CN111432049B - Mobile terminal shell and mobile terminal - Google Patents

Mobile terminal shell and mobile terminal Download PDF

Info

Publication number
CN111432049B
CN111432049B CN201910023199.2A CN201910023199A CN111432049B CN 111432049 B CN111432049 B CN 111432049B CN 201910023199 A CN201910023199 A CN 201910023199A CN 111432049 B CN111432049 B CN 111432049B
Authority
CN
China
Prior art keywords
layer
mobile terminal
metal
shell
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201910023199.2A
Other languages
Chinese (zh)
Other versions
CN111432049A (en
Inventor
蔡明�
施文明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN201910023199.2A priority Critical patent/CN111432049B/en
Publication of CN111432049A publication Critical patent/CN111432049A/en
Application granted granted Critical
Publication of CN111432049B publication Critical patent/CN111432049B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/324Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal matrix material layer comprising a mixture of at least two metals or metal phases or a metal-matrix material with hard embedded particles, e.g. WC-Me
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/341Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/343Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one DLC or an amorphous carbon based layer, the layer being doped or not
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C23C28/3455Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Signal Processing (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The application provides a mobile terminal shell and a mobile terminal, wherein the shell comprises a shell body, the shell body is a metal shell body, at least one gap is formed in the shell body in a cutting mode, and a non-conductive inorganic non-metal material layer is filled in the gap. In addition, the shell further comprises an attached film layer, the film layer comprises at least two layer-by-layer structures which are arranged on the shell in a laminated mode, the layer-by-layer structure which is closest to the shell is a bottoming layer, and the layer-by-layer structure which is farthest from the shell is a surface layer; the at least two layer of the layer structure is an insulating layer, and at least one layer of the at least two layer of the layer structure is a non-oxide layer. The film layer is manufactured by adopting the insulating layer, so that the electromagnetic signal penetration effect of the film layer is improved, and the attractive effect of the film layer on the mobile terminal shell is improved.

Description

Mobile terminal shell and mobile terminal
Technical Field
The application relates to the technical field of mobile terminals, in particular to a mobile terminal shell and a mobile terminal.
Background
At present, the development of the middle frame or the frame of the mobile phone is mainly based on metal structural parts, such as titanium stainless steel, aluminum and the like, and the middle frame or the frame of the mobile phone is used for supporting the strength and the rigidity of the mobile phone. However, when a metal shell is adopted, the existing metal material has an electromagnetic shielding effect, electromagnetic signals of a mobile phone antenna are difficult to pass through, and a seam must be formed on a complete metal middle frame or a complete metal frame to enable the electromagnetic signals of the antenna to pass through. In order to improve the aesthetic effect of the mobile phone, a film is coated on the housing of the mobile terminal to improve the appearance effect of the mobile phone of the mobile terminal, but the electromagnetic signal penetration effect of the film coated on the housing is poor in the prior art.
Disclosure of Invention
The application provides a mobile terminal shell and a mobile terminal, which are used for improving the electromagnetic signal penetration effect of the shell of the mobile terminal.
In a first aspect, a mobile terminal housing is provided, which includes a housing, the housing is a metal housing, and at least one slit is cut on the housing, and a non-conductive inorganic non-metallic material layer is filled in the slit. In addition, the shell further comprises an attached film layer, the film layer comprises at least two layer-by-layer structures which are arranged on the shell in a laminated mode, the layer-by-layer structure closest to the shell is a bottoming layer, and the layer-by-layer structure farthest from the shell is a surface layer; in order to improve the shielding effect, when the shielding structure is arranged, the at least two layer-by-layer structures are insulating layers, and at least one layer structure in the at least two layer-by-layer structures is a non-oxide layer. The insulating layer may be a single insulating layer or a mixture of insulating layers. The film layer is manufactured by adopting the insulating layer, so that the electromagnetic signal penetration effect of the film layer is improved, and the attractive effect of the film layer on the mobile terminal shell is improved.
When the primer layer is specifically arranged, different materials can be adopted for preparation, for example, the primer layer is an insulating metal compound layer or a mixed layer composed of metal and an insulating compound of the metal, or the primer layer is a semiconductor layer. When a metal oxide is used, zirconia or other oxides may be used. When the mixed layer is used, zirconium metal and an oxide of zirconium metal may be used.
When the primer layer is specifically provided, the primer layer may be formed on the housing by sputtering or ion plating.
When the film layer is prepared specifically, the film layer further comprises a middle layer arranged between the base layer and the surface layer.
Specifically, when the intermediate layer and the surface layer are provided, the intermediate layer and the surface layer are mixed layers of one or at least two of metal oxide, metal carbide, and metal nitride. The intermediate layer and the surface layer are formed of different materials.
When the above layers are specifically arranged, at least one of the base layer, the intermediate layer and the surface layer is a non-transparent insulating layer. Thereby forming an opaque film layer.
When the layers are specifically arranged, the ratio of metal atoms to nonmetal atoms in the metal compound, the metal oxide, the metal carbide and the metal nitride accords with the atomic ratio of combination, and the error is not more than 10%.
When the priming layer is prepared specifically, the thickness of the mixed layer is less than 200 nanometers. Thereby further improving the electromagnetic signal passing effect of the film layer.
Specifically, when the intermediate layer is prepared, the intermediate layer is at least one layer, and when the intermediate layer is at least two layers, at least two intermediate layers are stacked.
When the film layer is specifically prepared, besides the above layers, the film layer can also comprise a diamond-like carbon layer, and the diamond-like carbon layer is arranged on one surface of the surface layer, which is far away from the priming layer.
Specifically, when the diamond-like carbon layer is prepared, the content of SP3 bonds in the diamond-like carbon layer is not less than 30%.
When the film layer is prepared specifically, the film layer further comprises an anti-fingerprint film layer arranged on one surface of the surface layer, which is far away from the bottom layer. Improve the condition of leaving fingerprints on the film layer.
When the base coat layer, the intermediate layer and the surface layer are prepared, the resistance value of each layer is not less than 10 5 Omega. The insulating effect of each layer is ensured.
In a specific arrangement, a certain mixed region may exist in the range of 50nm among the base layer, the intermediate layer and the surface layer, and the mixed region does not influence the independence among the layers.
In a second aspect, a mobile terminal is provided, which includes the mobile terminal housing as described in any one of the above, and a display screen disposed on the mobile terminal housing. The film layer is manufactured through the insulating layer, so that the shielding effect of the film layer is improved, and meanwhile, the attractive effect of the film layer on the mobile terminal shell is improved.
Drawings
Fig. 1 is a schematic layer structure diagram of a mobile terminal housing according to an embodiment of the present application;
fig. 2 is a schematic diagram of another layer structure of a mobile terminal housing provided in an embodiment of the present application;
fig. 3 is a schematic diagram of another layer structure of a mobile terminal housing according to an embodiment of the present application;
fig. 4 is a schematic diagram of another layer structure of a mobile terminal housing provided in an embodiment of the present application;
fig. 5 is a schematic diagram of another layer structure of a mobile terminal housing according to an embodiment of the present application;
fig. 6 is a schematic diagram of another layer structure of a mobile terminal housing according to an embodiment of the present application;
fig. 7 is a schematic diagram of another layer structure of a mobile terminal housing according to an embodiment of the present application;
fig. 8 is a schematic diagram of another layer structure of a mobile terminal housing according to an embodiment of the present application;
fig. 9 is a schematic diagram of another layer structure of a mobile terminal housing according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
For convenience of understanding the mobile terminal housing provided in the embodiments of the present application, an application scenario of the mobile terminal housing is described below, where the mobile terminal housing is applied to a mobile terminal, such as a mobile phone, a tablet computer, a watch, or a bracelet. And in a mobile terminal, a portion of the mobile terminal case is used as a radiator of an antenna of the mobile terminal. Therefore, the shell of the mobile terminal shell adopts a metal shell, and at least one gap is formed in the metal shell. In order to ensure the integrity of the housing, the housing is filled with an insulating substance. In order to ensure the integrity and the attractive effect of the mobile terminal shell, a film layer is attached to the outer surface of the shell to improve the appearance effect of the mobile terminal, but when the film layer is arranged, the penetrating effect of the electromagnetic signal of the film layer is ensured.
When the shell is specifically arranged, the shell and the filled material can be different materials, for example, the metal shell is made of stainless steel, titanium alloy, amorphous alloy, aluminum alloy, magnesium alloy, zinc alloy or a simple substance or alloy coating on the surface of the alloy, and the insulating material filled in the gap can be selected from zirconia ceramic, alumina ceramic, sapphire, glass and other materials or inorganic non-metal coatings formed by other methods.
When the film layer is arranged, the film layer comprises at least two films which are arranged on the shell in a stacking way as shown in figure 1The structure of layers, wherein, the layer of layer structure closest to the shell is the bottom layer 20, and the layer of layer structure furthest from the shell is the surface layer 40; at least two layers of the layer structure are insulating layers, and at least one layer of the layer structure is a non-oxide layer. In the setting, the primer layer 20 is disposed on the housing and covers the housing and the insulating material 10 filled in the gap. When the surface layer 40 is provided, the surface layer 40 is covered on the primer layer 20. When the priming layer 20 and the surface layer 40 are arranged, the insulating layer is adopted to ensure the insulating effect of the whole film layer, and in the application, the insulating layer can be made of a single material or a mixture. However, in any case, it is necessary to ensure that the resistance values of the primer layer 20 and the surface layer 40 are not less than 10 5 Omega to guarantee the insulating effect of each layer, thereby make whole rete wholly insulating, in order to guarantee electromagnetic signal's penetrability. Of course, when the film layer is disposed, the intermediate layer 30 may be further added between the bottom layer 20 and the surface layer 40, and the intermediate layer 30 is also an insulating layer made of the insulating material 10, and the resistance value of the insulating layer is not lower than 10 5 Omega. Of course, special functional layer structures can be added according to needs.
In the specific preparation of each layer, the insulating metal compound may be prepared, such as metal oxide or other materials, such as metal nitride, metal carbide, or a mixture of materials, such as: metal and its oxide, the mixture of metal oxide and metal nitride, the mixture of metal oxide and metal carbide, etc. When the mixture is adopted, the proportion of each substance in the mixture is not limited, the mixture can be mixed according to the actual requirement, and only the resistance value of the formed mixed layer is ensured to be not less than 10 5 And omega, ensuring the insulation effect.
For the convenience of understanding the above-mentioned film layers provided in the embodiments of the present application, the following detailed description is made with reference to the accompanying drawings.
As shown in fig. 1 and 2, the structure shown in fig. 1 and 2 only shows a portion of the film layer covering the insulating material 10 filled in the gap of the case. In filling the gap, a seamless material composed of 17-4 stainless steel and zirconia, that is, a mixture composed of 17-4 stainless steel and zirconia, may be selected, and in the embodiment of the present application, the mixing ratio of the mixture is not limited, and the two substances may be mixed according to the actual requirement. Or zirconia ceramics can be used as the material for filling the gap.
When the primer layer 20 is disposed, the primer layer 20 is an insulating layer, and the insulating layer is a metal compound layer or a mixed layer composed of an insulating compound of a metal and a metal, and when a mixed layer is employed, the mixed layer includes, but is not limited to, materials such as a metal and an oxide thereof, a metal and a carbide thereof, and a metal and a nitride thereof. In the structure shown in fig. 1, metal zirconium and zirconium oxide are used as the primer layer 20. During specific preparation, (1) a PVD process is adopted, and zirconium is selected as a target material. Among them, PVD (Physical Vapor Deposition) is a method of vaporizing a coating material by a Physical method (e.g., sputtering) and depositing the material on a substrate surface to form a film. In addition to conventional sputter deposition techniques, various ion beam deposition, ion plating and ion beam assisted deposition techniques have been developed vigorously over the last 30 years. The deposition types include magnetron sputtering, ion plating and the like, or other vapor deposition methods such as chemical vapor deposition.
(2) And opening the furnace to wash the target for half an hour to remove impurities such as oxides on the surface of the target, and simultaneously cleaning the vacuum in the furnace to reduce gas impurities.
(3) The zirconium target was turned on while oxygen was turned on for 3 minutes, and a mixture layer of ultra-thin zirconium oxide and discontinuous zirconium metal was finally formed. When the zirconium oxide is formed, the atomic ratio of zirconium atoms to oxygen atoms in the formed zirconium oxide is as follows: 1: 1.9-1: 2.1. In the specific preparation, the adjustment can be carried out according to the needs, for example, the atomic ratio between zirconium atoms and oxygen atoms in the formed oxide is: 1:1.9, 1:2, 1:2.1 and the like are in any ratio of 1: 1.9-1: 2.1. Specifically, the ratio is formed by controlling the ratio of zirconium atoms to oxygen atoms at the time of injection, and metal zirconium oxide are directly formed at the time of formation, thereby forming discontinuous metal zirconium and zirconium oxide. And the ratio between the formed metal zirconium and the zirconia may be adjusted as needed, which is not limited in this application.
Of course, the above-mentioned atomic ratio is only a specific example, and when other metals are used, the atomic ratio of the formed oxides is different, for example, when aluminum oxide is used, the atomic ratio of the metal atoms to the oxygen atoms is 1:1.4 to 1:1.6, and when zinc oxide is used, the atomic ratio of the metal atoms to the oxygen atoms is 1:0.98 to 1: 1.1. However, when an insulating compound containing metal atoms such as metal oxide, metal carbide, or metal nitride is used, the atomic ratio of metal atoms to nonmetal atoms corresponds to the atomic ratio of the compound, and the error is less than 10%.
With continued reference to fig. 1, in the primer layer 20 provided in the embodiments of the present application, an ultra-thin layer of a mixture of zirconium oxide and discontinuous zirconium metal is formed, the ultra-thin layer being less than 200 nm thick. That is, the thickness of the primer layer 20 provided in the embodiment of the present application is less than 200 nm, such as 190 nm, 150 nm, 100 nm, 50nm, and so on, thereby avoiding a continuous condition occurring when forming zirconium metal, and further improving the electromagnetic signal passing effect of the film layer.
With continuing reference to fig. 1 and 2, it can be seen from fig. 1 and 2 that the prepared film layer includes an intermediate layer 30, the intermediate layer 30 may be one of metal oxide, metal carbide, and metal nitride, or a mixed layer of at least two of them, and the number of layers is at least one, and in the case of at least two layers, at least two intermediate layers are stacked. The intermediate layer 30 as shown in fig. 1 and 2 is two layers each. However, the intermediate layer 30 provided in the embodiment of the present application is not limited to two layers, and may be a different number of layers, such as one layer, three layers, four layers, and the like, or certainly, the intermediate layer 30 may not be provided. With continued reference to fig. 1 and 2, the intermediate layer 30 includes an oxide layer, a mixed layer of an oxide and a carbide, or a mixed layer of an oxide and a nitride, which are stacked, and the oxide layer is provided on the primer layer 20. The intermediate layer 30 provided in the embodiments of the present application is described below by taking fig. 1 and fig. 2 as an example.
For convenience of description, the intermediate layers 30 shown in fig. 1 and 2 are respectively named as a first intermediate layer 32 and a second intermediate layer 31, wherein the first intermediate layer 32 is covered on the base layer 20, and the second intermediate layer 31 is covered on the first intermediate layer 32 and is interposed between the first intermediate layer 32 and the surface layer 40. Specifically, when the first intermediate layer 32 is prepared, the first intermediate layer 32 is a zirconia layer, and after the primer layer 20 is prepared, the oxygen content is increased to form a final atomic ratio of 1: 1.9-1: 2.1 of a zirconia insulating film. As can be seen from the above preparation process, when the primer layer 20 and the first intermediate layer 32 are prepared, continuous preparation is possible, a mixed layer (primer layer 20) of zirconium metal and zirconium oxide can be formed by controlling the addition amount of oxygen, and then the content of oxygen is increased to form a zirconium oxide layer (first intermediate layer 32), and by continuous preparation, the effect of the connection between the first intermediate layer 32 and the primer layer 20 is increased.
After the first intermediate layer 32 is prepared, the preparation of the second intermediate layer 31 is started, the second intermediate layer 31 is an insulating layer which is a mixture of zirconia and zirconium carbide, and during the preparation, acetylene gas is firstly turned on to provide carbon atoms, and finally, the atomic ratio of 1: 1.9-1: 2.1, and forming a mixture of zirconium oxide and zirconium oxide in an atomic ratio close to 1:1, and the final product is a mixture of these two materials. When the mixture is formed, the ratio of the added zirconium atoms, oxygen atoms and carbon atoms is controlled. The ratio of the formed zirconia to the zirconium carbide is not limited in the embodiments of the present application, and different ratios may be selected according to actual needs.
When the surface layer 40 is formed, the surface layer 40 covers the second intermediate layer 31, and the surface layer 40 may be a metal oxide layer, a metal nitride layer, or a metal nitride layer. Such as zirconia, zirconium carbide or zirconium nitride. In the structure shown in fig. 1, the surface layer 40 is a zirconium carbide layer. During specific preparation, oxidation is closed, the acetylene content is increased, and finally the atomic ratio is close to 1:1 zirconium carbide layer. The method comprises the following steps of 1:0.9, 1:1. 1: 1.2, etc. in different proportions.
As can be seen from the above description, in the preparation of each layer of the above film layer provided in the embodiment of the present application, each layer is formed by using a continuous preparation method, and therefore, there may be some mixed states between adjacent layers in the nanometer level between each layer, and also within the protection scope of the embodiment of the present application, for example, there may be a certain mixed region in the 50nm range, and the mixed state between the material of the primer layer 20 and the material of the first intermediate layer 32 exists between the primer layer 20 and the first intermediate layer 32, and the mixed state between the material of the first intermediate layer 32 and the material of the second intermediate layer 31 exists between the first intermediate layer 32 and the second intermediate layer 31, and the mixed region does not affect the independence between each layer.
At least one of the prepared primer layer 20, intermediate layer 30 and surface layer 40 is a non-transparent insulating layer. For example, the primer layer 20 is opaque, the intermediate layer 30 (the first intermediate layer 32 or the second intermediate layer 31) is opaque, or the surface layer 40 is opaque. Of course, two or more layers can be non-transparent layer structures, and the specific setting can be set according to actual needs.
In addition, after the surface layer 40 is prepared, other film layers may be further included in the film layer provided in the embodiment of the present application, as shown in fig. 2, the film layer may further include a diamond-like carbon layer 50, and the diamond-like carbon layer 50 is disposed on a side of the surface layer 40 facing away from the primer layer 20. In the specific preparation, the diamond-like carbon layer 50 is formed on the surface layer 40. And the SP3 bond content in the diamond-like carbon layer 50 is not less than 30% when the diamond-like carbon layer 50 is specifically prepared.
Of course, in addition to the above-described film layer, the film layer may further include an anti-fingerprint film layer disposed on a side of the surface layer 40 facing away from the base layer 20 to improve the condition of leaving fingerprints on the film layer. The anti-fingerprint film layer can be made of materials known in the prior art, such as an AF film, and the AF film can be formed in an evaporation or magnetron sputtering coating mode. And when the anti-fingerprint film layer is specifically prepared, when the diamond-like carbon layer 50 is included, the anti-fingerprint film layer is prepared on the side of the diamond-like carbon layer 50, which faces away from the bottom layer 20.
Referring to fig. 1 and 2 together, as can be seen from fig. 1 and 2, the film is finally formed: (1) the bottom layer 20: a layer of a mixture of ultrathin zirconium oxide and discontinuous zirconium metal; (2) first intermediate layer 32: the atomic ratio is close to 1:2, a zirconia insulating film; (3) second intermediate layer 31: the atomic ratio is close to 1:2, and a mixture of zirconium oxide and zirconium oxide forming an atomic ratio close to 1:1, the final result being a mixture of these two materials; (4) the surface layer 40 is a layer with an atomic ratio close to 1:1, and (5) a diamond-like carbon layer 50 formed on the basis of the zirconium carbide.
When the film layer is formed, compared with the prior art, each layer structure of the film layer is made of an insulating material 10, and the resistance value is not lower than 10 5 Omega, the insulation of the whole film system is realized, and the effect of transmitting electromagnetic waves is improved.
Referring to fig. 3 and 4, the insulating material 10 filled in the gap in the housing may be an insulating material 10 composed of titanium alloy and alumina, i.e. a mixture composed of titanium alloy and alumina. Alumina ceramics may be used alone as the insulating material 10.
The film layer structure shown in fig. 3 and 4 includes a structure of the primer layer 20, the intermediate layer 30, and the surface layer 40, similar to the layer structure of fig. 1 and 2. The difference lies in the different materials prepared. The following description will be made with reference to fig. 3 and 4, respectively.
With continued reference to fig. 3, the primer layer 20 employs an oxide layer, such as zirconia, as the primer layer 20. During preparation, a PVD process is adopted to select zirconium as a target material. And opening the furnace to wash the target for half an hour to remove impurities such as oxides on the surface of the target, and simultaneously cleaning the vacuum in the furnace to reduce gas impurities. And starting the zirconium target, simultaneously starting oxygen, and increasing the oxygen content to form a product with the final atomic ratio close to 1: 1.9-1: 2.1 zirconium oxide insulating film. For example, the atomic ratio between zirconium atoms and oxygen atoms in the formed oxide is: 1:1.9, 1:2, 1:2.1 and the like are in any ratio of 1: 1.9-1: 2.1. Specifically, the ratio is formed by controlling the ratio of zirconium atoms to oxygen atoms at the time of injection, and the metal zirconium oxide is directly formed at the time of formation.
With continued reference to fig. 3, the thickness of the primer layer 20 provided in the embodiment of the present application is less than 200 nm, such as 190 nm, 150 nm, 100 nm, 50nm, and so on, to improve the electromagnetic signal passing effect of the film layer.
In forming the intermediate layer 30, the intermediate layer 30 may be selected from different layer structures, such as an insulating layer or an insulating layer, and specifically may be an oxide layer, a mixed layer of an oxide and a carbide, a mixed layer of an oxide and a nitride, or the like. In the present application, at least one of the primer layer 20, the surface layer 40, and the intermediate layer 30 is a non-oxide layer. Therefore, in providing the intermediate layer 30, as shown in fig. 3, a mixed layer of an oxide and a carbide is employed. In specific preparation, acetylene gas is firstly started to provide carbon atoms, and finally the atomic ratio of 1: 1.9-1: 2.1, and forming a mixture of zirconium oxide and zirconium oxide in an atomic ratio close to 1:1, and a mixture of the two materials is ultimately formed. In the formation of the above mixture, the ratio of the added zirconium atom, oxygen atom and carbon atom is controlled. The ratio of the formed zirconia to the zirconium carbide is not limited in the embodiments of the present application, and different ratios may be selected according to actual needs.
When the surface layer 40 is formed, the surface layer 40 covers the second intermediate layer 31, and the surface layer 40 may be a metal oxide layer, a metal nitride layer, or a metal nitride layer. Such as zirconia, zirconium carbide or zirconium nitride. In the structure shown in fig. 1, the surface layer 40 is a zirconium carbide layer. During specific preparation, oxidation is closed, the acetylene content is increased, and finally the atomic ratio is close to 1:1 zirconium carbide layer. The method comprises the following steps of 1:0.9, 1:1. 1: 1.2, etc. in different proportions.
As can be seen from the above description, in the preparation of each layer of the above film layer provided in the embodiments of the present application, each layer is formed by using a continuous preparation method, and therefore, there may be some mixed state between adjacent layers in the nanometer scale between each layer, which is also within the scope of the embodiments of the present application. If the mixture state of the primer layer 20 and the first intermediate layer 32 is different between the primer layer 20 and the first intermediate layer 32, or if the mixture state of the first intermediate layer 32 and the second intermediate layer 31 is different between the first intermediate layer 32 and the second intermediate layer 31, the mixture state of the first intermediate layer 32 and the second intermediate layer 31 may be different.
At least one of the prepared primer layer 20, intermediate layer 30 and surface layer 40 is a non-transparent insulating layer. Such as using a primer layer 20 that is non-transparent, or an intermediate layer 30 (first intermediate layer 32 or second intermediate layer 31) that is non-transparent, or a surface layer 40 that is non-transparent. Of course, two or more layers can be non-transparent layer structures, and the specific setting can be set according to actual needs.
In addition, after the surface layer 40 is prepared, other film layers may be further included in the film layer provided in the embodiment of the present application, as shown in fig. 4, the film layer may further include a diamond-like carbon layer 50, and the diamond-like carbon layer 50 is disposed on a side of the surface layer 40 facing away from the primer layer 20. In the specific preparation, the diamond-like carbon layer 50 is formed on the surface layer 40. And when the diamond-like carbon layer 50 is specifically prepared, the content of SP3 bonds in the diamond-like carbon layer 50 is not less than 30%.
Of course, in addition to the above-described film layer, the film layer may further include an anti-fingerprint film layer disposed on a side of the surface layer 40 facing away from the base layer 20 to improve the condition of leaving fingerprints on the film layer. The anti-fingerprint film layer can be made of materials known in the prior art, such as an AF film. And when the anti-fingerprint film layer is specifically prepared, when the diamond-like carbon layer 50 is included, the anti-fingerprint film layer is prepared on the side of the diamond-like carbon layer 50, which faces away from the bottom layer 20.
Referring to fig. 3 and 4 together, as can be seen from fig. 3 and 4, the film is finally formed: (1) the bottom layer 20: the atomic ratio is close to 1:2, a zirconia insulating film; (2) intermediate layer 302: the atomic ratio is close to 1:2, and a forming agent having an atomic ratio of approximately 1:1, the final resulting mixture of these two materials; (3) the surface layer 40 is a film with an atomic ratio close to 1:1, or a diamond-like carbon layer 50 on a zirconium carbide basis.
Referring to fig. 5, fig. 5 shows another film layer. In fig. 5, the insulating material 10 filled in the gap in the case may be a seamless material composed of a zirconium-based amorphous alloy and zirconium oxide, that is, a mixture composed of a zirconium-based amorphous alloy and zirconium oxide. The insulating material 10 may be made of zirconia ceramics alone.
With continued reference to fig. 5, in the structure shown in fig. 5, the structure and the preparation method of the bottom layer 20 are the same as those of the bottom layer 20 shown in fig. 1, and are not repeated herein. The only difference is that the bottom layer 20 of fig. 5 is made of titanium metal, i.e. the insulating layer is formed by a mixture of metal titanium and titanium oxide. And the atomic ratio of the titanium oxide is as follows: 1: 1.9-1: 2.1. In the specific preparation, the adjustment can be carried out according to the needs, for example, the atomic ratio between the titanium atom and the oxygen atom in the formed oxide is as follows: 1:1.9, 1:2, 1:2.1 and the like are in any ratio of 1: 1.9-1: 2.1. Specifically, the ratio is formed by controlling the ratio of titanium atoms to oxygen atoms at the time of injection, and the metal titanium oxide are directly formed at the time of formation, thereby forming discontinuous metal titanium and titanium oxide. And the ratio between the formed metallic titanium and the titanium oxide can be adjusted as needed, which is not limited in this application.
With continued reference to fig. 5, in the prepared intermediate layer 30, two intermediate layers 30, a first intermediate layer 32 and a second intermediate layer 31, respectively, are included. The preparation method can be referred to the preparation method in fig. 1, and the only difference is that the first intermediate layer 32 is formed by titanium oxide, and the atomic ratio of titanium oxide is: 1: 1.9-1: 2.1. In the specific preparation, the adjustment can be carried out according to the needs, for example, the atomic ratio between the titanium atom and the oxygen atom in the formed oxide is as follows: 1:1.9, 1:2, 1:2.1 and the like are in any ratio of 1: 1.9-1: 2.1. In forming the second intermediate layer 31, a mixture of titanium oxide and titanium nitride is used as the second intermediate layer 31 in the second metal layer. During specific preparation, nitrogen gas is started, and finally the atomic ratio is close to 2: 1, and a titanium oxide having an atomic ratio of approximately 1:1, and a mixture of the two materials is finally formed.
When the surface layer 40 is formed, the surface layer 40 covers the second intermediate layer 31, and the surface layer 40 may be a metal oxide layer, a metal nitride layer, or a metal nitride layer. Such as titanium oxide, titanium carbide or titanium nitride. In the structure shown in fig. 5, the surface layer 40 is a titanium nitride layer. During preparation, oxidation is closed, nitrogen content is increased, and finally the atomic ratio is close to 1:1 titanium nitride layer. Such as 1:0.9, 1:1. 1: 1.2, etc. in different proportions.
Similarly, a diamond-like carbon layer and an anti-fingerprint layer may be added to the film layer shown in fig. 5, which is not described herein again.
With continued reference to fig. 5, the film layer is ultimately formed: (1) the bottom layer 20: a mixture layer of ultra-thin titanium oxide and discontinuous titanium metal; (2) first intermediate layer 32: the atomic ratio is close to 2: 1 titanium oxide insulating film; (3) second intermediate layer 31: the atomic ratio is close to 2: 1, and a titanium oxide having an atomic ratio of approximately 1:1, which ultimately forms a mixture of the two materials; (4) the surface layer 40 is a layer with an atomic ratio close to 1:1 with titanium nitride.
Referring to fig. 6, fig. 6 shows another film, and the insulating material 10 filled in the gap of the case may be a seamless material composed of aluminum alloy and sapphire, that is, the insulating material 10 is composed of a mixture of aluminum alloy and sapphire. Sapphire alone may be used as the insulating material 10.
With continued reference to fig. 6, the film includes a primer layer 20, a middle layer 30, and a surface layer 40, wherein the number of the middle layers 30 is 1.
The bottom layer 20 is made of titanium oxide, and the preparation method can refer to the preparation method corresponding to the structure in fig. 5, and only the addition of oxygen needs to be controlled, and the atomic ratio of the titanium oxide to be finally formed is as follows: 1: 1.9-1: 2.1. During the specific preparation, the adjustment can be carried out according to the needs, for example, the atomic ratio between the titanium atom and the oxygen atom in the formed oxide is as follows: 1:1.9, 1:2, 1:2.1, and the like are in a ratio of 1:1.9 to 1: 2.1.
With continued reference to fig. 6, in forming the intermediate layer 30, the intermediate layer 30 is only one layer and a mixture of titanium oxide and titanium nitride is used. And (3) starting nitrogen gas to finally form a mixture with the atomic ratio close to 2: 1, and a titanium oxide having an atomic ratio of approximately 1:1, and a mixture of the two materials is finally formed.
The surface layer 40 covers the intermediate layer 30 when the surface layer 40 is formed, and the surface layer 40 may be a metal oxide layer, a metal nitride layer, or a metal carbide layer. Such as titanium oxide, titanium carbide or titanium nitride. In the structure shown in fig. 5, the surface layer 40 is a titanium nitride layer. During preparation, oxidation is stopped, the nitrogen content is increased, and finally the atomic ratio is close to 1:1 titanium nitride layer. The method comprises the following steps of 1:0.9, 1:1. 1: 1.2, etc. in different proportions.
Similarly, a diamond-like carbon layer and an anti-fingerprint layer may be added to the film layer shown in fig. 6, which is not described herein again.
With continued reference to fig. 6, the film layer is ultimately formed: (1) the bottom layer 20: the atomic ratio is close to 2: 1 titanium oxide insulating film; (3) intermediate layer 301: the atomic ratio is close to 2: 1, and a titanium oxide having an atomic ratio of approximately 1:1, which ultimately forms a mixture of the two materials; (4) the surface layer 40 is a layer with an atomic ratio close to 1:1 titanium nitride.
As shown in FIG. 7, FIG. 7 shows another film, the insulating material 10 filled in the gap of the housing can be a seamless material composed of 17-4 stainless steel and zirconia, i.e. the insulating material 10 is composed of a mixture of 17-4 stainless steel and zirconia. (2) Zirconia ceramics alone is used as the insulating material 10.
With continued reference to fig. 7, the primer layer 20 is made of a mixture of zirconium metal and zirconium oxide, which can be specifically referred to the description in fig. 1 and will not be described herein again.
The intermediate layer 30 of the film is a layer, and the intermediate layer 30 uses an oxide as the intermediate layer 30, which can be referred to the material and preparation of the first intermediate layer in fig. 1.
The surface layer 40 of the film layer is made of a mixture of oxide and nitride, namely a mixture of zirconia and zirconium nitride, and during specific preparation, nitrogen gas is started to finally form a mixture with an atomic ratio close to 1:2, the zirconium oxide comprises the following components in atomic ratio: zirconia in any ratio of 1:1.9, 1:2, 1:2.1 and the like in the range of 1:1.9 to 1:2.1, and the zirconium oxide is formed in a ratio of 1:1, such as 1:0.9, 1:1. 1: 1.2, etc. in different proportions. And a mixture of the two materials is finally formed, and the mixing ratio is not limited herein.
In addition, the thickness of the two mixed materials can be adjusted and increased, and one of red, orange, yellow, green, blue, purple and other colors can be selectively deposited in sequence, so that film layers with different colors can be formed.
Similarly, a diamond-like carbon layer and an anti-fingerprint layer may be added to the film layer shown in fig. 7, which is not described herein again.
With continued reference to fig. 7, the film layer is ultimately formed: (1) the base layer 20: a mixture layer of ultra-thin titanium oxide and discontinuous titanium metal; (2) intermediate layer 301: the atomic ratio is close to 2: 1 titanium oxide insulating film; (3) surface layer 40: the atomic ratio is close to 2: 1, and a titanium oxide having an atomic ratio of approximately 1:1, and a mixture of the two materials is finally formed.
Referring to fig. 8 and 8, another film is shown, and the insulating material 10 filled in the gap of the housing may be a seamless material composed of 17-4 stainless steel and zirconia, i.e., the insulating material 10 is composed of a mixture of 17-4 stainless steel and zirconia. Zirconia ceramics alone may be used as the insulating material 10.
With continued reference to fig. 8, the film includes a primer layer 20 and a surface layer 40. Wherein, the bottom layer 20 is made of zirconium oxide, and during preparation, zirconium is selected as a target material by adopting a PVD (physical vapor deposition) process. And opening the furnace to wash the target for half an hour, removing impurities such as oxides on the surface of the target, and simultaneously cleaning the vacuum in the furnace to reduce gas impurities. And starting the zirconium target and oxygen at the same time, increasing the oxygen content, and forming a product with the final atomic ratio close to 1:2. Wherein the atomic ratio between zirconium atoms and oxygen atoms in the formed oxide is as follows: 1:1.9, 1:2, 1:2.1 and the like are in any ratio of 1: 1.9-1: 2.1.
The surface layer 40 is made of a mixture of zirconium nitride and zirconium oxide, and during preparation, nitrogen gas is started to finally form a mixture with an atomic ratio close to 1:2, the zirconium oxide comprises the following components in atomic ratio: zirconia in any ratio of 1:1.9, 1:2, 1:2.1 and the like in the range of 1:1.9 to 1:2.1, and the zirconium oxide is formed in a ratio of 1:1, such as 1:0.9, 1:1. 1: 1.2, etc. in different proportions. And a mixture of the two materials is finally formed, and the mixing ratio is not limited herein.
In addition, the thickness of the two mixed materials can be adjusted and increased, and one of the colors such as red, orange, yellow, green, blue and purple can be selectively deposited in sequence, so that film layers with different colors can be formed.
Similarly, a diamond-like carbon layer and an anti-fingerprint layer may be added to the film layer shown in fig. 8, which are not described herein again.
With continued reference to fig. 8, the film layer is ultimately formed: the bottom layer 20: the atomic ratio is close to 2: 1 titanium oxide insulating film; (3) surface layer 40: the atomic ratio is close to 2: 1, and a titanium oxide having an atomic ratio of approximately 1:1, and a mixture of the two materials is finally formed.
Referring to fig. 9, fig. 9 shows another film layer structure in which a primer layer is formed of a semiconductor material, such as silicon.
In this case, the insulating material 10 filled in the gap of the case may be a seamless material composed of titanium and glass, that is, the insulating material 10 composed of a mixture of titanium and glass. Glass alone may be used as the insulating material 10.
With continued reference to fig. 9, the film includes a primer layer 20, an intermediate layer 30, and a surface layer (not shown). Wherein, the bottom layer 20 is made of semiconductor material, and a semiconductor layer is prepared on the insulating material 10.
The intermediate layer is a mixed layer of a semiconductor and at least one of an oxide, a nitride and a carbide, such as a mixture of different materials of silicon and silicon oxide, silicon and silicon nitride, silicon and silicon carbide and the like. The ratio of each material in the finally formed mixture is not limited herein.
In addition, the thickness of the two mixed materials can be adjusted and increased, and one of red, orange, yellow, green, blue, purple and other colors can be selectively deposited in sequence, so that film layers with different colors can be formed.
When the surface layer is provided, an oxide, a nitride, or a carbide may be used for the surface layer.
Similarly, a diamond-like carbon layer and an anti-fingerprint layer may be added to the film layer shown in fig. 9, which are not described herein again.
As can be seen from the above specific embodiments, in the mobile terminal housing provided in the embodiments of the present application, a film layer is disposed on the housing, and the film layer includes multiple layers, such as a bottom layer 20 disposed on the housing, and a surface layer disposed on the bottom layer 20; in order to improve the shielding effect, when the shielding structure is arranged, the surface layer is an insulating layer; the base layer 20 is an insulating layer or an insulating mixture layer, and at least one of the surface layer and the base layer 20 is a non-oxide layer. The film layer is manufactured by adopting the insulating layer, so that the shielding effect of the film layer is improved, and the attractive effect of the film layer on the mobile terminal shell is improved.
In addition, this application implementation still provides a mobile terminal, and this mobile terminal can be common mobile terminal such as cell-phone, panel computer, bracelet. The mobile terminal comprises the mobile terminal shell and a display screen arranged on the mobile terminal shell. As shown in fig. 10, fig. 10 is a schematic diagram illustrating a mobile terminal as a mobile phone, which includes a mobile terminal housing 100, and a display screen 200 disposed in the housing 100. The housing 100 includes the above-mentioned housing and a film layer, and the insulating layer is used to manufacture the film layer, so that the shielding effect of the film layer is improved, and the aesthetic effect of the film layer on the mobile terminal housing 100 is improved.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (11)

1. A mobile terminal housing, comprising: a shell and a film layer;
at least one gap is cut on the shell, and insulating materials are filled in the gap; the shell is made of any one or combination of more of stainless steel, titanium alloy, amorphous alloy, aluminum alloy, magnesium alloy and zinc alloy; or the shell comprises a substrate and a simple substance or alloy coating arranged on the surface of the substrate, wherein the substrate is made of any one or combination of more of stainless steel, titanium alloy, amorphous alloy, aluminum alloy, magnesium alloy and zinc alloy; the insulating material is any one of zirconia ceramic, alumina ceramic, sapphire and glass; or the insulating material is any one of a mixture of stainless steel and zirconia ceramic, a mixture of titanium alloy and alumina ceramic, a mixture of zirconium-based amorphous alloy and zirconia ceramic, a mixture of titanium and glass, and a mixture of aluminum alloy and sapphire;
the film layer covers the gap and comprises at least two layer-by-layer structures which are arranged on the shell in a laminated mode, wherein the layer-by-layer structure closest to the shell is a bottoming layer, and the layer-by-layer structure farthest from the shell is a surface layer; the at least two layer-by-layer structures are insulating layers, and at least one layer structure in the at least two layer-by-layer structures is a non-oxide layer; the bottom layer is a mixed layer consisting of metal and an insulating compound of the metal, or the bottom layer is a semiconductor layer;
the film layer also comprises a middle layer arranged between the bottom layer and the surface layer; the priming layer, the middle layer and the surface layer are of a continuously prepared layer structure, wherein the middle layer comprises a mixed layer of a priming layer part material and a middle layer part material; and between the layers, there is a mixed state between adjacent layers of nanometer scale.
2. The mobile terminal housing according to claim 1, wherein the intermediate layer and the surface layer are a mixed layer of one or at least two of metal oxide, metal carbide, and metal nitride.
3. The mobile terminal housing according to claim 1, wherein at least one of the primer layer, the intermediate layer and the surface layer is a non-transparent insulating layer.
4. The mobile terminal housing according to claim 2, wherein the ratio of metal atoms to non-metal atoms in the metal compound, metal oxide, metal carbide, metal nitride corresponds to the atomic ratio of the compound with an error of no more than 10%.
5. The mobile terminal housing according to claim 1, wherein the thickness of the hybrid layer is less than 200 nm.
6. The mobile terminal housing according to claim 1, wherein the intermediate layer is at least one layer, and when the intermediate layer is at least two layers, at least two intermediate layers are stacked.
7. The mobile terminal housing of claim 1, wherein the resistance values of the base layer, the middle layer and the surface layer are not less than 10 5 Ω。
8. The mobile terminal housing according to any one of claims 1 to 7, further comprising a diamond-like carbon layer, wherein the diamond-like carbon layer is disposed on a surface of the surface layer facing away from the base layer.
9. The mobile terminal housing according to claim 8, wherein the content of SP3 bonds in the diamond-like carbon layer is not less than 30%.
10. The mobile terminal housing according to any one of claims 1 to 7, further comprising an anti-fingerprint film layer disposed on a surface of the surface layer facing away from the base layer.
11. A mobile terminal characterized by comprising a mobile terminal housing according to any one of claims 1 to 10, and a display screen provided on the mobile terminal housing.
CN201910023199.2A 2019-01-10 2019-01-10 Mobile terminal shell and mobile terminal Active CN111432049B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910023199.2A CN111432049B (en) 2019-01-10 2019-01-10 Mobile terminal shell and mobile terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910023199.2A CN111432049B (en) 2019-01-10 2019-01-10 Mobile terminal shell and mobile terminal

Publications (2)

Publication Number Publication Date
CN111432049A CN111432049A (en) 2020-07-17
CN111432049B true CN111432049B (en) 2022-09-23

Family

ID=71546601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910023199.2A Active CN111432049B (en) 2019-01-10 2019-01-10 Mobile terminal shell and mobile terminal

Country Status (1)

Country Link
CN (1) CN111432049B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108570676A (en) * 2017-03-09 2018-09-25 苹果公司 Wearing face finishing on metal shell
CN207958152U (en) * 2017-12-28 2018-10-12 华为技术有限公司 Mobile terminal shell and mobile terminal

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108570676A (en) * 2017-03-09 2018-09-25 苹果公司 Wearing face finishing on metal shell
CN207958152U (en) * 2017-12-28 2018-10-12 华为技术有限公司 Mobile terminal shell and mobile terminal

Also Published As

Publication number Publication date
CN111432049A (en) 2020-07-17

Similar Documents

Publication Publication Date Title
US11383478B2 (en) Metallic lustrous member with electromagnetic wave transmissibility, article using the member, and metal thin film
JP5570507B2 (en) Method for manufacturing a layer system on a substrate and layer system
CN104220634B (en) Coloured hard decorative component
TW201430158A (en) Light-absorbing layer system and production of and suitable sputtering target for said layer system
JP7409791B2 (en) Copper-based antibacterial PVD coating
JPH0510309B2 (en)
CN108156776B (en) Shell of electronic equipment and preparation method thereof
EP0516248B1 (en) Multilayered film
CN104204277A (en) Golden rigid decorative member
CN102089455A (en) A method to manufacture an oxide sputter target comprising a first and second phase
TW201934782A (en) Radio wave-transmitting lustrous metal member, article using same, and method for producing same
CN111432049B (en) Mobile terminal shell and mobile terminal
CA2298278A1 (en) Composite film and process for its manufacture
JP2018124267A (en) Component for watch and watch
JP2854104B2 (en) Manufacturing method of ceramic coating material
US20180217558A1 (en) Timepiece part and timepiece
CN205528998U (en) Metal product with royalblue PVD film
TW201135817A (en) Colourful multi-layer film structure and the method manufacturing the same
JP2546622B2 (en) Complex mixed multilayer film
CN113621914B (en) Silvery white coating and preparation method thereof
TW201125744A (en) Casing having color and the related surface-treating method
JPH07248415A (en) Production of optical thin film
JP2915525B2 (en) Silver surface transparent protective film structure
JPS62138345A (en) Cover glass
TW201127253A (en) Casing having color and the related surface-treating method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant