CN111426698A - Linear array image sensor - Google Patents

Linear array image sensor Download PDF

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Publication number
CN111426698A
CN111426698A CN202010279767.8A CN202010279767A CN111426698A CN 111426698 A CN111426698 A CN 111426698A CN 202010279767 A CN202010279767 A CN 202010279767A CN 111426698 A CN111426698 A CN 111426698A
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CN
China
Prior art keywords
light
linear array
lens
array image
transmitting cover
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Pending
Application number
CN202010279767.8A
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Chinese (zh)
Inventor
李宏明
肖昌林
刘成名
肖建全
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Shenzhen Guangtai Technology Co ltd
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Shenzhen Guangtai Technology Co ltd
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Priority to CN202010279767.8A priority Critical patent/CN111426698A/en
Publication of CN111426698A publication Critical patent/CN111426698A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106General arrangement of respective parts
    • G01N2021/0112Apparatus in one mechanical, optical or electronic block
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9511Optical elements other than lenses, e.g. mirrors

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  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The invention discloses a linear array image sensor. The linear array image sensor comprises a substrate, a linear array image sensing chip, a lens, a light-transmitting cover and a light source; the linear array image sensing chip is arranged on the substrate, and the lens is arranged between the linear array image sensing chip and the light-transmitting cover; the light-transmitting cover is arc-shaped; the substrate, the linear array image sensing chip, the lens and the light source are all positioned on the outer side of the arc of the light-transmitting cover; an object focusing line at one end of the lens close to the light-transmitting cover is intersected with a light beam central line of the light source; and the angle between the optical axis of the lens and the beam centre line of the light source is greater than 50 deg.. The light-transmitting cover adopted by the invention is in a circular arc shape and is matched with the column shape of the scanning target, so that the installation and debugging are convenient. And because the included angle between the optical axis of the lens and the central line of the light beam of the light source is more than 50 degrees, the overexposure of the normal cylindrical surface can be avoided, a high-quality image of the cylindrical mirror surface defect can be obtained, and the detection efficiency is greatly improved.

Description

Linear array image sensor
Technical Field
The invention relates to the technical field of photoelectric imaging, in particular to a linear array image sensor.
Background
The linear array image sensor is widely applied to detection of industrial finished products and semi-finished products, wherein defect detection of a cylindrical metal outer mirror surface becomes an application bottleneck of the traditional linear array image sensor, mainly because a light-transmitting cover of the traditional linear array image sensor is planar, an included angle between a light beam central line of a built-in light source and an optical axis of a lens is small, overexposure is easy, image quality is seriously influenced, the planar light-transmitting cover is not fit with a cylindrical scanning target, alignment of an object focal line is not easy, and installation and debugging difficulty is increased.
Disclosure of Invention
The invention aims to provide a linear array image sensor to solve the problems of poor image quality and high installation and debugging difficulty when the traditional linear array image sensor is used for detecting defects of a cylindrical metal outer mirror surface.
In order to achieve the purpose, the invention provides the following scheme:
a linear array image sensor, the linear array image sensor comprising: the device comprises a substrate, a linear array image sensing chip, a lens, a light-transmitting cover and a light source;
the linear array image sensing chip is mounted on the substrate, and the lens is arranged between the linear array image sensing chip and the light-transmitting cover; the light-transmitting cover is arc-shaped; the substrate, the linear array image sensing chip, the lens and the light source are all positioned on the outer side of the arc of the light-transmitting cover; an object focusing line of one end, close to the light-transmitting cover, of the lens is intersected with a light beam center line of the light source; the included angle between the optical axis of the lens and the central line of the light beam of the light source is larger than 50 degrees.
Optionally, an angle between the optical axis of the lens and the central line of the light beam of the light source is 55 ° to 65 °.
Optionally, an image focusing line at one end of the lens, which is far away from the light-transmitting cover, is overlapped with a central line of a light receiving surface of the linear array image sensing chip.
Optionally, the object focusing line at one end of the lens close to the light-transmitting cover falls on the scanning target through the light-transmitting cover.
Optionally, the scanning target is located inside the arc of the light-transmitting cover.
Optionally, the scanning target is a cylindrical metal.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects:
the invention provides a linear array image sensor, which comprises: the device comprises a substrate, a linear array image sensing chip, a lens, a light-transmitting cover and a light source; the linear array image sensing chip is mounted on the substrate, and the lens is arranged between the linear array image sensing chip and the light-transmitting cover; the light-transmitting cover is arc-shaped; the substrate, the linear array image sensing chip, the lens and the light source are all positioned on the outer side of the arc of the light-transmitting cover; an object focusing line of one end, close to the light-transmitting cover, of the lens is intersected with a light beam center line of the light source; the included angle between the optical axis of the lens and the central line of the light beam of the light source is larger than 50 degrees. The light-transmitting cover adopted by the invention is in a circular arc shape and is matched with the column shape of the scanning target, so that the installation and debugging are convenient. And because the included angle between the optical axis of the lens and the central line of the light beam of the light source is more than 50 degrees, the overexposure of a normal cylindrical surface can be avoided, a high-quality image of the defect of the cylindrical mirror surface can be obtained, and the detection efficiency is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a linear array image sensor provided in the present invention;
fig. 2 is a schematic diagram of detecting concave-convex defect of the cylindrical mirror surface of the linear array image sensor provided by the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a linear array image sensor to solve the problems of poor image quality and high installation and debugging difficulty when the traditional linear array image sensor is used for detecting defects of a cylindrical metal outer mirror surface.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Fig. 1 is a schematic structural diagram of a linear array image sensor provided in the present invention. The invention provides a linear array image sensor for detecting defects of a cylindrical metal mirror surface, referring to fig. 1, the linear array image sensor comprises: the device comprises a substrate 1, a linear array image sensing chip 2, a lens 3, a light-transmitting cover 4 and a light source 5.
The linear array image sensing chip 2 is mounted on the substrate 1. The lens 3 is arranged between the linear array image sensing chip 2 and the light-transmitting cover 4, so that an image focusing line at one end of the lens 3 close to the linear array image sensing chip 2 (i.e. the end far away from the light-transmitting cover 4) is superposed with the central line of the light receiving surface of the linear array image sensing chip 2; the object focusing line of the lens 3 close to one end of the light-transmitting cover 4 falls on the scanning target 6 through the light-transmitting cover 4.
In order to better match the scanning target 6 and meet the light source incidence angle requirement, the transparent cover 4 is designed into a circular arc shape. The scanning target 6 is positioned on the inner side of the circular arc of the light-transmitting cover 4; the substrate 1, the linear array image sensing chip 2, the lens 3 and the light source 5 are all positioned outside the arc of the light-transmitting cover 4, and the object focusing line of one end of the lens 3 close to the light-transmitting cover 4 is intersected with the light beam center line of the light source 5; and the included angle between the optical axis of the lens 3 and the central line of the light beam of the light source 5 is more than 50 degrees.
The light-transmitting cover 4 is arc-shaped, and the included angle between the optical axis of the lens 3 and the central line of the light beam of the light source 5 is more than 50 degrees, so that the cylindrical metal external mirror surface defect imaging is facilitated, and the installation and debugging are convenient.
Preferably, the angle between the optical axis of the lens and the beam centre line of the light source is between 55 ° and 65 °.
Preferably, the scan target 6 is a cylindrical metal. That is to say, the invention provides the linear array image sensor which is convenient to install, clear in image and suitable for detecting the defects of the cylindrical metal outer mirror surface.
In practical application, the linear array image sensing chip can adopt a CMOS process linear array image sensing chip of a model such as STC012H of Toshiba Japan.
The light-transmitting cover 4 is in a circular arc shape and is matched with the 6 column shape of the scanning target, so that the installation and debugging are more convenient. And because the included angle between the optical axis of the lens 3 and the central line of the light beam of the light source 5 is between 55 degrees and 65 degrees, the overexposure of a normal cylindrical surface can be avoided, and the image of the concave-convex side surface can be acquired, so that a high-quality image of the defect of the cylindrical mirror surface can be acquired, and the detection efficiency is greatly improved.
Fig. 2 is a schematic diagram of detecting concave-convex defect of the cylindrical mirror surface of the linear array image sensor provided by the invention. As shown in fig. 2, the principle of detecting the concave-convex depression of the outer mirror surface of the cylindrical metal requires that the reflective light source 5 irradiates at an angle within a specific range, so that the reflected light from the normal surface should be prevented from entering the lens 3, and the reflected light from the side surface of the concave or convex portion on the outer mirror surface of the cylindrical metal scanning target 6 can enter the lens 3, so as to enter the linear array image sensing chip 2 to achieve the purpose of detecting the defect.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.

Claims (6)

1. The linear array image sensor is characterized by comprising: the device comprises a substrate, a linear array image sensing chip, a lens, a light-transmitting cover and a light source;
the linear array image sensing chip is mounted on the substrate, and the lens is arranged between the linear array image sensing chip and the light-transmitting cover; the light-transmitting cover is arc-shaped; the substrate, the linear array image sensing chip, the lens and the light source are all positioned on the outer side of the arc of the light-transmitting cover; an object focusing line of one end, close to the light-transmitting cover, of the lens is intersected with a light beam center line of the light source; the included angle between the optical axis of the lens and the central line of the light beam of the light source is larger than 50 degrees.
2. The linear array image sensor of claim 1, wherein the angle between the optical axis of the lens and the central line of the light beam of the light source is 55 ° to 65 °.
3. The line array image sensor of claim 1, wherein an image focusing line at an end of the lens away from the transparent cover coincides with a center line of a light receiving surface of the line array image sensor chip.
4. The line image sensor of claim 1, wherein said object focal line of said lens near one end of said light transmissive cover falls on a scan target through said light transmissive cover.
5. The linear array image sensor of claim 4, wherein the scan target is located inside an arc of the light-transmissive cover.
6. The line image sensor of claim 4, wherein the scan target is a cylindrical metal.
CN202010279767.8A 2020-04-10 2020-04-10 Linear array image sensor Pending CN111426698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010279767.8A CN111426698A (en) 2020-04-10 2020-04-10 Linear array image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010279767.8A CN111426698A (en) 2020-04-10 2020-04-10 Linear array image sensor

Publications (1)

Publication Number Publication Date
CN111426698A true CN111426698A (en) 2020-07-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010279767.8A Pending CN111426698A (en) 2020-04-10 2020-04-10 Linear array image sensor

Country Status (1)

Country Link
CN (1) CN111426698A (en)

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