CN111454680A - Detachable thermosetting epoxy adhesive composition and preparation method thereof - Google Patents
Detachable thermosetting epoxy adhesive composition and preparation method thereof Download PDFInfo
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- CN111454680A CN111454680A CN201910989011.XA CN201910989011A CN111454680A CN 111454680 A CN111454680 A CN 111454680A CN 201910989011 A CN201910989011 A CN 201910989011A CN 111454680 A CN111454680 A CN 111454680A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
- C08K2003/3045—Sulfates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a detachable thermosetting epoxy adhesive composition and a preparation method thereof, wherein the adhesive composition comprises the following materials in parts by weight based on 100 parts by weight of a coating composition: 10-50 parts of flexible epoxy resin as a component A, 0.5-15 parts of nano core-shell rubber epoxy resin toughening agent as a component B, 5-30 parts of epoxy diluent as a component C, 0.2-10.0 parts of polyvinylpyrrolidone as a component D, 0.5-4.0 parts of micromolecular alcohol as a component E, 40-60 parts of barium sulfate by a precipitation method as a component F, 0.2-4.0 parts of organic thixotropic agent as a component G and 0.2-5.0 parts of thermal initiator for initiating epoxy cationic polymerization as a component H. The thermosetting epoxy resin provided by the invention has good toughness, has excellent acid resistance in a formula, can be soaked in hot water to realize stripping, and can be applied to electronic processing plants in a large scale.
Description
Technical Field
The invention relates to the technical field of detachable thermosetting epoxy adhesives, in particular to a detachable thermosetting epoxy adhesive composition and a preparation method thereof.
Background
An ogs (one Glass solution) touch screen is an electronic product protection screen manufactured under a technology of directly forming an ITO conductive film and a sensor on a protection Glass. One piece of glass serves both as protective glass and as a touch sensor. Compared with the G/G touch technology, the touch control method has the following advantages: the structure is simple, the light and thin structure is light and has good light transmission, and because a glass substrate and a laminating procedure are saved, the production cost is reduced and the product percent of pass is improved. The OGS preparation process generally adopts a large-scale process or a small-scale process, wherein the large-scale process has higher efficiency and is more popular in mass production.
In order to improve the yield of large-scale processing and prevent the cutting of the glass after ITO plating from influencing the sputtered patterns, temporary protective glue is needed, and an effective protective film can be well formed on the surface of the glass by curing. Burrs are easily formed on the edge of the cut glass, the strength of the glass is affected, and the subsequent process needs to be carried out by soaking in hydrofluoric acid and hydrochloric acid and numerical control polishing and grinding, so that the temporarily protected glue needs to have excellent acid resistance and strength. After the glass is processed, the adhesive is more desirable to be easily removed under certain conditions, so that the production efficiency is improved.
In the prior art, a strippable light-cured adhesive composition and application thereof reported in CN201810658718 of electronic glass surface coating technology adopt a UV-cured acrylic acid technology, a main polymer with extremely strong hydrophobicity is adopted in a formula, and the formula is not suitable for screen printing. The adhesive is more suitable for processing small glass, and the acid and alkali resistance concentration of the adhesive is less than 10 percent; in addition, the problem of oxygen inhibition after acrylic acid photocuring is that the defects of burrs and the like are easily generated on the edge in the temporary bonding glass processing process and the subsequent acid-base soaking treatment, and the large sheet processing process mentioned in the patent can not be satisfied. The patent refers to the field of 'adhesives'. The strippable expanded microspheres are adopted in the formula, the diluent contains methacrylic acid which cannot participate in thermosetting reaction, and the strippable expanded microspheres can be used for conventional slicing of monocrystalline silicon, but cannot be used by soaking in an acid environment, have the defects that unreacted components are easy to separate out and the like, and are difficult to meet the strict glass processing process. U.S. Pat. No. 2,9850409 to Hangao discloses a high temperature resistant peelable glue for hydrosilylation systems. Due to the defects of an organic silicon system and the existence of small molecular ring bodies, organic silicon pollution is easy to occur to products in processing and use. The high temperature resistance of the formula after curing is excellent, but the organic silicon has general acid and alkali resistance, is not suitable for harsh acid soaking glass processing process and cannot meet the requirements;
the conventional photocuring acrylic acid system has serious surface oxygen inhibition, and the surface of the cured material is seriously sticky; the organic silicon system has poor acid resistance; the cationic epoxy modified system is often brittle and poor in toughness, so that the wear resistance and the adhesive force are greatly reduced, and therefore the detachable thermosetting epoxy adhesive composition and the preparation method thereof are designed to solve the problems.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a detachable heat-curable epoxy adhesive composition.
In order to achieve the purpose, the invention adopts the following technical scheme:
a detachable heat-curable epoxy adhesive composition comprises the following materials in parts by weight based on 100 parts by weight of a coating composition: 10-50 parts of flexible epoxy resin as a component A, 0.5-15 parts of nano core-shell rubber epoxy resin toughening agent as a component B, 5-30 parts of epoxy diluent as a component C, 0.2-10.0 parts of polyvinylpyrrolidone as a component D, 0.5-4.0 parts of small molecular alcohol as a component E, 40-60 parts of barium sulfate by a precipitation method as a component F, 0.2-4.0 parts of organic thixotropic agent as a component G and 0.2-5.0 parts of thermal initiator for initiating epoxy cationic polymerization as a component H.
Preferably, the feed comprises the following raw materials in parts by weight: 10-35 parts of flexible epoxy resin as a component A, 3-8 parts of nano core-shell rubber epoxy resin toughening agent as a component B, 8-25 parts of epoxy diluent as a component C, 0.5-4.0 parts of polyvinylpyrrolidone as a component D, benzyl alcohol as a component E, 42-55 parts of barium sulfate by a precipitation method as a component F, 0.3-2.5 parts of organic thixotropic agent as a component G, and 1.0-4.0 parts of thermal initiator for initiating epoxy cationic polymerization as a component H.
Preferably, the component E: 0.5 to 4.0 parts by weight of a small molecule alcohol can dissolve component D and is sparingly soluble in water.
A preparation method of a detachable thermosetting epoxy adhesive composition comprises the following steps:
s1, dissolving the component D in the component E, wherein the mass concentration is 30%, and preparing a premix;
s2, adding the premix and the components A-C and F-H (total 100g) into a plastic barrel with the capacity of 150g in sequence, putting into a mixer, and dispersing and mixing at high speed for 10 minutes at 2500 rpm.
Preferably, the mixer is of the type SpeedMixer DAC 150.1 FVZ.
Compared with the prior art, the adhesive composition has the beneficial effects that after being cured:
1. the silk-screen printing technology can be met, and no wire drawing tailing phenomenon exists in the technological process;
2. the surface dryness is excellent, and the pollution problem caused by poor irradiation of the surface dryness is reduced;
3. the polishing agent can withstand the polishing processing technology without glue failure, and the strength meets the technological requirements;
4. the glue has excellent HF acid/hydrochloric acid (concentration of 15 percent) resistance, and the edge of the glue has no defects of burrs, glue shortage and the like;
5. can be stripped under a simple hot water soaking process.
The technical problem to be solved by the invention can be overcome by overcoming the defects of the prior art, and the thermosetting epoxy resin with good toughness is provided, has excellent acid resistance in a formula, can be soaked in hot water to realize stripping, and can be applied to electronic processing plants in a large scale.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
A detachable heat-curable epoxy adhesive composition comprises the following materials in parts by weight based on 100 parts by weight of a coating composition: 10-50 parts of flexible epoxy resin as a component A, 0.5-15 parts of nano core-shell rubber epoxy resin toughening agent as a component B, 5-30 parts of epoxy diluent as a component C, 0.2-10.0 parts of polyvinylpyrrolidone as a component D, 0.5-4.0 parts of small molecular alcohol as a component E, 40-60 parts of barium sulfate by a precipitation method as a component F, 0.2-4.0 parts of organic thixotropic agent as a component G, 0.2-5.0 parts of thermal initiator for initiating epoxy cationic polymerization as a component H, wherein the weight ratio of the component E to the component E is as follows: 0.5-4.0 parts by weight of a small molecule alcohol which can dissolve component D and is slightly soluble in water;
specifically, a defoaming agent can be used for improving the defoaming capability of the glue according to the requirement in the formula, a leveling agent is used for improving the leveling property of the glue, fumed silica is used for adjusting the viscosity and the thixotropy of the composition, or a fluorescent indicator is added for facilitating electronic application identification and the like;
wherein, the component A: 10 to 50 parts by weight of a flexible epoxy resin having an epoxy equivalent of 400 or more. Preferably 10 to 35 parts by weight, and an epoxy equivalent of 450 or more. Common commercial products are:
produced by Reichhold corporation
37-051，
37-151, EEW 500Japan Epoxy Resin company Epikote Y L7170, EEW 1000Epikote Y L7217, EEW 430 Japan DIC company EXC-4850-;
and (B) component: 0.5-15 parts by weight of a nano core-shell rubber epoxy resin toughening agent; preferably 3 to 8 parts by weight, polybutadiene rubber toughened epoxy resin. Common commercial products are Kane ACE MX 217, MX 252, MX267, MX 416, MX 553, etc. by Kaneka corporation; EPX 125, EPX 225, EPX 253, etc., produced by complex chemistry;
and (3) component C: 5-30 parts by weight of a diepoxy-functional epoxy diluent; preferably 8 to 25 parts by weight. Such as Syna Epoxy S-06E, Syna Epoxy S-21, Syna Epoxy S-27 and Syna Epoxy S-28, etc., manufactured by Synasia corporation;
and (3) component D: 0.2-10.0 parts by weight of polyvinylpyrrolidone, preferably 0.5-4.0 parts by weight, and has a weight average molecular weight of 10000 or more and 16000 or less. The following are common: k15, K17, K25 and K30 series manufactured by Shanghai vitamin A materials science and technology Limited company; PVP K30 manufactured by Ashland corporation, etc.;
and (3) component E: 0.5 to 4.0 parts by weight of a small molecular alcohol which can dissolve component D but is slightly soluble in water; typically benzyl alcohol;
and (3) component F: 40-60 parts by weight of precipitation-process barium sulfate; preferably 42-55 parts by weight, and the grain diameter is less than or equal to 800 meshes. BaSO of 800 meshes, 1250 meshes and 3000 meshes of chemical production of Yangtze river is common; JX-80, JX-120, JX-150 and JX-200 produced by Jiaxin chemical industry;
a component G: 0.2 to 4.0 parts by weight of an organic thixotropic agent, preferably 0.3 to 2.5 parts by weight, such as BYK606, BYK410, BYK411, BYK430, BYK431 and the like available from BYK;
a component H: 0.2 to 5.0 parts by weight of a thermal initiator for initiating cationic polymerization of epoxy, preferably 1.0 to 4.0 parts by weight of an antimony hexafluoride-based catalyst, such as K-PURE CXC-1612 and K-PURE CXC-1613 available from King Industrial;
obtaining the following detachable thermosetting epoxy adhesive composition and a performance parameter table thereof;
example 1
The adhesive compositions were formulated according to the following table formula:
all parts are parts by weight based on 100 parts by weight of the adhesive composition.
The preparation method comprises the following steps:
s1, dissolving the component D in the component E, wherein the mass concentration is 30%, and preparing a premix;
s2, sequentially adding the premix and the components A-C and F-H (total 100g) into a plastic barrel with the capacity of 150g, putting into a mixer, and dispersing and mixing at high speed for 10 minutes at 2500 rpm;
wherein the mixer is model No. SpeedMixer DAC 150.1 FVZ.
After preparation, it was tested and verified:
1. viscosity and thixotropic value testing
Which refers to Brookfield viscosity, is measured using ASTM D1084 at a test temperature of 25 ℃. The glue touch value is obtained according to the ratio of the viscosity at the rotating speed of 1rpm and the rotating speed of 10rpm (25C);
2. screen printing verification
Adopting a manual screen printing machine (350 mesh) of Shanxi Si Da screen printing material business in Bantian in Shenzhen Longgang region, carrying out screen printing on the polyester screen plate on glass, and observing whether the phenomenon of wire drawing or edge tailing occurs in the printing process;
the surface dryness and the stripping removal mode after the glue is cured are as follows:
coating a coating with the thickness of 50 microns on the surface of 100 mm-150 mm Corning glass by a screen printing method, and placing the sample piece into a 150C oven for curing for 30 minutes. Then placing the sample in a standard environment of 23C and 50% RH relative humidity for 24 hours, and then touching the surface of the touch sensitive glue with a finger to sense the dryness of the solidified surface of the glue;
then putting the solidified sample piece into 90C hot water, and observing whether the sample piece can be peeled off or not within 30min, 45min and 60 min;
3. hardness test
In a circular aluminum foil tray (diameter about 4cm), glue with a thickness of about 2cm was poured. The sample was placed in a 150C oven and cured thoroughly for 1 hour. After the glue has cured, the sample is placed in a standard environment at 23C, 50% RH relative humidity for 24 hours before the hardness is measured. During the hardness test, three adhesive films with the same size and the thickness of 2mm are selected, and the hardness value of 6mm is measured by a hardness meter;
4. tensile bond Strength test
The resulting adhesive composition was dropped onto glass sheets (25mm by 40mm by 4mm) at room temperature, the thickness of the glue was controlled by a stainless steel wire with a thickness of 100 μm, and another glass sheet of the same size was cross-stuck together. The sample was placed in a 150C oven for curing for 30 minutes. Then placing the sample in a standard environment at 23C and 50% RH relative humidity for 24 hours;
the bonding tensile strength test was carried out by pulling the glass sheet and the glass sheet in opposite directions with respect to the specimen in a direction perpendicular to the surface of the glass sheet using a universal tensile machine (manufacturer: Instron, model: Instron 5540) at a tensile speed of 10mm per minute and under a load of 2000N. Dividing the obtained tension value by the lapping area of the glass sheet and the glass sheet to obtain the bonding strength (unit: MPa);
5. acid resistance test after glue solidification
Coating a coating with the thickness of 50 microns on the surface of 100 mm-150 mm Corning glass by a screen printing method, and placing the sample piece into a 150C oven for curing for 30 minutes. After cooling for 2 hours, they were placed in 15% HF and 15% HCl (under 25C), respectively, and soaked for 20 minutes. After being taken out, the sample piece is checked to be free from cracking, glue shortage, permeation, pinholes, etching marks and degumming;
the viscosity of the obtained adhesive composition was 140,500cps/25 ℃ (rotation speed 1 rpm); 31,500cp/25 ℃ (rotation speed 10 rpm);
thixotropic index of glue: 4.46
Screen printing test: good, no wire drawing or edge tailing phenomenon
And (3) glue thermosetting conditions: 150 ℃ for 30 minutes.
Surface dryness and stripping removal mode after glue curing:
-23C/50% RH relative humidity, surface dryness: excellent in non-tackiness.
And (3) screen printing a 50-micron cured glass sample, and putting the glass sample into 90C hot water for 30min to realize stripping.
Hardness after curing: shore D53
Glue tensile bond strength (100 microns thick): 5.8 MPa.
Acid resistance after glue cure (HF/HCl) test: and (4) passing.
Example 2
In the same manner as in example 1, an adhesive composition of example 2 was prepared. The formulation of the adhesive composition is shown in the following table, with the water soluble polymer PVP K30 removed in example 2:
all parts are parts by weight, based on 99.25 parts by weight of the adhesive composition after removal of PVP K30.
The viscosity of the obtained adhesive composition was 136,700cps/25 ℃ (rotation speed 1 rpm); 30,800cp/25 ℃ (rotation speed 10 rpm);
thixotropic index of glue: 4.44
Screen printing test: good, no wire drawing or edge tailing phenomenon
And (3) glue thermosetting conditions: 150 ℃ for 30 minutes.
And (3) testing the acid resistance of the glue after curing: and (4) passing.
Surface dryness and stripping removal mode after glue curing:
-23C/50% RH relative humidity, surface dryness: excellent in non-tackiness.
But the glass sample after 50 microns solidification is screen-printed and put into hot water of 90 ℃ for 60min, and still cannot be peeled off.
It is apparent that the adhesive composition of comparative example 1 has a greatly reduced releasability from hot water after curing due to the removal of the water-soluble polymer, and it is difficult to achieve releasability at 90C for 1 hour.
Example 3
In the same manner as in example 1, an adhesive composition of example 3 was prepared. Example 3 greatly reduced the amount of barium sulfate used with the adhesive composition formulations shown in the following table:
all parts are parts by weight based on 100 parts by weight of the adhesive composition.
The viscosity of the obtained adhesive composition was 96,500cps/25 ℃ (rotation speed 1 rpm); 27,900cp/25 ℃ (rotation speed 10 rpm);
thixotropic index of glue: 3.46
Screen printing test: poor, and has obvious phenomena of wiredrawing or edge tailing.
It is apparent that the adhesive composition of comparative example 1 has a remarkably reduced thixotropy of the glue due to the greatly reduced amount of barium sulfate used. Because barium sulfate is chemically inert, the addition of barium sulfate can obviously reduce the crosslinking density and polarity of the adhesive. When the dosage of calcium sulfate is reduced, the wettability of an adhesive system and a base material is poor, the crosslinking density and polarity of glue are too high, and shrinkage and wire drawing are serious. After screen printing, a continuous phase is difficult to form, and the coating performance is poor.
From the above embodiments, it can be seen that the present invention has the following features compared to the prior art:
(1) the epoxy resin is selected from a resin system with good flexibility and an epoxy equivalent of more than 400;
(2) the polybutadiene toughened epoxy with a core-shell structure is selected, so that the acid resistance of the formula is further improved;
(3) the formula adopts water-soluble polyvinylpyrrolidone, so that the epoxy system after thermosetting has excellent film-forming performance. When the adhesive is soaked in hot water, the adhesive expands rapidly, and the adhesive force is greatly reduced;
(4) the use of more barium sulfate filler by a precipitation method reduces the crosslinking density of an epoxy system, can eliminate the phenomenon of wire drawing tailing in screen printing, and is beneficial to the stripping of glue after hot water soaking;
(5) the formula technology is a thermosetting epoxy polymerization technology, and the problem of oxygen inhibition after free radical polymerization is solved;
(6) the glue is a single-component high-thixotropy product, can effectively control glue overflow and screen printing, and is convenient for construction and customer use.
The coating composition is particularly suitable for an OGS glass processing procedure and is used as a bonding material so as to facilitate subsequent cutting and polishing of glass, particularly chemical reinforcement processes (such as hydrofluoric acid and hydrochloric acid with the concentration of less than or equal to 15 percent) such as acid etching and the like;
after curing the adhesive composition:
6. the silk-screen printing technology can be met, and no wire drawing tailing phenomenon exists in the technological process;
7. the surface dryness is excellent, and the pollution problem caused by poor irradiation of the surface dryness is reduced;
8. the polishing agent can withstand the polishing processing technology without glue failure, and the strength meets the technological requirements;
9. the glue has excellent HF acid/hydrochloric acid (concentration of 15 percent) resistance, and the edge of the glue has no defects of burrs, glue shortage and the like;
10. can be stripped under a simple hot water soaking process.
The technical problem to be solved by the invention can be overcome by overcoming the defects of the prior art, and the thermosetting epoxy resin with good toughness is provided, has excellent acid resistance in a formula, can be soaked in hot water to realize stripping, and can be applied to electronic processing plants in a large scale.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention should be covered by the scope of the present invention.
Claims (5)
1. A detachable heat-curable epoxy adhesive composition comprises 100 parts by weight of coating composition and is characterized by mainly comprising the following materials in parts by weight: 10-50 parts of flexible epoxy resin as a component A, 0.5-15 parts of nano core-shell rubber epoxy resin toughening agent as a component B, 5-30 parts of epoxy diluent as a component C, 0.2-10.0 parts of polyvinylpyrrolidone as a component D, 0.5-4.0 parts of micromolecular alcohol as a component E, 40-60 parts of barium sulfate by a precipitation method as a component F, 0.2-4.0 parts of organic thixotropic agent as a component G and 0.2-5.0 parts of thermal initiator for initiating epoxy cationic polymerization as a component H.
2. The detachable heat-curable epoxy adhesive composition according to claim 1, comprising the following raw materials in parts by weight: 10-35 parts of flexible epoxy resin as a component A, 3-8 parts of nano core-shell rubber epoxy resin toughening agent as a component B, 8-25 parts of epoxy diluent as a component C, 0.5-4.0 parts of polyvinylpyrrolidone as a component D, benzyl alcohol as a component E, 42-55 parts of barium sulfate by a precipitation method as a component F, 0.3-2.5 parts of organic thixotropic agent as a component G, and 1.0-4.0 parts of thermal initiator for initiating epoxy cationic polymerization as a component H.
3. The releasable heat curable epoxy adhesive composition of claim 1, wherein said component E: 0.5 to 4.0 parts by weight of a small molecule alcohol can dissolve component D and is sparingly soluble in water.
4. The preparation method of the detachable thermosetting epoxy adhesive composition is characterized by comprising the following steps:
s1, dissolving the component D in the component E, wherein the mass concentration is 30%, and preparing a premix;
s2, adding the premix and the components A-C and F-H (total 100g) into a plastic barrel with the capacity of 150g in sequence, putting into a mixer, and dispersing and mixing at high speed for 10 minutes at 2500 rpm.
5. The method of claim 4, wherein the mixer is a SpeedMixer DAC 150.1 FVZ.
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| CN101341212A (en) * | 2005-10-25 | 2009-01-07 | 汉高公司 | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| CN102925088A (en) * | 2011-08-10 | 2013-02-13 | 烟台德邦科技有限公司 | Solar crystalline silicon wafer temporary adhesive and its preparation method |
| CN107474773A (en) * | 2017-09-09 | 2017-12-15 | 烟台德邦科技有限公司 | Smart card chip adhesive and preparation method thereof |
| CN107641490A (en) * | 2017-09-22 | 2018-01-30 | 北京天山新材料技术有限公司 | A kind of epoxy adhesive |
| CN108026248A (en) * | 2015-07-02 | 2018-05-11 | 亨斯迈先进材料许可(瑞士)有限公司 | It is used to prepare the thermosetting epoxy resin composition of outdoor product and thus obtained product |
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2019
- 2019-10-17 CN CN201910989011.XA patent/CN111454680A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101341212A (en) * | 2005-10-25 | 2009-01-07 | 汉高公司 | Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability |
| CN102925088A (en) * | 2011-08-10 | 2013-02-13 | 烟台德邦科技有限公司 | Solar crystalline silicon wafer temporary adhesive and its preparation method |
| CN108026248A (en) * | 2015-07-02 | 2018-05-11 | 亨斯迈先进材料许可(瑞士)有限公司 | It is used to prepare the thermosetting epoxy resin composition of outdoor product and thus obtained product |
| CN107474773A (en) * | 2017-09-09 | 2017-12-15 | 烟台德邦科技有限公司 | Smart card chip adhesive and preparation method thereof |
| CN107641490A (en) * | 2017-09-22 | 2018-01-30 | 北京天山新材料技术有限公司 | A kind of epoxy adhesive |
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Application publication date: 20200728 |