CN111463333A - Anti-cold-solder-joint surface-mounted light-emitting diode - Google Patents
Anti-cold-solder-joint surface-mounted light-emitting diode Download PDFInfo
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- CN111463333A CN111463333A CN202010269797.0A CN202010269797A CN111463333A CN 111463333 A CN111463333 A CN 111463333A CN 202010269797 A CN202010269797 A CN 202010269797A CN 111463333 A CN111463333 A CN 111463333A
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- electrode
- emitting diode
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- connecting rod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The invention provides a false welding prevention patch light-emitting diode, which comprises a heat dissipation groove hole, a light reflection ring groove, a sealing cover and a warning protective cover structure, wherein the heat dissipation groove hole and the warning protective cover structure are integrated, the warning connecting rod structure is arranged, when the false welding exists, a connecting disc is driven to move upwards under the action of an elastic device, so that an electrode connecting rod structure is driven to move upwards, when a warning block connected to the electrode connecting rod structure moves upwards on the slide groove hole, the phenomenon that the electrode connecting rod structure and a patch light-emitting diode pin have the false welding phenomenon is explained, so that the warning effect on whether the false welding exists between the electrode connecting rod structure and the patch light-emitting diode pin or not can be realized, the contact area between silver glue and the pin is increased to fixedly weld a connecting frame on the pin by arranging the electrode connecting rod structure, the fixing between the pin and the connecting frame is ensured to be firmer.
Description
Technical Field
The invention relates to the technical field of L ED, in particular to a cold-solder-proof patch light-emitting diode.
Background
The patch light emitting diode is also called a patch L ED, is a common light emitting device, emits light by energy released by electron and hole recombination, is widely applied in the field of illumination, has the characteristics of energy conservation and environmental protection, is more popular with people, is welded on a circuit board in parallel in a welding mode in the past and is controlled by the circuit board, but the prior art has the following defects:
when carrying out the welding with paster emitting diode, because its pin is short excessively to with its welding on the circuit board, produce the phenomenon of rosin joint easily, the welding short time inner lead will break away from the solder joint, and when it breaks away from the solder joint, can not play the effect of warning again, and the pin breaks away from the solder joint, produced clearance is less, can't come out through the direct observation of naked eye, cause the circuit to the circuit on the circuit board that needs relapse to survey and detect, find out the bright reason of paster emitting diode, work load is great.
Summary of the invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a cold-welding-prevention surface-mounted light-emitting diode, which solves the problems that when the surface-mounted light-emitting diode is welded, because the pin is too short, the cold welding phenomenon is easy to generate when the surface-mounted light-emitting diode is welded on a circuit board, the pin can be separated from the welding point within short welding time, and when the pin is separated from the welding point, the warning effect cannot be realized, and the pin is separated from the welding point, the generated gap is small, so that the pin cannot be directly observed by naked eyes, the circuit on the circuit board needs to be repeatedly detected, the reason that the surface-mounted light-emitting diode is not bright is found, and the workload is large.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a prevent rosin joint paster emitting diode, its structure includes heat dissipation slotted hole, reflection of light annular, closing cap, warning protection casing structure, heat dissipation slotted hole and warning protection casing structure be the integral structure, reflection of light annular and closing cap be the integral structure, the structural inner wall threaded connection of closing cap outer loop and warning protection casing, warning protection casing structure includes protecting crust, backup pad, warning connective bar structure, paster emitting diode, the backup pad is installed to the protecting crust inner wall, paster emitting diode lower extreme is inlayed and is installed in the backup pad top, warning connective bar structure welds with paster emitting diode mutually, the warning connective bar structure runs through in the protecting crust below.
Preferably, the warning connective bar structure includes welds the ring, leads and connects structure, spliced pole structure, lead and connect structure and pass through to weld ring and spliced pole structure fixed connection, it is the ring structure to weld the ring.
As preferred, lead and connect the structure and include spring exerciser structure, electrode connective bar structure, warning piece, electrode connective bar structure embedding is installed in spring exerciser structural, the warning piece is equipped with two altogether, and welds in leading and connect the structure both sides, it is the arc structure to lead to connect the structure, and the surface is smeared and is had bright warning coating.
Preferably, the spring exerciser structure comprises a connecting disc, a protection ring, a lower support and a spring exerciser, wherein the lower end of the connecting disc is fixedly connected with the upper end of the lower support through the spring exerciser, the spring exerciser is wrapped by the protection ring, and the protection ring is made of rubber.
Preferably, the spliced pole structure includes protection pillar, interior slotted hole, electrode ring, sliding groove hole, electrode holder, the electrode holder is installed on the protection pillar, protection pillar and interior slotted hole structure as an organic whole, sliding groove hole is equipped with two altogether, and locates on the protection pillar respectively, the electrode ring outer loop is connected with electrode holder inner ring electric welding, the electrode ring is the ring structure, and the inner wall is the smooth surface state.
Preferably, the lower end of the electrode frame is provided with a welding block, and the welding block is in a circular ring structure.
Preferably, the electrode connecting rod structure includes electrode post, electrode connecting rod, welding frame structure, the electrode connecting rod is inlayed and is installed in the electrode post right side, electrode connecting rod right side welding frame structure left side electric welding is connected, the electrode post is the cylinder structure, and the right side is equipped with the guide hole.
Preferably, the welding frame structure comprises a guide ring block, a connecting frame and a guide groove, the guide ring block and the guide groove are of an integrated structure, the guide ring block is embedded and installed on the inner side of the connecting frame, the cross section of the guide ring block is in a trapezoidal state with the upper end and the lower end being of the same size and being of a symmetrical structure, and the middle part of the guide ring block is a cuboid in cross section.
(III) advantageous effects
The invention provides a cold-solder-proof surface-mounted light-emitting diode. The method has the following beneficial effects:
1. according to the invention, by arranging the warning connecting rod structure, when the cold joint exists, the connecting disc is driven to move upwards under the action of the elastic device, so that the electrode connecting rod structure is driven to move upwards, and when the warning block connected to the electrode connecting rod structure moves upwards on the sliding groove hole, the phenomenon of the cold joint existing between the electrode connecting rod structure and the pin of the surface mount light-emitting diode is indicated, so that the warning effect of warning whether the cold joint exists between the electrode connecting rod structure and the pin of the surface mount light-emitting diode can be realized.
2. According to the invention, the electrode connecting rod structure is arranged, the silver colloid is spot-welded on the flow guide ring block, the silver colloid is in a liquid structure in a heating state, and flows to the lower part of the flow guide groove along the flow guide ring block and is contacted with the pins, the flow guide groove is filled under slow spot welding, the upper end surface of the cooled silver colloid block is flush with the upper end surface of the connecting frame, the connecting frame is fixedly welded on the pins by increasing the contact area between the silver colloid and the pins, and the fixation between the pins and the connecting frame is ensured to be firmer.
Drawings
FIG. 1 is a schematic structural view of a cold-solder-resistant SMD LED according to the present invention;
FIG. 2 is a schematic structural view of a front view of the warning shield structure of the present invention;
FIG. 3 is a schematic structural view of a warning connecting rod according to the present invention;
FIG. 4 is a side view of the conductive connection structure of the present invention;
FIG. 5 is a side view of the spring device of the present invention;
FIG. 6 is a schematic front view of a connecting column structure according to the present invention;
FIG. 7 is a schematic top view of an electrode connecting rod according to the present invention;
FIG. 8 is a schematic top view of the welding frame structure of the present invention.
In the figure: a heat dissipation slot-1, a light reflecting ring groove-2, a sealing cover-3, a warning protective cover structure-4, a protective shell-41, a support plate-42, a warning connecting rod structure-43, a patch light emitting diode-44, a welding ring-431, a guide connecting structure-432, a connecting column structure-433, an elastic device structure-C1, an electrode connecting rod structure-C2, a warning block-C3 and a connecting disc-C11, the device comprises a protective ring-C12, a lower support-C13, an elastic device-C14, a protective support-T1, an inner slot-T2, an electrode ring-T3, a sliding slot-T4, an electrode frame-T5, an electrode column-C21, an electrode connecting rod-C22, a welding frame structure-C23, a guide ring block-CC 1, a connecting frame-CC 2 and a guide groove-CC 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in figures 1 to 8:
example 1
The embodiment of the invention provides a false soldering prevention patch light-emitting diode which structurally comprises a heat dissipation groove hole 1, a light reflection ring groove 2, a sealing cover 3 and a warning protective cover structure 4, wherein the heat dissipation groove hole 1 and the warning protective cover structure 4 are of an integrated structure, the light reflection ring groove 2 and the sealing cover 3 are of an integrated structure, the outer ring of the sealing cover 3 is in threaded connection with the upper inner wall of the warning protective cover structure 4, the warning protective cover structure 4 comprises a protective shell 41, a supporting plate 42, a warning connecting rod structure 43 and a patch light-emitting diode 44, the supporting plate 42 is installed on the inner wall of the protective shell 41, the lower end of the patch light-emitting diode 44 is embedded and installed above the supporting plate 42, the warning connecting rod structure 43 is welded with the patch light-emitting diode 44, and the warning connecting rod structure 43 penetrates through.
The warning connecting rod structure 43 comprises a welding ring 431, a guide connecting structure 432 and a connecting column structure 433, the guide connecting structure 432 is fixedly connected with the connecting column structure 433 through the welding ring 431, and the welding ring 431 is of a circular ring structure.
The guide-connection structure 432 comprises an elastic device structure C1, an electrode connecting rod structure C2 and warning blocks C3, wherein the electrode connecting rod structure C2 is embedded in the elastic device structure C1, the warning blocks C3 are provided with two blocks in total and welded on two sides of the guide-connection structure 432, the guide-connection structure 432 is of an arc-shaped plate structure, and the outer surface of the guide-connection structure is coated with a clear warning coating for detecting whether the electrode connecting rod structure C2 moves upwards or not.
The elastic device structure C1 comprises a connecting disc C11, a protection ring C12, a lower support C13 and an elastic device C14, the lower end of the connecting disc C11 is fixedly connected with the upper end of the lower support C13 through the elastic device C14, the protection ring C12 wraps the elastic device C14, and the protection ring C12 is made of rubber and has the function of lifting and contracting.
Wherein, spliced pole structure 433 includes protection pillar T1, interior slot T2, electrode ring T3, slotted eye T4, electrode holder T5, electrode holder T5 is installed on protection pillar T1, protection pillar T1 and interior slot T2 structure as an organic whole, slotted eye T4 is equipped with two altogether, and locates on the protection pillar T1 respectively, electrode ring T3 outer loop is connected with electrode holder T5 inner ring electric welding, electrode ring T3 is the ring structure, and the inner wall is the smooth surface state for with lead the effect of connecting structure 432 and carry out the laminating and be connected.
The specific working process is as follows:
when the pins of the patch light-emitting diode 44 are welded, the connecting disc C11 is pressed downwards to enable the electrode connecting rod structure C2 to be close to one side of the pins of the patch light-emitting diode 44 to be in contact with the pins, silver colloid is dotted between the electrode connecting rod structure C2 and the pins of the patch light-emitting diode 44 to be cooled into silver colloid blocks, then the connecting disc C11 is loosened to be continuously pressed, the elastic device C14 pushes upwards to detect the weldability of the electrode connecting rod structure C2 and the patch light-emitting diode 44 and see whether a false welding phenomenon exists or not, and when the false welding exists, the connecting disc C11 is driven to move upwards under the action of the elastic device C14 so as to drive the electrode connecting rod structure C2 to move upwards, so that the warning block C3 connected to the electrode connecting rod structure C2 moves upwards on the sliding slot T4, the phenomenon that the pins of the electrode connecting rod structure C2 and the pins of the patch light-emitting diode 44 are in false welding is indicated, with this observation that can be quick, and can be quick maintain it and weld again, and when there is not the phenomenon of rosin joint, spring exerciser C14 will keep the state of compressed to can play the effect of warning to whether there is the phenomenon of rosin joint to electrode connector bar structure C2 and paster emitting diode 44 pin.
Example 2
The lower end of the electrode frame T5 is provided with a welding block, and the welding block is of a circular ring structure and used for increasing the fixing property of the electrode frame T5 when the electrode frame T5 is electrically welded with a circuit board.
Wherein, electrode connective bar structure C2 includes including electrode post C21, electrode connecting rod C22, welding frame structure C23, electrode connecting rod C22 inlays and installs in electrode post C21 right side, electrode connecting rod C22 right side welding frame structure C23 left side electric welding is connected, electrode post C21 is the cylinder structure, and the right side is equipped with the switch hole for the effect of assembling mutually with electrode connecting rod C22.
Wherein, weld holder structure C23 includes guide ring piece CC1, link CC2, guiding gutter CC3, guide ring piece CC1 and guiding gutter CC3 structure as an organic whole, guide ring piece CC1 inlays and installs in link CC2 inboard, guide ring piece CC1 sectional view is the upper and lower extreme for the size equals, and is symmetrical structure's trapezoidal state, and the middle part is the cuboid for the cross-section, and is used for the firm pin top with link CC 2.
The specific working process is as follows:
when the electrode holder T5 is welded to a circuit board, the welding block is arranged below the electrode holder T5, the weldability between the electrode holder T5 and the circuit board can be enhanced, the welding holder structure C23 is welded to the pins, the silver colloid is welded to the guide ring block CC1 in a spot welding mode, the silver colloid is of a liquid structure in a heating state, the silver colloid flows to the position below the guide groove CC3 along the guide ring block CC1 and contacts with the pins, the guide groove CC3 is filled in the slow spot welding mode, the upper end face of the cooled silver colloid block is flush with the upper end face of the connecting holder CC2, the contact area between the silver colloid and the pins is increased to fixedly weld the connecting holder CC2 on the pins, and the fixation between the pins and the connecting holder CC2 is firmer.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a prevent rosin joint paster emitting diode, its structure includes heat dissipation slotted hole (1), reflection of light annular (2), closing cap (3), warning protection casing structure (4), heat dissipation slotted hole (1) and warning protection casing structure (4) are the integral structure, reflection of light annular (2) and closing cap (3) are the integral structure, inner wall threaded connection, its characterized in that on closing cap (3) outer loop and warning protection casing structure (4):
warning protection casing structure (4) are including protecting crust (41), backup pad (42), warning connective bar structure (43), paster emitting diode (44), backup pad (42) are installed to protecting crust (41) inner wall, inlay to install in backup pad (42) top paster emitting diode (44) lower extreme, warning connective bar structure (43) and paster emitting diode (44) weld mutually, warning connective bar structure (43) run through in protecting crust (41) below.
2. The cold-solder-proof patch light-emitting diode of claim 1, wherein: the warning connecting rod structure (43) comprises a welding ring (431), a guide connection structure (432) and a connecting column structure (433), and the guide connection structure (432) is fixedly connected with the connecting column structure (433) through the welding ring (431).
3. The cold-solder-proof patch light-emitting diode of claim 2, wherein: the guide-connection structure (432) comprises an elastic device structure (C1), an electrode connecting rod structure (C2) and a warning block (C3), wherein the electrode connecting rod structure (C2) is embedded in the elastic device structure (C1), and the warning block (C3) is welded on two sides of the guide-connection structure (432).
4. The cold-solder-proof patch light-emitting diode of claim 3, wherein: the elastic device structure (C1) comprises a connecting disc (C11), a protection ring (C12), a lower support (C13) and an elastic device (C14), wherein the lower end of the connecting disc (C11) is fixedly connected with the upper end of the lower support (C13) through the elastic device (C14), and the elastic device (C14) is wrapped by the protection ring (C12).
5. The cold-solder-proof patch light-emitting diode of claim 2, wherein: the connecting column structure (433) comprises a protective support column (T1), an inner slot hole (T2), an electrode ring (T3), a sliding slot hole (T4) and an electrode frame (T5), wherein the electrode frame (T5) is installed on the protective support column (T1), the protective support column (T1) and the inner slot hole (T2) are of an integrated structure, the sliding slot hole (T4) is formed in the protective support column (T1), and an outer ring of the electrode ring (T3) is connected with the inner ring of the electrode frame (T5) in an electric welding mode.
6. The cold-solder-proof patch light-emitting diode of claim 5, wherein: and the lower end of the electrode frame (T5) is provided with a welding block.
7. The cold-solder-proof patch light-emitting diode of claim 3, wherein: electrode connective bar structure (C2) is including electrode post (C21), electrode connecting rod (C22), welding frame structure (C23), electrode connecting rod (C22) are inlayed and are installed in electrode post (C21) right side, electrode connecting rod (C22) right side welding frame structure (C23) left side electric welding is connected.
8. The cold-solder-proof patch light-emitting diode of claim 7, wherein: the welding frame structure (C23) comprises a guide ring block (CC1), a connecting frame (CC2) and a guide groove (CC3), the guide ring block (CC1) and the guide groove (CC3) are of an integrated structure, and the guide ring block (CC1) is embedded and installed on the inner side of the connecting frame (CC 2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010269797.0A CN111463333B (en) | 2020-04-08 | 2020-04-08 | Anti-cold-solder-joint surface-mounted light-emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010269797.0A CN111463333B (en) | 2020-04-08 | 2020-04-08 | Anti-cold-solder-joint surface-mounted light-emitting diode |
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| CN111463333A true CN111463333A (en) | 2020-07-28 |
| CN111463333B CN111463333B (en) | 2021-05-04 |
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| US20080017873A1 (en) * | 2006-07-18 | 2008-01-24 | Sony Corporation | Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, led display, led backlight and electronic device |
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| Publication number | Publication date |
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| CN111463333B (en) | 2021-05-04 |
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