CN111432109A

CN111432109A - Many cameras module

Info

Publication number: CN111432109A
Application number: CN202010372054.6A
Authority: CN
Inventors: 詹海明; 陈海潭
Original assignee: Hunan Kingcome Optoelectronics Co ltd
Current assignee: Hunan Kingcome Optoelectronics Co ltd
Priority date: 2020-05-06
Filing date: 2020-05-06
Publication date: 2020-07-17

Abstract

The invention discloses a multi-camera module which comprises a camera shooting assembly, a focusing assembly and a plurality of lens assemblies, wherein the camera shooting assembly comprises a flexible circuit board, an imaging chip, a base and optical filters, an accommodating space is formed between the base and the flexible circuit board, the imaging chip is arranged in the accommodating space and consists of a plurality of wafers, and each wafer and each optical filter are positioned on an optical axis of the lens assembly corresponding to the wafer and each optical filter. The multi-camera module disclosed by the invention forms the multi-camera module through the camera component, the focusing component and the plurality of lens components, and a plurality of single camera modules are not required to be fixed through the mounting bracket; through set up an imaging chip of constituteing by a plurality of wafers in inside, satisfy the formation of image demand of many camera modules, make the imaging chip of many camera modules as long as through once equipment can, the size of many camera modules accounts for than little, the laminating precision is high, and the required precision of equipment is low, has improved the yield, has reduced manufacturing cost.

Description

Many cameras module

Technical Field

The invention relates to the technical field of variable-focus imaging, in particular to a multi-camera module.

Background

With the rapid development of intelligent electronic devices, mobile terminals occupy a very important position in daily life of people, and the requirements of people on the mobile terminals are higher and higher from the technical aspect, the appearance aspect and the structure aspect. The camera is an indispensable part on the mobile terminal. At present, the market of the mobile terminal is directly influenced by the technical content of the function of the camera. In order to improve the shooting quality and increase diversified functions, it has become a great trend that terminal electronic equipment is provided with multiple cameras.

As shown in fig. 1, a sectional view of an assembly of a plurality of camera modules in the related art is shown. A plurality of camera modules pass through installing support 10 and install single camera module 20 on the terminal with the superimposed mode, and simultaneously, the flexible circuit board 30 of each camera module 20 need be made alone, each imaging chip 40 needs laminating equipment alone, however, camera module overall dimension can appear like this and account for than big and the equipment required precision is high, the complicated and high defect of maintenance degree of difficulty of technology, the outward appearance at terminal has not only been influenced seriously, and the cost of manufacture is also high.

Disclosure of Invention

In order to solve the above technical problems, embodiments of the present invention provide a multi-camera module with small size, low requirement for assembly precision, simple process, and low maintenance difficulty.

The technical scheme of the invention is realized as follows:

the utility model provides a many cameras module, is including making a video recording the subassembly, be fixed in make a video recording focus the subassembly on the subassembly and connect in focus a plurality of camera lens subassembly in the subassembly, the subassembly of making a video recording includes flexible circuit board, imaging chip, base and a plurality of being fixed in light filter on the base, the base is fixed in on the flexible circuit board and form an accommodation space between the two, imaging chip set up in the accommodation space, imaging chip comprises a plurality of wafers, each wafer and each light filter are located it corresponds the setting on the optical axis of camera lens subassembly.

Preferably, a plurality of assembly spaces are formed in the focusing assembly, and each lens assembly is correspondingly installed in each assembly space.

Preferably, the focusing assembly comprises a housing fixed on the base and a plurality of carriers arranged in the housing at intervals, and each lens assembly is correspondingly connected with one of the carriers.

Preferably, the carrier and the lens assembly form a detachable connection.

Preferably, the carrier is connected with the lens assembly through threads.

Preferably, the housing includes a support seat, a surrounding body surrounding the support seat and connected to the support seat, a separating strip connecting opposite two side edges of the surrounding body, and at least one connecting rib simultaneously connecting the separating strip and the support seat, the connecting rib divides a space in the surrounding body into a plurality of independent spaces, and each of the carriers is disposed in each of the spaces and fixed to the support seat.

Preferably, the housing is made of a cold-rolled steel sheet.

Preferably, the base comprises a base body and a plurality of mounting holes formed in the base body, the optical filter is fixed in the mounting holes, and the mounting holes are communicated with one another to form the accommodating space.

Preferably, the imaging chip is formed by one-time cutting.

Preferably, the number of the wafers and the number of the lens assemblies are respectively 2-4.

The multi-camera module provided by the embodiment of the invention forms the multi-camera module by the camera component, the focusing component fixed on the camera component and the plurality of lens components arranged in the focusing component, and a plurality of single camera modules are not required to be fixed by the mounting bracket at the same time, so that the size of the multi-camera module is greatly reduced; the imaging chip formed by a plurality of wafers is arranged in the multi-camera module, so that the imaging chip of the multi-camera module can be assembled once, and the optical axis deviation error caused by the fact that the imaging chip is required to be attached for multiple times when a plurality of single camera modules are assembled is avoided.

Drawings

Fig. 1 is a sectional view of an assembly of a plurality of camera modules in the related art;

FIG. 2 is an assembly view of a multi-camera module according to the present invention;

FIG. 3 is an assembly view of the multi-camera module of FIG. 2 at another angle;

FIG. 4 is an exploded view of the multi-camera module shown in FIG. 2;

FIG. 5 is a cross-sectional view of the multi-camera module shown in FIG. 2;

FIG. 6 is an assembled view of the flexible circuit board and the imaging chip shown in FIG. 5;

fig. 7 is an optical axis schematic diagram of the multi-camera module shown in fig. 2.

Detailed Description

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Please refer to fig. 2 to 5, wherein fig. 2 is a schematic structural diagram of a multi-camera module according to the present invention; FIG. 3 is an assembly view of the multi-camera module of FIG. 2 at another angle; FIG. 4 is an exploded view of the multi-camera module shown in FIG. 2; fig. 5 is a cross-sectional view of the multi-camera module shown in fig. 2. The multi-camera module comprises a camera component 1, a focusing component 3 fixed on the camera component 1 and a plurality of lens components 5 arranged in the focusing component 3, wherein the camera component 1 comprises a flexible circuit board 11, an imaging chip 13, a base 15 and a plurality of optical filters 17 fixed on the base 15, the base 15 is fixed on the flexible circuit board 11, an accommodating space 19 is formed between the base 15 and the flexible circuit board 11, the imaging chip 13 is arranged in the accommodating space 19, the imaging chip 13 consists of a plurality of wafers 131, each wafer 131 and each optical filter 17 are positioned on the optical axis of the lens component 5 correspondingly arranged with the wafer 131, a plurality of cameras are formed by the camera component 1, the focusing component 3 fixed on the camera component 1 and the plurality of lens components 5 arranged in the focusing component 3, and a plurality of single camera modules are not required to be fixed simultaneously by a mounting bracket, the overall size of the multi-camera module is greatly reduced; the imaging chip 13 formed by the wafers 131 is arranged inside to meet the imaging requirements of the multiple camera modules, so that the imaging chip 13 of the multiple camera modules can be assembled only once, and the optical axis offset error caused by the fact that the imaging chips need to be attached for multiple times when a plurality of single camera modules are assembled is avoided.

Fig. 6 is a schematic diagram of the assembly of the flexible circuit board and the imaging chip shown in fig. 5. The flexible circuit board 11 is T type, and the laminating of the one end that the width is big has imaging chip 13, and the end fixing of the one end that the width is little has connector 9, many camera modules pass through connector 9 is connected with external device.

The imaging chip 13 is composed of a plurality of wafers 131 cut from the wafer carrying disc at one time. The number of the wafers 131 is 2 to 4, that is, the number of the wafers 131 may be 2, 3, or 4. Preferably, in the present embodiment, there are 2 wafers 131, but in other embodiments, there may be more than four wafers 131.

The base 15 includes a seat body 151 and sets up in a plurality of mounting holes 153 on the seat body 151, the light filter 17 is fixed in the mounting hole 153, it is a plurality of communicate each other between the mounting hole 153, it is a plurality of the space that forms after the intercommunication between the mounting hole 153 does accommodation space 19, imaging chip 13 install in the accommodation space 19 and laminate in on the flexible circuit board 11.

The focusing assembly 3 is fixed on the seat body 151, a plurality of assembling spaces 31 are formed in the focusing assembly 3, and one lens assembly 5 is installed in each assembling space 31. Specifically, the focusing assembly 3 includes a housing 33 fixed on the seat body 151 and a plurality of carriers 35 disposed in the housing 33, one of the assembly spaces 31 is formed in each of the carriers 35, and one of the lens assemblies 5 is disposed in one of the assembly spaces 31, so as to form the multi-camera module. The casing 33 direct fixation of subassembly 3 of focusing is in on the base 15, the installing support that needs when having removed a plurality of single camera module equipment from also need not to relocate single camera module in the installing support through glue simultaneously, makes the maintenance become simpler, the effectual application that reduces spare part to reduced the overall dimension of many camera modules.

The shell 33 includes a support base 331 fixed on the base body 151, an enclosing body 333 enclosing the periphery of the support base 331 and connected to the support base 331, a separating strip 335 connecting two opposite sides of the enclosing body 333, and at least one connecting rib 357 connecting the separating strip 335 and the support base 331, wherein the connecting rib 357 divides the space in the enclosing body 333 into a plurality of independent spaces, and each of the carriers 35 is respectively arranged in each of the spaces and fixed to the support base 331. Therefore, the integrated shell 33 can fix a plurality of carriers 35, and then a plurality of lens assemblies 5 can be assembled, so that the assembly of a plurality of camera modules is realized.

Specifically, the focusing mechanism is a VCM (Voice Coil Motor). The housing 33 is a casing of VCM, and the carrier 35 is a VCM carrier. Specifically, in the present embodiment, the housing 33 is made of a cold-rolled steel plate, and has high strength and high hardness.

The number of the lens assemblies 5 is the same as that of the wafers 131, and the number of the lens assemblies is 2 to 4. One wafer 131 is correspondingly disposed on one lens assembly 5, and in this embodiment, there are 2 lens assemblies 5.

Each lens assembly 5 includes a lens barrel 51 and a lens 53 disposed in the lens barrel 51, and one lens barrel 51 is correspondingly connected to one carrier 35. Each wafer 131 and each filter 17 are located on the optical axis of the lens 53 disposed correspondingly thereto.

Specifically, in this embodiment, the lens barrel 51 and the carrier 35 are detachably connected. Preferably, the lens barrel 51 is connected to the carrier 35 by a screw thread. Of course, in other embodiments, the carrier 35 and the lens barrel 51 may also be formed by integral injection molding.

Please refer to fig. 7, which is a schematic view of optical axes of the multi-camera module shown in fig. 2. The optical axis of the lens 53 coincides with the optical axis of the corresponding filter 17 and the optical axis of the wafer 131. Because the imaging chip 13 of the multi-camera module is composed of a plurality of wafers 131, the wafers 131 are located on the same plane, so that optical axis deviation caused by the fact that a plurality of imaging chips need to be installed simultaneously when a plurality of single camera modules are installed is avoided, installation accuracy is effectively improved, and product yield is further improved.

Note that, in the case of mounting two lens assemblies as well, the length and width of the outer dimension of two single camera modules assembled by the mounting bracket are 21 × 11mm, while the length and width of the outer dimension of the multi-camera module in this embodiment are 17 × 8.5mm, which greatly reduces the overall size of the camera module.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. The utility model provides a many cameras module, its characterized in that, including the subassembly of making a video recording, be fixed in make a video recording focus the subassembly on the subassembly and connect in focus a plurality of lens subassembly in the subassembly, the subassembly of making a video recording includes flexible circuit board, imaging chip, base and a plurality of being fixed in light filter on the base, the base is fixed in on the flexible circuit board and between the two form an accommodation space, imaging chip set up in the accommodation space, imaging chip comprises a plurality of wafers, each wafer and each light filter are located the setting with it on the optical axis of lens subassembly.

2. The multi-camera module as claimed in claim 1, wherein the focusing assembly has a plurality of assembling spaces defined therein, and each of the lens assemblies is correspondingly mounted in each of the assembling spaces.

3. The multi-camera module as claimed in claim 1, wherein the focusing assembly comprises a housing fixed on the base and a plurality of carriers spaced apart from each other in the housing, and each lens assembly is connected to one of the carriers.

4. The multi-camera module of claim 3, wherein the carrier and the lens assembly form a detachable connection therebetween.

5. The multi-camera module of claim 4, wherein the carrier is threadably connected to the lens assembly.

6. The multi-camera module as claimed in claim 3, wherein the housing comprises a supporting base, a surrounding body surrounding the supporting base and connected to the supporting base, a separating strip connecting opposite sides of the surrounding body, and at least one connecting rib connecting the separating strip and the supporting base, the connecting rib dividing the space in the surrounding body into a plurality of independent spaces, and each carrier is disposed in each space and fixed to the supporting base.

7. The multi-camera module of claim 6, wherein the housing is made of cold rolled steel.

8. The multi-camera module as claimed in claim 1, wherein the base includes a base body and a plurality of mounting holes formed in the base body, the optical filter is fixed to the mounting holes, and the mounting holes are communicated with each other to form the accommodating space.

9. The multi-camera module of claim 1, wherein the imaging chip is formed by one-time cutting.

10. The multi-camera module of claim 1, wherein the number of the wafers and the number of the lens assemblies are 2-4 respectively.