CN111434725A - Polyimide film convenient for heat conduction and production process thereof - Google Patents
Polyimide film convenient for heat conduction and production process thereof Download PDFInfo
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Abstract
The invention discloses a polyimide film convenient for heat conduction, which comprises the following components in percentage by weight: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 400 parts of imide of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene. According to the production process of the polyimide film convenient for heat conduction, provided by the invention, a finished product can be prepared through simple steps of stirring, mixing, heating and washing, the finished product is low, and the production steps are simple.
Description
Technical Field
The invention belongs to the technical field of polyimide films, and particularly relates to a polyimide film convenient for heat conduction. Meanwhile, the invention also relates to a production process of the polyimide film convenient for heat conduction.
Background
The Polyimide (PI) film has the special properties of high strength, high toughness, wear resistance, high temperature resistance, corrosion resistance and the like, can meet the design requirements of light weight, thinness, shortness and smallness, and is a high-temperature-resistant insulating material with competitive advantages, the PI film has become one of important raw materials of electronic and motor products after more than 40 years of development, the electronic field is widely applied to soft boards, semiconductor packaging, photovoltaic (solar) energy sources, liquid crystal displays and the like, the motor field is mainly applied to spaceflight military industry, machinery, automobiles and the like, along with the development of the advanced science and technology and the vigorous development of industrial technology, the PI film has the physical property requirements of various products, and also needs to have the special properties of high strength, high toughness, wear resistance, high temperature resistance, corrosion resistance and the like, and can meet the design requirements of light weight, thinness, shortness and smallness, and the PI film has the increasing demand of novel application in the industries of high-order, L ED, electronic communication, photoelectric display and the like, and the PI film plays an increasingly important role in the industrial development.
When the existing polyimide film is used, the heat-conducting property is poor, and the polyimide film is used on an electronic element and an electric wire outer cladding layer, so that the aging of the electronic element and the electric wire is accelerated, the performance is reduced, and the service life is shortened.
Therefore, it is desirable to provide a polyimide film with good thermal conductivity and a process for producing the same.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a polyimide film convenient for heat conduction and a production process thereof.
In order to achieve the purpose, the invention provides the following technical scheme:
a polyimide film convenient for heat conduction is prepared from the following formula: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 400 parts of imide of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene.
Preferably, the formula of the polyimide film is as follows: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 200 parts of imidization products of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 150 parts of polytetrafluoroethylene, 15 parts of nanocellulose, 10 parts of polyester resin, 5 parts of graphene, 20 parts of p-phenylenediamine, 10 parts of diphenyl butanedione, 15 parts of dipentaerythritol, 20 parts of potassium tetraborate and 50 parts of polypropylene.
Preferably, the formula of the polyimide film is as follows: calculated according to the mass of the components: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 300 parts of imidization substance of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 160 parts of polytetrafluoroethylene, 18 parts of nanocellulose, 13 parts of polyester resin, 8 parts of graphene, 25 parts of p-phenylenediamine, 13 parts of diphenyl butanedione, 18 parts of dipentaerythritol, 25 parts of potassium tetraborate and 60 parts of polypropylene.
Preferably, the formula of the polyimide film is as follows: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 400 parts of imidization substance of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 180 parts of polytetrafluoroethylene, 20 parts of nanocellulose, 15 parts of polyester resin, 10 parts of graphene, 30 parts of p-phenylenediamine, 15 parts of diphenyl butanedione, 20 parts of dipentaerythritol, 30 parts of potassium tetraborate and 70 parts of polypropylene.
The invention also provides a production process of the polyimide film convenient for heat conduction, which comprises the following steps:
s1, material proportioning: 400 parts of imide of polyamic acid, 180 parts of polytetrafluoroethylene 150, 15-20 parts of nano-cellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene;
s2, putting 400 parts of imide of polyamic acid into a reaction kettle, adding 15-20 parts of dipentaerythritol, stirring, mixing, and heating for dehydration;
s3, adding 150-180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene into a reaction kettle, and continuously stirring and uniformly mixing to obtain slurry;
and S4, casting and heating the slurry to form a film, and washing to obtain the polyimide film convenient for heat conduction.
Preferably, the heating temperature in S2 is 100-120 ℃.
Preferably, the heating temperature in S4 is 200-300 ℃.
Preferably, the washing in S4 is performed by using distilled water.
The invention has the technical effects and advantages that: according to the polyimide film convenient for heat conduction, due to the use of the graphene, the polyester resin, the nanocellulose and the polytetrafluoroethylene, the prepared polyimide film has good heat conduction performance, heat dissipation of electronic elements and electric wires is facilitated, the service life of the electronic elements is prolonged, and the aging speed is reduced; according to the production process of the polyimide film convenient for heat conduction, provided by the invention, a finished product can be prepared through simple steps of stirring, mixing, heating and washing, the finished product is low, and the production steps are simple.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A polyimide film convenient for heat conduction is prepared from the following formula: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 200 parts of imidization products of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 150 parts of polytetrafluoroethylene, 15 parts of nanocellulose, 10 parts of polyester resin, 5 parts of graphene, 20 parts of p-phenylenediamine, 10 parts of diphenyl butanedione, 15 parts of dipentaerythritol, 20 parts of potassium tetraborate and 50 parts of polypropylene.
The invention also provides a production process of the polyimide film convenient for heat conduction, which comprises the following steps:
s1, material proportioning: 400 parts of imide of polyamic acid, 180 parts of polytetrafluoroethylene 150, 15-20 parts of nano-cellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene;
s2, placing 400 parts of imide of polyamic acid into a reaction kettle, adding 15-20 parts of dipentaerythritol, stirring, and heating for dehydration, wherein the heating temperature is 100-120 ℃;
s3, adding 150-180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene into a reaction kettle, and continuously stirring and uniformly mixing to obtain slurry;
s4, casting and heating the slurry to form a film, and washing to obtain the polyimide film convenient for heat conduction, wherein the heating temperature is 200-300 ℃, and the washing is washed by distilled water.
Example 2
A polyimide film convenient for heat conduction is prepared from the following formula: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 300 parts of imidization substance of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 160 parts of polytetrafluoroethylene, 18 parts of nanocellulose, 13 parts of polyester resin, 8 parts of graphene, 25 parts of p-phenylenediamine, 13 parts of diphenyl butanedione, 18 parts of dipentaerythritol, 25 parts of potassium tetraborate and 60 parts of polypropylene.
The invention also provides a production process of the polyimide film convenient for heat conduction, which comprises the following steps:
s1, material proportioning: 400 parts of imide of polyamic acid, 180 parts of polytetrafluoroethylene 150, 15-20 parts of nano-cellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene;
s2, placing 400 parts of imide of polyamic acid into a reaction kettle, adding 15-20 parts of dipentaerythritol, stirring, and heating for dehydration, wherein the heating temperature is 100-120 ℃;
s3, adding 150-180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene into a reaction kettle, and continuously stirring and uniformly mixing to obtain slurry;
s4, casting and heating the slurry to form a film, and washing to obtain the polyimide film convenient for heat conduction, wherein the heating temperature is 200-300 ℃, and the washing is washed by distilled water.
Example 3
A polyimide film convenient for heat conduction is prepared from the following formula: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 400 parts of imidization substance of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 180 parts of polytetrafluoroethylene, 20 parts of nanocellulose, 15 parts of polyester resin, 10 parts of graphene, 30 parts of p-phenylenediamine, 15 parts of diphenyl butanedione, 20 parts of dipentaerythritol, 30 parts of potassium tetraborate and 70 parts of polypropylene.
The invention also provides a production process of the polyimide film convenient for heat conduction, which comprises the following steps:
s1, material proportioning: 400 parts of imide of polyamic acid, 180 parts of polytetrafluoroethylene 150, 15-20 parts of nano-cellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene;
s2, placing 400 parts of imide of polyamic acid into a reaction kettle, adding 15-20 parts of dipentaerythritol, stirring, and heating for dehydration, wherein the heating temperature is 100-120 ℃;
s3, adding 150-180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene into a reaction kettle, and continuously stirring and uniformly mixing to obtain slurry;
s4, casting and heating the slurry to form a film, and washing to obtain the polyimide film convenient for heat conduction, wherein the heating temperature is 200-300 ℃, and the washing is washed by distilled water.
The components of examples 1 to 3 of the present invention are listed below:
| example 1 | Example 2 | Example 3 | |
| Imidization of polyamic acid | 200 portions of | 300 portions of | 400 portions of |
| Polytetrafluoroethylene | 150 portions of | 160 portions of | 180 portions of |
| Nano cellulose | 15 portions of | 18 portions of | 20 portions of |
| Polyester resin | 10 portions of | 13 portions of | 15 portions of |
| Graphene | 5 portions of | 8 portions of | 10 portions of |
| P-phenylenediamine | 20 portions of | 25 portions of | 30 portions of |
| Diphenyl butanedione | 10 portions of | 13 portions of | 15 portions of |
| Bispentaerythritol | 15 portions of | 18 portions of | 20 portions of |
| Potassium tetraborate | 20 portions of | 25 portions of | 30 portions of |
| Polypropylene | 50 portions of | 60 portions of | 70 portions of |
In summary, the following steps: according to the polyimide film convenient for heat conduction, due to the use of the graphene, the polyester resin, the nanocellulose and the polytetrafluoroethylene, the prepared polyimide film has good heat conduction performance, heat dissipation of electronic elements and electric wires is facilitated, the service life of the electronic elements is prolonged, and the aging speed is reduced; according to the production process of the polyimide film convenient for heat conduction, provided by the invention, a finished product can be prepared through simple steps of stirring, mixing, heating and washing, the finished product is low, and the production steps are simple.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (8)
1. A polyimide film convenient for heat conduction is characterized in that: the formula of the polyimide film is as follows: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 400 parts of imide of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene.
2. The polyimide film facilitating thermal conduction according to claim 1, wherein: the formula of the polyimide film is as follows: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 200 parts of imidization products of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 150 parts of polytetrafluoroethylene, 15 parts of nanocellulose, 10 parts of polyester resin, 5 parts of graphene, 20 parts of p-phenylenediamine, 10 parts of diphenyl butanedione, 15 parts of dipentaerythritol, 20 parts of potassium tetraborate and 50 parts of polypropylene.
3. The polyimide film facilitating thermal conduction according to claim 1, wherein: the formula of the polyimide film is as follows: calculated according to the mass of the components: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 300 parts of imidization substance of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 160 parts of polytetrafluoroethylene, 18 parts of nanocellulose, 13 parts of polyester resin, 8 parts of graphene, 25 parts of p-phenylenediamine, 13 parts of diphenyl butanedione, 18 parts of dipentaerythritol, 25 parts of potassium tetraborate and 60 parts of polypropylene.
4. The polyimide film facilitating thermal conduction according to claim 1, wherein: the formula of the polyimide film is as follows: calculating according to the mass parts: the polyimide film convenient for heat conduction comprises 400 parts of imidization substance of polyamic acid obtained by polymerization reaction of aromatic diamine and tetracarboxylic dianhydride, 180 parts of polytetrafluoroethylene, 20 parts of nanocellulose, 15 parts of polyester resin, 10 parts of graphene, 30 parts of p-phenylenediamine, 15 parts of diphenyl butanedione, 20 parts of dipentaerythritol, 30 parts of potassium tetraborate and 70 parts of polypropylene.
5. A process for producing a polyimide film facilitating heat conduction according to claim 1, wherein: the method comprises the following steps:
s1, material proportioning: 400 parts of imide of polyamic acid, 180 parts of polytetrafluoroethylene 150, 15-20 parts of nano-cellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 15-20 parts of dipentaerythritol, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene;
s2, putting 400 parts of imide of polyamic acid into a reaction kettle, adding 15-20 parts of dipentaerythritol, stirring, mixing, and heating for dehydration;
s3, adding 150-180 parts of polytetrafluoroethylene, 15-20 parts of nanocellulose, 10-15 parts of polyester resin, 5-10 parts of graphene, 20-30 parts of p-phenylenediamine, 10-15 parts of diphenyl butanedione, 20-30 parts of potassium tetraborate and 50-70 parts of polypropylene into a reaction kettle, and continuously stirring and uniformly mixing to obtain slurry;
and S4, casting and heating the slurry to form a film, and washing to obtain the polyimide film convenient for heat conduction.
6. The process for producing a polyimide film facilitating heat conduction according to claim 5, wherein: the heating temperature in the S1 is 100-120 ℃.
7. The process for producing a polyimide film facilitating heat conduction according to claim 5, wherein: the heating temperature in the S4 is 200-300 ℃.
8. The process for producing a polyimide film facilitating heat conduction according to claim 5, wherein: the washing in S4 is performed by using distilled water.
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| JP2002161244A (en) * | 2000-11-27 | 2002-06-04 | Jsr Corp | Thermally conductive film, liquid for forming the same, substrate provided with thermally conductive film, method for producing the substrate, heat radiating plate and heat radiating structure |
| CN104342850A (en) * | 2013-08-08 | 2015-02-11 | 珠海市红旌发展有限公司 | Polyimide film containing nanocrystal cellulose and preparation method thereof |
| CN104592950A (en) * | 2014-12-26 | 2015-05-06 | 苏州格瑞丰纳米科技有限公司 | High-thermal conductivity graphite alkenyl polymer heat conducting film and preparation method thereof |
| CN106045515A (en) * | 2016-06-01 | 2016-10-26 | 斯迪克新型材料（江苏）有限公司 | Preparation method of graphene-polyimide composite heat conducting film |
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| CN107652432A (en) * | 2017-09-28 | 2018-02-02 | 无锡顺铉新材料有限公司 | A kind of heat conduction Kapton |
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