CN111428417A - Method for predicting service life of target material - Google Patents
Method for predicting service life of target material Download PDFInfo
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- CN111428417A CN111428417A CN202010300099.2A CN202010300099A CN111428417A CN 111428417 A CN111428417 A CN 111428417A CN 202010300099 A CN202010300099 A CN 202010300099A CN 111428417 A CN111428417 A CN 111428417A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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Abstract
The invention relates to a method for predicting the service life of a target, which comprises the following steps: (1) obtaining topography maps of the target material before and after sputtering by using a three-dimensional scanning method, combining the topography maps of the target material before and after sputtering to prepare a surface erosion curve, and obtaining the original thickness of the target material and the minimum residual thickness of the target material from the surface erosion curve; (2) and constructing a functional relation among the minimum residual thickness of the target, the sputtering power consumption and the original thickness of the target, and predicting the service life of the target through the functional relation. The method can reflect the real appearance of the target, quickly find the actual innermost sputtering position on the surface of the target, and accurately obtain the minimum residual thickness of the target, so that the utilization rate of the target is maximized; the method is suitable for various targets and has a wide application range.
Description
Technical Field
The invention relates to the technical field of magnetron sputtering, in particular to a method for predicting the service life of a target material.
Background
The magnetron sputtering technology is widely applied to the technical fields of machinery, electronics, semiconductors and the like. The principle is that charged particles (ions or neutral atoms and molecules) are utilized to bombard the surface of a target material, so that various particles near the surface of the target material obtain enough energy, and finally the particles escape from the surface of the target material and are deposited on a substrate to form a film.
When the target is used, the target is continuously consumed along with the progress of sputtering, the sputtering depth on the surface of the target is not uniform due to the non-uniform magnetic field intensity, and an irregular erosion curved surface is presented, so that if the distribution condition of the sputtering depth of the target cannot be detected in time, on one hand, the target cannot be fully utilized, and the waste of the target is caused; on the other hand, when the maximum depth of the curved surface is close to the original thickness of the target, the service life of the target reaches the limit, and the target is in danger of being punctured, so that the sputtering equipment is damaged.
In order to improve the utilization rate of the target material, researchers improve the erosion uniformity of the target material by improving the magnetic control source. CN102465268A discloses a magnetron source, a magnetron sputtering apparatus, and a magnetron sputtering method, wherein the magnetron source comprises: a target material; the magnetron is positioned above the target material; and the scanning mechanism is connected with the magnetron to control the magnetron to rotate around the center of the target, and the scanning mechanism adjusts the rotation radius of the magnetron in stages according to a preset step length, wherein the scanning mechanism controls the rotation number and/or the rotation speed of the magnetron at each stage so as to etch the target to a preset depth at each stage. A user can flexibly control the running track of the magnetron by controlling the motion mode of the magnetron, so that the target utilization rate and the metal ionization rate are improved, but the method is only suitable for the target matched with the magnetron sputtering equipment and has no universality.
At present, the commonly used estimation method for the service life of the target material is as follows: the method can not visually feed back the relation between the service life of the target and the actual sputtering depth, if the actual sputtering depth of the target is close to the original thickness, the backboard material can be sputtered onto the sample to cause the pollution of the sample, and therefore, how to obtain the actual sputtering depth of the target becomes a hotspot of research.
The device comprises a collecting part and a measuring part, wherein the collecting part comprises a measuring needle frame and a plurality of rows of measuring needles arranged in the measuring needle frame, measuring ends of the plurality of rows of measuring needles are used for contacting at least one part of etching surface of the target and forming a simulation surface matched with the etching surface contacted with the measuring needles, the measuring part is mutually involuted with the collecting part after the simulation surface is formed, and the measuring part is used for contacting with the measuring end of the measuring needle at the position with the maximum protruding dimension of the simulation surface and measuring the maximum depth of the recess of the etching surface. However, the device is limited by the number and arrangement of the measuring needles, the sputtering depth of the etched surface cannot be truly reflected, and the deepest sputtering can be missed.
CN103572222A discloses a method for determining the sputtering life of a target, which comprises: determining a linear relation between sputtering power consumption and the minimum residual thickness of the target; setting the standard residual thickness of the target material; substituting the standard residual thickness into the linear relation to determine the sputtering life of the target, and further disclosing that a three-coordinate measuring instrument is used for determining the minimum residual thickness of the target, but the target to be tested needs to be moved to a test area when the three-coordinate measuring instrument tests; generally testing 2 vertical lines, and spending time for testing 1 line more, possibly omitting target material sputtering deepest part; and can only test circular target material, can't test non-circular target material and sputter unusual target material, in addition, the equipment is heavier, can't carry about.
Based on the research of the prior art, how to develop a method which is suitable for various targets, can obtain the real situation of the target surface, measure the erosion situation of all points on the target surface, quickly and accurately find the actual deepest sputtering of the target, and can predict the service life of the target becomes a technical problem to be solved at present.
Disclosure of Invention
In view of the problems in the prior art, the invention provides a method for predicting the service life of a target, which uses a three-dimensional scanning method to obtain the real situation of the surface of the target, particularly the sputtering depth distribution condition of the sputtered surface of the target, and can quickly and accurately find the actual deepest sputtering position of the target; combining the topography before and after sputtering the target to obtain an erosion curve, determining the original thickness of the target and the minimum residual thickness of the target from the erosion curve, and accurately predicting the service life of the target according to the relation between the minimum residual thickness of the target, the sputtering power consumption and the original thickness of the target.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a method for predicting the service life of a target, which comprises the following steps:
(1) obtaining topography maps of the target material before and after sputtering by using a three-dimensional scanning method, combining the topography maps of the target material before and after sputtering to prepare a surface erosion curve, and obtaining the original thickness of the target material and the minimum residual thickness of the target material from the surface erosion curve;
(2) and constructing a functional relation among the minimum residual thickness of the target, the sputtering power consumption and the original thickness of the target, and predicting the service life of the target through the functional relation.
According to the method for predicting the service life of the target, provided by the invention, the target can be scanned in all directions at any time by adopting a three-dimensional scanning method, the obtained target topography can accurately reflect the real topography of the target, especially the actual sputtering depth distribution condition of the sputtered surface of the target, the actual sputtering deepest position can be quickly and accurately found, the technical problem that the erosion states of all points on the surface of the target cannot be quickly and accurately determined in the prior art is solved, and meanwhile, unnecessary damage to a product in the detection process is avoided; and according to the power consumption of the actual sputtering process, constructing a functional relation among the minimum residual thickness of the target, the sputtering power consumption and the original thickness of the target, and through the functional relation, accurately predicting the service life of the target so as to maximize the utilization rate of the target.
In the invention, by setting the standard residual thickness of the target, when the minimum residual thickness of the target is close to or equal to the standard residual thickness, the target is stopped to be used and is replaced by a new target.
The method provided by the invention can obtain the overall erosion condition of the surface of the target material, analyze the overall erosion condition of the surface of the target material, obtain the distribution rule of the magnetic field, change the appearance of the surface of the target material before sputtering through the obtained magnetic field distribution, and further improve the utilization rate of the target material.
The method provided by the invention has no special requirements on the shape, size and material of the target, can be suitable for targets with various shapes such as round, rectangular and the like, is also suitable for targets with larger volume, and is not limited by detection space. The method has the characteristics of simplicity, feasibility, rapidness, effectiveness, high accuracy and the like, and is wide in application range.
Preferably, the three-dimensional scanning in step (1) uses an instrument comprising a three-dimensional scanner. The three-dimensional scanner is portable and can be carried about, various targets can be detected anytime and anywhere, the real morphology of the targets can be rapidly and comprehensively obtained, the deepest sputtering position of the targets can be accurately found, the problems that the traditional three-dimensional scanner is low in detection efficiency, the products are likely to be damaged in the detection process, dead angles and complex curved surfaces cannot be detected at the same time are solved, and the like.
In the present invention, the type of the three-dimensional scanner is not particularly limited, and any type commonly used by those skilled in the art can be used to obtain the target morphology in all directions, and is suitable for the present invention.
Preferably, the three-dimensional scanner comprises a three-dimensional laser scanner and/or a photographic three-dimensional scanner, and the "and/or" means: the three-dimensional scanner can be used for scanning the appearance, the photographic scanner can be used for scanning the appearance, and the appearance can be scanned by using the photographic scanner at the same time.
Preferably, the target material in step (1) comprises any one or a combination of at least two of Al, Ti, Cu or Au, wherein the combination is typically, but not limited to: al and Ti, Cu and Au, Ti and Au, etc.
Preferably, the surface erosion curve in step (1) is obtained by plotting the topography before target sputtering and the topography after target sputtering on the same coordinate system.
The surface erosion curve comprises a surface appearance curve before sputtering, a back appearance curve before sputtering, a surface appearance curve after sputtering and a surface appearance curve after sputtering, and the back appearance curve before sputtering and the back appearance curve after sputtering of the target are superposed.
In the present invention, the position of the surface erosion curve in the coordinate system is not particularly limited as long as: the back surface appearance curve before sputtering of the target material is superposed with the back surface appearance curve after sputtering, and the invention is suitable for the target material and the sputtering target material.
Preferably, the minimum remaining thickness of the target in step (1) is: and in the surface erosion curve, the vertical distance between the lowest point of the sputtered surface topography curve and the back surface topography curve.
In the present invention, the minimum remaining thickness of the target material is: the distance between the deepest position actually sputtered on the surface of the target and the back surface of the target.
Preferably, the original thickness of the target material in the step (1) is as follows: in the surface erosion curve, the perpendicular distance between the surface profile curve and the back profile curve before sputtering.
Preferably, the method for obtaining the functional relationship in step (2) includes: and sputtering the target under the set sputtering power, recording data once every certain sputtering time, and recording at least one group of sputtering power consumption and the corresponding minimum residual thickness of the target. And fitting to obtain the functional relation according to the sputtering power consumption, the minimum residual thickness of the target corresponding to the sputtering power consumption and the original thickness of the target.
Preferably, the number of the data records is 3-5, for example, 3, 4 or 5 sets.
In the present invention, the sputtering method of the target is not specifically limited, and may be sputtering one target at any power for the same time, sputtering one target at any power for different times, or sputtering a plurality of targets at the same sputtering power for different times, and any sputtering method commonly used by those skilled in the art is applicable to the present invention.
In the present invention, the sputtering time of the target material per time is not particularly limited, and may be 30min or 60min, and any sputtering time commonly used by those skilled in the art is applicable to the present invention.
In the present invention, the construction of the functional relationship is not specifically limited, and may be obtained by computer fitting, or may be obtained by direct calculation according to related data, and any construction method commonly used by those skilled in the art is applicable to the present invention.
As a preferred technical scheme of the invention, the functional relation in the step (2) is expressed as: y is b-ax, where b is the original thickness of the target, y is the minimum remaining thickness of the target, x is the sputtering power consumption, and a is a constant, which is in a range of 0 to 1, inclusive, depending on the material, grain size, grain orientation, etc. of the target, and may be, for example, 0.1, 0.3, 0.5, 0.8, or 0.9.
As a further preferred embodiment of the present invention, the method comprises the steps of:
(1) scanning the target by using a three-dimensional laser scanner to obtain a topography of the target before sputtering;
(2) setting sputtering power, sputtering the target, recording 3-5 groups of sputtering power consumption, and scanning the sputtered target by using a three-dimensional laser scanner to obtain a corresponding target sputtered topography under the sputtering power consumption;
(3) drawing the topography before sputtering the target and the topography after sputtering the target in the same coordinate system to obtain an erosion curve of the target, wherein the erosion curve comprises a surface topography curve before sputtering, a back topography curve before sputtering, a surface topography curve after sputtering and a surface topography curve after sputtering, and the back topography curve before sputtering the target is superposed with the back topography curve after sputtering;
(4) in the erosion curve, the vertical distance between the surface profile curve and the back profile curve before sputtering is the original thickness of the target material, and the vertical distance between the lowest point of the surface profile curve and the back profile curve after sputtering is the minimum residual thickness of the target material;
(5) and (3) constructing a functional relation y-b-ax according to the sputtering power consumption in the step (2), the original thickness of the target material in the step (4) and the minimum residual thickness of the target material, wherein b is the original thickness of the target material, y is the minimum residual thickness of the target material, x is the sputtering power consumption, a is a constant, the value range of a is 0-1, and the service life of the target material is predicted through the functional relation.
Compared with the prior art, the invention has at least the following beneficial effects:
(1) the method for predicting the service life of the target material, provided by the invention, adopts a three-dimensional scanning method, can carry out omnibearing scanning on the target material at any time, can accurately and comprehensively reflect the actual sputtering depth and distribution condition of the surface of the target material, can quickly and accurately find the actual deepest sputtering position, and further accurately predicts the service life of the target material, and the error rate of the target material sputtering life predicted by the method can reach below 1.35 percent, so that the utilization rate of the target material is maximized; furthermore, the used three-dimensional scanner is light in weight, convenient to carry and capable of detecting at any time and any place;
(2) the method for predicting the service life of the target material is suitable for target materials with various shapes, sizes and materials, is not limited by detection space, and has the characteristics of simple operation, rapidness, effectiveness, high accuracy and wide application range.
Drawings
FIG. 1 is a topographical view of the target material of example 1 before sputtering.
Fig. 2 is an erosion curve of the target obtained in example 1.
FIG. 3 is a functional relationship diagram obtained in example 2.
FIG. 4 is a topographical view of the target material of example 6 before sputtering.
Fig. 5 is an erosion curve of the target obtained in example 6.
Detailed Description
The technical solution of the present invention will be further described with reference to the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
The embodiment provides a method for predicting the service life of a target, which comprises the following steps:
(1) scanning a circular aluminum target by using a three-dimensional laser scanner to obtain a topography of the aluminum target before sputtering;
(2) setting the sputtering power to be 110kW, sputtering the aluminum target for 3h, recording the power consumption of the sputtering process to be 330kWh, and scanning the sputtered aluminum target by using a three-dimensional laser scanner to obtain a morphology map of the sputtered aluminum target;
(3) drawing the topography before the aluminum target material is sputtered and the topography after the aluminum target material is sputtered in the same coordinate system to obtain an erosion curve of the aluminum target material;
(4) the data obtained from the erosion curves are shown in table 1, where the sputtering power consumption is recorded as the lifetime and the minimum residual thickness as the residual.
TABLE 1
| Service life/kWh | Residual amount/ |
| 0 | 19.61 |
| 330 | 15.80 |
And (3) obtaining a functional relation of y, 19.61-0.01154x by adopting a computer fitting method according to the sputtering power consumption in the step (2), the original thickness of the aluminum target in the step (4) and the minimum residual thickness of the aluminum target.
Through the functional relation, the service life of the aluminum target material is 1534kWh calculated according to the preset minimum residual thickness of the target material of 1.9mm, and the standard residual thickness is set as the same as that in the prior art.
As shown in fig. 1, the surface topography of the aluminum target material before sputtering provided in this embodiment is smooth and flat; the erosion curve of the aluminum target is shown in fig. 2, wherein the dotted line represents a surface profile curve before sputtering, and the back profile curve before sputtering is overlapped with the back profile curve after sputtering; the solid lines show the surface profile after sputtering and the backside profile after sputtering. The erosion curve indicates that the surface depth of the sputtered aluminum target material is unevenly distributed and has the deepest sputtering position.
Example 2
The difference from example 1 is only that in step (2), the aluminum target material was sputtered three times for 3h, 8h, and 10h, respectively, and the power consumption of the sputtering process and the minimum remaining thickness of the aluminum target material are shown in table 2, in which the sputtering power consumption is recorded as the service life and the minimum remaining thickness is recorded as the remaining amount.
TABLE 2
| Service life/kWh | Residual amount/ |
| 0 | 19.61 |
| 330 | 15.80 |
| 880 | 9.49 |
| 1100 | 6.90 |
And (3) obtaining a functional relation graph according to the sputtering power consumption in the step (2), the original thickness of the aluminum target in the step (4) and the minimum residual thickness of the aluminum target, wherein the functional relation graph is shown in fig. 3, and the obtained functional relation is that y is 19.61-0.01157x by adopting a computer fitting method.
Through the functional relation, the service life of the aluminum target material is 1531kWh according to the calculation result according to the preset minimum residual thickness of the target material of 1.9mm, and the standard residual thickness is set as the same as that in the prior art. Example 2 more data was used to determine the linear relationship between the sputtering power consumption and the minimum residual thickness of the titanium target, and is more valuable for reference.
Example 3
The embodiment provides a method for predicting the service life of a target, which comprises the following steps:
(1) scanning the rectangular copper target by using a three-dimensional laser scanner to obtain a topography of the copper target before sputtering;
(2) setting the sputtering power to be 120kW, sputtering the copper target for 2h, 5h and 10h, recording the power consumption of the sputtering process to be 240, 600 and 1200kWh, and scanning the sputtered copper target by using a three-dimensional laser scanner to obtain a morphology map of the sputtered copper target;
(3) drawing the topography before sputtering the copper target and the topography after sputtering the copper target in the same coordinate system to obtain an erosion curve of the copper target;
(4) and obtaining the original thickness and the minimum residual thickness of the copper target from the erosion curve, recording data in a table 3, recording sputtering power consumption in the table as service life, and recording the minimum residual thickness as residual quantity.
TABLE 3
| Service life/kWh | Residual amount/ |
| 0 | 20.32 |
| 240 | 18.78 |
| 600 | 16.50 |
| 1200 | 12.64 |
And (3) obtaining a functional relation of y-20.32-0.00644 x by adopting a computer fitting method according to the sputtering power consumption in the step (2), the original thickness of the copper target in the step (4) and the minimum residual thickness of the copper target.
And replacing the target material according to the preset minimum residual thickness of the target material of 1.9mm by the functional relation to obtain the service life of the copper target material of 2862 kWh.
Example 4
The embodiment provides a method for predicting the service life of a target, which comprises the following steps:
(1) scanning a round gold target by using a three-dimensional laser scanner to obtain a topography of the gold target before sputtering;
(2) setting the sputtering power to be 200kW, sputtering the gold target for 1h, 2h and 3h, recording the power consumption of the sputtering process to be 200kWh, and scanning the sputtered gold target by using a three-dimensional laser scanner to obtain a morphology graph of the gold target after sputtering;
(3) drawing the topography before the gold target material is sputtered and the topography after the gold target material is sputtered in the same coordinate system to obtain an erosion curve of the gold target material;
(4) and obtaining the original thickness and the minimum residual thickness of the gold target material from the erosion curve, recording data in a table 4, recording sputtering power consumption in the table as service life, and recording the minimum residual thickness as residual quantity.
TABLE 4
| Service life/kWh | Residual amount/ |
| 0 | 7.00 |
| 200 | 5.74 |
| 400 | 4.48 |
| 600 | 3.20 |
And (3) obtaining a functional relation y of 7-0.00630x by adopting a computer fitting method according to the sputtering power consumption in the step (2), the original thickness of the gold target material in the step (4) and the minimum residual thickness of the gold target material.
And replacing the target material according to the preset minimum residual thickness of 1.9mm by the functional relation, so as to obtain that the service life of the gold target material is 810 kWh.
Example 5
The embodiment provides a method for predicting the service life of a target, which comprises the following steps:
(1) respectively scanning the round titanium target material by using a three-dimensional laser scanner to obtain a morphology map of the titanium target material before sputtering;
(2) setting the sputtering power to be 150kW, sputtering the titanium target for 1h, 1.5h and 2h, recording the power consumption of the sputtering process to be 150kWh, 225kWh and 300kWh respectively, and scanning the sputtered titanium target by using a three-dimensional laser scanner to obtain a morphology map of the sputtered titanium target;
(3) drawing the topography before the titanium target material is sputtered and the topography after the titanium target material is sputtered in the same coordinate system to obtain an erosion curve of the titanium target material;
(4) and obtaining the original thickness and the minimum residual thickness of the titanium target from the erosion curve of the titanium target, recording data in a table 5, recording sputtering power consumption in the table as service life, and recording the minimum residual thickness as residual quantity.
TABLE 5
| Service life/kWh | Residual amount/ |
| 0 | 8.89 |
| 150 | 7.65 |
| 225 | 7.03 |
| 300 | 6.39 |
And (3) obtaining a functional relation corresponding to the titanium target by adopting a computer fitting method according to the sputtering power consumption in the step (2), the original thickness of the titanium target in the step (4) and the minimum residual thickness of the titanium target, wherein y is 8.89-0.00841 x.
And calculating to obtain the service life of the titanium target material to be 831kWh according to the preset minimum residual thickness of the target material to be 1.9mm by the functional relation.
Example 6
The embodiment provides a method for predicting the service life of a target, which comprises the following steps:
(1) scanning an aluminum target material with a complex shape by using a photographic three-dimensional scanner to obtain a topography of the aluminum target material before sputtering;
(2) setting the sputtering power to be 310kW, sputtering the aluminum target for 3h, 4h and 5h, recording the power consumption of the sputtering process to be 930kWh, 1240kWh and 1550kWh respectively, and scanning the sputtered aluminum target by using a photographic three-dimensional scanner to obtain a morphology map of the sputtered aluminum target;
(3) drawing the topography before the aluminum target material is sputtered and the topography after the aluminum target material is sputtered in the same coordinate system to obtain an erosion curve of the aluminum target material;
(4) and obtaining the original thickness and the minimum residual thickness of the aluminum target from the erosion curve of the aluminum target, recording data in a table 6, recording sputtering power consumption in the table as service life, and recording the minimum residual thickness as residual quantity.
TABLE 6
| Service life/kWh | Residual amount/ |
| 0 | 26.61 |
| 930 | 14.61 |
| 1240 | 10.61 |
| 1550 | 6.81 |
And (3) obtaining a functional relation corresponding to the aluminum target by adopting a computer fitting method according to the sputtering power consumption in the step (2), the original thickness of the aluminum target in the step (4) and the minimum residual thickness of the aluminum target, wherein y is 26.61-0.01297 x.
And calculating and fitting the preset minimum residual thickness of the target material to obtain 1905kWh of service life of the aluminum target material according to the functional relation.
As shown in fig. 4, the surface topography of the aluminum target material before sputtering provided by this embodiment is uneven and has a complex curved surface; the erosion curve of the aluminum target is shown in fig. 5, wherein the dotted line represents a surface profile curve before sputtering, and the back profile curve before sputtering is overlapped with the back profile curve after sputtering; the solid lines show the surface profile after sputtering and the backside profile after sputtering. The erosion curve shows that the surface depth of the sputtered target material is unevenly distributed, and the target material is sputtered deepest.
Comparative example 1
Compared with the example 1, the difference is only that the comparative example adopts a depth gauge to test the surface corrosion condition of the aluminum target, the minimum residual thickness of the aluminum target is 6.96mm, and the service life of the aluminum target is 1550 kWh.
Comparative example 2
The only difference compared to example 1 is that this comparative example uses the apparatus disclosed in CN108180814A to test the surface erosion condition of the aluminum target, resulting in a minimum residual thickness of 7.01mm for the aluminum target, giving a lifetime of 1565kWh for said aluminum target.
Comparative example 3
Compared with example 1, the difference is only that the comparative example adopts the method disclosed in CN103572222A to predict the service life of the aluminum target, the minimum residual thickness of the aluminum target is 6.95mm, and the service life of the aluminum target is 1558 kWh.
Evaluating the target service life prediction accuracy:
the target material service lives predicted in the above examples 1 to 6 and comparative examples 1 to 3 were evaluated for accuracy by the following methods: the accuracy of the prediction method is evaluated by calculating the difference between the predicted service life and the actual service life and then calculating the ratio of the difference to the actual service life according to the value.
The evaluation results are shown in Table 7.
TABLE 7
As can be seen from the data in table 7, the service life of the target obtained in example 2 is relatively accurate, because example 2 accurately finds the deepest sputtering position on the surface of the aluminum target, so that the minimum residual thickness is close to the true value; in comparative examples 1 to 3, point-taking tests show that the probability of missing the deepest part of actual sputtering exists, the obtained minimum residual thickness of the target material is probably not the true minimum residual thickness of the target material, and the accuracy is low; the accuracy of the target lifetime calculated from the minimum remaining thickness of the target is also low.
In conclusion, the method for predicting the service life of the target material provided by the invention adopts a three-dimensional scanning method, accurately reflects the real appearance of the target material, particularly the actual sputtering depth distribution condition of the sputtered surface of the target material, and can quickly and accurately find the actual deepest sputtering position; and according to the power consumption of the actual sputtering process, constructing a functional relation among the minimum residual thickness of the target, the sputtering power consumption and the original thickness of the target, and through the functional relation, accurately predicting the service life of the target so as to maximize the utilization rate of the target. The method is simple and easy to implement, has high accuracy and has wide application prospect.
The applicant declares that the present invention illustrates the detailed structural features of the present invention through the above embodiments, but the present invention is not limited to the above detailed structural features, that is, it does not mean that the present invention must be implemented depending on the above detailed structural features. It should be understood by those skilled in the art that any modifications of the present invention, equivalent substitutions of selected components of the present invention, additions of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. A method of predicting the service life of a target, comprising the steps of:
(1) obtaining topography maps of the target material before and after sputtering by using a three-dimensional scanning method, combining the topography maps of the target material before and after sputtering to prepare a surface erosion curve, and obtaining the original thickness of the target material and the minimum residual thickness of the target material from the surface erosion curve;
(2) and constructing a functional relation among the minimum residual thickness of the target, the sputtering power consumption and the original thickness of the target, and predicting the service life of the target through the functional relation.
2. The method of claim 1, wherein the three-dimensional scanning of step (1) uses an instrument comprising a three-dimensional scanner.
3. The method of claim 2, wherein the three-dimensional scanner comprises a three-dimensional laser scanner and/or a photographic three-dimensional scanner.
4. The method of claim 1, wherein the target material of step (1) comprises any one or a combination of at least two of Al, Ti, Cu, or Au.
5. The method according to claim 1, wherein the surface erosion curve of step (1) is obtained by plotting the topography before sputtering the target and the topography after sputtering the target on the same coordinate system;
the surface erosion curve comprises a surface appearance curve before sputtering, a back appearance curve before sputtering, a surface appearance curve after sputtering and a surface appearance curve after sputtering, and the back appearance curve before sputtering and the back appearance curve after sputtering of the target are superposed.
6. The method of claim 1, wherein the minimum remaining thickness of the target of step (1) is: and in the surface erosion curve, the vertical distance between the lowest point of the sputtered surface topography curve and the sputtered back surface topography curve.
7. The method according to claim 1, wherein the original thickness of the target material of step (1) is: and in the surface erosion curve, the vertical distance between the surface appearance curve before sputtering and the back appearance curve before sputtering.
8. The method of claim 1, wherein the step (2) of obtaining the functional relationship comprises: sputtering the target under a set sputtering power, recording data once every certain sputtering time, and recording at least one group of sputtering power consumption and the corresponding minimum residual thickness of the target;
and fitting to obtain the functional relation according to the sputtering power consumption, the minimum residual thickness of the target corresponding to the sputtering power consumption and the original thickness of the target.
9. The method of claim 1, wherein the functional relationship of step (2) is represented by: and y is b-ax, wherein b is the original thickness of the target, y is the minimum residual thickness of the target, x is the sputtering power consumption, and a is a constant and has a value ranging from 0 to 1.
10. Method according to claim 1, characterized in that it comprises the following steps:
(1) scanning the target by using a three-dimensional laser scanner to obtain a topography of the target before sputtering;
(2) setting sputtering power, sputtering the target, recording 3-5 groups of sputtering power consumption, and scanning the sputtered target by using a three-dimensional laser scanner to obtain a corresponding target sputtered topography under the sputtering power consumption;
(3) drawing the topography before sputtering the target and the topography after sputtering the target in the same coordinate system to obtain an erosion curve of the target, wherein the erosion curve comprises a surface topography curve before sputtering, a back topography curve before sputtering, a surface topography curve after sputtering and a surface topography curve after sputtering, and the back topography curve before sputtering the target is superposed with the back topography curve after sputtering;
(4) in the erosion curve, the vertical distance between the surface profile curve and the back profile curve before sputtering is the original thickness of the target material, and the vertical distance between the lowest point of the surface profile curve and the back profile curve after sputtering is the minimum residual thickness of the target material;
(5) and (3) constructing a functional relation y-b-ax according to the sputtering power consumption in the step (2), the original thickness of the target material in the step (4) and the minimum residual thickness of the target material, wherein b is the original thickness of the target material, y is the minimum residual thickness of the target material, x is the sputtering power consumption, a is a constant, the value range of a is 0-1, and the service life of the target material is predicted through the functional relation.
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