and no air bubbles exist. During testing, the tensile testing machine keeps constant loading rate, the clamp and the sample do not move relatively, and the sample keeps consistent with the force application direction and the central line of the clamp. The adhesive composition was tested for change in adhesive strength after standing at room temperature for one year.
Dumbbell test: the adhesive composition is prepared into a dumbbell shape by a dumbbell mould and is tested according to the regulation of GB/T528-2009-determination of tensile stress strain performance of vulcanized rubber or thermoplastic rubber; cured with UV light for 20S and left to stand at room temperature (25 deg.C, 50% RH) for 1 day for testing.
And (4) testing the storage stability: the adhesive compositions were tested for viscosity change in a sealed condition, in a 70 ℃ incubator for 7 days, 14 days. Calculating according to an accelerated aging formula to obtain: aging at 70 ℃ for 7 days and 14 days corresponds to a storage time at 23 ℃ of 6 months and 1 year at room temperature.
Specifically, please refer to tables 2 and 3, where table 2 shows the performance test results of each example and comparative example, and table 3 shows the performance test results of the storage stability of each example and comparative example:
TABLE 2
Figure BDA0002542600820000101
Figure BDA0002542600820000111
TABLE 3
Figure BDA0002542600820000112
Referring to tables 2 and 3, example 2 and comparative example 4 are specifically compared, wherein example 1 is polymer C with polyether backbone structure added, and is STP E-10; comparative example 4 is polymer G, a polybutadiene urethane oligomer having both acryloxy and alkoxysilane groups; from the results of the performance tests, it can be seen that example 2, in which the polyether backbone structure is the same as that of oligomer a (i.e., component a), was added, the curing time was shorter in test 2 glass to stainless steel, the adhesive strength was as high as 7.2 in test 4 stainless steel to PC, and the following properties were superior to those of comparative example 4; referring to Table 3, in the storage stability test, the final viscosity increase percentage of example 2 at 70 ℃ for 7 days and 14 days was only 13.22% and 28.60%, contrary to comparative example 4, the viscosity increase percentage of example 2 at 70 ℃ for 7 days had reached 19.65%, and the viscosity increase percentage of example 2 at 14 days had reached 39.36%; therefore, the component A and the component C both adopt the same polyether main chain structure, the compatibility with a system is better, the storage stability is better, and the mechanical properties such as the bonding strength, the tensile strength and the like of the embodiment 2 are better than those of the comparative example 4.
Referring specifically to comparative examples 1-4, examples 1-4 adjusting the ratio of component A to component C, it can be seen from the test results in Table 2 that as the content of component C increases, the room temperature moisture curing time decreases, the hardness decreases, the adhesive strength decreases, and the elongation at break increases, and when the content of oligomer A is 50 parts and the content of polymer C is 30 parts, the adhesive composition before and after curing has good overall properties, such as the light curing time is less than 20S, the room temperature moisture curing time is less than 12h, the adhesive strength between stainless steel and PC is greater than 6MPa, the elongation at break is greater than 100%, and the tensile strength is greater than 4 MPa.
Referring to Table 3, specifically to example 2 and example 5, which are catalyzed by different catalysts, tetramethylguanidine is used in example 2 and tetramethylguanidine is used in example 5
Figure BDA0002542600820000121
Titanate, both of which adopt non-organic metallic tin as a moisture curing catalyst, is more environment-friendly and safer than the prior adhesive; as can be seen from tables 2-3, even if no organotin catalysts are used in the present application, the properties are still superior, for example 2, in test 4, the bond strength of stainless steel to PC is up to 7.2, and example 5, in test 6.7, both exceeding the same type of commercial dual-cure adhesive; referring to tables 2-3, it can be seen from comparison of examples 2 and 5 that example 5, which uses a titanate chelate as a catalyst, is superior in storage stability but remarkably slow in moisture curing speed.
Referring to tables 2-3, specifically to examples 2 and comparative examples 1-3, comparative examples 1-3 adjusted the monomer content of component B, which was found to have good storage stability and high adhesive strength as compared to the test results in example 2.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. It will be readily apparent to those skilled in the art that various modifications can be made to the embodiments, and thus, several simple deductions or substitutions made without departing from the spirit and scope of the present invention should be considered as falling within the protection scope of the present invention.

Claims (8)

1. A dual uv and moisture curing composition characterized by: the composition comprises the following components in parts by mass:
a is polyether polyurethane oligomer with (methyl) acryloxy and alkoxy silane functional groups, the content is 10-50 wt%;
b, (methyl) acrylic ester reactive diluent, the content is 20-40 wt%;
c, alkoxy silane-containing end-capped polymer with the content of 20-40 wt%;
d, free radical type photoinitiator, the content is 1-5 wt%;
e, moisture curing catalyst, the content is 0.01-0.5 wt%;
f is auxiliary additive with the content of 0.1 to 5 weight percent
Wherein the component C is STP E-10 of Wacker company, and the structural formula is as follows:
Figure FDA0003406860940000011
2. the dual cure composition of claim 1, wherein: the component A is a polyether polyurethane oligomer with bifunctional groups, and the polyether main chain of the component A is at least one of propylene glycol, glycerol, trimethylolpropane, xylitol and sorbitol.
3. The dual cure composition of claim 1, wherein: the component B is at least one of isobornyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, N-dimethylacrylamide, trimethylolpropane triacrylate, 2-phenoxyethyl acrylate, hydroxybutyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate and tetrahydrofurfuryl (meth) acrylate.
4. The dual cure composition of claim 1, wherein: the component D is at least one of alpha-hydroxy ketone derivatives, benzophenone and derivatives thereof, benzil ketal, amino ketone and acyl phosphine peroxide photoinitiators.
5. The dual cure composition of claim 1, wherein: the component E is at least one of titanate derivatives or chelates thereof and tetramethyl guanidine.
6. The dual cure composition of claim 1, wherein: the auxiliary agent in the component F comprises a coupling agent, and the coupling agent is a bifunctional compound with acrylate functional groups and alkoxy or acyloxy silane end groups; the paint also comprises at least one additive of a water removing agent, a stabilizing agent and a thixotropic agent.
7. A method for preparing the ultraviolet light and moisture dual-curing composition as set forth in any one of claims 1 to 6, characterized in that: the method comprises the following steps:
(1) pretreating the component B, carrying out reduced pressure distillation or molecular sieve dehydration on the component B, and sealing for later use;
(2) weighing the pretreated component B, the component D and the component F, and then putting the components into a stirring kettle for stirring, wherein the stirring time is 30-50min, and the stirring speed is set to be 20-40 rpm;
(3) weighing the component A and the component C, putting the component A and the component C into a stirring kettle, stirring, vacuumizing, stirring and mixing under a vacuum condition of (-100) - (-95) KPa for 30-50min, setting the stirring speed at 30-50rpm, and introducing nitrogen to relieve pressure after the stirring is finished;
(4) and weighing the component E, putting the component E into a stirring kettle, vacuumizing, stirring and mixing under the vacuum condition of (-100) - (-95) KPa, stirring for 15-25min at the stirring speed of 30-50rpm, introducing nitrogen after stirring to relieve pressure, filtering and canning the mixture to obtain the ultraviolet and moisture dual-curing composition.
8. Use of a dual uv and moisture curing composition according to any of claims 1 to 6, characterized in that: the composition is used for packaging in the field of electronic products or optical devices; the adhesive is used for bonding metal, glass and plastic materials.
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