CN111405439A - Loudspeaker - Google Patents
Loudspeaker Download PDFInfo
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- CN111405439A CN111405439A CN202010275114.2A CN202010275114A CN111405439A CN 111405439 A CN111405439 A CN 111405439A CN 202010275114 A CN202010275114 A CN 202010275114A CN 111405439 A CN111405439 A CN 111405439A
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- piezoelectric sheet
- loudspeaker
- fixedly connected
- shell
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- 229910000831 Steel Inorganic materials 0.000 claims description 15
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- 230000005284 excitation Effects 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 239000006260 foam Substances 0.000 description 5
- 241000463219 Epitheca Species 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
The invention discloses a loudspeaker which comprises at least one piezoelectric patch, a power supply circuit, a mounting plate, at least one damping structure and a shell, wherein the power supply circuit is connected with the piezoelectric patch and an external circuit, the mounting plate is fixedly connected with the piezoelectric patch, the damping structure is fixedly connected with the piezoelectric patch and a vibrated surface, the shell is fixedly connected with the mounting plate and wraps the piezoelectric patch, the power supply circuit and the mounting plate, and a through hole for the damping structure to penetrate through is formed in the shell. From this, through the encapsulation that piezoelectric patches, supply circuit and mounting panel parcel realized the piezoelectric patches of casing, play the guard action to the piezoelectric patches, make the structure moduleization of speaker, the wholeness of reinforcing speaker structure, and then improve the overall structure performance and the reliability of use of speaker. Moreover, the damping structure is arranged between the piezoelectric sheet and the vibrated surface, so that the tone quality of the loudspeaker is improved, and the use performance of the loudspeaker is further optimized.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a loudspeaker.
Background
The loudspeaker is a common electroacoustic transducer, and is widely applied to electronic communication terminal equipment such as mobile phones.
According to different driving modes, the loudspeaker mainly comprises: an electromagnetically driven moving coil speaker and a piezoelectrically driven piezoelectric speaker. Compared with the traditional moving-coil loudspeaker, the piezoelectric loudspeaker has the advantages of no magnetic field interference, low power consumption, light weight, thinness and the like. Under the development trend of light weight and high performance of electronic products, the piezoelectric type loudspeaker has wide development prospect and future. However, the existing piezoelectric type loudspeaker is mostly composed of a single piezoelectric element, has a single structure, is thin, has poor performance, and still has a great improvement space.
Disclosure of Invention
In view of the above, the present invention provides a speaker to improve the overall structural performance and operational performance of the speaker.
In a first aspect, an embodiment of the present invention provides a speaker, where the speaker includes:
at least one piezoelectric patch;
the power supply circuit is connected with the piezoelectric patch and an external circuit and is used for providing voltage excitation for the piezoelectric patch;
the mounting plate is fixedly connected with the piezoelectric sheet;
at least one damping structure fixedly connected with the piezoelectric sheet and the vibrated surface and used for conducting vibration to the vibrated surface; and
the shell is fixedly connected with the mounting plate and used for wrapping the piezoelectric sheet, the power supply circuit and the mounting plate, and the shell is provided with a through hole for the damping structure to pass through;
wherein the vibrated surface is a screen or a housing of an electronic device.
Further, the speaker further includes:
and the protection structure is arranged between the shell and the vibrated surface and is used for avoiding noise generated by collision between the shell and the vibrated surface.
Further, the at least one piezoelectric patch includes:
the first piezoelectric piece is fixedly connected to one side of the mounting plate; and
a second piezoelectric sheet arranged on the other side of the mounting plate opposite to the first piezoelectric sheet;
the first piezoelectric sheet and the second piezoelectric sheet are fixedly connected.
Further, the speaker further includes:
and the steel plate is arranged in the area surrounded by the protection structure and is connected between the damping structure and the vibrated surface.
Further, the speaker further includes:
and the counterweight component is fixedly connected with the first piezoelectric sheet, and the projection of the counterweight component and the damping structure along the variation direction of the piezoelectric sheet does not overlap.
Further, the weight member is located at an outer side corner or a center position of the piezoelectric sheet.
Further, the damping structure is located at the outer corners or the center of the piezoelectric sheet.
Further, the power supply circuit comprises a flexible circuit board;
the shell is provided with a mounting groove;
the flexible circuit board is provided with a connecting part and a conducting part, the connecting part is fixedly connected with the piezoelectric sheet, and the conducting part extends to the outside of the shell from the inner side of the shell through the mounting groove and is connected with an external circuit.
Furthermore, the surface to be vibrated is connected with a plate-shaped middle frame structure, a fixing groove is formed in the middle frame structure, and the outer wall of the shell is fixedly connected with the inner wall of the fixing groove.
In a second aspect, an embodiment of the present invention provides an electronic device, which includes the speaker as described above.
According to the technical scheme of the embodiment of the invention, the piezoelectric sheet, the power supply circuit and the mounting plate are wrapped by the shell, so that the packaging of the piezoelectric sheet is realized, the piezoelectric sheet is protected, the structure of the loudspeaker is modularized, the structural integrity of the loudspeaker is enhanced, and the integral structural performance and the use reliability of the loudspeaker are improved. Moreover, the damping structure is arranged between the piezoelectric sheet and the vibrated surface, so that the tone quality of the loudspeaker is improved, and the use performance of the loudspeaker is further optimized.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 is an overall structural view of a speaker according to a first embodiment of the present invention;
fig. 2 is an exploded view of the overall structure of a speaker according to a first embodiment of the present invention;
fig. 3 is a schematic mounting diagram of a first flexible wiring board according to a first embodiment of the present invention;
fig. 4 is a structural view of a first flexible wiring board according to a first embodiment of the present invention;
fig. 5 is an overall configuration diagram of a speaker according to a second embodiment of the present invention;
fig. 6 is an exploded view of the entire structure of a speaker according to a second embodiment of the present invention;
fig. 7 is a structural view of a second flexible wiring board according to a second embodiment of the present invention;
fig. 8 is an overall configuration diagram of a speaker according to a third embodiment of the present invention;
fig. 9 is an exploded view of the entire structure of a speaker according to a third embodiment of the present invention;
fig. 10 is an exploded view of the entire structure of a speaker of the fourth embodiment of the present invention;
fig. 11 is an exploded view of the entire structure of a speaker of the fifth embodiment of the present invention;
fig. 12 is an exploded view of the entire structure of an electronic device according to a sixth embodiment of the present invention.
In the figure: 1. an upper shell; 101. mounting grooves; 2. a power supply circuit; 21. a connecting portion; 211. a first connection portion; 212. a second connecting portion; 22. a conductive portion; 23. a body portion; 3. a piezoelectric sheet; 31. a first piezoelectric sheet; 32. a second piezoelectric sheet; 4. mounting a plate; 5. a lower case; 51. a through hole; 6. a damping structure; 7. a protective structure; 8. a surface to be vibrated; 9. a steel plate; 10. a weight member; 11. double-sided adhesive tape; 12. a middle frame structure; 121. fixing grooves; 13. a screen; 14. a housing; 15. a frame; 16. a loudspeaker.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
Example one
Fig. 1 is an overall configuration diagram of a speaker according to a first embodiment of the present invention. Fig. 2 is an exploded view of the entire structure of the speaker according to the first embodiment of the present invention. As shown in fig. 1 and 2, the speaker of the present embodiment includes: the device comprises a shell, a mounting plate 4, a power supply circuit 2, a piezoelectric sheet 3, a damping structure 6 and a protection structure 7. Wherein, the piezoelectric sheet 3 is arranged as one and is fixedly connected with one side of the mounting plate 4. The power supply circuit 2 is fixedly connected to the piezoelectric patch 3 and connected to an external circuit, and is used for providing voltage excitation for the piezoelectric patch 3. The damping structure 6 is arranged between the piezoelectric sheet 3 and the vibrated surface 8 and fixedly connected with the piezoelectric sheet 3 and the vibrated surface 8. The vibrated surface 8 may be a screen or housing of an electronic device. In fig. 2, the vibrated surface 8 is a screen of an electronic device. The damping structure 6 and the vibrated surface 8 are fixedly connected through bonding, welding or spot-gluing curing. During the use, provide voltage excitation for piezoelectric patches 3 through external circuit and supply circuit 2 for piezoelectric patches 3 produces deformation under the voltage effect, drives damping structure 6 vibration and conducts the vibration to by vibration surface 8 by damping structure 6, makes by vibration surface 8 production sound, realizes the sound production of speaker. Simultaneously, through setting up damping structure 6, the vibration mode of adjustment speaker optimizes the sound radiation, improves the tone quality of speaker for the performance of speaker is more reliable, and the equipment degree of difficulty is little, has further improved the reliability when speaker uses. In an alternative implementation manner, the material of the piezoelectric sheet 3 may be any one of a single crystal, a double crystal, a piezoelectric ceramic sheet containing a steel plate or no steel plate with any size and shape, and thus, the material may be selected and modified according to different application occasions, and the application range of the loudspeaker is expanded.
Preferably, the mounting plate 4 is provided as a hollow rectangular-structured steel plate. The casing includes epitheca 1 and inferior valve 5, and the relative epitheca 1 of inferior valve 5 sets up in the outside edge of the opposite side of mounting panel 4 and with mounting panel 4 fixed connection in the outside edge fixed connection of one side of epitheca 1 and mounting panel 4, and the through-hole 51 that supplies damping structure 6 to pass is still seted up to the bottom of inferior valve 5. The piezoelectric sheet 3 is arranged between the upper shell 1 and the mounting plate 4, and the size of the piezoelectric sheet is smaller than or equal to that of the mounting plate. The damping structure 6 passes through the through hole 51 and is fixedly connected with the bottom of the piezoelectric sheet 3. Through epitheca 1 and 5 parcel piezoelectric patches 3 of inferior valve, supply circuit 2 and mounting panel 4, make into modular structure with the speaker, realize the encapsulation of piezoelectric patches, when playing the guard action to the piezoelectric patches, overall structure is simple compact, is favorable to strengthening the wholeness of speaker structure, improves the overall structure performance and the reliability of use of speaker, and the equipment degree of difficulty is low. Meanwhile, the resonant frequency of the loudspeaker is adjusted by adjusting the shape of the mounting plate, and the use performance of the loudspeaker is further optimized.
In an alternative implementation, the power supply circuit 2 is provided as a first flexible wiring board. Fig. 3 is a schematic mounting diagram of the first flexible wiring board according to the first embodiment of the present invention. Fig. 4 is a structural diagram of a first flexible wiring board according to a first embodiment of the present invention. Referring to fig. 3 and 4, the first flexible wiring board includes a body portion 23, a connection portion 21, and a conductive portion 22, and the connection portion 21 and the conductive portion 22 are respectively provided at both ends of the body portion 23. The connecting portion 21 is fixedly connected to the top of the piezoelectric sheet 3, and the conductive portion 22 is connected to an external circuit. Thus, the conductive part 22 extends from the inside of the housing to the outside of the housing via the mounting groove 101 and communicates with an external circuit, and supplies voltage excitation to the piezoelectric sheet 3. The flexible circuit board has the advantages of being capable of being bent at will, small in size, light in weight, good in heat dissipation performance, easy to assemble and connect, low in comprehensive cost and the like, so that the loudspeaker can be conveniently installed, the size and the weight of the loudspeaker are reduced, and the heat dissipation performance of the loudspeaker is improved.
In an optional implementation manner, the damping structure 6 is located at an outer side corner or a central position of the bottom of the piezoelectric patch 3, and an elastic mechanical element (such as a spring) or an elastic material (such as foam, spring steel, rubber, and the like) with a block/ring structure in any shape is adopted, so that the arrangement manner of the damping structure 6 is more flexible, and performance requirements of different speakers are met. Specifically, the damping structure 6 in this embodiment is configured as a circular foam, and is located at the center of the piezoelectric patch 3, so that the speaker is more convenient to assemble.
The protective structure 7 is arranged as a ring-shaped foam and is fixedly connected with the bottom of the shell and the surface 8 to be vibrated. Therefore, in the using process of the loudspeaker, the sealing performance of the connection between the loudspeaker and the vibrated surface 8 is enhanced through the annular foam, and the noise generated by the collision between the shell and the vibrated surface 8 is reduced or avoided, so that the performance of the loudspeaker is further improved.
According to the technical scheme of the first embodiment of the invention, the piezoelectric sheet, the power supply circuit and the mounting plate are wrapped by the shell, so that the packaging of the piezoelectric sheet is realized, the piezoelectric sheet is protected, the structure of the loudspeaker is modularized, the structural integrity of the loudspeaker is enhanced, and the overall structural performance and the use reliability of the loudspeaker are improved. Moreover, the damping structure is arranged between the piezoelectric sheet and the vibrated surface, so that the tone quality of the loudspeaker is improved, and the use performance of the loudspeaker is further optimized.
Example two
Fig. 5 is an overall configuration diagram of a speaker according to a second embodiment of the present invention, and fig. 6 is an exploded diagram of the overall configuration of the speaker according to the second embodiment of the present invention. Referring to fig. 5 and 6, the speaker of the present embodiment includes: the piezoelectric device comprises a shell, a mounting plate 4, a power supply circuit 2, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6 and a protection structure 7. The housing, the mounting plate 4, the damping structure 6, and the protection structure 7 are substantially the same as those of the first embodiment, and are not described herein again.
Preferably, the first piezoelectric sheet 31 is fixedly connected to one side of the mounting plate 4, the second piezoelectric sheet 32 is disposed opposite to the first piezoelectric sheet 31 on the other side of the mounting plate 4, and the first piezoelectric sheet 31 and the second piezoelectric sheet 32 are fixedly connected corresponding to the hollow portion of the mounting plate 4. Preferably, the first piezoelectric sheet 31 and the second piezoelectric sheet 32 in this embodiment are identical in structure, which facilitates assembly and production of the speaker.
Fig. 7 is a structural view of a second flexible wiring board according to a second embodiment of the present invention. Referring to fig. 7, the power supply circuit 2 of the present embodiment is a second flexible wiring board. The second flexible wiring board includes a main body 23, and a conductive portion 22 and a connecting portion 21 which are oppositely disposed at both ends of the main body 23, and the connecting portion 21 includes a first connecting portion 211 and a second connecting portion 212 which are oppositely disposed at one end of the main body 23 with respect to the conductive portion 22. Specifically, the first connection portion 211 is fixedly connected to the top of the first piezoelectric sheet 31. One end of the second connection portion 212 is connected to the bottom of the first connection portion 211 close to one end of the conductive portion 22, and the other end is disposed below the first connection portion 211 and extends in a direction parallel to the first connection portion 211 and is fixedly connected to the bottom of the second piezoelectric sheet 32. Thus, the conductive portion 22 extends from the inside of the housing to the outside of the housing via the mounting groove 101 and communicates with an external circuit, and simultaneously provides voltage excitation to the first piezoelectric sheet 31 and the second piezoelectric sheet 32 through the first connection portion 211 and the second connection portion 212. The flexible circuit board has the advantages of being capable of being bent at will, small in size, light in weight, good in heat dissipation performance, easy to assemble and connect, low in comprehensive cost and the like, so that the loudspeaker can be conveniently installed, the size and the weight of the loudspeaker are reduced, and the heat dissipation performance of the loudspeaker is improved.
EXAMPLE III
Fig. 8 is an overall configuration diagram of a speaker according to a third embodiment of the present invention. Fig. 9 is an exploded view of the entire structure of a speaker according to a third embodiment of the present invention. Referring to fig. 8 and 9, the speaker of the present embodiment includes: the device comprises a shell, a mounting plate 4, a power supply circuit 2, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6, a protection structure 7 and a steel plate 9. The arrangement of the housing, the mounting plate 4, the power supply circuit 2, the first piezoelectric patch 31, the second piezoelectric patch 32, the damping structure 6, and the protection structure 7 is substantially the same as that of the second embodiment, and therefore, the description thereof is omitted.
It should be noted that the steel plate 9 is disposed in the area surrounded by the protective structure 7 and connected between the damping structure 6 and the vibrated surface 8, and the size of the steel plate 9 is larger than that of the damping structure 6 and smaller than that of the connection portion of the second piezoelectric sheet 32 and the mounting plate 4. Specifically, the steel plate 9 may be a closed structure with regular size, or may have a hollow. Therefore, in the working process of the loudspeaker, the steel plate 9 enhances the conduction of vibration, improves the vibration amplitude of the loudspeaker and further adjusts the loudness of the loudspeaker. Moreover, the resonance frequency of the loudspeaker is adjusted by adjusting the structure of the steel plate 9, so that the low-frequency response is optimized, and the quality of the loudspeaker is improved.
Example four
Fig. 10 is an exploded view of the entire structure of a speaker according to a fourth embodiment of the present invention. Referring to fig. 10, the speaker of the present embodiment includes: the device comprises a shell, a mounting plate 4, a power supply circuit 2, a weight component 10, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6, a protection structure 7 and a steel plate 9. The arrangement of the housing, the mounting plate 4, the power supply circuit 2, the first piezoelectric patch 31, the second piezoelectric patch 32, the damping structure 6, the protection structure 7, and the steel plate 9 is substantially the same as that of the second embodiment, and therefore, the description thereof is omitted.
It should be noted that at least one of the weight members 10 is fixedly connected to the outer corners or the center of the first piezoelectric plate 31, and does not overlap with the projection of the damping structure 6 along the deformation direction of the first piezoelectric plate 31 and the second piezoelectric plate 32. In an alternative implementation, the weight member 10 may be a rectangular parallelepiped block, a cylindrical block, a circular tube block, a circular ring, a polygonal ring, or a polygonal block structure. The material of the weight member 10 may be a metal material such as iron or copper, an inorganic nonmetal material such as glass or silicon, or an organic polymer material such as polyvinyl chloride or epoxy resin. The weight member 10 and the first piezoelectric sheet 31 are fixedly connected by adhesion or welding.
Specifically, the weight member 10 of the present embodiment is provided with four, respectively at four outer side edge positions of the first piezoelectric sheet 31. Thus, the mass and stiffness distribution of the loudspeaker are adjusted by adding the weight member 10, optimizing the vibration mode of the loudspeaker, and thus the acoustic radiation of the loudspeaker. Furthermore, the relative positions of the weight component 10 and the damping structure 6 are adjusted to optimize the flatness of the sound pressure level frequency response curve of the loudspeaker, reduce the distortion degree of the loudspeaker and enable the sound quality of the loudspeaker to be better.
EXAMPLE five
Fig. 11 is an exploded view of the entire structure of a speaker according to a fifth embodiment of the present invention. Referring to fig. 10, the speaker of the present embodiment includes: the piezoelectric device comprises a shell, a mounting plate 4, a power supply circuit 2, a first piezoelectric sheet 31, a second piezoelectric sheet 32, a damping structure 6 and a protection structure 7. The arrangement of the housing, the mounting plate 4, the power supply circuit 2, the first piezoelectric patch 31, the second piezoelectric patch 32, and the damping structure 6 is substantially the same as that of the second embodiment, and the description thereof is omitted here.
It should be noted that the protection structure 7 is a double-sided adhesive tape 11 with a hollow rectangular structure. The vibrating surface is connected with a middle frame structure 12, the middle frame structure 12 is in a plate shape, a fixing groove 121 is formed in the plate-shaped structure, and the edge of the bottom of the shell is fixedly connected with the inner wall of the fixing groove 121 through a double-faced adhesive tape 11. Therefore, when the first piezoelectric patch 31 and the second piezoelectric patch 32 are deformed, the damping structure 6 is driven to vibrate and conduct the vibration to the middle frame structure 12 and the vibrated surface 8, and the sound of the loudspeaker is generated. By introducing the middle frame structure 12, the fixing mode between the loudspeaker and the vibrated surface 8 is more flexible, the requirements of different installation occasions are further met, and the usability of the loudspeaker is enlarged.
It is understood that the above structures related to the speaker include, but are not limited to, the description of the embodiments of the present invention, wherein the first piezoelectric sheet, the second piezoelectric sheet, the steel plate, the weight member, the ring-shaped foam, the double-sided tape, and the middle frame structure can be freely combined according to actual needs.
EXAMPLE six
Fig. 12 is an exploded view of the entire structure of an electronic device according to a sixth embodiment of the present invention. Referring to fig. 12, the electronic apparatus of the present embodiment includes a speaker, a screen 13, a housing 14, and a bezel 15. Wherein, the screen 13 or the shell 14 can be used as the vibrated surface, and the loudspeaker is fixedly connected with the vibrated surface. The speaker of this embodiment may adopt the speaker structure of any one of embodiments one to five, and the surface to be vibrated is the screen 13. Therefore, when the piezoelectric sheet in the loudspeaker vibrates, the vibration is conducted to the surface of the screen through the damping structure, the sound production of the electronic equipment is realized, and the use requirements of the electronic equipment on different occasions are met.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A loudspeaker, characterized in that the loudspeaker comprises:
at least one piezoelectric patch (3);
the power supply circuit (2) is connected with the piezoelectric sheet (3) and an external circuit and is used for providing voltage excitation for the piezoelectric sheet (3);
the mounting plate (4) is fixedly connected with the piezoelectric sheet (3);
at least one damping structure (6) fixedly connected with the piezoelectric sheet (3) and the vibrated surface (8) and used for conducting vibration to the vibrated surface (8); and
the shell is fixedly connected with the mounting plate (4) and used for wrapping the piezoelectric sheet (3), the power supply circuit (2) and the mounting plate (4), and the shell is provided with a through hole (51) for the damping structure (6) to pass through;
wherein the vibrated surface (8) is a screen or housing of an electronic device.
2. The speaker of claim 1, further comprising:
and the protection structure (7) is arranged between the shell and the vibrated surface (8) and is used for avoiding noise generated by collision of the shell and the vibrated surface (8).
3. A loudspeaker according to claim 1, wherein the at least one piezoelectric patch (3) comprises:
the first piezoelectric sheet (31) is fixedly connected to one side of the mounting plate (4); and
a second piezoelectric plate (32) provided on the other side of the mounting plate (4) so as to oppose the first piezoelectric plate (31);
the first piezoelectric sheet (31) and the second piezoelectric sheet (32) are fixedly connected.
4. The speaker of claim 2, further comprising:
a steel plate (9) arranged in the area surrounded by the protective structure (7) and connected between the damping structure (6) and the surface (8) to be vibrated.
5. The speaker of claim 2, further comprising:
at least one weight component (10) is fixedly connected with the first piezoelectric sheet (31), and the projection of the weight component (10) and the damping structure (6) along the deformation direction of the piezoelectric sheet (3) is not overlapped.
6. A loudspeaker according to claim 5, wherein the weight member (10) is located at an outer corner or central position of the piezoelectric sheet (3).
7. A loudspeaker according to claim 1, wherein the damping structure (6) is located at an outer corner or central position of the piezoelectric patch (3).
8. Loudspeaker according to claim 1, characterized in that the supply circuit (2) comprises a flexible circuit board;
the shell is provided with a mounting groove (101);
the flexible circuit board is provided with a connecting part (21) and a conducting part (22), the connecting part (21) is fixedly connected with the piezoelectric sheet (3), and the conducting part (22) extends from the inner side of the shell to the outside of the shell through the mounting groove (101) and is connected with an external circuit.
9. The loudspeaker according to claim 1, wherein the surface (8) to be vibrated is connected with a plate-shaped middle frame structure (12), the middle frame structure (12) is provided with a fixing groove (121), and the outer wall of the casing is fixedly connected with the inner wall of the fixing groove (121).
10. An electronic device, characterized in that the electronic device comprises a loudspeaker as claimed in any one of claims 1-9.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010275114.2A CN111405439A (en) | 2020-04-09 | 2020-04-09 | Loudspeaker |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010275114.2A CN111405439A (en) | 2020-04-09 | 2020-04-09 | Loudspeaker |
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CN111405439A true CN111405439A (en) | 2020-07-10 |
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CN202010275114.2A Pending CN111405439A (en) | 2020-04-09 | 2020-04-09 | Loudspeaker |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022143503A1 (en) * | 2020-12-28 | 2022-07-07 | 华为技术有限公司 | Loudspeaker and electronic apparatus |
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CN201623850U (en) * | 2010-03-31 | 2010-11-03 | 精拓丽音科技(北京)有限公司 | Matrix form piezoelectricity panel speaker with a weighting structure and a damping structure |
CN201718027U (en) * | 2010-07-09 | 2011-01-19 | 精拓丽音科技(北京)有限公司 | Flexible counterweight structure for piezoelectric flat-panel speaker |
CN108334165A (en) * | 2018-01-19 | 2018-07-27 | 瑞声科技(新加坡)有限公司 | Electronic equipment |
CN110178380A (en) * | 2016-11-08 | 2019-08-27 | Lg 电子株式会社 | Show equipment |
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