CN111463654B - Light-emitting device and manufacturing method and application thereof - Google Patents
Light-emitting device and manufacturing method and application thereof Download PDFInfo
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- CN111463654B CN111463654B CN202010319778.4A CN202010319778A CN111463654B CN 111463654 B CN111463654 B CN 111463654B CN 202010319778 A CN202010319778 A CN 202010319778A CN 111463654 B CN111463654 B CN 111463654B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0215—Bonding to the substrate
Abstract
The invention provides a light-emitting device and a manufacturing method and application thereof, wherein the light-emitting device comprises a first conductive substrate; the second conductive substrate is opposite to the first conductive substrate, and a preset distance is reserved between the second conductive substrate and the first conductive substrate to form a light emitting area; the laser is arranged in the light emergent area and electrically connected with the first conductive substrate and the second conductive substrate; a support disposed on the first conductive substrate and the second conductive substrate; an optical element disposed on the support, the light emitted by the laser exiting from the optical element. The light-emitting device provided by the invention can effectively reduce the packaging inductance.
Description
Technical Field
The invention relates to the technical field of laser, in particular to a light-emitting device and a manufacturing method and application thereof.
Background
The Time Of Flight (TOF) method measures the three-dimensional structure or three-dimensional profile Of an object to be measured (or a detection area Of the object to be measured) by measuring a Time interval t between transmission and reception Of a pulse signal from a light source (often referred to as a pulse ranging method) or a phase difference generated by laser light once traveling back and forth to the object to be measured (a phase difference ranging method). The TOF module can obtain grayscale images and distance images simultaneously, and is widely applied to a plurality of fields such as somatosensory control, behavior analysis, monitoring, automatic driving, artificial intelligence, machine vision and automatic 3D modeling.
However, the conventional TOF packaging structure mainly utilizes a vcsel (vertical Cavity Surface Emitting laser) laser, and for the TOF packaging structure of an eel (edge Emitting laser), an additional optical path is required to convert light from a horizontal direction to a vertical direction, so that the material cost and the process cost of the TOF are increased, which limits the wide application of the TOF technology, especially the popularization of the TOF technology in electronic consumer products. Therefore, the response speed of TOF packaging is improved, the signal integrity problem is improved, the TOF packaging cost is reduced under the condition that heat dissipation is influenced as little as possible, the packaging period is shortened, and the TOF packaging method is suitable for batch production and is a defect needing to be solved in the prior art.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention provides a light emitting device, which has a simple structure, and can improve the response speed and detection quality of the light emitting device.
To achieve the above and other objects, the present invention provides a light emitting device, including,
a first conductive substrate;
the second conductive substrate is opposite to the first conductive substrate, and a preset distance is reserved between the second conductive substrate and the first conductive substrate to form a light emitting area;
the laser is arranged in the light emergent area and electrically connected with the first conductive substrate and the second conductive substrate;
and an optical element disposed on the first conductive substrate and the second conductive substrate, the optical element emitting light from the laser.
Further, the first conductive substrate includes a first portion and a second portion, the first portion is connected to the second portion, the second conductive substrate includes a third portion and a fourth portion, and the third portion is connected to the fourth portion.
Further, the first portion and the third portion are oppositely arranged in parallel, and the first portion and the third portion are provided with a connecting material on a preset area.
Further, the display device further comprises a support member, wherein the support member is arranged on the first conductive substrate and the second conductive substrate.
Further, the support is disposed on the second portion and the fourth portion.
Further, a step part is formed on the top of the supporting part.
Further, the optical element is disposed on the stepped portion.
Further, the laser is an edge-emitting laser.
Further, when the first conductive substrate is a positive electrode, the second conductive substrate is a negative electrode, and when the first conductive substrate is a negative electrode, the second conductive substrate is a positive electrode.
Further, the first conductive substrate and the second conductive substrate are electrically connected to the PCB substrate.
Furthermore, the invention also provides a manufacturing method of the light-emitting device, which comprises the following steps,
providing a first conductive substrate and a second conductive substrate, wherein the second conductive substrate is arranged opposite to the first conductive substrate, and a preset distance is reserved between the second conductive substrate and the first conductive substrate to form a light emergent area;
arranging a laser in the light emergent area, wherein the laser is electrically connected with the first conductive substrate and the second conductive substrate;
an optical element is disposed on the first and second conductive substrates, and light emitted from the laser exits the optical element.
Furthermore, the invention also provides an electronic device comprising,
a light emitting module for emitting signal light;
the light receiving module is used for receiving the reflected signal light;
wherein the light emitting module comprises a light emitting diode,
a first conductive substrate;
the second conductive substrate is opposite to the first conductive substrate, and a preset distance is reserved between the second conductive substrate and the first conductive substrate to form a light emitting area;
the laser is arranged in the light emergent area and electrically connected with the first conductive substrate and the second conductive substrate;
and an optical element disposed on the first conductive substrate and the second conductive substrate, the optical element emitting light from the laser.
In summary, the present invention provides a light emitting device and a method for manufacturing the same and an application thereof, wherein a laser is disposed between a first conductive substrate and a second conductive substrate which are oppositely disposed, and the laser is directly electrically connected to a PCB substrate through the first conductive substrate and the second conductive substrate, thereby omitting a ceramic substrate. The light-emitting device does not need to wire the laser, so that the inductive effect caused by gold wires can be effectively avoided, the response speed can be improved, and the detection quality can be improved. Meanwhile, the use of additional optical elements is avoided, the assembly process is reduced, and the manufacturing cost is reduced.
Drawings
FIG. 1: the manufacturing method of the light emitting device in this embodiment is a flowchart.
FIG. 2: the structure of step S1.
FIG. 3: the first conductive substrate is schematically shown in the structure.
FIG. 4: the position of the preset area is schematically shown.
FIG. 5: the structure of step S2.
FIG. 6: the structure of step S3.
FIG. 7: a side view of the support.
FIG. 8: a top view of the support.
FIG. 9: the structure of step S4.
FIG. 10: fig. 9 is a top view.
FIG. 11: another structure of the light emitting device.
FIG. 12: another structure of the light emitting device.
FIG. 13: another structure of the light emitting device.
FIG. 14: application of the light-emitting device is shown.
FIG. 15: a block diagram of an electronic device.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
As shown in fig. 1, the present embodiment provides a method for manufacturing a light emitting device, including,
s1: providing a first conductive substrate, and arranging one side of a laser on the first conductive substrate;
s2: disposing the other side of the laser on a second conductive substrate;
s3: disposing a support member on the first and second conductive substrates;
s4: an optical element is disposed on the support, from which the light emitted by the laser emerges.
As shown in fig. 2, in step S1, a first conductive substrate 111 is first provided, and the first conductive substrate 111 includes a first portion 111a and a second portion 111 b. The first portion 111a connects the second portion 111b, for example, the first portion 111a is perpendicular to the second portion 111b, the first portion 111a is perpendicular to one end of the second portion 111b, the first portion 111a extends along the Y direction, and the second portion 111b extends along the X direction. In this embodiment, the first conductive substrate 111 has an L-shape, for example, and the first conductive substrate 111 may be made of copper-tungsten alloy, aluminum-silicon alloy, or beryllium oxide ceramic.
As shown in fig. 3, in the present embodiment, a predetermined region 111c is disposed on the first conductive substrate 111, the laser may be disposed on the predetermined region 111c, the predetermined region 111c may be disposed on the first portion 111a, and a connection material, such as gold-tin solder, is disposed on the predetermined region 111c, and the laser may be electrically connected to the first conductive substrate 111 through the gold-tin solder. In this embodiment, the predetermined area 111c may be located at one end of the first portion 111a, that is, at one end of the first portion 111a far from the second portion 111 b.
As shown in fig. 3 to 4, in step S1, the laser 120 can be electrically connected to the first conductive substrate 111 because the first conductive substrate 111 is disposed on the predetermined region 111c and the predetermined region 111c has the au-sn solder therein. The laser 120 is, for example, an edge emitting laser. The edge-emitting laser chip is made of a GaAs/AlGaAs multiple quantum well material or an InP based material, and has an emission wavelength of 850nm, 940nm, 1310nm, 1350nm, or 1550nm, for example.
As shown in fig. 5, in step S2, after one side of the laser 120 is electrically connected to the first conductive substrate 111, the other side of the laser 120 may be electrically connected to the second conductive substrate 112. In the present embodiment, the first conductive substrate 111 and the second conductive substrate 112 have a symmetrical structure, that is, the second conductive substrate 112 includes a third portion 112a and a fourth portion 112b, the first portion 111a and the third portion 112a have the same structure, and the second portion 111b and the fourth portion 112b have the same structure. The second conductive substrate 112 may be copper-tungsten alloy, aluminum-silicon alloy, beryllium oxide ceramic. A predetermined area is also provided on the third portion 112a so that the laser 120 can be electrically connected to the second conductive substrate 112, in this embodiment, the laser 120 is flush with the first portion 111a and the third portion 112 a. In this embodiment, the distance between the first conductive substrate 111 and the second conductive substrate 112 may be equal to the thickness of the laser 120, and the region between the first conductive substrate 111 and the second conductive substrate 112 may also be defined as a light emitting region through which light emitted by the laser 120 is emitted. In this embodiment, the first conductive substrate 111 may be a positive electrode and the second conductive substrate 112 may be a negative electrode, or the first conductive substrate 111 may be a negative electrode and the second conductive substrate 112 may be a positive electrode. The first conductive substrate 111 and the second conductive substrate 112 may be directly electrically connected on the PCB substrate. In some embodiments, a laser array, which may include at least three lasers 120, for example, may also be electrically connected between the first and second conductive substrates 111 and 112.
As shown in fig. 6 to 8, in step S3, after the laser 120 is electrically connected to the first conductive substrate 111 and the second conductive substrate 112, the support member 130 is then disposed on the first conductive substrate 111 and the second conductive substrate 112. The supporting member 130 may be disposed on the second portion 111b of the first conductive substrate 111 and the fourth portion 112b of the second conductive substrate 112, for example, and the supporting member 130 is attached to the first portion 111a of the first conductive substrate 111 and the third portion 112a of the second conductive substrate 112. The height of the supporting member 130 may be greater than the height of the first portion 111a, i.e., the supporting member 130 protrudes from the first conductive substrate 111 and the second conductive substrate 112. As can be seen in fig. 7-8, the support member 130 is a unitary structure, i.e., the support members 130 are joined together by a top portion to form a receiving area 132, the receiving area 132 being used to receive optical elements. In this embodiment, the top of the supporting member 130 further includes a step portion 131, and the optical element may be disposed on the step portion 131. In this embodiment, the supporting member 130 may be made of plastic or alumina ceramic, for example. The supporting member 130 may be bonded to the first conductive substrate 111 and the second conductive substrate 112, for example, by glue.
As shown in fig. 9 to 10, at step S4, fig. 9 is a schematic structural view of the light emitting device, and fig. 10 is a top view of fig. 9, when the support member 130 is fixed on the first conductive substrate 111 and the second conductive substrate 112, the optical element 140 is then disposed on the support member 130. In the present embodiment, the optical element 140 is fixed on the step portion 131 of the supporting member 130, for example, the optical element is fixed on the step portion 131 of the supporting member 130 by glue, and the height of the optical element 140 is equal to the height of the step portion 131, that is, the optical element 140 is flush with the height of the supporting member 130, that is, the optical element 140 does not protrude from the supporting member 130, so that the height of the light emitting device can be reduced, and the volume of the light emitting device can be reduced. In this embodiment, the optical element 140 may be, for example, a spot homogenizing glass through which light is emitted when the laser 120 emits the light.
As shown in fig. 9 to 10, the light emitting device includes a first conductive substrate 111 and a second conductive substrate 112, the first conductive substrate 111 and the second conductive substrate 112 have the same structure, the first conductive substrate 111 and the second conductive substrate 112 are oppositely disposed, that is, a first portion 111a of the first conductive substrate 111 is disposed in parallel with a third portion 112a of the second conductive substrate 112, and a second portion 111b of the first conductive substrate 111 is disposed in opposite with a fourth portion 112b of the second conductive substrate 112. The first conductive substrate 111 is, for example, a positive electrode, and the second conductive substrate 112 is, for example, a negative electrode, or the first conductive substrate 111 is, for example, a negative electrode, and the second conductive substrate 112 is, for example, a positive electrode. The first conductive substrate 111 and the second conductive substrate 112 may also have different structures.
As shown in fig. 9 to 10, since there is a space between the first conductive substrate 111 and the second conductive substrate 112, a light exit region (a blank region in fig. 10) is formed. A laser 120 is disposed between the first conductive substrate 111 and the second conductive substrate 112, that is, the laser 120 is disposed in the light exiting region, that is, the laser 120 is electrically connected to the first conductive substrate 111 and the second conductive substrate 112. A support 130 is further disposed on the first conductive substrate 111 and the second conductive substrate 112, the support 130 is used for placing an optical element 140, and the light emitted from the laser 120 can exit through the optical element 140.
As shown in fig. 11, the present embodiment also proposes another light emitting device including a first conductive substrate 111 and a second conductive substrate 112. The first conductive substrate 111 and the second conductive substrate 112 are disposed opposite to each other, a laser 120 is further connected between the first conductive substrate 111 and the second conductive substrate 112, the laser 120 is flush with the tops of the first conductive substrate 111 and the second conductive substrate 112, and the laser 120 is electrically connected to the first conductive substrate 111 and the second conductive substrate 112. A support 130 is disposed on top of the first conductive substrate 111 and the second conductive substrate 112, an optical element 140 is disposed on the support 130, the support 130 is fixed on the first conductive substrate 111 and the second conductive substrate 112 by glue, for example, and the optical element 140 is fixed on the support 130 by glue, for example. The laser 120 is, for example, an edge emitting laser, and light emitted from the laser 120 exits through the optical element 140. In the present embodiment, the first conductive substrate 111 and the second conductive substrate 112 have the same shape, and in some embodiments, the first conductive substrate 111 and the second conductive substrate 112 may have different shapes. The first conductive substrate 111 may be a positive electrode, and the second conductive substrate 112 may be a negative electrode, although the first conductive substrate 111 may be a negative electrode and the second conductive substrate 112 may be a positive electrode.
As shown in fig. 12, the present embodiment further provides another light emitting device, the light emitting device includes a first conductive substrate 111 and a second conductive substrate 112, a laser 120 is disposed between the first conductive substrate 111 and the second conductive substrate 112, and the laser 120 is electrically connected to the first conductive substrate 111 and the second conductive substrate 112. The laser 120 may, for example, be arranged on the middle region of the first conductive substrate 111 and the second conductive substrate 112, i.e. the laser 120 is also spaced apart from the top of the first conductive substrate 111 or the second conductive substrate 112, for example, by 2 to 5 μm. An optical element 140 is further disposed on the first conductive substrate 111 and the second conductive substrate 112, the optical element 140 is fixed on the first conductive substrate 111 and the second conductive substrate 112 by glue, for example, and the light emitted from the laser 120 exits through the optical element 140. The laser 120 is, for example, an edge emitting laser. Since the light emitting device does not require a support, the volume of the light emitting device can be reduced.
As shown in fig. 13, the present embodiment also proposes another light emitting device, which includes a first conductive substrate 111 and a second conductive substrate 112. The first conductive substrate 111 and the second conductive substrate 112 have the same structure and are disposed opposite to each other. The first and second conductive substrates 111 and 112 include a stepped portion on the top of the first and second conductive substrates 111 and 112, and the optical element 140 is disposed on the stepped portion, whereby the optical element 140 can be leveled with the height of the first and second conductive substrates 111 and 112. A laser 120 is also electrically connected between the first conductive substrate 111 and the second conductive substrate 112, and the laser 120 may be an edge emitting laser. The light emitted by the laser 120 exits through the optical element 140. The first conductive substrate 111 may be a positive electrode, and the second conductive substrate 112 may be a negative electrode, although the first conductive substrate 111 may be a negative electrode and the second conductive substrate 112 may be a positive electrode.
As shown in fig. 14, when the light emitting device is disposed on the PCB substrate 150, since the PCB substrate 150 is disposed with the first electrode 113 and the second electrode 114, the first electrode 113 is connected to the first conductive substrate 111, and the second electrode 114 is connected to the second conductive substrate 112, so that the laser 120 can be directly electrically connected to the PCB substrate 150 without the step of bonding gold wires to connect the laser 120 to the PCB substrate 150. Because the first conductive substrate 111 and the second conductive substrate 112 can be directly electrically connected to the PCB substrate 150, that is, they are not connected to the PCB substrate 150 through a ceramic substrate, thereby avoiding the punching operation, and because the first conductive substrate 111 and the second conductive substrate 112 are metal substrates, the heat dissipation effect can be improved.
As shown in fig. 15, the present embodiment also proposes an electronic device 20, where the electronic device 20 includes a light emitting module 21 and a light receiving module 22. The light emitting module 21 is provided therein with a light emitting device 211, and signal light can be emitted through the light emitting device 211. The structure of the light emitting device 211 is shown in fig. 9-10, and the structure of the light emitting device 211 is not described herein.
As shown in fig. 15, in the present embodiment, a power supply unit is further disposed in the light emitting module 21, and the power supply unit provides power support for the light emitting device 211, so that the light emitting module 21 can emit signal light to the target object. In this embodiment, the light receiving module 22 is configured to receive the signal light reflected by the target object and generate depth information of the target object.
As shown in fig. 15, in the embodiment, the electronic device 20 is, for example, a tof (time Of flight) camera module, and the tof camera module can be used for a portable electronic device, such as a smart phone, a tablet computer, a portable computer, or other portable electronic devices.
As shown in fig. 15, in the present embodiment, the electronic device 20 is, for example, a tof (time Of flight) camera module, which can be assembled to an electronic device to change an interaction manner between the electronic device and a person, such as functions Of gesture control, iris unlocking, and the like.
As shown in fig. 15, in this embodiment, the electronic device 20 is, for example, a tof (time Of flight) camera module, and the tof (time Of flight) camera module is applied to a video image capturing apparatus, such as a video camera, a camera, and the like, so that in the video image processing in the later stage, the special effect item can be inserted into any position in the video image through simple post-processing, and in this way, on one hand, the fidelity Of the special effect can be enhanced, on the other hand, the shooting is not limited by the shooting location, and the manufacturing cost is greatly reduced.
As shown in fig. 15, in this embodiment, the electronic device 20 is, for example, a tof (time Of flight) camera module, and the tof camera module may be configured in a home device, such as an air conditioner, a refrigerator, a television, and the like, so as to change an interaction mode between a user and the home device, for example, to implement functions such as gesture control Of the home device.
As shown in fig. 15, in the present embodiment, the electronic device 20 is, for example, a tof (time Of flight) camera module, which can be assembled in a robot device to provide three-dimensional vision capability for the robot device, so that the robot device can achieve functions Of spatial positioning, path planning, obstacle avoidance, gesture control, and the like, so as to enable the robot device to better serve human beings, wherein the robot includes an entertainment robot, a medical robot, a home robot, a field robot, and the like.
As shown in fig. 15, in the embodiment, the electronic device 20 is, for example, a tof (time Of flight) camera module, and the tof camera module can be assembled in a security monitoring device, for example, a monitoring device, so as to improve the analysis accuracy Of the security monitoring device and increase intelligent applications such as behavior analysis.
As shown in fig. 15, in this embodiment, the electronic device 20 is, for example, a TOF (time Of flight) camera module, and the TOF camera module may be assembled in a terminal device Of the internet Of things, so as to collect depth information Of other terminal devices through the TOF camera module, so as to enhance the accuracy and the comprehensiveness Of communication between different terminals in the network Of the internet Of things.
As shown in fig. 15, in the present embodiment, the electronic device 20 is, for example, a TOF (time Of flight) camera module, which can be applied to an unmanned device, such as an unmanned vehicle, an unmanned plane, an unmanned ship, etc., and provides a three-dimensional visual base for the unmanned device through the TOF camera module to provide a technical guarantee for unmanned driving.
As shown in fig. 15, in the present embodiment, the electronic device 20 is, for example, a tof (time Of flight) camera module, and the tof camera module can be assembled in a medical device, such as an endoscope, an enteroscope, etc., so that the medical device can perform three-dimensional observation on a human organ to obtain more comprehensive information Of the human organ.
In summary, the present invention provides a light emitting device and a method for manufacturing the same and an application thereof, wherein a laser is disposed between a first conductive substrate and a second conductive substrate which are oppositely disposed, and the laser can be directly electrically connected to a PCB substrate through the first conductive substrate and the second conductive substrate, so that a wire bonding operation for the laser is not required, an inductance effect caused by gold wires can be effectively avoided, and thus, a response speed and a detection quality can be improved.
The above description is only a preferred embodiment of the present application and a description of the applied technical principle, and it should be understood by those skilled in the art that the scope of the present invention related to the present application is not limited to the technical solution of the specific combination of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept, for example, the technical solutions formed by mutually replacing the above features with (but not limited to) technical features having similar functions disclosed in the present application.
Other technical features than those described in the specification are known to those skilled in the art, and are not described herein in detail in order to highlight the innovative features of the present invention.
Claims (5)
1. A light-emitting device, comprising,
a first conductive substrate;
the second conductive substrate is opposite to the first conductive substrate, and a preset distance is reserved between the second conductive substrate and the first conductive substrate to form a light emitting area;
the laser is arranged in the light emergent area and electrically connected with the first conductive substrate and the second conductive substrate;
an optical element disposed on the first conductive substrate and the second conductive substrate, the optical element emitting light from the laser;
step parts are arranged on the tops of the first conductive substrate and the second conductive substrate, the optical element is arranged on the step parts, and the optical element is flush with the first conductive substrate and the second conductive substrate in height;
wherein the laser has a predetermined distance from the top of the first conductive substrate.
2. The light-emitting device according to claim 1, wherein the second conductive substrate is a negative electrode when the first conductive substrate is a positive electrode, and wherein the second conductive substrate is a positive electrode when the first conductive substrate is a negative electrode.
3. The light-emitting device according to claim 1, wherein the first conductive substrate and the second conductive substrate are electrically connected to a PCB substrate.
4. A method of manufacturing a light emitting device, comprising,
providing a first conductive substrate and a second conductive substrate, wherein the first conductive substrate and the second conductive substrate are arranged oppositely, and a preset distance is reserved between the second conductive substrate and the first conductive substrate to form a light emergent area;
arranging a laser in the light emergent area, wherein the laser is electrically connected with the first conductive substrate and the second conductive substrate;
disposing an optical element on the first and second conductive substrates, the light emitted by the laser exiting the optical element; step parts are arranged on the tops of the first conductive substrate and the second conductive substrate, the optical element is arranged on the step parts, and the optical element is flush with the first conductive substrate and the second conductive substrate in height; the laser has a predetermined distance from the top of the first conductive substrate.
5. An electronic device, comprising,
a light emitting module for emitting signal light;
the light receiving module is used for receiving the reflected signal light;
wherein the light emitting module comprises a light emitting diode,
a first conductive substrate;
the second conductive substrate is opposite to the first conductive substrate, and a preset distance is reserved between the second conductive substrate and the first conductive substrate to form a light emitting area;
the laser is arranged in the light emergent area and electrically connected with the first conductive substrate and the second conductive substrate;
an optical element disposed on the first conductive substrate and the second conductive substrate, the optical element emitting light from the laser;
step parts are arranged on the tops of the first conductive substrate and the second conductive substrate, the optical element is arranged on the step parts, and the optical element is flush with the first conductive substrate and the second conductive substrate in height;
wherein the laser has a predetermined distance from the top of the first conductive substrate.
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