CN111460609A - Method and device for extracting critical temperature points on heating surface of part - Google Patents
Method and device for extracting critical temperature points on heating surface of part Download PDFInfo
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Abstract
The embodiment of the invention provides a method and a device for extracting critical temperature points on a heating surface of a part, wherein the method comprises the following steps: establishing a coordinate system of a shaping light beam loading temperature field calculation model; generating a three-dimensional contour map of all given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line; and extracting key temperature points according to the distance value, the severe change area of the contour line temperature and the highest and lowest temperature areas. The method and the device for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, provide a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all given temperature data values aiming at the condition that a given temperature field on the heating surface of the part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Description
Technical Field
The invention relates to the technical field of laser, in particular to a method and a device for extracting critical temperature points on a heating surface of a part.
Background
With the trend toward high power density, high-compactness diesel engines, the problem of thermal damage to engine combustion chamber components caused by high thermal loads is increasingly prominent. The thermal load test platform is an effective means for evaluating the thermal strength of heated parts, and the existing thermal load test platform for the parts has heating modes such as gas, high-frequency induction, quartz lamps and the like. However, the conventional heat load test method of the heating system is still insufficient in effectively evaluating the heat strength of the heated component, and it is necessary to search for a new heat load test method.
Because the laser has the characteristics of controllable time and space energy and controllable power density, the research of thermal load tests on the heating surface of the loading part adopting the laser as a heat source becomes possible. The laser beam with specific light intensity distribution is applied to the heating surface of the part by shaping the original laser beam, and the temperature distribution generated on the heating surface meets the requirement of a thermal load test by the thermal interaction of the laser and the heating surface of the part. The key of the research of the shaping laser beam heat load test is that the heat load temperature field distribution of the heating surface of the part required by the test is simply, controllably, efficiently and accurately simulated. In the stage of developing the structure of the component, the temperature distribution of the heated surface of the component, which is usually the result of the calculated temperature field of the structural simulation design, required by the thermal load test will include a large number of temperature data values of the model nodes, and if all the temperature data are to be used as the target temperature field, and the temperature field generated by the shaping beam loaded on the heated surface of the component is consistent with the target temperature field, it will obviously need to consume a large amount of time and workload, and increase the difficulty of design.
In a shaping laser beam heat load test, given part heating surface temperature field distribution is used as a target temperature field, and the temperature field distribution generated by the shaping beam loading part heating surface is required to be consistent with the target temperature field. When the target temperature field is a calculation result obtained by the structural simulation of the engine parts, a large amount of temperature data brings huge calculation amount and high difficulty value to the experimental design.
Disclosure of Invention
The embodiment of the invention provides a method and a device for extracting critical temperature points on a heating surface of a part, which are used for solving the technical problems in the prior art.
In order to solve the above technical problem, in one aspect, an embodiment of the present invention provides a method for extracting critical temperature points on a heated surface of a component, including:
establishing a coordinate system of a shaping light beam loading temperature field calculation model;
generating a three-dimensional contour map of all given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line;
and extracting key temperature points according to the distance value, the severe change area of the contour line temperature and the highest and lowest temperature areas.
Further, the establishing of the coordinate system of the shaped light beam loading temperature field calculation model specifically includes:
and if the temperature distribution of the heating surface of the given part is calculated data obtained after structure simulation, selecting a default coordinate system of the calculated data as a coordinate system of the shaping beam loading temperature field calculation model.
Further, the establishing of the coordinate system of the shaped light beam loading temperature field calculation model specifically includes:
and if the temperature distribution of the heating surface of the given part is actually measured temperature data of each point on the heating surface of the part, determining a coordinate system according to the structural characteristics of the given part.
Further, the determining a coordinate system according to the structural characteristics of the given component specifically includes:
and taking the center of the given part as a coordinate origin, and enabling the actual measurement points to fall on X and Y coordinate axes as much as possible to determine a coordinate system.
Further, the extracting of the key temperature point according to the distance value, the severe change area of the contour line temperature, and the highest and lowest temperature areas specifically includes:
the temperature point of the highest temperature value and the temperature point of the lowest temperature value are taken as key temperature points.
Further, the extracting of the key temperature point according to the distance value, the severe change area of the contour line temperature, and the highest and lowest temperature areas specifically includes:
and taking the temperature point, in the three-dimensional contour map, of which the variable of the adjacent temperature point is greater than a preset threshold value as a key temperature point.
Further, after extracting the key temperature points according to the distance value, the region of drastic change in contour temperature, and the regions of highest and lowest temperatures, the method further includes:
and drawing a three-dimensional contour map according to the temperature values of all the currently extracted key temperature points, comparing the three-dimensional contour map with the three-dimensional contour map of all the given temperature points, and taking the temperature point with the difference value of the temperature points in the two contour maps larger than a second preset threshold value as a supplementary key temperature point.
In another aspect, an embodiment of the present invention provides an apparatus for extracting critical temperature points on a heated surface of a component, including:
the establishing module is used for establishing a coordinate system of the shaping light beam loading temperature field calculation model;
the generating module is used for generating three-dimensional contour maps of all the temperature points and determining the distance value extracted from the key temperature points according to the width value of each contour line;
and the extraction module is used for extracting the key temperature points according to the distance values, the severe change areas of the contour line temperature and the highest and lowest temperature areas.
In another aspect, an embodiment of the present invention provides an electronic device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the steps of the above method when executing the computer program.
In yet another aspect, the present invention provides a non-transitory computer readable storage medium, on which a computer program is stored, which when executed by a processor implements the steps of the above method.
The method and the device for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, provide a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
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FIG. 1 is a schematic diagram of a method for extracting key temperature points on a heated surface of a component according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an apparatus for extracting key temperature points from a heated surface of a component according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
At present, a novel engine part needing to be subjected to shaping laser beam thermal load tests is often subjected to thermal load tests of related parts in the structural research and development stage of the engine, namely under the condition that the engine is not used under the actual working condition, and the purpose of correcting the structural design of the engine and the like is achieved through the feedback of test results. In this case, the temperature distribution of the heated surface of the component in the thermal load test as the target temperature field is mostly based on the temperature simulation result of the heated surface obtained after the structural simulation of the component, and includes a large number of temperature data values of model nodes. How to utilize and process these temperature data values as the design input conditions of the shaped beam distribution in the laser thermal load test to develop the subsequent design of the shaped optical element is not described and reported in detail in this section.
In a shaping laser beam heat load test, given part heating surface temperature field distribution is used as a target temperature field, and the temperature field distribution generated by the shaping beam loading part heating surface is required to be consistent with the target temperature field. When the target temperature field is a calculation result obtained by the structural simulation of the engine parts, a large amount of temperature data brings huge calculation amount and high difficulty value to the experimental design.
In order to solve the technical problem, the embodiment of the invention extracts the key temperature point capable of reflecting the overall temperature distribution on the heating surface of the part from all the temperature data values, so that the aims of simplifying the design difficulty, accelerating the design period and simplifying the workload can be achieved.
According to the method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, the temperature distribution of the key temperature points can reflect the temperature field distribution of all the temperature points, and the temperature field distribution is used as a target temperature field to carry out the simulation calculation of the temperature field generated by loading the shaping laser beam on the heating surface of the part, so that the temperature field generated by loading the shaping laser beam with specific light intensity distribution is consistent with the target temperature field.
Fig. 1 is a schematic diagram of a method for extracting a critical temperature point on a heated surface of a component according to an embodiment of the present invention, and as shown in fig. 1, the embodiment of the present invention provides a method for extracting a critical temperature point on a heated surface of a component, where an implementation subject of the method is an extraction apparatus for the critical temperature point on the heated surface of the component. The method comprises the following steps:
and S101, establishing a coordinate system of the shaping light beam loading temperature field calculation model.
Specifically, a coordinate system is first established, for example, if the temperature distribution of the heating surface of the given component is calculated data obtained after structural simulation, a default coordinate system of the data may be selected as a coordinate system of the shaping beam loaded temperature field calculation model; if the measured temperature data of each point on the heating surface of the part is the measured temperature data of each point, selecting a coordinate system according to the structural characteristics of the part, and if the center of the part is taken as a coordinate origin, enabling each measured point to fall on X and Y coordinate axes as much as possible.
And S102, generating a three-dimensional contour map of all the given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line.
Specifically, after the coordinate system is established, the temperature points of the highest and lowest temperature values are found, the position coordinates and corresponding temperature values thereof are determined, and they are selected as the key temperature points.
And drawing a three-dimensional contour map of all the given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line.
And S103, extracting key temperature points according to the distance value, the severe change area of the contour line temperature and the highest and lowest temperature areas.
Specifically, after the pitch value of the key temperature point extraction is determined, the key temperature point extraction is performed on the X-axis and the Y-axis with this pitch value centered on the origin of coordinates.
The method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, is a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Based on any of the above embodiments, further, the establishing a coordinate system of the shaped beam loading temperature field calculation model specifically includes:
and if the temperature distribution of the heating surface of the given part is calculated data obtained after structure simulation, selecting a default coordinate system of the calculated data as a coordinate system of the shaping beam loading temperature field calculation model.
Specifically, in the embodiment of the present invention, if the temperature distribution of the heating surface of the given component is calculated data obtained after structural simulation, the default coordinate system of the data may be the coordinate system of the shaped beam loaded temperature field calculation model.
The method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, is a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Based on any of the above embodiments, further, the establishing a coordinate system of the shaped beam loading temperature field calculation model specifically includes:
and if the temperature distribution of the heating surface of the given part is actually measured temperature data of each point on the heating surface of the part, determining a coordinate system according to the structural characteristics of the given part.
Specifically, in the embodiment of the present invention, if the measured temperature data of each point on the heated surface of the component is obtained, the coordinate system is selected according to the structural characteristics of the component.
The method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, is a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Based on any one of the above embodiments, further, the determining a coordinate system according to the structural characteristics of the given component specifically includes:
and taking the center of the given part as a coordinate origin, and enabling the actual measurement points to fall on X and Y coordinate axes as much as possible to determine a coordinate system.
Specifically, in the embodiment of the present invention, the center of a given component is used as the origin of coordinates, and the coordinate system is determined such that as many actual measurement points as possible fall on the X and Y coordinate axes.
The method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, is a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Based on any one of the above embodiments, further, the extracting the key temperature point according to the distance value, the region of drastic change in contour line temperature, and the highest and lowest temperature regions specifically includes:
the temperature point of the highest temperature value and the temperature point of the lowest temperature value are taken as key temperature points.
Specifically, in the embodiment of the present invention, the temperature points of the highest and lowest temperature values are found, the position coordinates and the corresponding temperature values are determined, and the temperature points are selected as the key temperature points.
The method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, is a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Based on any one of the above embodiments, further, the extracting the key temperature point according to the distance value, the region of drastic change in contour line temperature, and the highest and lowest temperature regions specifically includes:
and taking the temperature point, in the three-dimensional contour map, of which the variable of the adjacent temperature point is greater than a preset threshold value as a key temperature point.
Specifically, in the embodiment of the present invention, in a location where the contour line changes drastically, the temperature point at the location is selected as the key temperature point.
The method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, is a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Based on any of the above embodiments, further, after the extracting the key temperature points according to the distance value, the region of drastic change in contour temperature, and the highest and lowest temperature regions, the method further includes:
and drawing a three-dimensional contour map according to the temperature values of all the currently extracted key temperature points, comparing the three-dimensional contour map with the three-dimensional contour map of all the given temperature points, and taking the temperature point with the difference value of the temperature points in the two contour maps larger than a second preset threshold value as a supplementary key temperature point.
Specifically, in the embodiment of the present invention, a three-dimensional contour map is drawn in accordance with the temperature values of all the key temperature points extracted above, and compared with the three-dimensional contour map of given all the temperature points. And finding out the position with larger difference in the contour maps of the two parts, and selecting the temperature point at the position as a key temperature point.
And adjusting the positions of the key points in the vicinity of the range by observing the range of the region with larger temperature difference until the three-dimensional contour map drawn by the extracted temperature values of the key points is consistent with the variation trend of the three-dimensional contour maps of all the given temperature points, so that the selection of the key temperature points meets the requirement.
Through the steps, the extraction of key temperature points from all temperature data values can be completed, the temperature distribution of the key temperature points is used as a target temperature field instead of the temperature distribution of all temperature points, the subsequent temperature field simulation calculation under the loading of the shaping light beam for the laser thermal load test is carried out, and the specific light intensity distribution of the shaping light beam is determined.
The method for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, is a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Any of the above embodiments is described below with a specific example:
taking the distribution of the temperature field of the heating surface obtained by the structural simulation of a piston as an example, the distribution of the temperature field comprises 3051 temperature points. If 3051 temperature points are used as the target temperature field, the large amount of temperature data will bring huge workload and design difficulty to the design of the subsequent shaped beam loading temperature distribution. In the actual shaping laser beam heat load test design, the purpose of reflecting the temperature field distribution of the whole piston surface can be realized only by extracting the key temperature points of the temperature distribution of the heating surface of the piston.
The coordinate system is selected as the default coordinate system of all temperature point data, and the origin is the central position of the piston surface. The locations of the highest and lowest temperature values are determined and the temperature values are 649.8K and 446.8K, respectively. According to the width value of each contour line, the distance value extracted from the key temperature point can be determined, and the distance value is 25 mm. Then temperature points approximately every 25mm on the X and Y axes, starting from the origin, are selected as critical temperature points. And at a position where the contour line changes drastically, for example, a position near the coordinates (-75mm, 25mm), the temperature point near this position is taken as the key temperature point. And drawing a three-dimensional contour map of the temperature field according to all the extracted key temperature points, comparing the three-dimensional contour map with the temperature field distribution of all the given temperature points, paying attention to the position with larger difference between the two, finally extracting 23 key temperature points from 3051 temperature values, and drawing the three-dimensional contour map of the temperature field distribution.
By contrast, the temperature distribution of 24 key target points on the heated surface of the piston is consistent with the temperature distribution of 3051 data points on the whole piston surface, so that the temperature distribution on the whole heated surface of the piston can be reflected. Therefore, in summary, in the simulation calculation of the loading temperature field of the specific light intensity distribution of the shaped light beam, only the temperature distribution of the key temperature point on the heating surface of the piston is taken as the target temperature field, and when the calculation result is consistent with the target temperature field of 24 points, the shaped light beam of the specific light intensity distribution is the shaped light beam required by the thermal load test.
Based on any of the above embodiments, fig. 2 is a schematic diagram of an extraction apparatus for a critical temperature point on a heated surface of a component according to an embodiment of the present invention, as shown in fig. 2, the extraction apparatus for a critical temperature point on a heated surface of a component according to an embodiment of the present invention includes an establishing module 201, a generating module 202, and an extracting module 203, where:
the establishing module 201 is used for establishing a coordinate system of a shaping light beam loading temperature field calculation model; the generating module 202 is configured to generate three-dimensional contour maps of all temperature points, and determine a distance value extracted from a key temperature point according to a width value of each contour line; the extraction module 203 is used for extracting the key temperature points according to the distance values, the severe change areas of the contour line temperature, and the highest and lowest temperature areas.
Embodiments of the present invention provide an apparatus for extracting critical temperature points on a heated surface of a component, which is used to perform the method described in any of the above embodiments, and the specific steps of performing the method described in one of the above embodiments by using the apparatus provided in this embodiment are the same as those in the corresponding embodiments, and are not described herein again.
The device for extracting the key temperature points on the heating surface of the part, provided by the embodiment of the invention, provides a method for extracting the key temperature points capable of reflecting the overall temperature distribution on the heating surface of the part from all temperature data values aiming at the condition that the temperature field of the heating surface of the given part contains a large number of temperature values, and can achieve the purposes of simplifying the design difficulty, accelerating the design period and simplifying the workload.
Fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention, and as shown in fig. 3, the electronic device includes: a processor (processor)301, a communication Interface (communication Interface)302, a memory (memory)303 and a communication bus 304, wherein the processor 301, the communication Interface 302 and the memory 303 complete communication with each other through the communication bus 304. The processor 301 and the memory 302 communicate with each other via a bus 303. Processor 301 may call logic instructions in memory 303 to perform the following method:
establishing a coordinate system of a shaping light beam loading temperature field calculation model;
generating a three-dimensional contour map of all given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line;
and extracting key temperature points according to the distance value, the severe change area of the contour line temperature and the highest and lowest temperature areas.
In addition, the logic instructions in the memory may be implemented in the form of software functional units and may be stored in a computer readable storage medium when sold or used as a stand-alone product. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
Further, embodiments of the present invention provide a computer program product comprising a computer program stored on a non-transitory computer-readable storage medium, the computer program comprising program instructions which, when executed by a computer, enable the computer to perform the steps of the above-described method embodiments, for example, including:
establishing a coordinate system of a shaping light beam loading temperature field calculation model;
generating a three-dimensional contour map of all given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line;
and extracting key temperature points according to the distance value, the severe change area of the contour line temperature and the highest and lowest temperature areas.
Further, an embodiment of the present invention provides a non-transitory computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the computer program implements the steps in the above method embodiments, for example, including:
establishing a coordinate system of a shaping light beam loading temperature field calculation model;
generating a three-dimensional contour map of all given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line;
and extracting key temperature points according to the distance value, the severe change area of the contour line temperature and the highest and lowest temperature areas.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A method for extracting critical temperature points on a heating surface of a part is characterized by comprising the following steps:
establishing a coordinate system of a shaping light beam loading temperature field calculation model;
generating a three-dimensional contour map of all given temperature points, and determining the distance value extracted from the key temperature points according to the width value of each contour line;
and extracting key temperature points according to the distance value, the severe change area of the contour line temperature and the highest and lowest temperature areas.
2. The method for extracting critical temperature points on the heating surface of the component according to claim 1, wherein the establishing a coordinate system of the shaped beam loading temperature field calculation model specifically comprises:
and if the temperature distribution of the heating surface of the given part is calculated data obtained after structure simulation, selecting a default coordinate system of the calculated data as a coordinate system of the shaping beam loading temperature field calculation model.
3. The method for extracting critical temperature points on the heating surface of the component according to claim 1, wherein the establishing a coordinate system of the shaped beam loading temperature field calculation model specifically comprises:
and if the temperature distribution of the heating surface of the given part is actually measured temperature data of each point on the heating surface of the part, determining a coordinate system according to the structural characteristics of the given part.
4. The method for extracting critical temperature points on a heated surface of a component according to claim 3, wherein the determining a coordinate system according to the structural characteristics of the given component specifically comprises:
and taking the center of the given part as a coordinate origin, and enabling the actual measurement points to fall on X and Y coordinate axes as much as possible to determine a coordinate system.
5. The method for extracting critical temperature points on a heated surface of a component according to claim 1, wherein the extracting of the critical temperature points according to the interval values, the drastic change region of contour line temperature, and the highest and lowest temperature regions specifically comprises:
the temperature point of the highest temperature value and the temperature point of the lowest temperature value are taken as key temperature points.
6. The method for extracting critical temperature points on a heated surface of a component according to claim 1, wherein the extracting of the critical temperature points according to the interval values, the drastic change region of contour line temperature, and the highest and lowest temperature regions specifically comprises:
and taking the temperature point, in the three-dimensional contour map, of which the variable of the adjacent temperature point is greater than a preset threshold value as a key temperature point.
7. The method for extracting critical temperature points on a heated surface of a component as claimed in claim 1, wherein after extracting the critical temperature points according to the distance values, the drastic change region of contour line temperature, and the highest and lowest temperature regions, the method further comprises:
and drawing a three-dimensional contour map according to the temperature values of all the currently extracted key temperature points, comparing the three-dimensional contour map with the three-dimensional contour map of all the given temperature points, and taking the temperature point with the difference value of the temperature points in the two contour maps larger than a second preset threshold value as a supplementary key temperature point.
8. An apparatus for extracting critical temperature points from a heated surface of a component, comprising:
the establishing module is used for establishing a coordinate system of the shaping light beam loading temperature field calculation model;
the generating module is used for generating a three-dimensional contour map of all given temperature points and determining the distance value extracted from the key temperature points according to the width value of each contour line;
and the extraction module is used for extracting the key temperature points according to the distance values, the severe change areas of the contour line temperature and the highest and lowest temperature areas.
9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to perform the steps of the method for extracting a critical temperature point on a heated surface of a component according to any one of claims 1 to 7.
10. A non-transitory computer-readable storage medium, on which a computer program is stored, wherein the computer program, when executed by a processor, implements the steps of the method for extracting critical temperature points on a heated surface of a component according to any one of claims 1 to 7.
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| CN202010112682.0A CN111460609A (en) | 2020-02-24 | 2020-02-24 | Method and device for extracting critical temperature points on heating surface of part |
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| CN202010112682.0A CN111460609A (en) | 2020-02-24 | 2020-02-24 | Method and device for extracting critical temperature points on heating surface of part |
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