CN111430524A - Guide-pillar-free glue sealing molding process for light emitting diode - Google Patents
Guide-pillar-free glue sealing molding process for light emitting diode Download PDFInfo
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- CN111430524A CN111430524A CN202010243722.5A CN202010243722A CN111430524A CN 111430524 A CN111430524 A CN 111430524A CN 202010243722 A CN202010243722 A CN 202010243722A CN 111430524 A CN111430524 A CN 111430524A
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- 239000003292 glue Substances 0.000 title claims abstract description 72
- 238000007789 sealing Methods 0.000 title claims abstract description 69
- 238000000465 moulding Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 31
- 239000002775 capsule Substances 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims description 97
- 238000001125 extrusion Methods 0.000 claims description 14
- 230000033001 locomotion Effects 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 230000001174 ascending effect Effects 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 24
- 230000006978 adaptation Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 14
- 238000004026 adhesive bonding Methods 0.000 description 4
- 229910000976 Electrical steel Inorganic materials 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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Abstract
The invention belongs to the technical field of electronic element glue sealing molding, and particularly relates to a guide pillar-free glue sealing molding process for a light-emitting diode; the fixing device in the process comprises a support frame, wherein a support plate is arranged at the top of the support frame, a glue sealing groove is formed in the end face of the support plate, a support cavity is formed in the glue sealing groove, a glue sealing capsule is arranged in the support cavity, a guide table is arranged at the end part of the support plate, a limiting groove is formed in the side face of the guide table, a fixture block is arranged on the top surface of the support plate, a diode tube pole is arranged at the top of the fixing device and connected through a connecting plate, a guide-in end is arranged at the end part of the connecting plate, and a clamping plate is arranged in the middle; the LED is quickly and effectively fixed by the arranged fixing device, and meanwhile, corresponding adjustment and adaptation can be carried out on each eccentric diode tube, so that the production efficiency and the production quality of the LED are greatly improved.
Description
Technical Field
The invention belongs to the technical field of electronic element glue sealing and forming, and particularly relates to a guide-pillar-free glue sealing and forming process for a light-emitting diode.
Background
In order to improve the production efficiency of the light emitting diode molding, people generally punch and shear a metal sheet suitable for being used as a light emitting diode tube pole into a metal support which comprises a plurality of pairs of tube poles connected into a whole, then simultaneously insert each pair of tube poles into a group of molding capsules through the support for molding by molding, pouring and baking, and molding by molding to form a plurality of light emitting diodes at one time.
In the molding process, a molding strip for fixing the molding capsule and supporting the metal bracket of the light emitting diode is required. In the traditional process, the die strip comprises a silicon steel sheet embedded with a group of sealing glue capsules, a plurality of support supporting plates and a pair of support guide posts, and a regular U-shaped support with an upper opening and a lower closed part, wherein a pair of horizontal guide grooves are arranged at the upper parts of two inner side surfaces of the regular U-shaped support, and the silicon steel sheet is inserted into the support through the horizontal guide grooves to form the whole die strip. The support plate is used for supporting the support upwards, the support guide post is used for positioning the support, so that the light emitting diode tube at the lower end of the support can be inserted into the sealing glue capsule on the silicon steel sheet in an aligning mode, and meanwhile, the support is prevented from moving after being inserted into the sealing glue capsule. In the traditional process, the bracket often has an eccentric phenomenon, so that the product quality is difficult to ensure, mainly because the bracket production mode is a continuous die production mode, the length dimension of the bracket can generate certain accumulated errors, when the length of the bracket is longer, the accumulated errors are larger, the lengths of all the brackets are difficult to be completely consistent, and when the distance between guide posts of the bracket is fixed, if the length of the bracket is smaller than the distance between the guide posts, the bracket can be loosened after being inserted into a capsule; if the length of the bracket is larger than the distance between the guide posts, the bracket is extruded into a fan shape after being inserted, and the fan shape causes the tube pole at the lower end of the bracket to be eccentric. In addition, the guide post has a certain length, and the guide groove is long and thin and has a relative tightness when being abutted with the bracket, so that the guide post is an obstacle to the insertion of the bracket, the oblique mutual clamping is easy to occur in the insertion process, and sometimes even the column body is inclined or the bracket is creased, so that the positioning accuracy is influenced.
The prior art also presents some technical schemes related to the molding of the light-emitting diode without the guide post by glue sealing, for example, a chinese patent with patent number 981048277, the invention discloses a molding process of the light-emitting diode without the guide post by glue sealing, which comprises the following steps: punching and shearing a metal sheet suitable for being used as a light-emitting diode tube pole into a metal bracket containing a plurality of pairs of light-emitting diode tube poles; preparing a mould strip with a group of glue sealing capsules and a plurality of support supporting plates; simultaneously inserting the pair of tube electrodes on the bracket into the glue sealing capsules of the die strip for glue pouring and baking, and performing glue sealing molding; the method is characterized in that: and clamping grooves vertical to the supporting grooves are arranged on the connecting ribs of the support corresponding to the supporting grooves of the support supporting plate, and the clamping grooves are closely matched with the supporting grooves in size. The process can overcome the problem of support eccentricity in the traditional process, can improve the product quality of the light-emitting diode, and has the advantages of simple operation and low production cost.
However, the fixing structure of the scheme still has the problems of low fixing efficiency, poor fixing effect and incapability of adjusting and adapting each eccentric light-emitting diode tube pole, so that the invention provides the light-emitting diode guide-pole-free glue sealing forming process.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a guide-pillar-free glue sealing and forming process for a light-emitting diode, which is used for quickly and effectively fixing the light-emitting diode through a fixing device and correspondingly adjusting and adapting each eccentric light-emitting diode tube pole, thereby greatly improving the production efficiency and the production quality of the light-emitting diode.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to a guide pillar-free sealing glue molding process for a light-emitting diode, which comprises the following steps of:
s1: firstly, punching and shearing a metal material into a plurality of groups of integrated metal supports for light-emitting diode tube poles, wherein the bottom ends of the light-emitting diode tube poles on the metal supports are connected through a connecting plate, and the end part and the middle part of the connecting plate are respectively punched and sheared with a guide-in end and a clamping plate; the metal material is punched and cut into a plurality of groups of integrated metal supports for the tube poles of the light-emitting diode, so that the glue sealing molding of the tube poles of the light-emitting diode can be produced in batch, and the production efficiency of the light-emitting diode is greatly improved;
s2: after the metal support where the light-emitting diode tube pole is located is processed in S1, the leading-in end of the connecting plate is inserted into the guide table in the fixing device, then the metal support is pushed to enable the diode tube pole arranged on the metal support to be inserted into the glue sealing capsule on the fixing device, and meanwhile, the clamping plate in the middle of the connecting plate is tightly clamped and matched with the clamping block in the fixing device, so that the metal support can be fixed on the fixing device; the fixing device is used for quickly and effectively fixing the light-emitting diode, and meanwhile, the quality problem caused by eccentricity and crease during the glue sealing process of the metal support can be reduced;
s3: fixing the metal support on a fixing device in S2, pouring glue, baking and molding the glue sealing capsule in which the diode tube pole is inserted, taking the metal support out of the fixing device after the glue sealing molding is finished, and cutting off redundant metal supports at the top end of the diode tube pole to form diode finished products which are separated from each other; the LED tube is sealed and processed in batches by the arranged fixing device, and the production efficiency of the LED is effectively improved.
Wherein, the fixing device used in S2 comprises a supporting frame, a group of through slots are symmetrically arranged on the inner wall of the top end of the supporting frame, supporting plates matched with the shapes and sizes of the notches of the slots are inserted in the slots, a group of through glue sealing grooves distributed uniformly are arranged on the end surfaces of the supporting plates, supporting blocks are symmetrically connected on the bottom surfaces of the supporting plates on the two sides of the glue sealing grooves, supporting cavities are arranged in the glue sealing grooves, funnel-shaped extrusion cavities with openings gradually increasing from bottom to top are arranged at the top ends of the supporting cavities, glue sealing capsules are arranged in the supporting cavities, movable gaps are arranged between the outer surfaces of the supporting cavities and the side surfaces of the glue sealing grooves, sliding rods are respectively connected at the positions of the bottom ends of the supporting cavities corresponding to the supporting blocks, the other ends of the sliding rods are respectively connected with the side surfaces of the supporting blocks in a sliding manner, and springs, the LED lamp fixing device is characterized in that a guide table is mounted at the end part of the top surface of the support plate, a limiting groove is formed in the side surface, close to the support cavity, of the guide table, a clamping block is mounted in the middle of the top surface of the support plate, inclined clamping surfaces are symmetrically arranged at the top ends of the clamping blocks, a metal support capable of being matched with the fixing device is arranged at the top of the fixing device, the metal support comprises a group of diode tube electrodes capable of being matched with the support cavity, the bottoms of the diode tube electrodes are connected through a connecting plate, a leading-in end capable of being matched with the limiting groove is arranged at the end part, corresponding to the guide table, of the connecting plate, a clamping plate is arranged at the position; when the metal bracket in the traditional process works, the problems of position eccentricity, low fixing efficiency, poor fixing effect and the like exist in the glue sealing process, so that the processing quality and the processing efficiency of the light-emitting diode are influenced; when the fixing device is used, firstly, the metal support and the fixing device are pre-aligned, then, the diode tube pole at the bottom end of the metal support is pushed to move towards the interior of the glue sealing capsule, at the moment, the leading-in end at one side of the metal support firstly moves to the guide table and penetrates into the limiting groove in the guide table, at the moment, the leading-in end positioned in the limiting groove can limit the longitudinal displacement of the metal support, so that the diode tube pole at the bottom end of the metal support can be more accurately inserted into the glue sealing capsule, and meanwhile, the phenomenon that the diode tube pole is difficult to be matched with the metal support due to the arrangement of a plurality of guide tables is reduced by arranging the single guide table at one side of; if a certain diode tube pole on the metal support deviates in position, the bottom end of the deviated diode tube pole firstly contacts and extrudes with the side wall of the extrusion cavity, the side wall of the extrusion cavity is stressed to drive the supporting cavity at the bottom end to extrude a spring on one side, and meanwhile, the supporting cavity limits the position of the diode tube pole by driving the sliding rod to slide in the supporting block, so that the position of the supporting cavity can be adjusted in a movable gap and is matched with the position of the diode tube pole; insert to sealing inside the glue capsule when diode pipe utmost point is all complete, cardboard on the connecting plate this moment moves to fixture block position department, cooperates the block through the clamping groove on with the cardboard with the clamping face on the fixture block afterwards to make mutually supporting draw-in groove and clamping face can transversely fix metal support with vertical ascending position, and then make metal support carry out stable swift sealed glue under fixing device's effect and handle, the effectual production quality and the production efficiency who improves emitting diode.
Preferably, a guide frame is arranged between the guide table and the support plate, a sliding groove is formed in the bottom surface of the guide frame, a sliding block capable of freely sliding in the sliding groove is arranged at the bottom end of the guide table, and a second spring is connected between the guide table and the side wall of the guide frame; the during operation, when guide table and fixture block position are fixed, cardboard on the metal support of overall length size error production is easy to be misplaced with the complex fixture block, thereby influence the cooperation effect of cardboard and fixture block, this moment through setting the guide table to the form that can move about on the leading truck, when metal support takes place off-centre, the effort is applyed to the guide table to the leading-in end this moment, make the guide table realize that tensile drive the slider and slide in that the spout is inside to No. two springs, thereby make gliding guide table can carry out the regulation that adapts to according to metal support's total length, make the cardboard can stabilize effectual and cooperate with the fixture block, thereby fixing device has improved the fixed effect between to the metal greatly.
Preferably, the top end of the side surface of the guide frame, which is close to the guide table, is symmetrically connected with a group of limiting plates, and the bottom surfaces of the limiting plates are attached to the top surface of the guide table and can limit the vertical movement of the guide table; during operation, although the guide table can carry out certain spacing under the mating reaction of slider and spout, the guide table still has the space of activity in its vertical direction, through setting up the limiting plate of laminating mutually with the guide table top surface this moment, when not influencing the smooth work of guide table, also can make the guide table carry out the ascending position of vertical side and prescribe a limit to under the effect of limiting plate to make the guide table can stabilize effectual motion, and then the effectual fixing device stability at the during operation that has improved.
Preferably, the top end of the limit groove is provided with a guide opening, and the notch of the guide opening is gradually enlarged from bottom to top; the during operation, because the notch top size of spacing groove is limited, make the leading-in end become time-consuming and hard when inserting from spacing groove notch top, thereby influence metal support's fixed efficiency, through set up the guide way of notch supreme crescent from bottom to top on the spacing groove top this moment, make things convenient for the leading-in end to insert to the spacing inslot along the lateral wall convenient and fast of guide way inside, make metal support can be fast and accurate fix on fixing device, thereby further improved emitting diode's production efficiency.
Preferably, the clamping surface at the top end of the clamping block is wrapped with an elastic layer, the elastic layer and the clamping surface inside the elastic layer are respectively provided with a locking groove, and the side wall of the clamping groove at the bottom end of the clamping plate is provided with a locking block capable of being matched with the locking groove; the during operation, although the fixture block can be fixed metal support with the cooperation of cardboard, nevertheless metal support breaks away from the fixture block easily under the circumstances of external force interference, it has one deck elastic layer to wrap up on the clamping face on fixture block top this moment, make cardboard and fixture block chucking that can be inseparabler when the cooperation, the latch segment on the draw-in groove lateral wall can be fixed the cardboard through the inside locking inslot portion of extrusion on advancing the clamping face simultaneously, reduce the cardboard and break away from the quality problems that lead to the diode when gluing from the fixture block, thereby further improved the stability of emitting diode when gluing.
Preferably, the top ends of the clamping surfaces are symmetrically provided with guide plates, one sides of the guide plates, which are close to the locking grooves, are all provided with inclined surfaces, openings among the inclined surfaces are gradually reduced from top to bottom, and the distance between the bottom ends of the inclined surfaces is the same as the thickness of the clamping plate; during operation, the cardboard is when cooperating with the fixture block, need to align the locking groove accuracy on the locking plate of draw-in groove department and the clamping face just can carry out effectual assembly with both, thereby the operation degree of difficulty when fixed of metal support has been increased, be provided with the deflector through clamping face top symmetry this moment, and the deflector is close to one side in locking groove and all sets the inclined plane to, make the cardboard can insert and slide to the position department that bottom and locking groove position correspond on the inclined plane from the opening between the inclined plane top, thereby make the quick accurate alignment and the cooperation of locking groove on locking plate and the clamping face, thereby the promptness of fixing device when using has further been improved.
The invention has the technical effects and advantages that:
1. according to the guide-pillar-free glue sealing molding process for the light-emitting diode, the light-emitting diode is quickly and effectively fixed through the arranged fixing device, and meanwhile, corresponding adjustment and adaptation can be carried out on each eccentric light-emitting diode tube electrode, so that the production efficiency and the production quality of the light-emitting diode are greatly improved.
2. According to the light-emitting diode guide-post-free glue sealing forming process, the guide table is arranged to be movable on the guide frame, when the metal support is eccentric, the guide end exerts acting force on the guide table, so that the sliding guide table can be adjusted adaptively according to the total length of the metal support, and the fixing effect of the fixing device on the metal is greatly improved.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a diagram of the steps of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is an enlarged view at A in FIG. 2;
FIG. 4 is a schematic structural view of the present invention;
FIG. 5 is an enlarged view at B in FIG. 4;
FIG. 6 is an enlarged view at C in FIG. 4;
in the figure: the device comprises a support frame 1, a slot 11, a support plate 12, a glue sealing groove 13, a support block 14, a support cavity 15, an extrusion cavity 16, a glue sealing capsule 17, a movable gap 18, a slide rod 2, a first spring 21, a guide table 3, a limit groove 31, a guide frame 32, a slide groove 33, a slide block 34, a second spring 35, a limit plate 36, a guide opening 37, a fixture block 4, a clamping surface 41, an elastic layer 42, a locking groove 43, a guide plate 44, an inclined surface 45, a metal support 5, a diode tube pole 51, a connecting plate 52, a leading-in end 53, a fixture plate 54, a fixture groove 55 and a locking block 56.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1-6, the molding process of the light emitting diode without the guide pillar molding compound of the present invention comprises the following steps:
s1: firstly, punching and shearing a metal material into a plurality of groups of integrated metal supports 5 for LED tube poles 51, wherein the bottom ends of the LED tube poles 51 on the metal supports 5 are connected by a connecting plate 52, and the end part and the middle part of the connecting plate 52 are respectively punched and sheared with a leading-in end 53 and a clamping plate 54; the metal material is punched and cut into a plurality of groups of integrated metal brackets 5 used for the LED tube poles 51, so that the glue sealing molding of the LED tube poles 51 can be produced in batch, and the production efficiency of the LED is greatly improved;
s2: after the metal bracket 5 with the led tube 51 is processed in S1, the leading-in end 53 of the connecting plate 52 is inserted into the guiding table 3 of the fixing device, and then the metal bracket 5 is pushed to insert the led tube 51 set on the metal bracket into the sealing compound capsule 17 on the fixing device, and simultaneously the clamping plate 54 at the middle of the connecting plate 52 is clamped and matched with the clamping block 4 in the fixing device, so that the metal bracket 5 can be fixed on the fixing device; the fixing device is used for quickly and effectively fixing the light-emitting diode, and meanwhile, the quality problem caused by eccentricity and crease during the glue sealing process of the metal bracket 5 can be reduced;
s3: fixing the metal support 5 on the fixing device in S2, pouring, baking and molding the sealant capsule 17 with the diode tube 51 inserted therein, taking the metal support 5 out of the fixing device after molding the sealant, and cutting off the redundant metal support 5 at the top end of the diode tube 51 to form the diode finished product separated from each other; the diode tube 51 is sealed and processed in batches by the arranged fixing device, so that the production efficiency of the light-emitting diode is effectively improved;
wherein, the fixing device used in S2 includes a support frame 1, a set of through slots 11 are symmetrically arranged on the inner wall of the top end of the support frame 1, a support plate 12 matched with the slot opening shape and size is inserted in the slots 11, a set of through glue sealing grooves 13 evenly distributed are arranged on the end surface of the support plate 12, support blocks 14 are symmetrically connected on the bottom surfaces of the support plate 12 at the two sides of the glue sealing grooves 13, a support cavity 15 is arranged in the glue sealing groove 13, a funnel-shaped extrusion cavity 16 with an opening gradually increasing from bottom to top is arranged at the top end of the support cavity 15, a glue sealing capsule 17 is arranged in the support cavity 15, a movable gap 18 is arranged between the outer surface of the support cavity 15 and the side surface of the glue sealing groove 13, slide bars 2 are respectively connected at the positions of the bottom end of the support cavity 15 corresponding to the support blocks 14, and the other ends of the slide bars 2, and a first spring 21 is connected between the side surface of the supporting block 14 and the side wall of the supporting cavity 15, the top surface end part of the supporting plate 12 is provided with a guide table 3, the side surface of one side of the guide table 3 close to the supporting cavity 15 is provided with a limit groove 31, a fixture block 4 is arranged in the middle of the top surface of the support plate 12, inclined fixture surfaces 41 are symmetrically arranged at the top end of the fixture block 4, the top of the fixing device is provided with a metal bracket 5 which can be matched with the fixing device, the metal bracket 5 comprises a group of diode tube poles 51 which can be matched with the supporting cavity 15, the bottom ends of the diode tube electrodes 51 are connected by a connecting plate 52, the end part of the connecting plate 52 corresponding to the guide table 3 is provided with a leading-in end 53 which can be matched with the limiting groove 31, a clamping plate 54 is arranged at the position of the connecting plate 52 corresponding to the fixture block 4, and a clamping groove 55 capable of being matched with the clamping surface 41 on the fixture block 4 is arranged at the bottom end of the clamping plate 54; when the metal bracket 5 in the traditional process works, the problems of position eccentricity, low fixing efficiency, poor fixing effect and the like exist in the glue sealing process, so that the processing quality and the processing efficiency of the light-emitting diode are influenced; when the fixing device is used, firstly, the metal support 5 and the fixing device are pre-aligned, then the diode tube pole 51 at the bottom end of the metal support 5 is pushed to move towards the inside of the glue sealing capsule 17, at the moment, the leading-in end 53 at one side of the metal support 5 firstly moves to the guide table 3 and is inserted into the limiting groove 31 in the metal support, at the moment, the leading-in end 53 positioned in the limiting groove 31 can limit the longitudinal displacement of the metal support 5, so that the diode tube pole 51 at the bottom end of the metal support 5 can be more accurately inserted into the glue sealing capsule 17, and meanwhile, the phenomenon that the metal support 5 is difficult to match due to the arrangement of a plurality of guide tables 3 is reduced by arranging the single guide table 3 at one side of the support plate 12; if a certain diode tube pole 51 on the metal support 5 is shifted in position, the bottom end of the shifted diode tube pole 51 is firstly in contact extrusion with the side wall of the extrusion cavity 16, the side wall of the extrusion cavity 16 is stressed to drive the support cavity 15 at the bottom end to extrude the first spring 21 at one side, and meanwhile, the support cavity 15 limits the position of the diode tube pole by driving the sliding rod 2 to slide in the support block 14, so that the support cavity 15 can adjust the position of the diode tube pole in the movable gap 18 and enable the position of the diode tube pole to be matched with the position of the diode tube pole 51, and the diode tube pole 51 after being eccentric can be smoothly inserted into the glue sealing capsule 17 in the support cavity 15 at the bottom end, so that the capacity of the glue sealing capsule 17 on the fixing device to be matched with each diode tube pole 51 on the metal support 5 is greatly improved; when the diode tube pole 51 is completely inserted into the sealing glue capsule 17, the clamping plate 54 on the connecting plate 52 moves to the position of the clamping block 4, and then the clamping groove 55 on the clamping plate 54 and the clamping surface 41 on the clamping block 4 are matched and clamped, so that the clamping groove 55 and the clamping surface 41 which are matched with each other can fix the transverse and longitudinal positions of the metal bracket 5, the metal bracket 5 is subjected to stable and rapid sealing glue treatment under the action of the fixing device, and the production quality and the production efficiency of the light-emitting diode are effectively improved.
As an embodiment of the present invention, a guide frame 32 is disposed between the guide table 3 and the support plate 12, a sliding groove 33 is disposed on a bottom surface of the guide frame 32, a sliding block 34 capable of freely sliding in the sliding groove 33 is disposed at a bottom end of the guide table 3, and a second spring 35 is connected between the guide table 3 and a side wall of the guide frame 32; during operation, when direction table 3 and fixture block 4 position are fixed, cardboard 54 on the metal support 5 of overall length size production error misplaces with complex fixture block 4 easily, thereby influence cardboard 54 and fixture block 4's cooperation effect, through setting the form that can move about on leading truck 32 with direction table 3 this moment, when metal support 5 takes place off-centre, guide-in end 53 applys the effort to direction table 3 this moment, make direction table 3 drive slider 34 and slide inside spout 33 when realizing tensile to No. two spring 35, thereby make gliding direction table 3 can carry out the regulation of adaptation according to metal support 5's total length, make cardboard 54 can stabilize effectual and cooperate with fixture block 4, thereby fixing device to between the metal has been improved greatly.
As an embodiment of the present invention, a group of limiting plates 36 is symmetrically connected to the top end of the side surface of the guide frame 32 close to the guide table 3, and the bottom surfaces of the limiting plates 36 are attached to the top surface of the guide table 3 and can limit the vertical movement of the guide frame; during operation, although guide table 3 can carry out certain spacing under the mating reaction of slider 34 with spout 33, but guide table 3 still has the space of activity in its vertical direction, this moment through setting up the limiting plate 36 of laminating mutually with guide table 3 top surface, when not influencing guide table 3 and working smoothly, also can make guide table 3 carry out the ascending position of vertical side and prescribe a limit to under limiting plate 36's effect, thereby make guide table 3 can stabilize effectual motion, and then the effectual fixing device stability of during operation that has improved.
As an embodiment of the present invention, a guide opening 37 is provided at the top end of the limiting groove 31, and a notch of the guide opening 37 gradually increases from bottom to top; the during operation, because the notch top size of spacing groove 31 is limited, make leading-in 53 become to waste time and energy when inserting from spacing groove 31 notch top, thereby influence the fixed efficiency of metal support 5, this moment through set up the guide way of notch supreme crescent from bottom to top on spacing groove 31 top, make things convenient for leading-in 53 along the lateral wall convenient and fast of guide way insert to spacing groove 31 inside, make fixing on fixing device that metal support 5 can be quick and accurate, thereby further improved emitting diode's production efficiency.
As an embodiment of the present invention, the engaging surface 41 at the top end of the clamping block 4 is wrapped by an elastic layer 42, the elastic layer 42 and the engaging surface 41 inside the elastic layer are respectively provided with a locking groove 43, and the side wall of the clamping groove 55 at the bottom end of the clamping plate 54 is provided with a locking block 56 capable of being matched with the locking groove 43; during operation, although fixture block 4 can be fixed metal support 5 with the cooperation of cardboard 54, metal support 5 breaks away from fixture block 4 easily under the circumstances that external force disturbed, it has one deck elastic layer 42 to wrap up on the clamping face 41 on fixture block 4 top this moment, make cardboard 54 and fixture block 4 can inseparabler chucking when the cooperation, the inside locking groove 43 that can advance on the clamping face 41 through the extrusion of latch segment 56 on the draw-in groove 55 lateral wall is fixed cardboard 54 simultaneously, reduce cardboard 54 and break away from the quality problems that lead to the diode when gluing from fixture block 4, thereby further improved the stability of emitting diode when gluing.
In an embodiment of the present invention, the top end of the engaging surface 41 is symmetrically provided with guide plates 44, one side of each guide plate 44 close to the locking groove 43 is provided with inclined surfaces 45, the openings between the inclined surfaces 45 are gradually reduced from top to bottom, and the distance between the bottom ends of the inclined surfaces 45 is the same as the thickness of the clamping plate 54; when the clamping plate 54 is matched with the clamping block 4, the locking plate at the clamping groove 55 and the locking groove 43 on the clamping surface 41 need to be accurately aligned to be effectively assembled, so that the operation difficulty of the metal support 5 during fixing is increased, the guide plates 44 are symmetrically arranged at the top end of the clamping surface 41 at the moment, the inclined surfaces 45 are arranged on one sides of the guide plates 44 close to the locking groove 43, the clamping plate 54 can be inserted from the opening between the top ends of the inclined surfaces 45 and can slide to the positions, corresponding to the positions of the locking groove 43, of the bottom end on the inclined surfaces 45, the locking plate and the locking groove 43 on the clamping surface 41 can be quickly and accurately aligned and matched, and the rapidness of the fixing device during use is further improved.
When the device works, firstly, the metal support 5 and the fixing device are pre-aligned, then the diode tube pole 51 at the bottom end of the metal support 5 is pushed to move towards the inside of the glue sealing capsule 17, at the moment, the leading-in end 53 at one side of the metal support 5 firstly moves to the guide table 3 and is inserted into the limiting groove 31 in the metal support, at the moment, the leading-in end 53 positioned in the limiting groove 31 can limit the longitudinal displacement of the metal support 5, so that the diode tube pole 51 at the bottom end of the metal support 5 can be more accurately inserted into the glue sealing capsule 17, and meanwhile, the phenomenon that the diode tube pole is difficult to be matched with the metal support 5 due to the arrangement of a plurality of guide tables 3 is reduced by arranging the single guide table 3 at; if a certain diode tube pole 51 on the metal support 5 is shifted in position, the bottom end of the shifted diode tube pole 51 is firstly in contact extrusion with the side wall of the extrusion cavity 16, the side wall of the extrusion cavity 16 is stressed to drive the support cavity 15 at the bottom end to extrude the first spring 21 at one side, and meanwhile, the support cavity 15 limits the position of the diode tube pole by driving the sliding rod 2 to slide in the support block 14, so that the support cavity 15 can adjust the position of the diode tube pole in the movable gap 18 and enable the position of the diode tube pole to be matched with the position of the diode tube pole 51, and the diode tube pole 51 after being eccentric can be smoothly inserted into the glue sealing capsule 17 in the support cavity 15 at the bottom end, so that the capacity of the glue sealing capsule 17 on the fixing device to be matched with each diode tube pole 51 on the metal support 5 is greatly improved; when the diode tube pole 51 is completely inserted into the sealing glue capsule 17, the clamping plate 54 on the connecting plate 52 moves to the position of the clamping block 4, and then the clamping groove 55 on the clamping plate 54 and the clamping surface 41 on the clamping block 4 are matched and clamped, so that the clamping groove 55 and the clamping surface 41 which are matched with each other can fix the transverse and longitudinal positions of the metal bracket 5, the metal bracket 5 is subjected to stable and rapid sealing glue treatment under the action of the fixing device, and the production quality and the production efficiency of the light-emitting diode are effectively improved.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A light-emitting diode non-guide-pillar glue sealing molding process is characterized by comprising the following steps:
s1: firstly, punching and shearing a metal material into a plurality of groups of integrated metal supports (5) for light-emitting diode tube poles (51), wherein the bottom ends of the light-emitting diode tube poles (51) on the metal supports (5) are connected through a connecting plate (52), and the end part and the middle part of the connecting plate (52) are respectively punched and sheared with a leading-in end (53) and a clamping plate (54);
s2: after the metal bracket (5) where the light-emitting diode tube pole (51) is located is processed in S1, firstly, the leading-in end (53) of the connecting plate (52) is inserted into the guide table (3) in the fixing device, then the metal bracket (5) is pushed to enable the diode tube pole (51) arranged on the metal bracket to be inserted into the glue sealing capsule (17) on the fixing device, and meanwhile, the clamping plate (54) in the middle of the connecting plate (52) is clamped and matched with the clamping block (4) in the fixing device, so that the metal bracket (5) can be fixed on the fixing device;
s3: fixing the metal support (5) on a fixing device in S2, pouring glue, baking and sealing glue molding the sealing glue capsule (17) inserted with the diode tube pole (51), taking the metal support (5) out of the fixing device after the sealing glue molding is finished, and cutting off the redundant metal support (5) at the top end of the diode tube pole (51) to form a diode finished product which is separated from each other;
wherein, the fixing device used in S2 comprises a support frame (1), a group of through slots (11) are symmetrically arranged on the inner wall of the top end of the support frame (1), supporting plates (12) matched with the slots in shape and size are inserted into the slots (11), a group of through glue sealing grooves (13) which are uniformly distributed are arranged on the end faces of the supporting plates (12), supporting blocks (14) are symmetrically connected on the bottom faces of the supporting plates (12) at the two sides of the glue sealing grooves (13), a supporting cavity (15) is arranged in the glue sealing groove (13), a funnel-shaped extrusion cavity (16) with gradually increasing openings from bottom to top is arranged at the top end of the supporting cavity (15), a glue sealing capsule (17) is arranged in the supporting cavity (15), and a movable gap (18) is arranged between the outer surface of the supporting cavity (15) and the side face of the glue sealing groove (13), the bottom end of the supporting cavity (15) is connected with a sliding rod (2) at a position corresponding to the supporting block (14), the other end of the sliding rod (2) is connected with the side face of the supporting block (14) in a sliding manner, springs (21) are connected between the side face of the supporting block (14) and the side wall of the supporting cavity (15), a guide table (3) is installed at the end part of the top face of the supporting plate (12), a limiting groove (31) is arranged on the side face of one side, close to the supporting cavity (15), of the guide table (3), a clamping block (4) is installed in the middle of the top face of the supporting plate (12), inclined clamping faces (41) are symmetrically arranged at the top end of the clamping block (4), a metal support (5) capable of being matched with the fixing device is arranged at the top of the fixing device, and the metal support (5) comprises a group, the diode tube pole (51) bottom is connected with connecting plate (52), the corresponding tip of connecting plate (52) and direction platform (3) is provided with and to be able to with spacing groove (31) matched with lead-in (53), the position department that connecting plate (52) and fixture block (4) correspond is provided with cardboard (54), cardboard (54) bottom is provided with can with fixture block (4) on block face (41) matched with draw-in groove (55).
2. The light emitting diode non-guide pillar molding process according to claim 1, wherein: be equipped with leading truck (32) between direction platform (3) and backup pad (12), be provided with spout (33) on the bottom surface of leading truck (32), the bottom of direction platform (3) is provided with can be in spout (33) inside free gliding slider (34), be connected with No. two spring (35) between the lateral wall of direction platform (3) and leading truck (32).
3. The light emitting diode non-guide pillar molding process according to claim 2, wherein: the side top that leading truck (32) is close to guide table (3) is connected with a set of limiting plate (36) symmetrically, the bottom surface of limiting plate (36) and guide table (3) top surface are laminated mutually and can carry out spacingly to its ascending motion of vertical direction.
4. The light emitting diode non-guide pillar molding process according to claim 1, wherein: the top of spacing groove (31) is provided with direction mouth (37), the notch of direction mouth (37) increases gradually from bottom to top.
5. The light emitting diode non-guide pillar molding process according to claim 1, wherein: the clamping surface (41) at the top end of the clamping block (4) is wrapped with an elastic layer (42), the elastic layer (42) and the clamping surface (41) inside the elastic layer are respectively provided with a locking groove (43), and the side wall of the clamping groove (55) at the bottom end of the clamping plate (54) is provided with a locking block (56) which can be matched with the locking groove (43).
6. The light emitting diode non-guide pillar molding process according to claim 5, wherein: the top end of the clamping surface (41) is symmetrically provided with guide plates (44), one sides of the guide plates (44) close to the locking grooves (43) are all provided with inclined surfaces (45), openings between the inclined surfaces (45) are gradually reduced from top to bottom, and the distance between the bottom ends of the inclined surfaces (45) is the same as the thickness of the clamping plate (54).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010243722.5A CN111430524B (en) | 2020-03-31 | 2020-03-31 | Guide-pillar-free glue sealing molding process for light emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010243722.5A CN111430524B (en) | 2020-03-31 | 2020-03-31 | Guide-pillar-free glue sealing molding process for light emitting diode |
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| CN111430524A true CN111430524A (en) | 2020-07-17 |
| CN111430524B CN111430524B (en) | 2021-09-03 |
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| CN206264255U (en) * | 2016-12-09 | 2017-06-20 | 江西迈赛特电子科技有限公司 | A kind of bubble-free high-quality LED is molded sealing adhesive device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4727648A (en) * | 1985-04-22 | 1988-03-01 | Savage John Jun | Circuit component mount and assembly |
| CN2340091Y (en) * | 1998-01-07 | 1999-09-22 | 陈章明 | Glue-sealing formation mould for luminous diode |
| CN1210372A (en) * | 1998-01-15 | 1999-03-10 | 优点机械塑模(深圳)有限公司 | Non-guide plastic packaging process for LED |
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| CN201450023U (en) * | 2009-04-30 | 2010-05-05 | 张浙东 | Glue sealing die strip of light-emitting diode |
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|---|---|
| CN111430524B (en) | 2021-09-03 |
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