CN111421199A - Diode dip soldering machine - Google Patents
Diode dip soldering machine Download PDFInfo
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- CN111421199A CN111421199A CN202010266925.6A CN202010266925A CN111421199A CN 111421199 A CN111421199 A CN 111421199A CN 202010266925 A CN202010266925 A CN 202010266925A CN 111421199 A CN111421199 A CN 111421199A
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- dip
- diode
- clamping piece
- groove
- soldering machine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a diode dip-soldering machine which structurally comprises an intelligent control panel, a diode clamping mechanical arm, a soldering assisting sprayer, a dip-soldering machine support, a tin soldering tank, a circuit board preheater and a smoke exhaust pipeline, wherein the dip-soldering machine support is vertically arranged on the ground, the intelligent control panel is fixed to the upper left corner of the front face of the dip-soldering machine support through bolts, the diode clamping mechanical arm is horizontally nested in the middle groove of the dip-soldering machine support, the diode dip-soldering machine is matched with a tin liquid impurity removal device through a clamping piece fixing frame, when a circuit board enters tin liquid, the circuit board vibrates, the situation that the pins of the circuit board are welded due to the fact that the tin liquid cannot enter pin gaps is avoided when the pin density of the diode is large, meanwhile, oxides, impurities and welding waste residues on the surface of the tin liquid are pushed to the inner wall of the tin soldering tank through air flow, the shaking of, The unstable condition, effectual circuit board welding quality that has promoted.
Description
Technical Field
The invention relates to the field of diode processing equipment, in particular to a diode dip-soldering machine.
Background
In the equipment production process of electronic product, need install diode component back on the PCB board usually, fix electronic component on the PCB board through the welding again, in order to promote PCB board welding machining efficiency and guarantee the welding effect, often adopt the wicking machine to accomplish the whole process of dip-soldering, but the present technical consideration is not perfect enough, has following shortcoming: when the dip soldering machine is used, the diode elements are generally inserted into a circuit board and fixed, then the diode elements are horizontally inserted into a manipulator clamp of the dip soldering machine, and simultaneously the back of the circuit board is immersed into a soldering groove after being sprayed and preheated by soldering flux; meanwhile, the circuit board clamping pieces move downwards in a reciprocating mode to be immersed into the tin soldering tank and then move upwards to be separated from the tin soldering tank, the clamping pieces continuously disturb molten tin in the tin furnace, the contact surface of the molten tin in the tin furnace and air is increased greatly, more oxides, impurities and solder waste residues exist on the surface of the molten tin, and therefore slag inclusion welding is formed in the dip welding process, welded diode pins are shaken and unstable, and welding quality is reduced.
Disclosure of Invention
In order to solve the problems, the invention provides a diode dip soldering machine.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a diode dip welding machine, its structure includes intelligent control panel, diode centre gripping manipulator, helps welds atomizer, dip welder support, solder bath, circuit board pre-heater, exhaust pipe, the vertical installation in subaerial in dip welder support, intelligent control panel passes through the bolt fastening in the positive upper left corner of dip welder support, diode centre gripping manipulator level nestification is at recess position in the middle of the dip welder support, the solder bath is the rightmost end of no top rectangle structure and level nested recess in the middle of the dip welder support, circuit board pre-heater is located soldering bath left side and middle a baffle that is equipped with, help to weld the atomizer in the middle of nested positive recess of dip welder support and the right-hand member is adjacent with circuit board pre-heater, exhaust pipe through connection is in dip welder support top rightmost end, diode centre gripping manipulator is by manipulator slide bar, clamping piece, mount, clamping piece, The tin liquid impurity removing device comprises a tin liquid impurity removing device, circuit board clamping pieces, a manual pressing rod and a drawer type push-pull frame, wherein the manipulator sliding rod is horizontally arranged in a groove in the front face of a support of the dip welding machine, the top of the manipulator sliding rod is buckled with a sliding rail, the drawer type push-pull frame is positioned below and parallel to each other, the left end of the manual pressing rod is buckled with the drawer type push-pull frame from left to right, the tin liquid impurity removing device is vertically arranged on the left side and the right side of the bottom of the drawer type push-pull frame, the clamping piece fixing frame is horizontally arranged below the drawer type push-pull frame and buckled with the manual pressing rod through a connecting.
As a further improvement of the invention, the clamping piece fixing frame is composed of a driving slide rail, a fixing frame main body, clamping piece connecting pieces, eccentric vibration discs, a driving gear, a transmission chain and a linkage rod, wherein the fixing frame main body is of a hollow rectangular structure, the top of the fixing frame main body is connected with the drawer type push-pull frame through a bolt, the top end of the driving slide rail is buckled with the bottom of the drawer type push-pull frame, the linkage rod is horizontally nested in the fixing frame main body, the two clamping piece connecting pieces are vertically arranged at the left end and the right end in the linkage rod respectively, the driving gear is nested in the middle of the linkage rod and meshed with the driving slide rail, the eccentric vibration discs are nested at the left side and the right side of the driving gear respectively and buckled with the linkage rod.
As a further improvement of the invention, the clamping piece connecting piece consists of a screw rod connecting hole, a connecting rod fixing seat, a clamping piece connecting rod, a linkage rod mounting groove and a self-resetting spring, wherein the connecting rod fixing seat is of a rectangular structure and is vertically arranged inside the fixing frame main body, the screw rod connecting hole is horizontally connected to the top of the connecting rod fixing seat in a penetrating manner and is in threaded connection with a screw rod of the fixing frame main body, the clamping piece connecting rod is of a T-shaped structure and is vertically inserted and embedded in the middle of the connecting rod fixing seat, the self-resetting spring is arranged on the outer side of the clamping piece connecting rod and is buckled with the bottom of an inner groove of the connecting rod fixing seat, and.
The tin liquid impurity removing device is further improved by comprising a rolling shaft, an air bag push plate, a telescopic air bag, an exhaust structure and an air bag fixing frame, wherein the air bag fixing frame is of a U-shaped structure and is vertically arranged below a drawer type push-pull frame, the telescopic air bag is nested inside the air bag fixing frame, the air bag push plate is positioned at the top of the telescopic air bag, the left end and the right end of the air bag push plate are mutually buckled with the inner wall of the air bag fixing frame, the rolling shaft is provided with three rolling shafts, the three rolling shafts are sequentially distributed on the upper surface of the air bag push plate from left to right, and the exhaust structure.
As a further improvement of the present invention, the exhaust structure comprises a driving impeller, a fixed shaft rod, an exhaust nozzle, a sliding groove, a buckling groove, a traction wheel carrier and an exhaust pipe carrier, wherein the exhaust pipe carrier adopts a hollow cylindrical structure, the top of the exhaust pipe carrier is communicated with the telescopic airbag, the fixed shaft rod is nested in the middle of the driving impeller, the sliding groove is of an arc structure and is positioned at the lower right corner of the exhaust pipe carrier, the exhaust nozzle is positioned in the exhaust pipe carrier and is buckled with the fixed shaft rod, the lower right corner is in clearance fit with the sliding groove, the driving impeller is installed in the exhaust pipe carrier and is buckled with the fixed shaft rod, the buckling groove is of a rectangular structure and is installed at the upper right corner of the exhaust nozzle, and the traction wheel carrier is positioned in front of the exhaust.
As a further improvement of the invention, the back of the traction wheel frame is provided with a cylindrical rod which is mutually buckled with the buckling groove, and simultaneously, as the driving impeller is meshed with the traction wheel frame, when the driving impeller rotates, the cylindrical rod on the traction wheel frame drives the exhaust nozzle to rotate back and forth through the buckling groove, which is beneficial to pushing impurities on the liquid level of the tin liquid to move towards the inner wall of the tin soldering groove by airflow.
As a further improvement of the invention, the driving slide rail is of an arc structure, the circle center of the driving slide rail is positioned at the buckling connection position of the left end of the manual pressure lever and the drawer type push-pull frame, and the lower half section of the inner wall of the right side is provided with meshing teeth, so that after the manual pressure lever is pressed down, the driving gear slides downwards along the top of the driving slide rail and is buckled with the meshing teeth, the eccentric vibration disc is favorably rotated to drive the circuit board in the circuit board clamping piece to vibrate, and the dip soldering effect is improved.
As a further improvement of the invention, the telescopic air bag in the molten tin impurity removing device on the right side of the clamping piece fixing frame is replaced by a spring structure, and when the manual pressure lever is pressed down, the forces applied to the left end and the right end of the clamping piece fixing frame are firstly the same, so that the clamping piece fixing frame is kept in a balanced state.
The invention has the beneficial effects that: diode dip welder mutually supports through clamping piece mount and tin liquid edulcoration device, after the circuit board got into the tin liquid, the circuit board produces vibrations, when avoiding diode pin density great, the unable pin clearance that gets into of tin liquid welds the condition that leads to the circuit board pin to have the rosin joint, simultaneously through the air current with the oxide on tin liquid surface, impurity and solder waste residue push to soldering inslot wall, avoid forming at the dip soldering in-process and press from both sides the sediment and weld and cause the diode pin to rock, the unstable condition, the effectual circuit board welding quality that has promoted.
The clamping piece fixing frame is combined with the molten tin impurity removing device, when the bottom surface of the circuit board is immersed in molten tin, the driving gear drives the eccentric vibrating disc to rotate through the transmission chain, the linkage rod is further utilized to drive the linkage rod mounting groove to move up and down, vibration is generated between the bottom of the circuit board and the molten tin, the molten tin and pins at the bottom of the circuit board are completely welded together, meanwhile, in the process that the clamping piece fixing frame moves downwards, the telescopic air bag is extruded through the air bag push plate, meanwhile, the air is blown to the surface of the molten tin through the back and forth rotation of the air exhaust nozzle, impurities on the surface of the molten tin are blown to the inner.
Drawings
FIG. 1 is a schematic structural diagram of a diode dip soldering machine according to the present invention.
Fig. 2 is a left side view of the diode clamping robot according to the present invention.
Fig. 3 is a schematic cross-sectional structural view of the clip fixing frame according to the present invention.
Fig. 4 is a schematic view of the clip connector of the present invention.
FIG. 5 is a schematic left-view structural diagram of a molten tin impurity removing device according to the present invention.
FIG. 6 is a left side view of the exhaust structure of the present invention.
In the figure: an intelligent control panel-1, a diode clamping manipulator-2, a soldering-assisting sprayer-3, a dip welder support-4, a soldering groove-5, a circuit board preheater-6, a smoke exhaust pipeline-7, a manipulator slide bar-2 a, a clamping piece fixing frame-2 b, a tin liquid impurity removal device-2 c, a circuit board clamping piece-2 d, a manual pressure lever-2 e, a drawer type push-pull frame-2 f, a driving slide rail-b 1, a fixing frame main body-b 2, a clamping piece connecting piece-b 3, an eccentric vibration disc-b 4, a driving gear-b 5, a driving chain-b 6, a linkage rod-b 7, a screw rod connecting hole-b 31, a connecting rod fixing seat-b 32, a clamping piece connecting rod-b 33, a linkage rod mounting groove-b 34, a self-reset spring-b 35, a rolling shaft-c 1, a, The air bag type air bag comprises an air bag push plate-c 2, a telescopic air bag-c 3, an exhaust structure-c 4, an air bag fixing frame-c 5, a driving impeller-c 41, a fixing shaft rod-c 42, an exhaust nozzle-c 43, a sliding groove-c 44, a buckling groove-c 45, a traction wheel frame-c 46 and an exhaust pipe frame-c 47.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, fig. 1 to fig. 6 schematically show the structure of the diode dip soldering machine of the embodiment of the invention, and the invention is further explained below by combining the specific embodiment.
Example one
Referring to fig. 1-4, the invention provides a diode dip-soldering machine, which comprises an intelligent control panel 1, a diode clamping manipulator 2, a welding-assisting sprayer 3, a dip-soldering machine support 4, a soldering bath 5, a circuit board preheater 6 and a smoke exhaust pipeline 7, wherein the dip-soldering machine support 4 is vertically arranged on the ground, the intelligent control panel 1 is fixed on the left upper corner of the front surface of the dip-soldering machine support 4 through bolts, the diode clamping manipulator 2 is horizontally nested in the middle groove of the dip-soldering machine support 4, the soldering bath 5 is of a non-top rectangular structure and is horizontally nested at the rightmost end of the middle groove of the dip-soldering machine support 4, the circuit board preheater 6 is arranged on the left side of the soldering bath 5 and is provided with a partition plate in the middle, the welding-assisting sprayer 3 is nested in the middle of the front surface groove of the dip-soldering machine support 4 and is adjacent to the circuit board preheater 6, the smoke exhaust pipeline, the diode clamping manipulator 2 comprises a manipulator slide bar 2a, a clamping piece fixing frame 2b, a molten tin impurity removal device 2c, a circuit board clamping piece 2d, a manual press bar 2e and a drawer type push-pull frame 2f, wherein the manipulator slide bar 2a is horizontally arranged in a groove in the front face of a dip welding machine support 4, the top of the manipulator slide bar is buckled with the slide rail, the drawer type push-pull frame 2f is positioned below and parallel to each other, the left end of the manual press bar 2e is buckled with the drawer type push-pull frame 2f from left to right by one sixth, the molten tin impurity removal device 2c is vertically arranged on the left side and the right side of the bottom of the drawer type push-pull frame 2f, the clamping piece fixing frame 2b is horizontally arranged below the drawer type push-pull frame 2f and buckled with the manual press bar 2e through a connecting rod, and. The clamping piece fixing frame 2b is composed of a driving sliding rail b1, a fixing frame main body b2, a clamping piece connecting piece b3, an eccentric vibration disc b4, a driving gear b5, a transmission chain b6 and a linkage rod b7, the fixing frame main body b2 is of a hollow rectangular structure, the top of the fixing frame main body b2 is connected with the drawer-type push-pull frame 2f through bolts, the top end of the driving sliding rail b1 is mutually buckled with the bottom of the drawer-type push-pull frame 2f, the linkage rod b7 is horizontally nested inside the fixing frame main body b2, the clamping piece connecting piece b3 is provided with two clamping piece connecting pieces which are vertically arranged at the left end and the right end inside the linkage rod b7 respectively, the driving gear b5 is nested in the middle of the linkage rod b7 and mutually meshed with the driving sliding rail b1, the eccentric vibration disc b4 is respectively nested at the left side and the right side of the driving gear b5 and is buckled with. Clip connecting piece b3 comprises screw rod connecting hole b31, connecting rod fixing base b32, clip connecting rod b33, trace mounting groove b34, from reset spring b35, connecting rod fixing base b32 adopts the rectangle structure and vertically installs inside mount main part b2, screw rod connecting hole b31 level through connection in connecting rod fixing base b32 top and adopt threaded connection with the screw rod of mount main part b2, clip connecting rod b33 is T shape structure and vertically inserts in the middle of connecting rod fixing base b32, from reset spring b35 install in the clip connecting rod b33 outside and with connecting rod fixing base b32 inner groovy bottom lock, trace mounting groove b34 passes clip connecting rod b33 from last two-thirds department down and adopt clearance fit with trace b 7. The driving slide rail b1 is an arc structure, the circle center is located at the buckling connection position of the left end of the manual pressure lever 2e and the drawer-type push-pull frame 2f, and the lower half section of the inner wall of the right side is provided with meshing teeth, so that after the manual pressure lever 2e is pressed down, the driving gear b5 slides downwards along the top of the driving slide rail b1 and is buckled with the meshing teeth, the rotation of the eccentric vibration disc b4 is facilitated to enable the circuit board in the circuit board clamping piece 2d to vibrate, and the dip soldering effect is improved. The telescopic air bag c3 inside the molten tin impurity removing device 2c on the right side of the clamping piece fixing frame 2b is replaced by a spring structure, when the manual pressure lever 2e is pressed down, the force applied to the left end and the right end of the clamping piece fixing frame 2b is made to be the same firstly, and the clamping piece fixing frame 2b is kept in a balanced state.
When the soldering aid device is used, the diodes are respectively inserted into the surface of the circuit board, the circuit board is transversely inserted into the middle of the circuit board clamping piece 2d, the drawer type push-pull frame 2f is transversely moved through the manual pressure lever 2e at the moment, the soldering aid sprayer 3 and the circuit board preheater 6 are enabled to spray soldering flux and preheat the bottom of the circuit board, then the circuit board is moved to the position above the soldering groove 5, the manual pressure lever 2e is pressed downwards, the driving gear b5 is embedded with the driving slide rail b1 and slides downwards along the driving slide rail b1, when the circuit board slides to the lower half section of the driving slide rail b1, the driving gear b5 is in engaged gear with the driving slide rail b1 and rotates, meanwhile, the eccentric vibrating disc b4 is driven by the driving chain b6 to rotate in the linkage rod b7, the linkage rod b7 is enabled to drive the clamping piece connecting rod b33 to extrude the self-resetting spring b35 and, the welding effect of the diode is improved.
Example two
Referring to fig. 5-6, the molten tin impurity removing device 2c includes a rolling shaft c1, an air bag push plate c2, a telescopic air bag c3, an air exhaust structure c4, and an air bag fixing frame c5, the air bag fixing frame c5 is a U-shaped structure and is vertically installed below the drawer-type push-pull frame 2f, the telescopic air bag c3 is nested inside the air bag fixing frame c5, the air bag push plate c2 is located at the top of the telescopic air bag c3, the left and right ends of the air bag push plate c 733 are fastened to the inner wall of the air bag fixing frame c5, the rolling shaft c1 is provided with three rolling shafts, the three rolling shafts are sequentially distributed on the upper surface of the air bag push plate c2 from left to right, and the air exhaust structure c 82. The exhaust structure c4 is composed of a driving impeller c41, a fixed shaft lever c42, an exhaust nozzle c43, a sliding groove c44, a buckling groove c45, a traction wheel carrier c46 and an exhaust pipe carrier c47, the exhaust pipe carrier c47 is of a hollow cylindrical structure, the top of the exhaust pipe carrier c3 is communicated with a telescopic air bag c3, the fixed shaft lever c42 is nested in the middle of the driving impeller c41, the sliding groove c44 is of an arc structure and is located at the lower right corner of the exhaust pipe carrier c47, the exhaust nozzle c43 is located in the exhaust pipe carrier c47 and is buckled with the fixed shaft lever c42, meanwhile, the lower right corner is in clearance fit with the sliding groove c44, the driving impeller c41 is installed in the exhaust pipe carrier c47 and is buckled with the fixed shaft lever c42, the buckling groove c45 is of a rectangular structure and is installed at the upper right corner of the exhaust nozzle c45, and the traction wheel carrier c45 is located in front of. The back of the traction wheel frame c46 is provided with a cylindrical rod which is buckled with the buckling groove c45, and meanwhile, as the driving impeller c41 is meshed with the traction wheel frame c46, when the driving impeller c41 rotates, the cylindrical rod on the traction wheel frame c46 drives the exhaust nozzle c43 to rotate back and forth through the buckling groove c45, so that the air flow is favorable for pushing impurities on the liquid level of the tin liquid to move towards the inner wall of the tin soldering groove 5.
When the manual pressure lever 2e drives the clip fixing frame 2b to move downwards, the bottom surface of the clip fixing frame 2b is attached to the rolling shaft c1 and extrudes the telescopic air bag c3 to compress downwards through the air bag push plate c2, at the moment, the air flow in the telescopic air bag c3 is discharged downwards and flows in from the top of the exhaust pipe frame c47, the air flow drives the driving impeller c41 to rotate, and as the driving impeller c41 is meshed with the traction wheel carrier c46, when the driving impeller c41 rotates, the cylindrical rod on the traction wheel carrier c46 drives the exhaust nozzle c43 to rotate back and forth by taking the fixed shaft c42 as the center of a circle through the buckling groove c45, so that impurities on the surface of tin liquid are blown by the air flow to move towards the inner wall of the tin.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a diode dip-soldering machine, its structure includes intelligent control panel (1), diode centre gripping manipulator (2), helps and welds atomizer (3), dip-soldering machine support (4), soldering groove (5), circuit board pre-heater (6), exhaust pipe (7), its characterized in that:
the dip welding machine support (4) is vertically installed on the ground, the intelligent control panel (1) is fixed to the left upper corner of the front face of the dip welding machine support (4) through bolts, the diode clamping manipulator (2) is horizontally nested in the middle groove of the dip welding machine support (4), the tin welding groove (5) is of a non-top rectangular structure and is horizontally nested at the rightmost end of the middle groove of the dip welding machine support (4), the circuit board preheater (6) is located on the left side of the tin welding groove (5), a partition plate is arranged in the middle of the tin welding groove, the welding-assisting sprayer (3) is nested in the middle of the front groove of the dip welding machine support (4), the right end of the welding-assisting sprayer is adjacent to the circuit board preheater (6), and the smoke exhaust pipeline (7) is connected to the rightmost;
the diode clamping manipulator (2) is composed of a manipulator sliding rod (2a), a clamping piece fixing frame (2b), a molten tin impurity removing device (2c), a circuit board clamping piece (2d), a manual pressing rod (2e) and a drawer type push-pull frame (2f), wherein the manipulator sliding rod (2a) is horizontally arranged in a groove in the front face of a dip soldering machine support (4), the top of the manipulator sliding rod is buckled with the sliding rail, the drawer type push-pull frame (2f) is located below and parallel to each other, the left end of the manual pressing rod (2e) is buckled with the drawer type push-pull frame (2f) from left to right by one sixth, the molten tin impurity removing device (2c) is vertically arranged on the left side and the right side of the bottom of the drawer type push-pull frame (2f), the clamping piece fixing frame (2b) is horizontally arranged below the drawer type push-pull frame (2f) and buckled with the manual pressing rod (2e) through a connecting rod, and the ) Below.
2. The diode dip soldering machine according to claim 1, wherein: the clamping piece fixing frame (2b) is composed of a driving sliding rail (b1), a fixing frame main body (b2), a clamping piece connecting piece (b3), an eccentric vibration disc (b4), a driving gear (b5), a transmission chain (b6) and a linkage rod (b7), the fixing frame main body (b2) is of a hollow rectangular structure, the top of the fixing frame main body is connected with a drawer type push-pull frame (2f) through bolts, the top end of the driving sliding rail (b1) is buckled with the bottom of the drawer type push-pull frame (2f), the linkage rod (b7) is horizontally nested inside the fixing frame main body (b2), the clamping piece connecting piece (b3) is provided with two clamping piece connecting pieces which are vertically arranged at the left end and the right end inside the linkage rod (b7) respectively, the driving gear (b5) is nested in the middle of the linkage rod (b7) and meshed with the driving sliding rail (b1), the eccentric vibration disc (b4) is nested at the left side and the right side of, the transmission chain (b6) is provided with two chains which are respectively buckled with the eccentric vibration disc (b4) and the driving gear (b 5).
3. The diode dip soldering machine according to claim 2, wherein: the clamping piece connecting piece (b3) consists of a screw connecting hole (b31), a connecting rod fixing seat (b32), a clamping piece connecting rod (b33), a linkage rod mounting groove (b34) and a self-reset spring (b35), the connecting rod fixing seat (b32) adopts a rectangular structure and is vertically arranged inside the fixing frame main body (b2), the screw connecting hole (b31) is horizontally connected with the top of the connecting rod fixing seat (b32) in a penetrating way and is in threaded connection with the screw of the fixing frame main body (b2), the clamping piece connecting rod (b33) is of a T-shaped structure and is vertically inserted and embedded in the middle of the connecting rod fixing seat (b32), the self-reset spring (b35) is arranged at the outer side of the clamping piece connecting rod (b33) and is buckled with the bottom of the inner groove of the connecting rod fixing seat (b32), the linkage rod mounting groove (b34) penetrates through two thirds of the clamping piece connecting rod (b33) from top to bottom and is in clearance fit with the linkage rod (b 7).
4. The diode dip soldering machine according to claim 1, wherein: tin liquid edulcoration device (2c) comprises rolling axle (c1), gasbag push pedal (c2), flexible gasbag (c3), exhaust structure (c4), gasbag mount (c5), gasbag mount (c5) is the U-shaped structure and vertically installs in drawer-type push-and-pull frame (2f) below, flexible gasbag (c3) nestification is inside gasbag mount (c5), gasbag push pedal (c2) are located flexible gasbag (c3) top and both ends and gasbag mount (c5) inner wall lock each other about and, rolling axle (c1) are equipped with three and from a left side to right side distribute in proper order in gasbag push pedal (c2) upper surface, exhaust structure (c4) are installed in gasbag mount (c5) bottom surface and are link up each other with flexible gasbag (c 3).
5. The diode dip soldering machine according to claim 4, wherein: the exhaust structure (c4) comprises a driving impeller (c41), a fixed shaft lever (c42), an exhaust nozzle (c43), a sliding groove (c44), a buckling groove (c45), a traction wheel carrier (c46) and an exhaust pipe carrier (c47), wherein the exhaust pipe carrier (c47) adopts a hollow cylindrical structure, the top of the exhaust pipe carrier is communicated with a telescopic air bag (c3), the fixed shaft lever (c42) is nested in the middle of the driving impeller (c41), the sliding groove (c44) is an arc-shaped structure and is positioned at the lower right corner of the exhaust pipe carrier (c47), the exhaust nozzle (c43) is positioned in the exhaust pipe carrier (c47) and is buckled with the fixed shaft lever (c42), meanwhile, the lower right corner is in clearance fit with the sliding groove (c44), the driving impeller (c41) is arranged in the exhaust pipe carrier (c47) and is buckled with the fixed nozzle (c42), the buckling groove (c45) is of a rectangular structure and is arranged at the upper right corner of the exhaust nozzle (c43, the traction wheel carrier (c46) is positioned in front of the exhaust nozzle (c43) and is meshed with the rotating shaft in the driving impeller (c 41).
6. The diode dip soldering machine according to claim 5, wherein: the back of the traction wheel frame (c46) is provided with a cylindrical rod which is buckled with the buckling groove (c 45).
7. The diode dip soldering machine according to claim 2, wherein: the driving slide rail (b1) is of an arc structure, the circle center of the driving slide rail is positioned at the buckling connection position of the left end of the manual pressure lever (2e) and the drawer type push-pull frame (2f), and the lower half section of the inner wall of the right side is distributed with meshing teeth.
8. The diode dip soldering machine according to claim 1, wherein: the telescopic air bag (c3) in the tin liquid impurity removing device (2c) on the right side of the clamping piece fixing frame (2b) is replaced by a spring structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010266925.6A CN111421199A (en) | 2020-04-07 | 2020-04-07 | Diode dip soldering machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010266925.6A CN111421199A (en) | 2020-04-07 | 2020-04-07 | Diode dip soldering machine |
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| CN111421199A true CN111421199A (en) | 2020-07-17 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222560A (en) * | 2020-09-29 | 2021-01-15 | 北京如利本辉科技有限公司 | Diode welding production line |
| CN112935639A (en) * | 2021-02-07 | 2021-06-11 | 重庆大江国立精密机械制造有限公司 | Welding water-cooling heat sink |
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| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
| CN109530842A (en) * | 2018-12-29 | 2019-03-29 | 昆山康达斯机械设备有限公司 | A kind of diode dip-soldering machine |
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| CN2421291Y (en) * | 2000-04-28 | 2001-02-28 | 蔡振发 | Swing and vibration device for hot-dipping tin-plating conveying processing device |
| CN204237856U (en) * | 2014-10-29 | 2015-04-01 | 范杰 | A kind of tinning furnace for tinned wird |
| CN204583905U (en) * | 2015-05-09 | 2015-08-26 | 江西广信铜业股份有限公司 | A kind of tinned wird processing integrated device |
| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112222560A (en) * | 2020-09-29 | 2021-01-15 | 北京如利本辉科技有限公司 | Diode welding production line |
| CN112222560B (en) * | 2020-09-29 | 2021-12-21 | 江苏贺颖智能科技有限公司 | Diode welding production line |
| CN112935639A (en) * | 2021-02-07 | 2021-06-11 | 重庆大江国立精密机械制造有限公司 | Welding water-cooling heat sink |
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