CN111421930A - Protective film suitable for manufacturing process of multilayer printed circuit board - Google Patents
Protective film suitable for manufacturing process of multilayer printed circuit board Download PDFInfo
- Publication number
- CN111421930A CN111421930A CN202010330632.XA CN202010330632A CN111421930A CN 111421930 A CN111421930 A CN 111421930A CN 202010330632 A CN202010330632 A CN 202010330632A CN 111421930 A CN111421930 A CN 111421930A
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- CN
- China
- Prior art keywords
- film
- protective film
- multilayer printed
- resin layer
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention belongs to the technical field of protective films, and particularly relates to a protective film suitable for a multilayer printed circuit board manufacturing process. The protective film suitable for the manufacturing process of the multilayer printed circuit board comprises a base material film, and a protective film with heat resistance and chemical resistance of a resin layer formed by solvent distribution on at least one surface of the base material film. The beneficial effects are as follows: the soft buffer film overcomes the defects in the prior art, has the performances of low price, chemical resistance, heat resistance and uniform thickness, can play a role in high-temperature stamping and can also play a role in the buffer film.
Description
Technical Field
The invention belongs to the technical field of protective films, and particularly relates to a protective film suitable for a multilayer printed circuit board manufacturing process.
Background
As is well known, many heat-resistant protective films are used widely, particularly in the field of manufacturing printed boards as described above. In the prior art process for producing a multilayer printed circuit board, copper foil which has not been patterned yet at the time of forming a circuit pattern is protected, or when a plurality of copper sheet laminated plates are pressure-bonded, the protrusion of pre-pressed plates is prevented, and the adhesion between the copper sheet laminated plates and a pressing plate is prevented. In the production process of the multilayer printed wiring board, such a protective film is exposed to chemicals such as a developing solution, an etching solution, and a resist stripping solution, and is also exposed to high temperatures in a hot press, and therefore, it is required to improve the chemical resistance and the heat resistance of the protective film.
Disclosure of Invention
The invention provides a protective film suitable for a multilayer printed circuit board manufacturing process in order to make up for the defects of the prior art.
The invention is realized by the following technical scheme:
a protective film suitable for use in a process for producing a multilayer printed wiring board, comprising a base film having on at least one side thereof a protective film of heat resistance and chemical resistance of a resin layer formed by solvent distribution.
Further, the resin layer contains polyether sulfonamide or polyacetamide.
Further, the base film includes an adhesive layer on the side opposite to the resin layer.
Further, both sides of the substrate film contain resin layers.
Further, the thickness of the resin layer is 0.1-5 μm.
Further, the thickness of the base material film is 20-250 μm.
Further, the thickness of the base material film is 4-30 μm.
Further, the substrate film is formed of a polyester or polyolefin film as a base material film.
The invention has the beneficial effects that: the soft buffer film overcomes the defects in the prior art, has the performances of low price, chemical resistance, heat resistance and uniform thickness, can play a role in high-temperature stamping and can also play a role in the buffer film.
Detailed Description
The following provides a further description of a protective film suitable for use in a multilayer printed circuit board manufacturing process according to the present invention with reference to examples.
A protective film suitable for use in a process for producing a multilayer printed wiring board, comprising a base film having on at least one side thereof a protective film of heat resistance and chemical resistance of a resin layer formed by solvent distribution.
Further, the resin layer contains polyether sulfonamide or polyacetamide.
Further, the base film includes an adhesive layer on the side opposite to the resin layer.
Further, both sides of the substrate film contain resin layers.
Further, the thickness of the resin layer is 0.1-5 μm.
Further, the thickness of the base material film is 20-250 μm.
Further, the thickness of the base material film is 4-30 μm.
Further, the substrate film is formed of a polyester or polyolefin film as a base material film.
The present invention relates to a protective film suitable for use in a process for producing a multilayer printed wiring board, which is a resin layer (hereinafter referred to as a "heat-resistant resin layer") of polyethersulfonamide (hereinafter referred to as "PES") or polyimide (hereinafter referred to as "PEI") formed by a solvent dispensing method, which imparts heat resistance and chemical resistance to the protective film, and which can be used as a substrate protective film (masking tape) because it is resistant to various chemicals such as an alkali developer such as an aqueous sodium hydroxide solution, an etchant such as a copper chloride or an aqueous iron chloride solution, a blackening solution, and an organic solvent such as an alcohol or a hydrocarbon solvent, and further, since the glass transition temperature of polyethersulfonamide is about 230 ℃ and the glass transition temperature of polyimide is about 210 ℃, the polyethersulfonamide is not decomposed at temperatures lower than these temperatures and is not wet-spread, for example, even when a high temperature such as 190 ℃ and 60Kg/c square meter is applied under pressure at a high temperature used in the production of printed circuit boards, foaming, flow, thermal decomposition and the like do not occur, and the contact surface is not bonded at the time of producing the boards under pressure, and thus the release film can be used.
The polyether sulfone used in the resin layer suitable for the protective film of the present invention is a structure in which a sulfo group and an ether group are bonded to an aromatic group.
For example, the following general formulae (1) to (3)
（－Ａｒ１－ＳＯ２ －Ａｒ２－Ｏ－） （１）
（－Ａｒ３－Ｘ－Ａｒ４－Ｏ－Ａｒ５－ＳＯ２－Ａｒ６－Ｏ－） （２）
（－Ａｒ７－ＳＯ２－Ａｒ８－Ｏ－Ａｒ９－Ｏ－） （３）
In the formula (1), Ar 1 and Ar 2 are the same or different aromatic hydrocarbon groups with 6-12 carbon atoms. In the formula (2), Ar 3-Ar 6 are the same or different aromatic hydrocarbon groups with 6-12 carbon atoms, and X is divalent hydrocarbon group with 1-15 carbon atoms. In the formula (3), Ar 7 to Ar 9 are aromatic hydrocarbon groups having 6 to 12 carbon atoms, which may be the same or different. At least one aromatic polyether sulfone selected from the group consisting of repeating units.
In the formula (1), Ar 1 and Ar 2 are preferably an aryl group having 6 to 12 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms. Specific examples thereof include m-styryl group, p-styryl group, dimethyl-p-styryl group, tetramethyl-p-styryl group, and distyryl group. When Ar 1 and Ar 2 are both p-styryl groups, they are advantageous from the viewpoint of production, and are particularly suitable.
In the formula (2), Ar 3 to Ar 6 are preferably an aryl group having 6 to 12 carbon atoms, and an aryl group having 6 to 10 carbon atoms is more preferable. Specifically, m-styryl, p-styryl, dimethyl-p-styryl, tetramethyl-p-styryl, xylyl, etc. are mentioned, and particularly suitable examples are those in which p-styryl is mentioned for Ar 3 to Ar 6. X is a divalent hydrocarbon group having 1 to 15 carbon atoms, and is selected from a divalent aliphatic hydrocarbon group having 1 to 15 carbon atoms, an alicyclic hydrocarbon group, and an aralkenyl group. X is a divalent hydrocarbon group having 1 to 15 carbon atoms, and is selected from a divalent aliphatic hydrocarbon group having 1 to 15 carbon atoms, an alicyclic hydrocarbon group, and an aralkenyl group. Preferably a divalent aliphatic hydrocarbon group, alicyclic hydrocarbon group, or aralkenyl group having 1 to 10 carbon atoms, more preferably a divalent aliphatic hydrocarbon group, alicyclic hydrocarbon group, or aralkenyl group having 1 to 10 carbon atoms. Specifically, aliphatic hydrocarbon groups such as methylene, 1-vinyl, 2-propenyl, 2-butyl, 4-methyl-2, 2-pentyl, etc., alicyclic hydrocarbon compounds such as 1, 1-epoxy, 3, 5-trimethyl-1, 1-epoxy, etc., and tetraalkyl groups such as 1-phenyl-1, 1-vinyl, diphenylmethylene, etc., can be exemplified. Among these, 2-propenyl is more preferably used. In formula (2), it is particularly preferable that Ar 3 to Ar 6 are all p-styryl, and X is 2, 2-propenyl.
In the formula (3), Ar 7 and Ar 8 are preferably an aryl group having 6 to 12 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms. Specific examples thereof include m-styryl group, p-styryl group, dimethyl-p-styryl group, tetramethyl-p-styryl group, naphthyl group, vinyl group and the like. Among them, p-styryl is more preferably used for both Ar 7 and Ar 8. Further, Ar 9 is preferably an aryl group having 6 to 12 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms. Specific examples thereof include m-styryl group, p-styryl group, naphthyl group, vinyl group and the like. Of these, p-styryl and vinyl are more suitable. It is particularly preferred in formula (3) that Ar 7, Ar 8, Ar 9 are all p-styryl.
As the aromatic polyether sulfone used in the present invention, a mixture of polymers having one or two or more kinds of repeating units represented by the above formulas (1) to (3) or a copolymer having these repeating units can be preferably used. For example, in the case of a copolymer, it is preferable to use an aromatic polyether sulfone composed of a repeating unit of formula (1) and a repeating unit of formula (2), and an aromatic polyether sulfone composed of a repeating unit of formula (1) and a repeating unit of formula (3). In this case, the ratio of the repeating unit of formula (1) to the repeating unit of formula (2) or the ratio of the repeating unit of formula (1) to the repeating unit of formula (3), i.e., the solubility, heat resistance and finished film of the aromatic polyether sulfone in the copolymer composition ratio of (1)/(2) to (1)/(3) may be determined in view of the film properties, but is not particularly limited, and the repeating unit of formula (1) is preferably 0.1 to 99.9 mol%, and more preferably 1 to 99 mol% of the aromatic polyether sulfone is contained.
The polyimide used as the resin layer suitable for the protective film of the present invention has a frame made of an aromatic group and a compound in which an ether group and an isomorphous group are bonded to each other. In more detail, it is described that,
[ CHEM 1 ]
The structural unit of (A) is suitably a polyimide. Here, Q is a divalent aliphatic or aromatic group, and A1 is
[ CHEM 2 ]
Wherein R1 is an alkyl group having 2 to 10 carbon atoms, each R2 is independently a C1-6 alkyl group, R3 is a C1-3 gem-alkyl group, and m, n, and p are independently 0 or 1. Or, a structural unit of the above formula (I)
[ CHEM 3 ]
The unit of (1) includes a clustered amide. Here, Q has been defined as above, and A2 is m-or p-styryl or Bis (aluminum foil) parylene or
[ CHEM 4 ]
Contains, in the formula, X is O, S or NR 4, R4 is hydrogen or C1-6 alkyl, and z is 0 or 1.
Suitable Q groups in the polyimide are
[ CHEM 5 ]
These heat-resistant resin layers are formed by a solvent casting method. The solvent is not particularly limited as long as PES or PEI is soluble in the solvent, but a solvent containing 1, 3-dioxolane as a main component is preferably used. 1, 3-dioxolane has a lower boiling point than amide solvents such as N-methylpyrrolidone, and therefore the amount of solvent remaining in the coating layer can be easily reduced, and there are no problems such as environmental pollution and corrosion compared with halogen-based solvents such as methylene chloride. The solvent may be added to 1, 3-dioxolane, and other cyclic ether solvents such as 1, 4-dioxane and tetrahydroxyfaran may be contained. The 1, 3-dioxolane, which is a main component, is an excellent solvent for the formation of PES or PEI, but is likely to generate a peroxide when it comes into contact with air, and therefore, it can be dried after being applied under an inactive condition. In addition, the solution of PES or PEI also depends on the molecular weight and solvent mixture, but a viscosity of around 400-300000cps is preferred for the formation of a uniform film.
The thickness of the heat-resistant resin layer is not limited, but is preferably 0.1 to 5 μm. When the thickness is less than 0.1 μm, sufficient heat resistance and chemical resistance may not be imparted, and when the thickness exceeds 5 μm, the entire film may curl or peel due to a difference in thermal expansion coefficient from the base film.
The substrate film is a polyester film or a polyolefin film. The tear strength of the substrate film is high, and the tear strength can be improved as compared with a film composed of PES or PEI alone. Examples of the base film include polyethylene terephthalate and polyethylene terephthalate as a polyester film. On the other hand, examples of the polyolefin film include polyethylene and polypropylene.
The substrate film thickness may be selected according to its desired characteristics. That is, PES or PEI constituting the heat-resistant resin layer has very high hardness, while the polyester film or olefin film constituting the substrate film has relative flexibility, and therefore the present invention can adjust the hardness of the film by adjusting the thickness of the substrate film. For example, when high hardness is required, the base film is relatively thin, for example, 4 to 30 μm in thickness. Because such a thickness can prevent deformation of the pressed body at the time of hot pressing. On the other hand, if the thickness of the base film is about 20 to 250 μm, the heat-resistant protective film is provided with flexibility, and can absorb the irregularities of the body to be pressed during hot pressing, thereby functioning as a cushion film.
When the base film is left as it is, the adhesiveness to a resin layer or an adhesive layer of polyether sulfone or polyacetamide may be low. In this case, the substrate film may be subjected to an easy-tack treatment. The treatment for facilitating adhesion includes chemical treatment of the coating main layer. For example, a main layer containing an isocyanate compound or a melamine compound and an epoxy compound may be considered together with a water-soluble or water-dispersible resin such as a polyurethane resin or a polyester resin. In addition, physical methods such as corona discharge treatment and plasma treatment may be considered for the easy-adhesion treatment.
The protective film of the present invention may be an adhesive layer on the side opposite to the side having the heat-resistant resin layer of the base film. The heat-resistant resin layer imparts heat resistance and chemical resistance to the protective film. Since such a film is resistant to various chemicals such as an alkali developer such as an aqueous sodium hydroxide solution used in the production of a printed wiring board, an etchant such as an aqueous solution of copper chloride or iron chloride, a blackening solution, and an organic solvent such as an alcohol or a hydrocarbon solvent, the film can be used as a protective film (masking tape) for a substrate, and can be used as a heat-resistant protective film for a press machine or a printed circuit board in a subsequent hot pressing process.
The protective film of the present invention can protect an adherend using an appropriate adhesive layer, and can be easily peeled from the adherend without leaving a gum after use. The adhesive layer is not particularly limited as long as it has heat resistance at a desired temperature (for example, a temperature experienced during hot pressing), and an adhesive such as an acrylic, rubber, silicone, or fluorine-based adhesive can be used.
In particular, an adhesive having a thermosetting removability has a sufficient adhesive force before heating, and after heating, the adhesive force is significantly reduced, and the adhesive is easily peeled off, and thus it is suitable for a protective film. As such an adhesive, for example, an acrylic adhesive containing an acrylic adhesive having a thermosetting activated (metal) acrylic such as an epoxy group and containing an acrylic polymer as a part of a monomer unit is used. More specifically, a polymer of glycerol methacrylic acid of about 5 to 15% (based on the mass of the monomer) is preferably used in the thermosetting release acrylic adhesive in addition to monomers such as 2-ethylhexyl acrylic acid and acrylic acid used in general acrylic adhesives.
The thickness of the binder is not particularly limited, but is usually 0.5 to 10 μm. When the thickness is less than 0.5 μm, the adhesiveness of the adherend is lowered, and the adherend may peel off during use. In addition, if the thickness exceeds 10 μm, a solvent, a chemical, or the like may penetrate between the adhesive and the adherend during use, and there is a risk of detachment and contamination of the adherend.
In the present invention, since the polyester film or the polyolefin film is used as the substrate, the thickness accuracy is good, the uniform pressurization can be achieved, and the price is low. Heat resistance, chemical resistance, which is a weak point of the polyester film or the polyolefin film, is improved by a polyether sulfone or a polyacetamide resin layer formed thereon by solvent partition.
In addition, high temperature and high pressure are required for sticking and thermosetting, and the adhesive film is also effective as a base material for an adhesive film using a thermosetting adhesive.
The present invention is not limited to the above embodiments, and any technical solutions similar or identical to the present invention, which are made in the light of the present invention, are within the scope of the present invention.
The techniques, shapes, and configurations not described in detail in the present invention are all known techniques.
Claims (8)
1. A protective film suitable for use in a process for producing a multilayer printed wiring board, comprising a base film, characterized in that the base film has, on at least one side thereof, a heat-resistant and chemical-resistant protective film of a resin layer formed by solvent distribution.
2. The protective film for a multilayer printed circuit board manufacturing process according to claim 1, wherein the resin layer contains polyether sulfonamide or polyacetamide.
3. The protective film according to claim 1, wherein the side of the base film opposite to the resin layer comprises an adhesive layer.
4. The protective film according to claim 1, wherein both sides of the substrate film comprise a resin layer.
5. The protective film according to claim 1, wherein the thickness of the resin layer is 0.1 to 5 μm.
6. The protective film according to claim 1, wherein the thickness of the base film is 20 to 250 μm.
7. The protective film according to claim 1, wherein the thickness of the base film is 4 to 30 μm.
8. The protective film for a multilayer printed circuit board manufacturing process according to claim 1, wherein the base material film is a polyester or polyolefin film as a base material film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010330632.XA CN111421930A (en) | 2020-04-24 | 2020-04-24 | Protective film suitable for manufacturing process of multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010330632.XA CN111421930A (en) | 2020-04-24 | 2020-04-24 | Protective film suitable for manufacturing process of multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111421930A true CN111421930A (en) | 2020-07-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010330632.XA Pending CN111421930A (en) | 2020-04-24 | 2020-04-24 | Protective film suitable for manufacturing process of multilayer printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN111421930A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005059220A (en) * | 2003-08-11 | 2005-03-10 | Three M Innovative Properties Co | Heat-resistant and chemical-resistant protective film |
| CN102991053A (en) * | 2011-09-09 | 2013-03-27 | 达迈科技股份有限公司 | Multilayer polyimide film and process for producing the same |
-
2020
- 2020-04-24 CN CN202010330632.XA patent/CN111421930A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005059220A (en) * | 2003-08-11 | 2005-03-10 | Three M Innovative Properties Co | Heat-resistant and chemical-resistant protective film |
| CN102991053A (en) * | 2011-09-09 | 2013-03-27 | 达迈科技股份有限公司 | Multilayer polyimide film and process for producing the same |
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Application publication date: 20200717 |