CN111463221B - Display panel, manufacturing method and display device - Google Patents
Display panel, manufacturing method and display device Download PDFInfo
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- CN111463221B CN111463221B CN202010277940.0A CN202010277940A CN111463221B CN 111463221 B CN111463221 B CN 111463221B CN 202010277940 A CN202010277940 A CN 202010277940A CN 111463221 B CN111463221 B CN 111463221B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
Abstract
The invention provides a display panel, a manufacturing method and a display device, wherein the display panel comprises: the stretchable substrate comprises a plurality of stretchable units, each stretchable unit comprises two island-shaped structures and a bridging structure for connecting the two island-shaped structures, and the island-shaped structures are arranged on a plane where the display panel is located at intervals. The array layer is arranged on the surface of one side of the island-shaped structure or the bridge structure, the light-emitting device layer is arranged on the surface of one side, away from the island-shaped structure, of the array layer on the island-shaped structure, and the heat dissipation unit is arranged on one side, away from the light-emitting device layer, of the island-shaped structure or the bridge structure. It is thus clear that this scheme can realize dispelling the heat to island structure or bridging structure through the heat dissipation unit, has improved the heat-sinking capability of panel of can stretching.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel, a manufacturing method and a display device.
Background
The flexible display panel is a development trend of the current display screen by virtue of the characteristics of being bendable, convenient to carry and the like. And in particular, the stretchable display panel, provides a new viewing experience for the user. However, the stretchable display panel generates a large amount of heat during use, thereby damaging the display panel.
Disclosure of Invention
In view of this, the present invention provides a display panel, a manufacturing method thereof and a display device, which can improve the heat dissipation capability of a stretchable panel.
In order to achieve the purpose, the invention provides the following technical scheme:
a display panel, comprising: a stretchable substrate, an array layer, a light emitting device layer and a heat dissipation unit,
the stretchable substrate comprises a plurality of island-shaped structures and a plurality of bridging structures, the island-shaped structures are arranged at intervals on the plane of the display panel, and two adjacent island-shaped structures and the bridging structures connecting the two island-shaped structures form a stretchable unit;
an array layer and a light-emitting device layer are arranged on one side surface of the island structure or the bridge structure, wherein the array layer at least comprises a thin film transistor;
the heat dissipation unit is arranged on one side of the island-shaped structure or the bridge structure far away from the light-emitting device layer.
A display device comprising any one of the above display panels.
A manufacturing method of a display panel comprises the following steps:
providing a stretchable substrate comprising a plurality of island structures and a plurality of bridge structures, wherein any two adjacent island structures and the bridge structure located therebetween form a stretchable unit, and at least one first gap is formed between the island structure and the bridge structure in each stretchable unit;
multiplexing metal layers in the array layer or the light-emitting device layer while forming the array layer and the light-emitting device layer to form a heat dissipation unit;
and then fixing the heat dissipation unit on the side of the island structure or the bridge structure far away from the light-emitting device layer.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
according to the display panel, the manufacturing method and the display device, the heat dissipation unit is arranged on one side of the island-shaped structure or the bridge-shaped structure, which is far away from the light-emitting device, so that the heat dissipation of the display panel is realized through the heat dissipation unit, and the heat dissipation capability of the stretchable panel is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic top view illustrating a stretchable display panel according to the prior art;
FIG. 2 is a schematic top view illustrating a stretchable unit of the stretchable display panel shown in FIG. 1 when stretched;
fig. 3 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 5 is a schematic top view illustrating a display panel according to an embodiment of the present invention;
fig. 6 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 7 is a cross-sectional view of a display panel according to an embodiment of the invention;
FIG. 8 is a cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 9a is a cross-sectional view of a display panel according to an embodiment of the invention;
FIG. 9b is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 10a is a cross-sectional view of a display panel according to an embodiment of the present invention;
FIG. 10b is a cross-sectional view of a display panel according to an embodiment of the present invention;
fig. 11 is a schematic top view illustrating a display panel according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 13 is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of the invention;
fig. 14 is a schematic flowchart illustrating a manufacturing method of a display panel according to another embodiment of the present invention;
fig. 15 is a schematic flowchart illustrating a manufacturing method of a display panel according to an embodiment of the invention;
fig. 16 is a schematic flowchart of a manufacturing method of a display panel according to an embodiment of the present invention.
Detailed Description
As background, the conventional stretchable display panel generates a large amount of heat during use, thereby damaging the display panel. The inventor found that this is because the conventional stretchable display panel generates a large amount of heat during the use process, and in addition, the stretching action may deform the stretchable substrate, thereby further increasing the generation of heat.
As shown in fig. 1, fig. 1 is a schematic top view of a stretchable display panel in a non-stretched state, which includes a plurality of rectangular island structures 10, a first gap 101 is formed between the island structures 10, and two adjacent island structures 10 are connected by a bridge structure 11.
As shown in fig. 2, fig. 2 is a schematic top view of a stretchable unit in the stretchable display panel shown in fig. 1, when the stretchable display panel is subjected to a stretching force, the island structures change position, the bridge structures deform, and heat is generated.
Based on this, the present invention provides a display panel to overcome the above problems of the prior art, comprising: a stretchable substrate, an array layer, a light emitting device layer and a heat dissipation unit,
the stretchable substrate comprises a plurality of island-shaped structures and a plurality of bridge structures, the island-shaped structures are arranged on a plane where the display panel is located at intervals, and two adjacent island-shaped structures and the bridge structures connecting the two island-shaped structures form a stretchable unit;
an array layer and a light-emitting device layer are arranged on one side surface of the island-shaped structure or the bridge-shaped structure, wherein the array layer at least comprises a thin film transistor;
the heat dissipation unit is arranged on one side of the island-shaped structure or the bridge structure far away from the light-emitting device layer.
The invention also provides a display device comprising any one of the display panels.
The invention also provides a manufacturing method of the display panel, which comprises the following steps:
providing a stretchable substrate comprising a plurality of island structures and a plurality of bridge structures, wherein any two adjacent island structures and the bridge structure between the two adjacent island structures form a stretchable unit, and at least one first gap is formed between the island structures and the bridge structure in each stretchable unit;
multiplexing the metal layers in the array layer or the light-emitting device layer to form a heat dissipation unit while forming the array layer and the light-emitting device layer;
and then fixing the heat dissipation unit on the side of the island structure or the bridge structure far away from the light-emitting device layer.
According to the display panel, the manufacturing method and the display device, the heat dissipation unit is arranged on one side of the island-shaped structure or the bridge structure, which is far away from the light-emitting device, so that the heat dissipation of the display panel is realized through the heat dissipation unit, and the heat dissipation capability of the stretchable panel is improved.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, so that the above-described objects, features and advantages of the present invention are more clearly understood and appreciated. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 3, fig. 3 is a schematic diagram of a top view structure of a display panel provided in an embodiment of the present invention when the display panel is not stretched, the display panel including: stretchable substrate 31, array layer 32, light emitting device layer 33, and heat dissipation unit 34.
The stretchable substrate 31 includes a plurality of island structures 311 and a plurality of bridge structures 312, the plurality of island structures 311 are arranged at intervals on a plane where the display panel is located, and any two adjacent island structures 311 are connected by the bridge structure 312 located therebetween.
It should be noted that the island-like structures 311 in the embodiment of the present invention are part of the stretchable substrate, and the island-like structures 311 are a structure actually existing, rather than a single island-like pattern. The shape of the island-shaped structures 311 may be a rectangle, a triangle, or a parallelogram, but the invention is not limited thereto, and in other embodiments, the shape of the island-shaped structures 311 may also be a pentagon, a hexagon, or the like, and in the embodiment of the invention, only the shape of the island-shaped structures 311 is described as a rectangle.
In the embodiment of the present invention, the stretchable substrate may be a substrate formed by cutting a flexible substrate and having island-shaped structures 311 that are independent of each other and connected by a bridge structure 312, but the present invention is not limited thereto. Among them, the material of the stretchable substrate may be Polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), or the like.
In addition, the bridge structures 312 may be a part of the stretchable substrate, that is, the bridge structures 312 and the island structures 311 are both formed by cutting a flexible substrate, but the invention is not limited thereto, and in other embodiments, the bridge structures 312 may also be elastic structures separately formed between the island structures 311 by other methods, such as a vapor deposition film.
Further, in the present embodiment, the array layer 32 is disposed on a side surface of the island structure or the bridge structure, and may include a thin film transistor and a metal trace. The light emitting device layer 33 is disposed on a side surface of the array layer located on the island-like structure away from the island-like structure. The light emitting device may be a light emitting diode, an organic light emitting diode, or the like, and the present invention is not limited thereto.
It should be noted that, in the present embodiment, the heat dissipation unit 33 is disposed on a side of the island structure 311 or the bridge structure 312 away from the light emitting device layer 33. When the stretchable substrate is stretched, the island structures 311 move in position, and the bridge structures 312 are stretched to a certain extent, so as to generate heat.
Specifically, in this embodiment, the heat dissipation unit may be an independent heat dissipation device, and may also be prepared by multiplexing metal layers in the array layer or the light emitting device layer, and the structure of the heat dissipation unit is not limited in this embodiment. In addition, the heat dissipation unit may have various heat dissipation methods, for example, when the heat dissipation unit is a fan, active heat dissipation is realized, and for example, the heat dissipation unit is a cooling medium heat dissipation method, a thermal contact heat dissipation method, or the like. In any case, the display panel provided in this embodiment can achieve the heat dissipation of the stretchable substrate through the heat dissipation unit.
In order to expand the stretching ability of the stretchable substrate and facilitate heat dissipation, referring to fig. 3, the stretchable substrate may be configured to have at least one first gap 35 between a plurality of island structures, specifically, in this embodiment, two adjacent island structures and a bridge structure connecting the two island structures are defined to form a stretchable unit, and the two island structures in the stretchable unit and the bridge structure connecting the two island structures form the first gap 35, which is a hollow portion, so that the first gap can dissipate heat and can also increase the stretchable space of the bridge structure 312. The inventor considers that the first gap is formed after being cut, and therefore, in the display panel provided by the embodiment of the invention, it is preferable to reuse the array layer or the light emitting device layer which is originally cut off to manufacture the metal heat dissipation unit, and fix the heat dissipation unit on the back surface of the island-shaped structure or the bridge structure.
Specifically, as shown in fig. 4, fig. 4 is a schematic view of a top view structure of a display panel in a semi-finished product according to an embodiment of the present invention, generally, when a light emitting device is formed on an island-shaped structure, an array layer is first laid, and then a light emitting device layer is disposed above the array layer, where the array layer at least includes an insulating layer, a gate metal layer, an interlayer insulating layer, a source/drain metal layer, and an insulating layer that are laid layer by layer. And etching the metal layer according to a preset pattern to form the thin film transistor. The light emitting device layer at least comprises an anode metal layer, a cathode metal layer and a light emitting material layer positioned between the anode metal layer and the cathode metal layer. In the prior art, after the light emitting device is formed, the array layer and the portion to be cut 41 corresponding to the first gap in the light emitting device layer need to be cut and removed. In this embodiment, the to-be-cut portion is cut to form a heat dissipation device, the heat dissipation device is bent to the back of the island-shaped structure or the bridge structure, and heat conduction is performed by using the metal in the to-be-cut portion, so that heat in the island-shaped structure or the bridge structure is conducted to the back of the island-shaped structure or the bridge structure through the metal in the to-be-cut portion (it should be noted that, in this embodiment, the heat dissipation unit is disposed on one side of the island-shaped structure or the bridge structure, which is far away from the light emitting device layer, and means that the heat dissipation unit is mounted on the back of the island-shaped structure or the bridge structure), thereby achieving heat dissipation of the display panel.
Wherein the heat dissipation unit is arranged on the back side of the island structure (the backlight side of the display panel) as shown in fig. 5, in this case, the projection 51 of the island structure on the stretchable substrate covers the projection 52 of the heat dissipation unit connected to the island structure on the stretchable substrate. That is, in the present embodiment, the heat dissipating unit is disposed on the back of the island structure, and the heat dissipating unit can be fixed by a snap structure, an adhesive, or the like.
In addition, in the present embodiment, the heat dissipation unit may be disposed on the back of the bridging structure, as shown in fig. 6, at this time, a projection 61 of the bridging structure on the stretchable substrate covers a projection 62 of the heat dissipation unit connected to the bridging structure on the stretchable substrate. That is, in the present embodiment, the heat dissipation unit is disposed on the back of the island structure, and in the present embodiment, the heat dissipation unit may be fixed on the back of the bridge structure by a snap structure, an adhesive, or the like. As described above, the inventors consider that the flexible display panel is formed by disposing the light emitting devices on the island structures in the stretchable substrate, and the island structures of the stretchable substrate have the first gap therebetween, so that the embodiment can etch the metal located at the corresponding position of the first gap and any metal layer in the light emitting device to form the heat dissipation unit while manufacturing the light emitting device, thereby reducing the cost of selecting a separate heat dissipation device and not increasing the manufacturing process of the light emitting device.
Specifically, referring to fig. 7, fig. 7 is a cross-sectional view of a display panel according to an embodiment of the present invention, wherein the light emitting device layer includes a plurality of light emitting devices 71, and the array layer includes a plurality of thin film transistors T. The pixel electrode 73 of each light emitting device is connected to one drain electrode 71d of the thin film transistor T. The common electrode 72 is located above the pixel electrode 73 or between the pixel electrode 73 and the thin film transistor T, and the common electrode 72 is located above the pixel electrode 73 in this embodiment as an example. The thin film transistor T includes an active layer 71a, a gate electrode 71b, a source electrode 71c, a drain electrode 71d, a gate insulating layer 71e disposed between the active layer 71a and the gate electrode 71b, and an interlayer insulating layer 71f disposed between the gate electrode 71b and the source and drain electrodes 71c and 71 d. The source 71c and the drain 71d are located in the same layer, i.e., a source-drain metal layer.
In this embodiment, the array layer and the light emitting device layer include a plurality of metal layers, such as a metal layer where the gate is located, a metal layer where the source and drain are located, a metal layer where the pixel electrode is located, a metal layer where the common electrode is located, and the like. In this embodiment, the metal layer may be any one of a metal layer where a gate is located, a metal layer where a source and a drain are located, a metal layer where a pixel electrode is located, and a metal layer where a common electrode is located, and the heat dissipation unit may include at least one heat dissipation metal layer, and when the heat dissipation unit includes only one heat dissipation metal layer, the heat dissipation metal layer may be used to multiplex any one of the metal layers in the array layer or the light emitting device layer. For example, when the first metal layer 75 is a metal layer where the gate is located, when the gate is etched, etching is performed at a position of the metal layer corresponding to the first gap to form a heat dissipation unit. Then, the first metal layer 75 and the film layers (the gate insulating layer 71e and the flexible substrate) under the first metal layer 75 are bent to the back of the island structure, so that the display panel provided by the present embodiment can conduct the heat on the display panel to the back of the display panel through the first metal layer 75. It should be noted that, in the present embodiment, the first metal layer 75 and the film layer located below the first metal layer are bent together, so that the flexible substrate supports the first metal layer 75, and further, the first metal layer 75 is prevented from being broken when being bent.
In another embodiment, as shown in fig. 8, after the first metal layer 75 is etched, a metal 81 connected to the first metal layer 75 is formed by ink-jet printing, via punching, or the like, so that the first metal layer 75 transmits the heat of the display panel to the back surface of the flexible substrate through the metal 81 in thermal contact therewith. Compared with the method shown in fig. 7, the film layer below the first metal layer 75 does not need to be bent in the embodiment, and the overall thickness of the entire display panel after the heat dissipation unit is bent can be reduced.
Generally, the display panel is mounted on the housing, so that the heat of the display panel can be conducted to the housing through the first metal layer 75 (or the metal 81 in thermal contact with the first metal layer 75), which is more favorable for heat dissipation of the display panel. Except this, can also link to each other the metal after can also buckling with other heat radiation structure for display panel's heat conducts to other heat radiation structure through first metal level, for example, links to each other the first metal level at a plurality of island structure backs and liquid cooling heat radiation module, realizes the heat conduction of first metal level to display panel, and then dispels the heat to display panel.
In addition, the heat dissipation unit provided in the embodiment of the present invention may further include multiple heat dissipation metal layers, as shown in fig. 9a, if the heat dissipation unit includes a first heat dissipation metal layer 91 and a second heat dissipation metal layer 92 in this embodiment, the first heat dissipation metal layer may be disposed in the same layer as any one of the metal layer where the gate is disposed, the metal layer where the source and drain are disposed, the metal layer where the pixel electrode is disposed, and the metal layer where the common electrode is disposed, and in addition, the second heat dissipation metal layer may be disposed in the same layer as other metal layers except the first heat dissipation metal layer. For example, in fig. 9a, the first heat dissipation metal layer 91 is used as a gate metal layer, and the second heat dissipation metal layer 92 is used as a source/drain metal layer. Then, the first heat dissipation metal layer 91 and the film layer located below the first heat dissipation metal layer are bent, so that the flexible display panel supports the bent first heat dissipation metal layer 91.
It should be noted that, in order to further improve the heat dissipation capability of the first metal layer, in this embodiment, the first heat dissipation metal layer 91 and the second heat dissipation metal layer 92 may be connected by at least one via hole, a trench, and the like, where the first heat dissipation metal layer and the second heat dissipation metal layer are connected by a via hole in fig. 9a, and the first heat dissipation metal layer and the second heat dissipation metal layer are connected by an etched trench in fig. 9 b. Then pack the metal in via hole or slot to make first heat dissipation metal level and second heat dissipation metal level carry out the thermal contact through the metal in the slot, then through being located the back that is close to the first heat dissipation metal level of flexible base plate with display panel's heat conduction to display panel, because the heat-sinking capability of metal is higher than interlayer insulation layer, consequently, through the display panel that this scheme provided, can be better with a side surface of heat conduction to display panel on the display panel, and then realize better heat dissipation.
Similarly, when the heat dissipation unit includes multiple heat dissipation metal layers, as shown in fig. 10a, after the first heat dissipation metal layer and the second heat dissipation metal layer are etched, the metal 101 connected to the first heat dissipation metal layer and the second heat dissipation metal layer is formed by inkjet printing, via punching, and the like, so that the first heat dissipation metal layer and the second heat dissipation metal layer transmit the heat of the display panel to the back surface of the flexible substrate through the metal 101 in thermal contact therewith.
In addition, in order to further improve the bending resistance of the first heat dissipation metal layer and the second heat dissipation metal layer, the inventor considers that an inorganic layer is between the first heat dissipation metal layer and the second heat dissipation metal layer, as shown in fig. 10b, in the embodiment of the invention, a groove is further formed on a film layer between the first heat dissipation layer and the second heat dissipation layer in the heat dissipation unit, so as to facilitate bending of the second heat dissipation metal layer.
On the basis of the above embodiments, in order to facilitate bending of the heat dissipation structure, in combination with fig. 11, in this embodiment, the heat dissipation unit may be configured as a plurality of heat dissipation subunits, for example, the heat dissipation unit includes at least one first heat dissipation subunit and at least one second heat dissipation subunit. Wherein a projection of the first heat dissipation subunit on the stretchable substrate is located within a projection of one of the island structures or the bridge structure in the stretchable substrate on the stretchable substrate; the projection of the second heat dissipation subunit on the stretchable substrate is located within the projection of another island structure or bridge structure in the same stretchable unit on the stretchable substrate. Therefore, the heat dissipation unit is configured to be a plurality of heat dissipation sub-units in the embodiment, so that the heat dissipation unit is more easily bent to the back of the island structure or the bridge structure.
Taking the example that the heat dissipation unit includes two heat dissipation sub-units, in this embodiment, the first heat dissipation sub-unit 113 is connected to one island-shaped structure 111, and the second heat dissipation sub-unit 114 is connected to another island-shaped structure 112 in the same stretchable unit. In the figure, the first heat dissipation subunit 113 is bent to the back of the island-shaped structure 111, and similarly, the second heat dissipation subunit 114 is bent to the back of the island-shaped structure 112.
It should be noted that, in the present embodiment, since the two island structures in the stretchable unit and the bridge structure connecting the two island structures form a first gap, and the first gap is for facilitating stretching or heat dissipation of the stretchable substrate, in the present embodiment, in the same stretchable unit, a projection of the heat dissipation unit on the stretchable substrate is located within a projection of the island structures on the stretchable substrate, or within a projection of the bridge structure on the stretchable substrate. And the projection of the heat dissipation unit on the stretchable substrate and the projection of the first gap on the stretchable substrate are not overlapped.
That is, after the heat dissipation unit is bent to the back of the island-shaped structure or the bridge structure, it is necessary to ensure that the heat dissipation unit is not located at the first gap, thereby avoiding the problem that the space occupying the first gap and the tensile property are affected due to bending.
In addition, the size of the heat dissipation subunit and the first gap is not limited in the embodiments of the present invention, for example, a projected area of the first heat dissipation subunit on the stretchable substrate may be smaller than or equal to a projected area of the first gap on the stretchable substrate. The projected area of the second heat dissipation subunit on the stretchable substrate may be smaller than or equal to the projected area of the first gap on the stretchable substrate. In addition, the sum of the projection areas of the first heat dissipation subunit and the second heat dissipation subunit in the same heat dissipation unit on the stretchable substrate is less than or equal to the projection area of a first gap between the first island-shaped structure connected with the first heat dissipation subunit, the second island-shaped structure connected with the second heat dissipation subunit, and the bridge structure connected with the first island-shaped structure and the second island-shaped structure on the stretchable substrate.
Illustratively, referring to fig. 11, the sum of the areas of the first heat dissipation subunit 113 and the second heat dissipation subunit 114 is smaller than the area of the first gap. It should be noted that, in this embodiment, the first heat dissipation subunit and the second heat dissipation subunit may have a symmetrical structure and have the same size. Besides, the first heat dissipation subunit and the second heat dissipation subunit can also have different sizes.
On the basis of the foregoing embodiments, an embodiment of the present invention further provides a display device, as shown in fig. 12, fig. 12 is a schematic structural diagram of the display device provided in the embodiment of the present invention, and the flexible display device P includes the stretchable panel provided in any of the foregoing embodiments. The flexible display device includes, but is not limited to, a mobile phone, a tablet computer, a digital camera, and the like. In the display device, the heat dissipation unit connected with the island-shaped structure or the bridge structure is arranged on one side of the island-shaped structure or the bridge structure, which is far away from the light-emitting device, so that the display device can dissipate heat of the island-shaped structure or the bridge structure connected with the heat dissipation unit through the heat dissipation unit.
In addition, as shown in fig. 13, an embodiment of the present invention further provides a method for manufacturing a display panel, including:
s1, providing a stretchable substrate;
the stretchable substrate comprises a plurality of stretchable units, each stretchable unit comprises two island-shaped structures and a bridging structure for connecting the two island-shaped structures, the island-shaped structures are arranged on the plane where the display panel is located at intervals, and the two island-shaped structures in the stretchable units and the bridging structure for connecting the two island-shaped structures form a first gap.
The stretchable substrate may be a substrate cut from a flexible substrate and having island structures that are independent of each other and connected by a bridge structure, although the invention is not limited thereto. Among them, the material of the stretchable substrate may be Polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), or the like. The island-shaped structures can be rectangular, triangular, parallelogram, pentagonal, hexagonal and the like. The bridging structures may be part of the stretchable substrate, or may be elastic structures formed separately between the island structures by other means, such as vapor deposition of a film layer.
S2, forming an array layer and a light-emitting device layer on the surface of one side of the island-shaped structure or the bridge structure, and meanwhile, multiplexing the array layer or the light-emitting device layer to form a heat dissipation unit;
in this embodiment, the light emitting device may be a light emitting diode, an organic light emitting diode, or the like. Specifically, the light emitting device layer may include a plurality of light emitting devices, the array layer may include a plurality of thin film transistors, and a plurality of gate lines, a plurality of data lines, etc., and drain electrodes of the thin film transistors are connected to the pixel electrodes. The common electrode layer is positioned above the pixel electrode or between the pixel electrode and the thin film transistor T. The thin film transistor may include an active layer, a gate electrode, a source electrode, a drain electrode, a gate insulating layer disposed between the active layer and the gate electrode, and an interlayer insulating layer disposed between the gate electrode and the source and drain electrodes. Wherein the source and the drain are located in the same layer.
In this embodiment, the heat dissipation unit is a metal heat dissipation sheet prepared by multiplexing metal layers in the array layer or the light emitting device layer, and specifically, the heat dissipation unit may include at least one heat dissipation metal layer, where, for example, the heat dissipation metal layer in the heat dissipation unit may be disposed on the same layer as any one of the metal layer where the gate electrode is disposed, the metal layer where the source and drain electrodes are disposed, the metal layer where the pixel electrode is disposed, and the metal layer where the common electrode is disposed.
And S3, selectively bending the heat dissipation unit to one side of the island-shaped structure or the bridge structure far away from the light-emitting device layer.
After the heat dissipation unit is prepared, the present embodiment fixes the heat dissipation unit to the back of the island structure or the bridge structure to perform heat dissipation of the display panel. The fixing manner of the heat dissipation unit, the island structure and the bridge structure is not limited in this embodiment, and may be a clamping manner or an adhesion manner.
Therefore, by adopting the method, the heat dissipation unit can be prepared without increasing the manufacturing process of the light-emitting device, and the heat dissipation characteristic of the display panel is improved.
On the basis of the foregoing embodiment, an embodiment of the present invention further provides a specific implementation manner of step S2, as shown in fig. 14, including:
s21, etching the same layer of metal where any one metal layer of the array layer and the light-emitting device layer is located according to a preset pattern to form a heat dissipation unit comprising at least one heat dissipation metal layer.
For example, in this embodiment, the same layer of metal as any metal layer in the array layer may be etched to form the heat dissipation unit, and the metal layer in the multiplexing light emitting device may be completed by the same process step as that used in etching the array layer.
As above, in this embodiment, the heat dissipation unit includes at least one heat dissipation metal layer, and then, as shown in fig. 15, when the heat dissipation unit includes at least two heat dissipation metal layers in this embodiment, this embodiment further provides a specific implementation manner for implementing step S2, including:
and S22, when the heat dissipation unit comprises at least two heat dissipation metal layers, at least one through hole is formed between every two adjacent heat dissipation metal layers.
The via holes at least penetrate through the film layer between the two heat dissipation metal layers to form the heat dissipation unit shown in fig. 9. The display panel prepared by the method can better conduct heat on the display panel to one side surface of the display panel and further realize better heat dissipation because the heat dissipation capacity of the metal is higher than that of the interlayer insulating layer.
On the basis of the foregoing embodiment, as shown in fig. 16, in this embodiment, a specific implementation manner of step S2 is further provided, and includes:
s23, etching the same layer of metal where any one metal layer in the array layer and the light-emitting device layer is located to form a heat dissipation unit comprising at least one first heat dissipation subunit and at least one second heat dissipation subunit;
accordingly, step S3 includes:
s31, bending the first heat dissipation subunit to one side, away from the light-emitting device layer, of the island-shaped structure or the bridge structure in the stretchable unit;
and S32, bending the second heat dissipation subunit to one side, away from the light-emitting device layer, of the other island-shaped structure or the bridge structure in the same stretchable unit.
That is, in this embodiment, the heat dissipation unit is cut into at least one first heat dissipation subunit and at least one second heat dissipation subunit, then the first heat dissipation subunit is bent to the back of one island-shaped structure or bridge structure, and the second heat dissipation subunit is bent to the back of another island-shaped structure or bridge structure located in the same stretchable unit, so as to facilitate the bending of the heat dissipation subunits.
In summary, the display panel manufactured by the manufacturing method of the display panel provided by the embodiment of the invention can conduct the heat on the display panel to the back of the display panel through the heat dissipation unit, so as to realize the heat dissipation of the island-shaped structure or the bridge structure, and improve the heat dissipation capability of the stretchable panel.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. A display panel, comprising:
the stretchable substrate comprises a plurality of stretchable units, each stretchable unit comprises two island-shaped structures and a bridging structure for connecting the two island-shaped structures, and the plurality of island-shaped structures are arranged at intervals on the plane of the display panel;
an array layer including at least a thin film transistor disposed on one side surface of the island structure or the bridge structure;
the light-emitting device layer is arranged on one side surface, away from the island-shaped structure, of the array layer on the island-shaped structure;
the heat dissipation unit is arranged on one side, away from the light-emitting device layer, of the island-shaped structure or the bridge-shaped structure, and part of the heat dissipation unit is used for multiplexing the metal layer in the array layer or the light-emitting device layer;
two of the island structures in the stretchable unit form a first gap with a bridge structure connecting the two island structures,
in the same stretchable unit, the projection of the heat dissipation unit on the stretchable substrate is located within the projection of the island-shaped structure on the stretchable substrate, or within the projection of the bridge structure on the stretchable substrate;
and the projection of the heat dissipation unit on the stretchable substrate and the projection of the first gap on the stretchable substrate are not overlapped with each other.
2. The display panel of claim 1, wherein the heat dissipation unit comprises at least one first heat dissipation subunit and at least one second heat dissipation subunit;
the projection of the first heat dissipation subunit on the stretchable substrate is positioned in the projection of one of the island structures or the bridge structure in the stretchable substrate;
the projection of the second heat dissipation subunit on the stretchable substrate is located within the projection of the other island-shaped structure or the bridge structure in the same stretchable unit on the stretchable substrate.
3. The display panel of claim 1, wherein the heat dissipation unit comprises at least one heat dissipation metal layer,
the heat dissipation metal layer and any one metal layer of the array layer or the light-emitting device layer are arranged on the same layer.
4. The display panel according to claim 1, wherein the heat dissipation unit comprises at least two heat dissipation metal layers;
at least one through hole is formed in the two adjacent heat dissipation metal layers.
5. A display device comprising the display panel according to any one of claims 1 to 4.
6. A method for manufacturing a display panel is characterized by comprising the following steps:
the stretchable substrate comprises a plurality of stretchable units, each stretchable unit comprises two island structures and a bridge structure for connecting the two island structures, the plurality of island structures are arranged on a plane where the display panel is located at intervals, and a first gap is formed between the two island structures in each stretchable unit and the bridge structure for connecting the two island structures;
s2, forming an array layer and a light-emitting device layer on one side surface of the island-shaped structure or the bridge structure, and multiplexing the array layer or the light-emitting device layer to form a heat dissipation unit;
s3, selectively bending the heat dissipation unit to one side of the island-shaped structure or the bridge structure far away from the light-emitting device layer.
7. The method for manufacturing a display panel according to claim 6, wherein the step S2 includes:
s21, etching the same layer of metal where any metal layer of the array layer and the light-emitting device layer is located according to a preset pattern to form the heat dissipation unit comprising at least one heat dissipation metal layer.
8. The method for manufacturing a display panel according to claim 7, wherein the step S2 further comprises:
s22, when the heat dissipation unit comprises at least two heat dissipation metal layers, at least one through hole is formed between every two adjacent heat dissipation metal layers, and the through hole at least penetrates through the film layer between the two heat dissipation metal layers.
9. The method for manufacturing a display panel according to claim 6, wherein the step S2 further comprises:
s23, etching the same layer of metal where any metal layer in the array layer and the light-emitting device layer is located to form the heat dissipation unit comprising at least one first heat dissipation subunit and at least one second heat dissipation subunit;
accordingly, step S3 includes:
s31, bending the first heat dissipation subunit to one side, away from the light-emitting device layer, of the island-shaped structure or the bridge structure in the stretchable unit;
and S32, bending the second heat dissipation subunit to one side, away from the light-emitting device layer, of the island-shaped structure or the bridge structure in the same stretchable unit.
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| US20180090699A1 (en) * | 2016-09-23 | 2018-03-29 | Samsung Display Co., Ltd. | Display device and manufacturing method thereof |
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| CN101680621A (en) * | 2007-05-22 | 2010-03-24 | 奥斯兰姆有限公司 | Lighting device, backlighting device, and display device |
| US20180090699A1 (en) * | 2016-09-23 | 2018-03-29 | Samsung Display Co., Ltd. | Display device and manufacturing method thereof |
| CN110739333A (en) * | 2018-07-20 | 2020-01-31 | 乐金显示有限公司 | Telescopic display device |
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