CN111415976A

CN111415976A - O L ED display panel and display device

Info

Publication number: CN111415976A
Application number: CN202010397229.9A
Authority: CN
Inventors: 罗程远
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2020-05-12
Filing date: 2020-05-12
Publication date: 2020-07-14
Anticipated expiration: 2040-05-12
Also published as: CN111415976B

Abstract

The invention relates to the technical field of display, and discloses an O L ED display panel and a display device, wherein the O L ED display panel comprises an array substrate, a packaging cover plate and packaging glue for bonding the array substrate and the packaging cover plate, the array substrate comprises a substrate, a non-display area of the substrate comprises a plurality of mutually insulated conductive routing lines, the part, corresponding to the packaging glue, of each conductive routing line extends along the side line of a grid unit in a grid pattern, a protective layer is arranged on the plurality of conductive routing lines, through holes opposite to the grid units are formed in the part, corresponding to the packaging glue, of the protective layer to expose the substrate, the parts, corresponding to the packaging glue, of the conductive routing lines of the array substrate are distributed in a grid shape, the area of the grid unit can be avoided, the through holes formed in the protective layer have larger opening area, the contact area between the packaging glue and the substrate is increased, the bonding firmness and tightness between the packaging glue and the substrate are enhanced, and the packaging effect of the O L ED display panel is enhanced.

Description

O L ED display panel and display device

Technical Field

The invention relates to the technical field of display, in particular to an O L ED display panel and a display device.

Background

Active matrix organic light emitting diode (AMO L ED) has gradually received wide attention because it can realize higher color gamut, ultra-thin, flexible display, but O L ED device is easily corroded by water vapor and oxygen, organic material and metal electrode are very easy to react with water oxygen, making the device fail, therefore, it needs to package the device, to prolong the service life, glass glue (frat) packaging is a commonly used O L ED packaging method, especially in the field of small and medium-sized devices, because it adopts the glass glue melting method, the upper and lower substrates are jointed, it can guarantee the good air tightness, compared with other methods, there are significant advantages, however, the glass powder coated position has many metal wires, in the prior art, the gap between the glass powder and the glass powder corresponding position set up the hole, make the glass powder and the hole place glass contact, to increase the cohesiveness, but because the glass powder dried contact surface is uneven, the contact hole is smaller, and the glass powder itself has poor elasticity and large stress, it is easy to transport, in the handling, the packaging process is influenced by external force, L, the packaging needs to increase the O packaging effect reasonably and improve L.

Disclosure of Invention

The invention discloses an O L ED display panel and a display device, wherein in the O L ED display panel, the parts of conductive wires in a non-display area of an array substrate, which correspond to packaging glue, are distributed in a grid shape, a grid unit area can be avoided, through holes arranged on a protective layer can have larger opening area, so that the contact area between the packaging glue and a substrate is increased, the bonding firmness and tightness between the packaging glue and the substrate are enhanced, and the packaging effect of the O L ED display panel is enhanced.

In order to achieve the purpose, the invention provides the following technical scheme:

an O L ED display panel comprises an array substrate, a package cover plate arranged opposite to the array substrate, and a package adhesive for bonding the array substrate and the package cover plate;

the array substrate comprises a substrate, the non-display area of the substrate comprises a plurality of mutually insulated conductive wires, and the part of each conductive wire corresponding to the packaging adhesive is arranged along the side line of the grid unit in the grid pattern in an extending way; the conductive wires are provided with a protective layer, through holes opposite to the grid units are formed in the positions, corresponding to the packaging glue, of the protective layer so as to expose the substrate base plate, and the orthographic projections of the through holes on the substrate base plate are not overlapped with the orthographic projections of the conductive wires on the substrate base plate.

In the above-mentioned O L ED display panel, including an array substrate and a package cover plate, the package cover plate and the array substrate are hermetically connected by a package adhesive, specifically, the package adhesive may be a glass adhesive, the package cover plate may be a glass cover plate, wherein, the array substrate includes a substrate base plate, the substrate base plate may be a glass base plate, a display area of the substrate base plate is provided with an organic electroluminescence structure, a plurality of conductive traces are provided in a non-display area, the plurality of conductive traces are insulated from each other, and a portion of each conductive trace opposite to the package adhesive is arranged along a side line of a grid unit in a grid pattern, that is, a portion of each conductive trace corresponding to the package adhesive extends along a grid line of the grid pattern, a portion of each conductive trace corresponding to the package adhesive is bent and extends, then, the portion of each conductive trace corresponding to the package adhesive constitutes a grid, an orthographic projection of the portion of each conductive trace corresponding to the package adhesive on the substrate base plate may form a grid pattern, a protection layer is provided on the plurality of conductive traces, a portion of the protection layer corresponding to the package adhesive is provided with a grid pattern corresponding to a grid unit in a portion of the package adhesive, and the package adhesive, the substrate base plate, the protection layer may be provided with a projection protection layer, and the protection layer, the substrate protection layer may be provided to enhance the substrate protection layer, the.

Therefore, in the O L ED display panel, the conductive traces in the non-display area of the array substrate are distributed in a grid pattern corresponding to the package adhesive, so as to avoid the grid cell area, and the through holes formed in the protective layer have a larger opening area, thereby increasing the contact area between the package adhesive and the substrate, enhancing the bonding firmness and tightness between the package adhesive and the substrate, and enhancing the packaging effect of the O L ED display panel.

Optionally, the shape of the grid cells in the grid-like pattern is a regular polygon.

Optionally, the grid cells are in the shape of regular hexagons.

Optionally, two opposite side lines of the grid units are arranged in parallel to the length extending direction of the packaging adhesive, and the side length of the grid unit and the width of the packaging adhesive in the direction parallel to the substrate base plate and the number of single-row grid units corresponding to the packaging adhesive in the width direction satisfy the following relationship:

wherein a is the side length of the grid unit and the unit is micrometer; d is the width dimension of the packaging adhesive, and the unit is micrometer; and N is the number of the single-row grid units corresponding to the width direction of the packaging adhesive.

Optionally, the through holes are formed in positions of the protective layer corresponding to the packaging adhesive and positions corresponding to the grids.

Optionally, the number of single-row grid units corresponding to the length direction of the package adhesive is greater than or equal to the number of the conductive traces.

Optionally, a groove corresponding to a side line of each grid unit in the grid pattern is disposed at a position of the substrate base plate opposite to the package adhesive, an orthogonal projection of all the grooves on the substrate base plate forms the grid pattern, and each conductive trace is disposed in the groove.

Optionally, the thickness of the conductive trace in the direction perpendicular to the substrate base plate is smaller than the depth of the strip-shaped groove.

Optionally, the conductive trace comprises a metal trace.

The invention also provides a display device which comprises any one O L ED display panel provided by the technical scheme.

Drawings

Fig. 1 is a schematic diagram illustrating an overall structure of an O L ED display panel according to an embodiment of the present invention;

FIG. 2 is a partial schematic view of the O L ED display panel of FIG. 1 along direction A;

fig. 3 is a partial layout diagram of conductive traces in a non-display area of an O L ED display panel according to an embodiment of the present invention;

icon: 1-an array substrate; 2-packaging the cover plate; 3-packaging glue; 4-a grid-like pattern; 11-a substrate base plate; 12-a conductive trace; 13-a protective layer; 14-organic electroluminescent structure; 15-a groove; 41-grid cells; 131-through holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1, 2 and 3, an embodiment of the invention provides an O L ED display panel, which includes an array substrate 1, a package cover plate 2 disposed opposite to the array substrate 1, and a package adhesive 3 adhering the array substrate 1 and the package cover plate 2, wherein the array substrate 1 includes a substrate 11, a non-display area of the substrate 11 includes a plurality of conductive traces 12 insulated from each other, and a portion of each conductive trace 12 corresponding to the package adhesive 3 extends along a side line of a grid unit 41 in a grid pattern 4, a protective layer 13 is disposed on the plurality of conductive traces 12, a through hole 131 corresponding to the grid unit 41 is disposed at a position of the protective layer 13 corresponding to the package adhesive 3 to expose the substrate 11, and an orthographic projection of the through hole 131 on the substrate 11 is not overlapped with an orthographic projection of the conductive trace 12 on the substrate 11.

In the above-mentioned O L ED display panel, including the array substrate 1 and the package cover plate 2, the package cover plate and the array substrate are hermetically connected through the package adhesive 3, specifically, the package adhesive may be a glass adhesive, the package cover plate may be a glass cover plate, wherein, the array substrate 1 includes the substrate base plate 11, the substrate base plate may be a glass substrate, the display area of the substrate base plate is provided with the organic electroluminescent structure 14, the non-display area is provided with the plurality of conductive traces 12, the plurality of conductive traces are insulated from each other, and the portion of each conductive trace 12 corresponding to the package adhesive 3 is arranged along the edge extension of the grid unit 41 in the grid pattern 4, that is, the portion of each conductive trace corresponding to the package adhesive is arranged along the grid line of the grid pattern, the portion of each conductive trace corresponding to the package adhesive is extended in a bent manner, then, the trace portion of each conductive trace corresponding to the package adhesive constitutes the grid trace, the portion of each conductive trace corresponding to the package adhesive forms a grid pattern on the substrate base plate by orthographic projection, the conductive trace portion of each conductive trace corresponding to the package adhesive forms a grid pattern, the grid pattern is provided with the conductive substrate base plate 13, the protection layer, the substrate base plate is provided with the conductive adhesive, the conductive through the grid substrate base plate, the protection layer, the substrate base plate is provided with the conductive through the grid substrate protection layer, the grid substrate protection layer is provided with the grid substrate protection layer, the grid substrate protection layer.

Specifically, the conductive traces may be arranged in the non-display area according to grid lines of the grid pattern, that is, the whole arrangement manner of the conductive traces is arranged along the grid lines of the grid pattern in an extending manner, and naturally, the corresponding portion of the conductive traces and the packaging adhesive is arranged in a grid manner.

In the O L ED display panel, the conductive traces are arranged according to the grid lines of a certain grid pattern, wherein the grid cells in the grid pattern can be regular polygons, and the distribution route of the conductive traces is a regular grid route, so that the conductive traces are conveniently arranged, and the avoided grid cell space is regularly distributed, thereby facilitating the preparation of through holes.

Specifically, as shown in fig. 2, the grid cells 41 in the grid pattern 4 may be regular hexagons, that is, the grid pattern is formed into a honeycomb structure pattern, the conductive traces 12 are distributed at positions corresponding to the packaging adhesive to form honeycomb traces, and the grid cells are regular hexagons in the grid pattern, so that the area of the avoided grid cells is large, and the conductive traces are conveniently arranged along the side lines of the grid cells in an extending manner, thereby facilitating the preparation. It should be noted that the shape of the grid unit may also be a regular octagon, a regular pentagon or other regular polygon, and the embodiment is not limited.

Specifically, as an arrangement implementation manner that the grid unit is a regular hexagon, when the conductive trace is arranged along the grid line in the grid pattern in an extending manner, two opposite side lines in the grid unit are arranged in parallel to the length extending direction of the packaging adhesive, as shown in fig. 2, the length extending direction of the packaging adhesive is parallel to the direction B and extends along the length direction of the side of the non-display area of the substrate, where the side length of the grid unit and the number of the single-row grid units corresponding to the packaging adhesive along the width parallel to the substrate direction and the width direction of the packaging adhesive satisfy the following relationship:

Above-mentioned make the length of a side of grid unit and the width dimension that the encapsulation was glued and the quantity of the single row grid unit that corresponds on the encapsulation was glued the width direction satisfy above relational expression, the size that makes the grid unit sets up according to the width that the encapsulation was glued, can make the grid unit have reasonable size, guarantee that the grid unit internal region area is enough big, can make the through-hole in the protective layer guarantee to have certain big diameter size, guarantee to expose sufficient substrate base plate, make the area of contact between encapsulation glue and the substrate base plate sufficient, strengthen cohesiveness, guarantee the tightness of the encapsulation between encapsulation apron and the array substrate, tightness. Note that the width of the package adhesive is as shown by a width D in fig. 1, and as shown in fig. 2 in conjunction with fig. 1, the width direction of the package adhesive is a direction perpendicular to a direction B in fig. 2 in a plane parallel to the substrate base plate.

It should be noted that the arrangement manner of the grid unit in the grid-shaped pattern according to which the conductive traces are arranged in the non-display area may also be other manners, for example, two opposite side lines in the grid unit are arranged perpendicular to the length extending direction of the package adhesive, and the specific arrangement manner of the grid unit may also be arranged according to the actual requirement, which is not limited in this embodiment.

Specifically, among the above-mentioned O L ED display panel, in the position that protective layer and encapsulation glue correspond, all be equipped with the through-hole with the position that each grid unit corresponds, in the region that corresponds with the encapsulation glue, make in the protective layer and all set up the through-hole with the position that every grid unit corresponds, can effectively increase the total area of contact of encapsulation glue and substrate, be favorable to strengthening the cohesiveness of encapsulation glue and substrate, reinforcing encapsulation fastness.

Certainly, on the premise of ensuring the bonding firmness of the packaging adhesive and the substrate, in the region opposite to the packaging adhesive, the through holes are arranged at the positions corresponding to the grid units in the protective layer, and the positions corresponding to the grid units of the selected part are specifically arranged, so that on the premise of ensuring the bonding firmness of the packaging adhesive and the substrate, other selection modes can be provided, and the embodiment is not limited.

Specifically, when the grid units in the grid pattern according to which the conductive wires are distributed are arranged, the number of the single-row grid units corresponding to the length direction of the packaging adhesive is larger than or equal to the number of the conductive wires, so that the conductive wires have enough distribution routes, excessive conductive wires are prevented from being distributed on the same grid line of the grid pattern, and signal transmission is prevented from being influenced by poor insulativity between adjacent conductive wires.

Specifically, referring to fig. 1 and fig. 2, as shown in fig. 3, a groove 15 corresponding to the side line of each grid unit 41 in the grid pattern 4 is disposed at a position of the non-display area of the substrate 11 opposite to the package adhesive 3, the orthographic projection of all the grooves 15 on the substrate forms a grid pattern, each conductive trace 12 is disposed in the groove, and as shown in fig. 3, at least one conductive trace 12 can be accommodated in the width direction of the groove 15, that is, in the groove 15 corresponding to the same side line of the grid unit, two or three conductive traces 12 can be provided, even multiple conductive traces can be provided, the conductive traces can have multiple extending distribution routes, which is favorable for the distribution of the conductive traces, wherein the grooves having a grid pattern distribution shape are formed on the substrate, the conductive traces are disposed in the grooves and extend along the recessed routes, the conductive wires are arranged in the grooves, and after the protective layer is formed on the substrate base plate and the conductive wires, the conductive wires are better protected, and the conductive wires are favorably ensured to keep a good signal transmission function.

Specifically, a groove may be formed in the entire non-display area of the substrate base plate, an orthographic projection of all the grooves on the substrate base plate forms a grid pattern, the groove is located on a side line of a grid unit of the grid pattern, and all the conductive routing lines are disposed in the groove.

Specifically, to the setting of above-mentioned recess, make electrically conductive walking line be less than the degree of depth of bar recess in the ascending thickness of perpendicular to substrate base plate direction, electrically conductive walking line be located the recess inside completely, can avoid by the technological influence of encapsulation glue preparation in-process, for example, the encapsulation glue is glass glue, electrically conductive walking line is located the recess completely, can effectively prevent by the laser influence of the focus when glass glue sintering.

Specifically, the conductive traces are metal traces disposed in the non-display area of the array substrate for transmitting electrical signals.

Based on the same inventive concept, embodiments of the present invention also provide a display device including any one of the O L ED display panels provided in the above embodiments.

It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An O L ED display panel comprises an array substrate, a package cover plate arranged opposite to the array substrate, and a package adhesive for bonding the array substrate and the package cover plate;

2. The O L ED display panel of claim 1, wherein the shape of the grid cells in the grid-like pattern is a regular polygon.

3. The O L ED display panel of claim 2, wherein the grid cells are regular hexagons in shape.

4. The O L ED display panel of claim 3, wherein two opposite side lines of the grid unit are disposed parallel to the extending direction of the length of the packaging adhesive, and the side length of the grid unit and the width of the packaging adhesive along the direction parallel to the substrate and the number of the corresponding single row of grid units along the width direction of the packaging adhesive satisfy the following relations:

5. The O L ED display panel of claim 1, wherein the through holes are disposed at positions corresponding to the grids in the portions of the protection layer corresponding to the encapsulant.

6. The O L ED display panel of claim 1, wherein the number of single row of grid cells corresponding to the length direction of the encapsulant is greater than or equal to the number of conductive traces.

7. The O L ED display panel of claim 1, wherein a groove corresponding to a side line of each grid cell in the grid pattern is disposed at a position of the substrate opposite to the packaging adhesive, an orthogonal projection of all the grooves on the substrate forms the grid pattern, and each conductive trace is disposed in the groove.

8. The O L ED display panel of claim 7, wherein the thickness of the conductive traces in the direction perpendicular to the substrate base is less than the depth of the stripe-shaped grooves.

9. The O L ED display panel of claim 1, wherein the conductive traces comprise metal traces.

10. A display device comprising the O L ED display panel according to any one of claims 1-9.