CN111449291B - Heating non-combustion baking device and heating device thereof - Google Patents

Heating non-combustion baking device and heating device thereof Download PDF

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Publication number
CN111449291B
CN111449291B CN202010365765.0A CN202010365765A CN111449291B CN 111449291 B CN111449291 B CN 111449291B CN 202010365765 A CN202010365765 A CN 202010365765A CN 111449291 B CN111449291 B CN 111449291B
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China
Prior art keywords
conductive substrate
heating device
heat generating
electrically connected
insulating layer
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CN202010365765.0A
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CN111449291A (en
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张幸福
黄鹏飞
方日明
廖焱程
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Shenzhen Maishi Technology Co Ltd
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Shenzhen Maishi Technology Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/18Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material

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  • Resistance Heating (AREA)

Abstract

The invention discloses a heating non-combustion baking device and a heating device thereof, wherein the heating device is used for inserting and heating an aerosol-forming substrate, and comprises a longitudinal sheet-shaped conductive substrate, a first insulating layer and at least one conductive circuit; the conductive substrate comprises a first surface, and the first insulating layer is formed on the first surface; the at least one conductive line is formed on the first insulating layer; the at least one conductive trace includes a first end electrically connected to the conductive substrate and a second end electrically insulated from the conductive substrate. The beneficial effects of the invention are as follows: by using the conductive substrate as the electrode, the electrical connection performance is more stable, the falling off is prevented, and the contact resistance is reduced.

Description

Heating non-combustion baking device and heating device thereof
Technical Field
The invention relates to a baking device, in particular to a heating non-combustion baking device and a heating device thereof.
Background
Electronic cigarettes are becoming more and more interesting and favored as cigarette substitutes, which have the advantages of safe, convenient, healthy, environment-friendly and the like. The heating does not burn the e-cigarette, which operates at a lower temperature. The heating and atomizing are carried out by heating the components of the cigarette at a lower temperature. The heating mode is usually tubular peripheral heating or central embedded heating, the former means that the heating pipe surrounds the outside of the cigarette, and the latter means that the heating plate or the heating rod is inserted into the cigarette. Wherein the heating plate is widely used due to the characteristics of simple manufacture, convenient use and the like. However, the conventional sheet heating is easy to cause the problems of poor electrical contact, unstable current during the operation of the conductive track and the like because the conductive track is formed on the surface of the insulating ceramic through silk screen printing or film plating.
Disclosure of Invention
In view of the shortcomings of the prior art, the present invention provides an improved heated non-combustible baking apparatus and heating device therefor.
To achieve the above object, the present invention provides a heating device for inserting and heating an aerosol-forming substrate, the heating device comprising an elongated sheet-like conductive substrate, a first insulating layer and at least one conductive trace; the conductive substrate comprises a first surface, and the first insulating layer is formed on the first surface; the at least one conductive line is formed on the first insulating layer; the at least one conductive trace includes a first end electrically connected to the conductive substrate and a second end electrically insulated from the conductive substrate.
In some embodiments, the at least one conductive trace includes a first heat generating portion having a first end electrically connected to the conductive substrate and a second end electrically insulated from the conductive substrate.
In some embodiments, the first heat generating portion is made of one or more of silver, platinum, copper, nickel, and palladium.
In some embodiments, the at least one conductive trace includes a first connection portion and a second connection portion, the first connection portion and the second connection portion having a resistance less than a resistance of the first heating portion; the first connection part is mechanically and electrically combined with the first surface and is mechanically and electrically connected with the first end of the first heating part; the second connection portion is formed on the first insulating layer and mechanically and electrically connected to the second end of the first heat generating portion.
In some embodiments, the first and second connection portions are made of one or more of gold, silver, copper.
In some embodiments, the at least one conductive trace includes a first lead and a second lead mechanically and electrically connected to the first connection portion and the second connection portion, respectively.
In some embodiments, a notch is provided at a corner of the root portion of the first insulating layer, and the first connection portion is mechanically and electrically connected to the conductive substrate at the notch.
In some embodiments, the heating device includes a first protective layer overlying an outer surface of the first heat-generating portion.
In some embodiments, the conductive substrate includes a second surface opposite the first surface, and the heating device includes a second insulating layer formed on the second surface.
In some embodiments, the heating device includes a second protective layer formed on a surface of the second insulating layer.
In some embodiments, the first and second connection portions are made of the same material as the first heating portion and are integrally formed with the first heating portion.
In some embodiments, a through hole is further formed near the notch on the first insulating layer, and the first end of the first heating portion is further electrically connected to the conductive substrate through the through hole.
In some embodiments, the at least one conductive trace includes a first connecting portion and a second connecting portion formed on the first insulating layer, the first connecting portion mechanically and electrically connected to the first end, the second connecting portion mechanically and electrically connected to the second end of the first heat generating portion; the at least one conductive trace includes a first lead and a second lead mechanically and electrically connected to the first connection portion and the second connection portion, respectively; the at least one conductive trace further includes a third connection portion that mechanically and electrically connects the first lead with the conductive substrate.
In some embodiments, the third connection portion is mechanically and electrically bonded to the underside edge of the conductive substrate.
In some embodiments, the at least one conductive trace includes a first connection portion and a second connection portion formed on the first insulating layer, the first connection portion mechanically and electrically connected to the first end, the second connection portion mechanically and electrically connected to the second end; the first insulating layer is provided with two through holes, and the first connecting part is electrically connected with the conductive substrate through one of the two through holes; the first end of the first heating part is electrically connected with the conductive substrate through the other one of the two through holes.
In some embodiments, the at least one conductive trace includes a first connection portion and a second connection portion having a lower resistance than the first heating portion, the first connection portion being mechanically and electrically bonded to the first surface and mechanically and electrically connected to the first end; the second connection part is formed on the first insulating layer and is mechanically and electrically connected with the second end of the first heating part; the conductive substrate includes a planar second surface opposite the first surface; the at least one conductive trace includes a fourth connection portion mechanically and electrically bonded to the second surface; the at least one conductive trace includes a first lead and a second lead that are mechanically and electrically connected to the fourth connection portion and the second connection portion, respectively.
In some embodiments, the at least one conductive trace includes a second heat generating portion in parallel with the first heat generating portion.
In some embodiments, the first heat-generating portion and the second heat-generating portion are both U-shaped, and the second heat-generating portion is located inside the first heat-generating portion, and two ends of the first heat-generating portion are mechanically and electrically connected to two ends of the second heat-generating portion, respectively.
In some embodiments, the first connection portion and the conductive substrate are connected in series or parallel between the first lead and the first end of the first heat generating portion.
In some embodiments, the first end of the first heating portion is electrically connected to one end of the conductive substrate; the at least one conductive circuit includes a first connection portion electrically connected to the other end of the conductive substrate.
In some embodiments, the first ends of the first heating portions are electrically connected to the conductive substrate, and the first connection portions are electrically connected to the conductive substrate, and are respectively located at opposite angles in the length direction of the conductive substrate.
In some embodiments, the first heat generating part includes at least three heat generating arms arranged in parallel at intervals in a series S-shape and a V-shaped heat generating part connected to the end of the heat generating arms.
There is provided a heated non-combustion toasting apparatus comprising a heating device as claimed in any one of the preceding claims.
In some embodiments, the device further comprises a power source, and the conductive substrate electrically connects a positive electrode of the power source with the first end.
The beneficial effects of the invention are as follows: by using the conductive substrate as the electrode, the electrical connection performance is more stable, the falling off is prevented, and the contact resistance is reduced.
Drawings
Fig. 1 is a schematic perspective view of a heating non-combustion baking apparatus according to some embodiments of the present invention in a use state.
Fig. 2 is a schematic perspective view showing a structure of the heating non-combustion baking apparatus shown in fig. 1 in a state of being separated from an aerosol-forming substrate.
Fig. 3 is a schematic view showing a longitudinal sectional structure of the heating non-combustion baking apparatus shown in fig. 1.
Fig. 4 is a schematic perspective view of a heating device of the heating non-combustion baking apparatus shown in fig. 3.
Fig. 5 is a partially exploded perspective view of the heating device of fig. 4.
Fig. 6 is a schematic view showing an exploded perspective structure of the heating device shown in fig. 4.
Fig. 7 is a schematic perspective view of the conductive substrate of the heating device of fig. 4 from another perspective.
Fig. 8 is a schematic perspective view of a first alternative of the heating device shown in fig. 4.
Fig. 9 is a partially exploded perspective view of the heating device of fig. 8.
Fig. 10 is a schematic view showing an exploded perspective structure of the heating device shown in fig. 8.
Fig. 11 is a schematic perspective view of a second alternative of the heating device shown in fig. 4.
Fig. 12 is a partially exploded perspective view of the heating device of fig. 11.
Fig. 13 is a schematic exploded perspective view of the heating device shown in fig. 11.
Fig. 14 is a schematic perspective view of a third alternative of the heating device shown in fig. 4.
Fig. 15 is a partially exploded perspective view of the heating device of fig. 14.
Fig. 16 is a schematic exploded perspective view of the heating device shown in fig. 14.
Fig. 17 is a schematic perspective view of a fourth alternative of the heating device shown in fig. 4.
Fig. 18 is a partially exploded perspective view of the heating device of fig. 17.
Fig. 19 is a schematic view showing an exploded perspective view of the heating device shown in fig. 17.
Fig. 20 is a schematic perspective view of a fifth alternative of the heating device shown in fig. 4.
Fig. 21 is a partially exploded perspective view of the heating device of fig. 20.
Fig. 22 is a schematic exploded perspective view of the heating device shown in fig. 20.
Fig. 23 is a schematic perspective view of a sixth alternative to the heating device shown in fig. 4.
Fig. 24 is a partially exploded perspective view of the heating device of fig. 23.
Fig. 25 is a schematic view showing an exploded perspective view of the heating device shown in fig. 23.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to the accompanying drawings.
Fig. 1 and 2 illustrate a heated non-combustion baking apparatus 1 according to some embodiments of the present invention, the heated non-combustion baking apparatus 1 being configured to heat-bake an aerosol-forming substrate 2 removably inserted therein to release an aerosol extract from the aerosol-forming substrate 2 in a non-combustion state. As shown, the aerosol-forming substrate 2 may be a cigarette arranged in a cylindrical shape. Correspondingly, the top of the heated non-combustion baking apparatus 1 is provided with receptacles 10 of a size adapted to the aerosol-forming substrate 2. A receptacle cover 15 may be provided beside the receptacle 10 to cover the receptacle 10 when not in use, preventing foreign matter from entering the receptacle 10, interfering with the use of the heated non-combustion baking apparatus 1.
Referring also to fig. 3, the heated non-combustion toasting device 1 may in some embodiments comprise a housing 11 and heating means 12, a power source 13 and a main board 14 arranged within the housing 11. The heating device 12 is inserted into the insertion hole 10 from the bottom of the insertion hole 10 so that the heating device 12 can be inserted into the aerosol-forming substrate 2 from the bottom end of the aerosol-forming substrate 2 longitudinally while being in close contact with the low-temperature baked aerosol-forming substrate 2 in the aerosol-forming substrate 2 when the aerosol-forming substrate 2 is inserted into the insertion hole 10. Thus, when the heating device 12 is energized to generate heat, the heat can be transferred to the aerosol-forming substrate 2, and the aerosol-forming substrate 2 is heated to emit smoke. The power supply 13 is electrically connected with the heating device 12, and the on-off of the power supply and the heating device is controlled by a switch. The motherboard 14 is used to arrange the associated master circuits.
As shown in fig. 4-6, the heating device 12 may in some embodiments include a conductive substrate 121 and a first insulating layer 122, a conductive trace 123, a first protective layer 124, a second insulating layer 125, and a second protective layer 126 bonded to the conductive substrate 121. The conductive trace 123 may in some embodiments include a first end and a second end for electrical connection with the positive and negative poles, respectively, of the power source 13, wherein the first end is electrically connected with the conductive substrate 121 and the second end is electrically insulated from the conductive substrate 121 so that current can enter the conductive trace 123 from the first end via the conductive substrate 121 and exit the conductive trace 123 from the second end.
The conductive substrate 121 may be made of a metal such as stainless steel or a conductive material such as conductive ceramic in some embodiments, and may have a thickness of 0.4-0.7mm. Referring also to fig. 7, the conductive substrate 121 may be in the form of an elongated sheet in some embodiments, which may include a planar first surface 1211 and a planar second surface 1212 opposite the first surface 1211. The conductive substrate 121 may include a fixing portion 1213 for fixing to the housing 11 and an insertion portion 1214 connected to the fixing portion 1213 in some embodiments. The insertion portion 1214 is for insertion into the aerosol-forming substrate 2 and may comprise a V-shaped tip 1215 to facilitate insertion into the aerosol-forming substrate 2. Both opposite edges of the insertion portion 1214 and both adjacent edges of the tip 1215 may be sharpened to further facilitate insertion into the aerosol-forming substrate 2.
The first insulating layer 122 may be made of one or more materials of glass, ceramic, and polyimide in some embodiments, and is formed on the first surface 1211 of the conductive substrate 121, and a notch 1220 may be provided at one corner of the root portion so that the conductive substrate 121 is exposed outside the first insulating layer 122 at the notch 1220.
The conductive line 123 may include a first heat generating portion 1231 and a second heat generating portion 1232 having a relatively large resistance temperature characteristic, and each of the first heat generating portion 1231 and the second heat generating portion 1232 may be formed on a surface of the first insulating layer 122 by a silk-screen or electroplating method to be electrically insulated from the conductive substrate 121. The first and second heat generating portions 1231 and 1232 may be U-shaped in some embodiments, and the second heat generating portion 1232 is located inside the first heat generating portion 1231. The first and second ends of the first heat generating part 1231 are connected to the first and second ends of the second heat generating part 1232, respectively, such that the first and second heat generating parts 1231 and 1232 are connected in parallel. The first and second heat generating portions 1231, 1232 may be formed of one or more materials of silver, platinum, copper, nickel, and palladium in some embodiments. In some embodiments, temperature measurements may be made with the first heat generating portion 1231 or the second heat generating portion 1232 to better monitor the heat generating temperature.
The first heating part 1231 may include two longitudinal heating arms arranged in parallel at a distance in the length direction of the conductive substrate 121 and a V-shaped heating part connecting the two heating arms together in series at the top end, the root parts of the two longitudinal heating arms forming the first and second ends of the first heating part 1231, respectively. Each heating arm may include a first heating section, a second heating section, and a third heating section sequentially connected in series in a longitudinal direction (a direction from the fixing portion 1213 to the insertion portion 1214), and widths of the first heating section, the second heating section, and the third heating section sequentially increase such that resistances of the first heating section, the second heating section, and the third heating section sequentially decrease to heat the baking aerosol-forming substrate 2 more uniformly. It will be appreciated that the heating arm is not limited to a three-segment resistance-decreasing configuration, as two or more segments may be used. Because the first heating part 1231 adopts a gradient resistor layout, the heating device 12 has the advantages of better energy utilization rate, better temperature field, large smoke amount during suction, better suction taste and the like.
The cold air enters the cigarette from bottom to top, and the heating device 12 and the lower part of the aerosol-forming substrate 2 are usually contacted with the low-temperature air first, so that the temperature difference is large, and the heat exchange efficiency is high. While the heating device 12 and the upper part of the aerosol-forming substrate 2 are usually in contact with the high temperature air heated by the lower part, the temperature difference is small, and the heat exchange efficiency is low. At this time, if the heating power of the upper and lower portions of the heating device 12 is equal, the temperature of the heating device 12 and the upper region of the aerosol-forming substrate 2 will always be higher than the temperature of the heating device 12 and the lower region of the aerosol-forming substrate 2 during use, which tends to cause excessive baking of a part of the tobacco shreds and insufficient baking of a part of the tobacco shreds. With the heating device 12 according to some embodiments of the present invention, this problem is advantageously solved, so that the temperature inside the aerosol-forming substrate 2 is more uniform during use.
The conductive line 123 may include first and second connection portions 1233 and 1234 having a lower resistance than the first and second heat generating portions 1231 and 1232 in some embodiments, and the first and second connection portions 1233 and 1234 may be made of one or more of gold, silver, and copper in some embodiments. The first connection portion 1233 may be formed on the conductive substrate 121 exposed at the notch 1220 in some embodiments and connected with the first ends of the first and second heat generating portions 1231 and 1232, thereby electrically connecting the first ends of the first and second heat generating portions 1231 and 1232 with the conductive substrate 121. The second connection portion 1234 is formed on the first insulating layer 122 and is connected to the second ends of the first and second heat generating portions 1231 and 1232. Here, the current may be transferred to the first ends of the first and second heat generating parts 1231 and 1232 via two parallel paths of the conductive substrate 121 and the first connection part 1233.
The conductive line 123 may include first and second leads 1235 and 1236 in some embodiments, and the first and second leads 1235 and 1236 may be soldered to the first and second connection portions 1233 and 1234, respectively. The first connection portion 1233 is preferably electrically connected to the positive electrode of the power source 13 via a first lead 1235, thereby electrically connecting the conductive substrate 121 to the positive electrode of the power source.
In some embodiments, the use of the conductive substrate 121 in electrical connection with one electrode of the power supply (preferably in electrical connection with the positive electrode of the power supply) has the following benefits: (1) The conductive substrate 121 has a high thermal conductivity and a more uniform temperature, and can ensure the overall atomization effect even when the temperature of the first heat generating part 1231 is low; (2) The electric connection performance is more stable, prevents to drop and reduces contact resistance.
The first protective layer 124 covers the outer surfaces of the first and second heat generating portions 1231 and 1232 to prevent the first and second heat generating portions 1231 and 1232 from directly contacting the aerosol-forming substrate 2 during use, thereby preventing the aerosol-forming substrate 2 from corroding the first and second heat generating portions 1231 and 1232. The first protective layer 124 may be made of glass or ceramic material in some embodiments.
The second insulating layer 125 may be formed on the second surface 1212 of the conductive substrate 121 in some embodiments to improve the insulating property of the side of the second surface 1212 of the conductive substrate 121. The second protective layer 126 is formed on the surface of the second insulating layer 125 to prevent corrosion of the second insulating layer 125 by the aerosol-forming substrate 2 during use or to prevent harmful substances in the second insulating layer 125 from entering into the aerosol-forming substrate 2. It will be appreciated that in some embodiments, the second insulating layer 125 and/or the second protective layer 126 may also be omitted if the conductive substrate 121 is made of a food-grade harmless and corrosion-resistant material.
It will be appreciated that in some embodiments, the heating device 12 may include two conductive traces 123, where the two conductive traces 123 are disposed on the first surface 1211 and the second surface 1212 of the conductive substrate 121, respectively, so that both sides of the conductive substrate 121 may be heated simultaneously, thereby further improving the heating efficiency.
Fig. 8-10 illustrate a heating device 12a in some embodiments of the invention, the heating device 12a may be substituted for the heating device 12 described above, and the heating device 12a may include a conductive substrate 121a and a first insulating layer 122a, a conductive trace 123a, a first protective layer 124a, a second insulating layer 125a, and a second protective layer 126a bonded to the conductive substrate 121a in some embodiments. The conductive trace 123a may in some embodiments include a first end and a second end for electrical connection with the positive and negative poles, respectively, of the power source 13, wherein the first end is electrically connected with the conductive substrate 121a and the second end is electrically insulated from the conductive substrate 121a so that current can enter the conductive trace 123a from the first end via the conductive substrate 121a and exit the conductive trace 123a from the second end.
The conductive substrate 121a may be in the form of an elongated sheet in some embodiments, which may include a planar first surface 1211a and a planar second surface 1212a opposite the first surface 1211 a. The first insulating layer 122a is formed on the first surface 1211a of the conductive substrate 121a, and a notch 1220a may be provided at one corner of the root portion so that the conductive substrate 121a is exposed outside the first insulating layer 122 a.
The conductive line 123a may include a first heat generating portion 1231a and a second heat generating portion 1232a having relatively high resistance in some embodiments, and each of the first heat generating portion 1231a and the second heat generating portion 1232a may be formed on a surface of the first insulating layer 122a by a silk-screen or electroplating method to be electrically insulated from the conductive substrate 121 a. The first and second heat generating portions 1231a and 1232a may be U-shaped in some embodiments, and the second heat generating portion 1232a is located inside the first heat generating portion 1231 a. The first and second ends of the first heat generating part 1231a are connected to the first and second ends of the second heat generating part 1232a, respectively, such that the first and second heat generating parts 1231a and 1232a are connected in parallel. The first and second heat generating portions 1231a and 1232a may be made of one or more materials of silver, platinum, copper, nickel, and palladium in some embodiments.
The conductive line 123a may include a first connection portion 1233a and a second connection portion 1234a having a smaller resistance than the first and second heat generating portions 1231a and 1232a in some embodiments, and the first connection portion 1233a and the second connection portion 1234a may be made of the same material as the first and second heat generating portions 1231a and 1232a in some embodiments and may be integrally formed with the first and second heat generating portions 1231a and 1232 a. The first connection portion 1233a may be formed on the conductive substrate 121a exposed at the notch 1220a in some embodiments and connected with the first ends of the first and second heat generating portions 1231a and 1232a, thereby electrically connecting the first ends of the first and second heat generating portions 1231a and 1232a with the conductive substrate 121 a. The second connection portion 1234a is formed on the first insulating layer 122a and is connected to the second ends of the first and second heat generating portions 1231a and 1232 a. Here, the current may be transferred to the first ends of the first and second heat generating parts 1231a and 1232a via two parallel paths of the conductive substrate 121a and the first connection part 1233 a.
The conductive line 123a may include first and second leads 1235a and 1236a in some embodiments, and the first and second leads 1235a and 1236a may be soldered to the first and second connection portions 1233a and 1234a, respectively. Preferably, the first lead 1235a is electrically connected to the positive electrode of the power source.
The first protective layer 124a covers the outer surfaces of the first and second heat generating portions 1231a and 1232a to prevent the first and second heat generating portions 1231a and 1232a from directly contacting the aerosol-forming substrate 2 during use, thereby preventing the first and second heat generating portions 1231a and 1232a from being corroded by the aerosol-forming substrate 2. The first protective layer 124a may be made of glass or ceramic material in some embodiments.
The second insulating layer 125a may be formed on the second surface 1212a of the conductive substrate 121a in some embodiments to improve the insulating property of the side of the second surface 1212a of the conductive substrate 121 a. The second protective layer 126a is formed on the surface of the second insulating layer 125a to prevent corrosion of the second insulating layer 125a by the aerosol-forming substrate 2 during use or to prevent harmful substances in the second insulating layer 125a from entering into the aerosol-forming substrate 2.
Fig. 11-13 illustrate a heating device 12b in some embodiments of the invention, the heating device 12b may be an alternative to the heating device 12 described above, and the heating device 12b may include a conductive substrate 121b and a first insulating layer 122b, a conductive trace 123b, a first protective layer 124b, a second insulating layer 125b, and a second protective layer 126b bonded to the conductive substrate 121b in some embodiments. The conductive trace 123b may in some embodiments include a first end and a second end for electrical connection with the positive and negative poles, respectively, of the power source 13, wherein the first end is electrically connected with the conductive substrate 121b and the second end is electrically insulated from the conductive substrate 121b so that current can enter the conductive trace 123b from the first end via the conductive substrate 121b and exit the conductive trace 123b from the second end.
The conductive substrate 121b may be in the form of an elongated sheet in some embodiments, which may include a planar first surface 1211b and a planar second surface 1212b opposite the first surface 1211 b. The first insulating layer 122b is formed on the first surface 1211b of the conductive substrate 121b, and a notch 1220b may be provided at one corner of the root portion so that the conductive substrate 121b is exposed outside the first insulating layer 122b thereat. A via 1221b is also provided adjacent to the notch 1220b in the first insulating layer 122b, where the conductive substrate 121b is also exposed outside the first insulating layer 122 b.
The conductive trace 123b may include a first heat generating portion 1231b and a second heat generating portion 1232b having a relatively large resistance in some embodiments, and each of the first heat generating portion 1231b and the second heat generating portion 1232b may be formed on a surface of the first insulating layer 122b by silk-screening or electroplating to be electrically insulated from the conductive substrate 121 b. The first and second heat generating portions 1231b and 1232b may be U-shaped in some embodiments, and the second heat generating portion 1232b is located inside the first heat generating portion 1231 b. The first and second ends of the first heat generating part 1231b are connected to the first and second ends of the second heat generating part 1232b, respectively, such that the first and second heat generating parts 1231b and 1232b are connected in parallel. The first and second heat generating portions 1231b, 1232b may be made of one or more materials of silver, platinum, copper, nickel, and palladium in some embodiments. The connection of the first end of the first heat generating portion 1231b and the first end of the second heat generating portion 1232b also corresponds to the through-hole 1221b of the first insulating layer 122b, so that the connection of the first end of the first heat generating portion 1231b and the first end of the second heat generating portion 1232b is bonded to the conductive substrate 121 b. Here, the current may be transferred to the first ends of the first and second heat generating parts 1231b and 1232b via two parallel paths of the conductive substrate 121b and the first connection part 1233 b.
The conductive line 123b may include first and second connection portions 1233b and 1234b having a lower resistance than the first and second heat generating portions 1231b and 1232b in some embodiments, and the first and second connection portions 1233b and 1234b may be made of one or more materials selected from gold, silver, and copper in some embodiments. The first connection portion 1233b may be formed on the conductive substrate 121b exposed at the notch 1220b in some embodiments to be electrically connected with the conductive substrate 121b, and thus electrically connected with the first ends of the first and second heat generating portions 1231b and 1232b via the conductive substrate 121 b. The second connection portion 1234b is formed on the first insulating layer 122b and is connected to the second ends of the first and second heat generating portions 1231b and 1232 b.
The conductive line 123b may include a first lead 1235b and a second lead 1236b in some embodiments, and the first lead 1235b and the second lead 1236b may be soldered to the first connection portion 1233b and the second connection portion 1234b, respectively.
The first protective layer 124b covers the outer surfaces of the first and second heat generating portions 1231b and 1232b to prevent the first and second heat generating portions 1231b and 1232b from directly contacting the aerosol-forming substrate 2 during use, thereby preventing the first and second heat generating portions 1231b and 1232b from being corroded by the aerosol-forming substrate 2. The first protective layer 124b may be made of glass or ceramic material in some embodiments.
The second insulating layer 125b may be formed on the second surface 1212b of the conductive substrate 121b in some embodiments to improve the insulating property of the side of the second surface 1212b of the conductive substrate 121 b. The second protective layer 126b is formed on the surface of the second insulating layer 125b to prevent corrosion of the second insulating layer 125b by the aerosol-forming substrate 2 during use or to prevent harmful substances in the second insulating layer 125b from entering into the aerosol-forming substrate 2.
Fig. 14-16 illustrate a heating device 12c in some embodiments of the invention, the heating device 12c may be an alternative to the heating device 12 described above, and the heating device 12c may include a conductive substrate 121c and, in some embodiments, a first insulating layer 122c, a conductive trace 123c, a first protective layer 124c, a second insulating layer 125c, and a second protective layer 126c bonded to the conductive substrate 121 c. The conductive trace 123c may in some embodiments include a first end and a second end for electrical connection with the positive and negative poles, respectively, of the power source 13, wherein the first end is electrically connected with the conductive substrate 121c and the second end is electrically insulated from the conductive substrate 121c so that current can enter the conductive trace 123c from the first end and exit the conductive trace 123c from the second end via the conductive substrate 121 c.
The conductive substrate 121c may be in the form of an elongated sheet in some embodiments, which may include a planar first surface 1211c and a planar second surface 1212c opposite the first surface 1211 c. The first insulating layer 122c is formed on the first surface 1211c of the conductive substrate 121 c.
The conductive line 123c may include a first heat generating portion 1231c and a second heat generating portion 1232c having relatively high resistance in some embodiments, and each of the first heat generating portion 1231c and the second heat generating portion 1232c may be formed on a surface of the first insulating layer 122c by silk-screening or electroplating to be electrically insulated from the conductive substrate 121 c. The first and second heat generating portions 1231c and 1232c may be U-shaped in some embodiments, and the second heat generating portion 1232c is located inside the first heat generating portion 1231 c. The first and second ends of the first heat generating part 1231c are connected to the first and second ends of the second heat generating part 1232c, respectively, such that the first and second heat generating parts 1231c and 1232c are connected in parallel. The first and second heat generating portions 1231c, 1232c may be made of one or more materials of silver, platinum, copper, nickel, and palladium in some embodiments.
The conductive line 123c may include first and second connection portions 1233c and 1234c having a lower resistance than the first and second heat generating portions 1231c and 1232c in some embodiments, and the first and second connection portions 1233c and 1234c may be made of one or more materials of gold, silver, and copper in some embodiments. The first and second connection portions 1233c and 1234c are each formed on the first insulating layer 122c, and the first connection portion 1233 is connected to first ends of the first and second heat generating portions 1231c and 1232c, and the second connection portion 1234c is connected to second ends of the first and second heat generating portions 1231c and 1232 c. Here, the current may be transferred to the first ends of the first and second heat generating parts 1231c and 1232c via two parallel paths of the conductive substrate 121c and the first connection part 1233 c.
The conductive line 123c may include first and second leads 1235c and 1236c in some embodiments, and the first and second leads 1235c and 1236c may be soldered to the first and second connection portions 1233c and 1234c, respectively. The conductive trace 123c may in some embodiments include a third connection portion 1237c, the third connection portion 1237c mechanically and electrically connecting the first lead 1235c with the conductive substrate 121 c. The third connection portion 1237c is bonded to the lower side edge of the conductive substrate 121c in some embodiments.
The first protective layer 124c covers the outer surfaces of the first and second heat generating portions 1231c and 1232c to prevent the first and second heat generating portions 1231c and 1232c from directly contacting the aerosol-forming substrate 2 during use, thereby avoiding corrosion of the first and second heat generating portions 1231c and 1232c by the aerosol-forming substrate 2. The first protective layer 124c may be made of glass or ceramic material in some embodiments.
The second insulating layer 125c may be formed on the second surface 1212c of the conductive substrate 121c in some embodiments to improve the insulating property of the side of the second surface 1212c of the conductive substrate 121 c. The second protective layer 126c is formed on the surface of the second insulating layer 125c to prevent corrosion of the second insulating layer 125c by the aerosol-forming substrate 2 during use or to prevent harmful substances in the second insulating layer 125c from entering into the aerosol-forming substrate 2.
Fig. 17-19 illustrate a heating device 12d in some embodiments of the invention, the heating device 12d may be an alternative to the heating device 12 described above, and the heating device 12d may include a conductive substrate 121d and a first insulating layer 122d, a conductive trace 123d, a first protective layer 124d, a second insulating layer 125d, and a second protective layer 126d bonded to the conductive substrate 121d in some embodiments. The conductive trace 123d may in some embodiments include a first end and a second end for electrical connection with the positive and negative poles, respectively, of the power source 13, wherein the first end is electrically connected with the conductive substrate 121d and the second end is electrically insulated from the conductive substrate 121d so that current can enter the conductive trace 123 from the first end via the conductive substrate 121d and exit the conductive trace 123d from the second end.
The conductive substrate 121d can be in the form of an elongated sheet in some embodiments, which can include a planar first surface 1211d and a planar second surface 1212d opposite the first surface 1211 d. The first insulating layer 122d is formed on the first surface 1211d of the conductive substrate 121d, on which two through holes 1221d are formed, and the conductive substrate 121d is exposed outside the first insulating layer 122d at corresponding positions of the two through holes 1221d, respectively.
The conductive line 123d may include a first heat generating portion 1231d and a second heat generating portion 1232d having a relatively large resistance in some embodiments, and each of the first heat generating portion 1231d and the second heat generating portion 1232d may be formed on a surface of the first insulating layer 122d by a silk-screen or an electroplating manner to be electrically insulated from the conductive substrate 121 d. The first and second heat generating portions 1231d and 1232d may be U-shaped in some embodiments, and the second heat generating portion 1232d is located inside the first heat generating portion 1231 d. The first and second ends of the first heat generating part 1231d are connected to the first and second ends of the second heat generating part 1232d, respectively, such that the first and second heat generating parts 1231d and 1232d are connected in parallel. The first ends of the first and second heat generating portions 1231d and 1232d are connected to correspond to one of the two through holes 1221d and are electrically connected to the conductive substrate 121 d. The first and second heat generating portions 1231d, 1232d may be made of one or more materials of silver, platinum, copper, nickel, and palladium in some embodiments.
The conductive line 123d may include first and second connection portions 1233d and 1234d having a lower resistance than the first and second heat generating portions 1231d and 1232d in some embodiments, and the first and second connection portions 1233d and 1234d may be made of one or more materials of gold, silver, and copper in some embodiments. The first and second connection portions 1233d and 1234d are each formed on the first insulating layer 122d, and the first connection portion 1233 is connected to first ends of the first and second heat generating portions 1231d and 1232d, and the second connection portion 1234d is connected to second ends of the first and second heat generating portions 1231d and 1232 d. In addition, the first connection portion 1233 corresponds to the other of the two through holes 1221d, and thus is electrically connected to the conductive substrate 121d, so that the current can be transferred to the first ends of the first and second heat generating portions 1231d and 1232d via the conductive substrate 121d in addition to being directly connected to the first ends of the first and second heat generating portions 1231d and 1232d by the first connection portion 1233, thereby improving the stability of the electrical connection. Here, the current may be transferred to the first ends of the first and second heat generating parts 1231d and 1232d via two parallel paths of the conductive substrate 121d and the first connection part 1233 d.
The conductive line 123d may include a first lead 1235d and a second lead 1236d in some embodiments, and the first lead 1235d and the second lead 1236d may be soldered to the first connection portion 1233d and the second connection portion 1234d, respectively.
The first protective layer 124d covers the outer surfaces of the first and second heat generating portions 1231d and 1232d to prevent the first and second heat generating portions 1231d and 1232d from directly contacting the aerosol-forming substrate 2 during use, thereby avoiding corrosion of the first and second heat generating portions 1231d and 1232d by the aerosol-forming substrate 2. The first protective layer 124d may be made of glass or ceramic material in some embodiments.
The second insulating layer 125d may be formed on the second surface 1212d of the conductive substrate 121d in some embodiments to improve the insulating property of the side of the second surface 1212d of the conductive substrate 121 d. The second protective layer 126d is formed on the surface of the second insulating layer 125d to prevent corrosion of the second insulating layer 125d by the aerosol-forming substrate 2 during use or to prevent harmful substances in the second insulating layer 125d from entering into the aerosol-forming substrate 2.
Fig. 20-22 illustrate a heating device 12e in some embodiments of the invention, the heating device 12e may be substituted for the heating device 12 described above, and the heating device 12e may include a conductive substrate 121e and a first insulating layer 122e, a conductive trace 123e, a first protective layer 124e, a second insulating layer 125e, and a second protective layer 126e bonded to the conductive substrate 121e in some embodiments. The conductive trace 123e may in some embodiments include a first end and a second end for electrical connection with the positive and negative poles, respectively, of the power source 13, wherein the first end is electrically connected with the conductive substrate 121e and the second end is electrically insulated from the conductive substrate 121e so that current can enter the conductive trace 123e from the first end via the conductive substrate 121e and exit the conductive trace 123e from the second end.
The conductive substrate 121e may be in the form of an elongated sheet in some embodiments, which may include a planar first surface 1211e and a planar second surface 1212e opposite the first surface 1211 e. The first insulating layer 122e is formed on the first surface 1211e of the conductive substrate 121e, and a notch 1220e may be provided at one corner of the root portion so that the conductive substrate 121e is exposed outside the first insulating layer 122 e.
The conductive trace 123e may include a first heat generating portion 1231e and a second heat generating portion 1232e having a relatively high resistance in some embodiments, and each of the first heat generating portion 1231e and the second heat generating portion 1232e may be formed on a surface of the first insulating layer 122e by a silk-screen or an electroplating method to be electrically insulated from the conductive substrate 121 e. The first and second heat generating portions 1231e and 1232e may be U-shaped in some embodiments, and the second heat generating portion 1232e is located inside the first heat generating portion 1231 e. The first and second ends of the first heat generating part 1231e are connected to the first and second ends of the second heat generating part 1232e, respectively, such that the first and second heat generating parts 1231e and 1232e are connected in parallel. The first and second heat generating portions 1231e, 1232e may be made of one or more materials of silver, platinum, copper, nickel, and palladium in some embodiments.
The conductive line 123e may include first and second connection portions 1233e and 1234e having a lower resistance than the first and second heat generating portions 1231e and 1232e in some embodiments, and the first and second connection portions 1233d and 1234d may be made of one or more materials of gold, silver, and copper in some embodiments. The first connection portion 1233e may be formed on the conductive substrate 121e exposed at the notch 1220e in some embodiments and connected with the first ends of the first and second heat generating portions 1231e and 1232e, thereby electrically connecting the first ends of the first and second heat generating portions 1231e and 1232e with the conductive substrate 121 e. The second connection portion 1234e is formed on the first insulating layer 122e and is connected to the second ends of the first and second heat generating portions 1231e and 1232 e. The conductive trace 123e may in some embodiments include a fourth connection portion 1238e, the fourth connection portion 1238e being bonded to the second surface 1212e of the conductive substrate 121e so as to be electrically connected to the first connection portion 1233e via the conductive substrate 121 e. Here, the current may be transferred to the first ends of the first and second heat generating portions 1231 and 1232 via the fourth connection portion 1238e, the conductive substrate 121e, and the first connection portion 1233e, which are sequentially connected in series.
The conductive line 123e may include first and second leads 1235e and 1236e in some embodiments, and the first and second leads 1235e and 1236e may be soldered to the fourth and second connection portions 1238e and 1234e, respectively.
The first protective layer 124e covers the outer surfaces of the first and second heat generating portions 1231e and 1232e to prevent the first and second heat generating portions 1231e and 1232e from directly contacting the aerosol-forming substrate 2 during use, thereby avoiding corrosion of the first and second heat generating portions 1231e and 1232e by the aerosol-forming substrate 2. The first protective layer 124e may be made of glass or ceramic material in some embodiments.
The second insulating layer 125e may be formed on the second surface 1212e of the conductive substrate 121e in some embodiments to improve the insulating property of the side of the second surface 1212e of the conductive substrate 121 e. The second insulating layer 125e has a notch 1250e for the fourth connecting portion 1238e to be bonded therein with the second surface 1212e of the conductive substrate 121 e. The second protective layer 126e is formed on the surfaces of the second insulating layer 125e and the fourth connection portion 1238e to prevent corrosion of the second insulating layer 125e and the fourth connection portion 1238e by the aerosol-forming substrate 2 during use or to prevent harmful substances in the second insulating layer 125e from entering into the aerosol-forming substrate 2.
Fig. 23-25 illustrate a heating device 12f in some embodiments of the invention, the heating device 12f may be an alternative to the heating device 12 described above, and the heating device 12f may include a conductive substrate 121f and a first insulating layer 122f, a conductive trace 123f, a first protective layer 124f, a second insulating layer 125f, and a second protective layer 126f bonded to the conductive substrate 121f in some embodiments. The conductive trace 123f may in some embodiments include a first end and a second end for electrical connection with the positive and negative poles, respectively, of the power source 13, wherein the first end is electrically connected with the conductive substrate 121f and the second end is electrically insulated from the conductive substrate 121f so that current can enter the conductive trace 123f from the first end and exit the conductive trace 123f from the second end via the conductive substrate 121 f.
The conductive substrate 121f may be in the form of an elongated sheet in some embodiments, which may include a planar first surface 1211f and a planar second surface 1212f opposite the first surface 1211 f. The first insulating layer 122f is formed on the first surface 1211f of the conductive substrate 121f, and a notch 1220f may be provided at a right corner of the root portion so that the conductive substrate 121f is exposed outside the first insulating layer 122 f. A through hole 1221f is further disposed on the first insulating layer 122f away from the tip of the notch 1220f, where the through hole 1221f is diagonally distributed to the notch 1220f, and the conductive substrate 121f is exposed outside the first insulating layer 122 f.
The conductive line 123f may include a first heat generating portion 1231f having a relatively high resistance in some embodiments, and the first heat generating portion 1231f may be formed on the surface of the first insulating layer 122f by silk-screen or electroplating. The first heat generating part 1231f may have an S-shape in some embodiments, and may include three heat generating arms A, B, C arranged in parallel at intervals in series in an S-shape and a V-shaped heat generating part D connected to the C-end of the heat generating arm so that the first heat generating part 1231f is uniformly distributed on the surface of the conductive substrate 121f as much as possible. The first heat generating portion 1231f may be made of one or more materials of silver, platinum, copper, nickel, and palladium in some embodiments. A first end of the first heat generating portion 1231f (i.e., an end of the heat generating portion D) corresponds to the through hole 1221f of the first insulating layer 122f, and is bonded to the conductive substrate 121f via the through hole 1221 f.
The conductive line 123f may include a first connection portion 1233f and a second connection portion 1234f that are less resistive than the first heat generating portion 1231f in some embodiments, and the first connection portion 1233f and the second connection portion 1234f may be made of one or more materials of gold, silver, copper in some embodiments. The first connection portion 1233f may be formed on the conductive substrate 121f exposed at the notch 1220f in some embodiments to be electrically connected with the conductive substrate 121f, and thus electrically connected with the first end of the first heating portion 1231f via the conductive substrate 121 f. Here, the current may be transferred to the first end of the first heat generating part 1231 via the first connection part 1233e and the conductive substrate 121e sequentially connected in series. And since the first connection portions 1233e are respectively distributed at diagonal positions of both ends of the conductive substrate 121e, the current may penetrate almost the entire length-direction diagonal line of the conductive substrate 121e during the transmission.
The conductive line 123f may include a first lead 1235f and a second lead 1236f in some embodiments, and the first lead 1235f and the second lead 1236f may be soldered to the first connection portion 1233f and the second connection portion 1234f, respectively.
The first protective layer 124f covers the outer surface of the first heat generating portion 1231f to prevent the first heat generating portion 1231f from directly contacting the aerosol-forming substrate 2 during use, thereby preventing the aerosol-forming substrate 2 from corroding the first heat generating portion 1231 f. The first protective layer 124f may be made of glass or ceramic material in some embodiments.
The second insulating layer 125f may be formed on the second surface 1212f of the conductive substrate 121f in some embodiments to improve the insulating property of the side of the second surface 1212f of the conductive substrate 121 f. The second protective layer 126f is formed on the surface of the second insulating layer 125f to prevent corrosion of the second insulating layer 125f by the aerosol-forming substrate 2 during use or to prevent harmful substances in the second insulating layer 125f from entering into the aerosol-forming substrate 2.
It is to be understood that the above examples only represent preferred embodiments of the present invention, which are described in greater detail and are not to be construed as limiting the scope of the invention.

Claims (19)

1. A heating device for inserting and heating an aerosol-forming substrate, the heating device comprising an elongated sheet-like conductive substrate, a first insulating layer, a second insulating layer, and at least one conductive trace; the conductive substrate comprises a first surface and a second surface opposite to the first surface, the first insulating layer is formed on the first surface, and the second insulating layer is formed on the second surface; the at least one conductive line is formed on the first insulating layer;
The at least one conductive trace includes a first end, a second end, a first heat generating portion, a first connecting portion, a second connecting portion, a first lead, and a second lead;
The first end is electrically connected with the conductive substrate, and the second end is electrically insulated from the conductive substrate;
the first end of the first heating part is electrically connected with the conductive substrate, and the second end of the first heating part is electrically insulated from the conductive substrate;
The resistances of the first connection portion and the second connection portion are smaller than the resistance of the first heating portion; the first connection part is mechanically and electrically combined with the first surface and is mechanically and electrically connected with the first end of the first heating part; the second connection part is formed on the first insulating layer and is mechanically and electrically connected with the second end of the first heating part;
A notch is arranged at one corner of the root part of the first insulating layer, and the first connecting part is mechanically and electrically connected with the conductive substrate at the notch;
The first and second leads are mechanically and electrically connected to the first and second connection portions, respectively.
2. The heating device of claim 1, wherein the first heat generating portion is made of one or more of silver, platinum, copper, nickel, and palladium.
3. The heating device of claim 1, wherein the first and second connection portions are made of one or more of gold, silver, copper.
4. The heating device of claim 1, wherein the heating device comprises a first protective layer overlying an outer surface of the first heat-generating portion.
5. The heating device of claim 1, wherein the heating device comprises a second protective layer formed on a surface of the second insulating layer.
6. A heating device according to claim 3, wherein the first connection portion and the second connection portion are made of the same material as the first heating portion and are integrally formed with the first heating portion.
7. The heating device of claim 1, wherein a through hole is further formed in the first insulating layer adjacent to the notch, and the first end of the first heat generating portion is further electrically connected to the conductive substrate through the through hole.
8. The heating device of claim 1, wherein the at least one conductive trace comprises a first connecting portion and a second connecting portion formed on the first insulating layer, the first connecting portion being mechanically and electrically connected to the first end, the second connecting portion being mechanically and electrically connected to the second end of the first heat generating portion; the at least one conductive trace includes a first lead and a second lead mechanically and electrically connected to the first connection portion and the second connection portion, respectively; the at least one conductive trace further includes a third connection portion that mechanically and electrically connects the first lead with the conductive substrate.
9. The heating device of claim 8, wherein the third connection portion is mechanically and electrically bonded to an underside edge of the conductive substrate.
10. The heating device of claim 1, wherein the at least one conductive trace comprises a first connection portion and a second connection portion formed on the first insulating layer, the first connection portion being mechanically and electrically connected to the first end, the second connection portion being mechanically and electrically connected to the second end; the first insulating layer is provided with two through holes, and the first connecting part is electrically connected with the conductive substrate through one of the two through holes; the first end of the first heating part is electrically connected with the conductive substrate through the other one of the two through holes.
11. The heating device of claim 1, wherein the at least one conductive trace comprises a first connection portion and a second connection portion having a lower electrical resistance than the first heating portion, the first connection portion being mechanically and electrically bonded to the first surface and mechanically and electrically connected to the first end; the second connection part is formed on the first insulating layer and is mechanically and electrically connected with the second end of the first heating part; the conductive substrate includes a planar second surface opposite the first surface; the at least one conductive trace includes a fourth connection portion mechanically and electrically bonded to the second surface; the at least one conductive trace includes a first lead and a second lead that are mechanically and electrically connected to the fourth connection portion and the second connection portion, respectively.
12. A heating device according to any one of claims 2 to 11, wherein the at least one electrically conductive line comprises a second heat generating portion in parallel with the first heat generating portion.
13. The heating device of claim 12, wherein the first heat-generating portion and the second heat-generating portion are each U-shaped, and the second heat-generating portion is located inside the first heat-generating portion, and both ends of the first heat-generating portion are mechanically and electrically connected to both ends of the second heat-generating portion, respectively.
14. The heating device of claim 1, wherein the first connection portion and the conductive substrate are connected in series or parallel between the first lead and the first end of the first heat generating portion.
15. The heating device of claim 1, wherein the first end of the first heat-generating portion is electrically connected to one end of the conductive substrate; the at least one conductive circuit includes a first connection portion electrically connected to the other end of the conductive substrate.
16. The heating device of claim 15, wherein the first ends of the first heat generating portions are electrically connected to the conductive substrate, and the first connection portions are electrically connected to the conductive substrate, respectively, at opposite corners in the longitudinal direction of the conductive substrate.
17. The heating device of claim 15, wherein the first heat generating portion comprises at least three parallel spaced apart heat generating arms connected in series in an S-shape and a V-shaped heat generating portion connected to an end of the heat generating arms.
18. A heated non-combustion toasting apparatus comprising a heating device as claimed in any one of claims 1 to 17.
19. The heated non-combustion baking apparatus of claim 18 comprising a power source, the conductive substrate electrically connecting a positive electrode of the power source to the first end.
CN202010365765.0A 2020-04-30 2020-04-30 Heating non-combustion baking device and heating device thereof Active CN111449291B (en)

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