CN111405415A - Electronic device - Google Patents
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- CN111405415A CN111405415A CN202010238587.5A CN202010238587A CN111405415A CN 111405415 A CN111405415 A CN 111405415A CN 202010238587 A CN202010238587 A CN 202010238587A CN 111405415 A CN111405415 A CN 111405415A
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- hole
- circuit board
- sound
- sound guide
- dielectric layer
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses an electronic device, which comprises a shell, a circuit board and an acoustic device, wherein the shell is provided with a first opening and a second opening; the casing has been seted up and has been held chamber and first through-hole, hold the chamber through first through-hole with the intercommunication outside the casing, the circuit board with acoustic device set up in hold the intracavity, the circuit board has been seted up and has been led sound passageway, first leading sound hole and second and lead the sound hole, first leading sound hole with the second is led the sound hole and is passed through lead sound passageway intercommunication, acoustic device is located one side of circuit board, and with first leading sound hole sets up relatively, the second is led the sound hole with first through-hole intercommunication. The scheme can solve the problems that the sound guide channel of the current mobile phone has a cavity structure formed by surrounding a circuit board and a sound guide structural member, so that the structural complexity of the sound guide channel and the production and manufacturing difficulty of the mobile phone are increased, and the light and thin development of the mobile phone is restricted.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular, to an electronic device.
Background
A microphone is widely used in electronic devices as an electronic component for converting a sound signal into an electric signal, such as a mobile phone.
The existing mobile phone comprises a shell, a microphone body, a circuit board and a sound guide structural part, wherein the microphone body, the circuit board and the sound guide structural part are arranged in the shell; the casing is provided with a sound guide hole, the microphone body is packaged and fixed on the circuit board, a cavity is enclosed between the sound guide structural member and one side of the circuit board, and the cavity forms a sound guide channel for communicating the sound guide hole with the microphone body, so that external sound signals can be transmitted to the microphone body along the sound guide channel through the sound guide hole and then converted into electric signals.
However, the sound guide channel of the conventional mobile phone adopts a cavity structure surrounded by the circuit board and the sound guide structural member, so that the complexity of the sound guide channel structure and the production and manufacturing difficulty of the mobile phone are increased, and the light and thin development of the mobile phone is restricted.
Disclosure of Invention
The invention discloses electronic equipment, which aims to solve the problems that the complexity of a sound guide channel structure and the production and manufacturing difficulty of a mobile phone are increased due to the fact that a cavity structure enclosed by a circuit board and a sound guide structural member is adopted in a sound guide channel of the traditional mobile phone, and the problem that the thinning and the development of the mobile phone are restricted.
In order to solve the problems, the invention adopts the following technical scheme:
the invention provides electronic equipment, which comprises a shell, a circuit board and an acoustic device, wherein the shell is provided with a first opening and a second opening; the casing has been seted up and has been held chamber and first through-hole, hold the chamber through first through-hole with the intercommunication outside the casing, the circuit board with acoustic device set up in hold the intracavity, the circuit board has been seted up and has been led sound passageway, first leading sound hole and second and lead the sound hole, first leading sound hole with the second is led the sound hole and is passed through lead sound passageway intercommunication, acoustic device is located one side of circuit board, and with first leading sound hole sets up relatively, the second is led the sound hole with first through-hole intercommunication.
The technical scheme adopted by the invention can achieve the following beneficial effects:
according to the electronic equipment disclosed by the invention, the sound guide channel is directly formed inside the circuit board through the sound guide channel arranged on the circuit board, so that the use of an additional sound guide structural member is avoided, the complexity of the sound guide channel can be reduced, the sound guide and sealing effects of the sound guide channel can be improved, the generation and manufacturing difficulty of the electronic equipment can be reduced, the manufacturing cost can be reduced, the space occupied by the circuit board can be fully utilized, the structural member can be prevented from being accumulated in the thickness direction of the electronic equipment, and the light and thin development of the electronic equipment is facilitated. Wherein, the sound channel of leading who sets up in the circuit board leads the sound hole through first and leads sound hole and acoustic device intercommunication, leads the sound channel and leads the sound hole through the second and set up in the first through-hole intercommunication of casing to make the casing outside with be located the casing hold the acoustic device of intracavity and can carry out sound transmission, guarantee that acoustic device can normally work.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic view of a first structure of a circuit board provided with a sound guide channel according to an embodiment of the present invention;
fig. 2 is a schematic view of a second structure of a circuit board with a sound guiding channel according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a second structure of the sound guiding channel and a soldering structure of a pin of the USB socket according to the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second through hole formed in a housing of an electronic device according to an embodiment of the disclosure.
Description of reference numerals:
100-shell, 110-jack, 111-second through hole, 112-pin, 120-sound guide hole, 130-SIM card slot, 140-card taking needle jack,
200-circuit board, 201-first dielectric layer, 202-second dielectric layer, 203-third dielectric layer, 204-circuit layer, 210-sound guide channel, 211-first sound guide hole, 212-second sound guide hole, 220-conduit, 230-welding disc,
300-acoustic device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 4, an embodiment of the invention discloses an electronic device, which includes a housing 100, a circuit board 200, and an acoustic device 300.
The casing 100 serves as a base member of the electronic device, and not only can provide a receiving space and a bearing base for the arrangement of functional devices such as the circuit board 200 and the acoustic device 300 of the electronic device, but also can have protection and appearance performance. The housing 100 is provided with an accommodating cavity and a first through hole, the accommodating cavity is communicated with the outside of the housing 100 through the first through hole, and the circuit board 200 and the acoustic device 300 are arranged in the accommodating cavity, so that an adaptive accommodating space is provided for arranging functional devices such as the circuit board 200 and the acoustic device 300 in the housing 100 through the accommodating cavity.
The circuit board 200 serves as an essential accessory of the electronic device, and plays a role in carrying and interconnecting electronic components in the electronic device, so that an electrical system of the electronic device realizes corresponding functions; generally, the acoustic device 300 is mounted and fixed to the circuit board 200.
In the electronic device disclosed in the embodiment of the present invention, the circuit board 200 is provided with the sound guide channel 210, the first sound guide hole 211 and the second sound guide hole 212, the first sound guide hole 211 is communicated with the second sound guide hole 212 through the sound guide channel 210, the circuit board 200 itself forms the sound guide channel 210 without using an additional sound guide structural member, which can reduce the complexity of the sound guide channel 210, is beneficial to improving the sound guide and sealing effects of the sound guide channel 210, can also reduce the manufacturing difficulty and manufacturing cost of the electronic device, and can also fully utilize the space occupied by the circuit board 200 to avoid the accumulation of the structural member in the thickness direction of the electronic device, thereby being beneficial to the light and thin development of the electronic device.
Meanwhile, the acoustic device 300 mounted and fixed on the circuit board 200 is located at one side of the circuit board 200, and the acoustic device 300 is opposite to the first sound guide hole 211, so that sound transmission can be performed between the acoustic device 300 and the first sound guide hole 211. By communicating the first through hole with the second sound guide hole 212, the external sound signal can be transmitted to the acoustic device 300 along the sound guide channel 210 through the first through hole 120, and then converted into an electrical signal, so as to implement the corresponding function of the acoustic device 300.
Specifically, the first through hole 120 may be separately opened on the housing 100; alternatively, the first through hole 120 may be disposed in other insertion holes 110 provided in the housing 100. The first sound guiding hole 211 and the second sound guiding hole 212 may be disposed on the same surface of the circuit board 200, or the first sound guiding hole 211 and the second sound guiding hole 212 may be disposed on different surfaces of the circuit board 200; the acoustic device 300 may be a microphone or a receiver or the like.
Generally, at least one jack 110 is generally disposed on the housing 100 of the electronic device, and the jack 110 may be a USB jack, a headphone jack, a pin jack, or the like. Therefore, compared with the scheme of separately forming the first through hole 120 on the casing 100, the first through hole 120 is formed on the hole wall of the jack 110, so that the first through hole 120 and the existing jack 110 on the casing 100 form a composite structure, which can prevent the casing 100 from affecting the structural strength of the casing 100 due to more openings formed, thereby ensuring that the overall structure of the electronic device has higher reliability and the casing 100 has better aesthetic property.
Moreover, as shown in fig. 4, under the condition that the housing 100 of the electronic device is further provided with the SIM card slot 130 and the card taking pin jack 140, since the jacks 110 such as the USB jack, the earphone jack or the card pin jack have strong and different structural features, the first through hole 120 and the jack 110 are multiplexed, so that the situation that the card taking pin is mistakenly inserted into the first through hole due to the fact that the user confuses the first through hole 120 and the card taking pin jack 140 can be avoided, which is beneficial to ensuring the safety and correct use of the electronic device.
The SIM card can be inserted into the SIM card slot 130 through the card holder, and the card-taking pin can be inserted into the card-taking pin insertion hole 140 when the card holder needs to be ejected from the SIM card slot 130; the SIM card slot 130 and the card taking pin jack 140 can refer to the structures of the SIM card slot 130 and the card taking pin jack 140 of the existing mobile phone, so detailed descriptions thereof are not repeated in the embodiments of the present invention.
In the electronic device disclosed in the embodiment of the present invention, the socket 110 may be provided with a USB socket, in this case, the socket 110 is a mounting hole of the USB socket, and the USB socket has a USB interface, so that a USB connector can be inserted into the USB interface, and the electronic device can be connected to a charger, a mobile power supply, or other electronic devices. The pins 112 of the USB socket are fixed to the circuit board 200, so as to achieve the purpose of data and power connection between the USB socket and the circuit board 200.
Optionally, a first through hole is formed in a side wall of the USB interface, and a channel formed by the USB interface, the first through hole, the second sound guide hole 212, the sound guide channel 210, and the first sound guide hole 211 can ensure that the acoustic device 300 can perform sound transmission with the outside of the casing 100.
As a specific structure of the first through hole 120 and the USB socket, the first through hole may be directly connected to the second sound guiding hole 212, or the first through hole located on the sidewall of the USB interface may be connected to the second sound guiding hole 212 by providing an intermediate connection function with the sound guiding structure.
As described above, during the assembly of the USB socket, the USB socket needs to be connected to the circuit board 200 via the pins 112. Optionally, the sound guiding structure may be the pin 112 of the USB socket, and the pin 112 is a hollow structure, that is, a cavity is formed inside the pin 112, so that the pin 112 can be used as the sound guiding structure, and the first through hole and the second sound guiding hole 212 are communicated with each other, so that the pin 112 has at least two functions, and the number of parts in the electronic device is reduced; moreover, after the scheme is adopted, the first through hole and the second sound guide hole 212 are communicated with each other through the sealing communication structure of the pin 112, so that the sealing performance of the USB seat can be improved, and the problem of sound leakage can be prevented to a certain extent.
Optionally, the second sound guiding hole 212 and the first sound guiding hole 211 may be located on the same surface of the circuit board 200, or the second sound guiding hole 212 and the first sound guiding hole 211 may also be located on two opposite surfaces of the circuit board 200, respectively.
Specifically, the acoustic device 300 may be packaged and fixed on the top surface of the circuit board 200, and accordingly, the first sound guide hole 211 is also located on the top surface of the circuit board 200, so as to ensure that the acoustic device 300 and the first sound guide hole 211 can communicate with each other.
Optionally, the USB socket may be fixed on the bottom surface or the top surface of the circuit board 200 through the pins 112 in a packaged manner, and the position of the second sound guiding hole 212 is changed according to the different mounting positions of the USB socket, that is, the second sound guiding hole 212 may be disposed on the top surface of the circuit board 200 or disposed on the bottom surface of the circuit board 200. In the case where the second sound guide hole 212 is located at a different position, the pin 112 is connected to the circuit board 200 at a different position.
It should be noted that, in the single-layer circuit board, the surface is the outer wall of the circuit board; in the multilayer circuit board, the surface refers to the surface of the entire circuit board 200 that is located on the outermost side of the circuit board 200, and in this case, does not include the surface sandwiched between different layers in the circuit board 200. The top surface may be an upper surface of the circuit board 200, the bottom surface is a lower surface of the circuit board 200, and a surface between the upper surface and the lower surface may be considered a side surface of the circuit board 200.
Optionally, the USB socket is packaged and fixed on the top surface of the circuit board 200 through the pins 112, and the acoustic device 300 is also packaged and fixed on the top surface of the circuit board 200. In this case, as shown in fig. 2 and 3, the first and second sound guide holes 211 and 212 are located on the top surface of the circuit board 200, and the acoustic device 300 is located at the first sound guide hole 211, and the end of the pin 112 that is fixed to the circuit board 200 in a package is located at the second sound guide hole 212. Compared with the USB socket and the acoustic device 300 which are respectively located at the upper side and the lower side of the circuit board 200, the USB socket and the acoustic device 300 are located at the same side of the circuit board 200, so that the space occupied by the USB socket and the acoustic device 300 in the thickness direction can be effectively reduced.
In order to ensure that the pin 112 and the circuit board 200 have high welding strength and welding sealing performance, the surface of the circuit board 200 may be provided with a pad 230, the pad 230 is distributed around the second sound guiding hole 212 along the circumferential direction of the second sound guiding hole 212, and an end of the pin 112 away from the USB socket is welded to the pad 230, so as to ensure that the connection structure between the first through hole and the second sound guiding hole 212 has high strength and sealing performance, and further improve the sound guiding effect of the sound guiding channel 210.
In another embodiment of the present invention, the second sound guiding hole 212 and the first sound guiding hole 211 may be respectively located on two adjacent surfaces of the circuit board 200, and the second sound guiding hole 212 faces the first through hole. When the technical scheme is adopted, the first through hole and the second sound guide hole 212 can be communicated with each other without other structures, so that the workpiece cost and the processing procedure can be saved. Two adjacent surfaces in the circuit board 200 may be a top surface and a side surface of the circuit board 200, a side surface and a bottom surface of the circuit board 200, or two side surfaces in the circuit board 200.
Specifically, during the assembly process, the specific positions of the first through hole and the second sound guide hole 212 may be determined according to the relative positions of the circuit board 200 and the USB socket, so as to ensure that the first through hole faces the second sound guide hole 212, and the two holes are communicated with each other.
Optionally, the side wall of the USB interface where the first through hole is located may be attached to the surface of the circuit board 200 where the second sound guide hole 212 is located, so that the first through hole is opposite to and communicated with the second sound guide hole 212, and thus the gap between the first through hole and the second sound guide hole 212 is relatively small, and even the gap between the first through hole and the second sound guide hole 212 may be eliminated, thereby further improving the sound guide effect. Specifically, the USB socket may be disposed on the side, above, or below the circuit board 200, and the outer wall surface of the USB socket is attached to the corresponding surface of the circuit board 200.
More specifically, as shown in fig. 1, the first sound guide hole 211 is located on the top surface of the circuit board 200 and corresponds to the acoustic device 300 encapsulated and fixed on the top surface of the circuit board 200, and the second sound guide hole 212 is located on the side surface of the circuit board 200 and corresponds to the first through hole on the side surface of the outer wall of the USB socket, so that after the side surface of the outer wall of the USB socket is attached to the side surface of the circuit board 200, the first through hole can be attached to and communicated with the second sound guide hole 212, and the electronic device is prevented from being relatively thick due to stacking of the USB socket and the circuit board 200 in the thickness direction of the electronic device.
Of course, the USB socket may also be disposed on the top surface of the circuit board 200, and the bottom surface of the outer wall of the USB socket is attached to the top surface of the circuit board 200; accordingly, as shown in fig. 2, the first and second sound guide holes 211 and 212 are disposed on the top surface of the circuit board 200. The second sound guiding hole 212 corresponds to the first through hole on the bottom surface of the outer wall of the USB socket, so that the first through hole and the second sound guiding hole 212 can be attached and communicated after the bottom surface of the outer wall of the USB socket is attached to the top surface of the circuit board 200.
As described above, the jack 110 may be a USB jack, an earphone jack, or a card pin jack of an electronic device, and when the first through hole is compositely disposed in the jack 110, a certain plugging effect may be generated on the first through hole due to insertion of a connector such as a USB connector or an earphone plug into the jack 110, optionally, the inner wall of the jack 110 is disposed with the second through hole 111, one end of the second through hole 111 is communicated with the first through hole, and the other end of the second through hole 111 is communicated with the outside of the housing 100.
Under the condition of adopting the technical scheme, even if the plug of the external device is inserted into the jack 110, as shown in fig. 4, the second through hole 111 can still provide a channel for the communication requirement between the first through hole and the outside of the shell 100, and the adverse effect of the insertion of the plug on the communication condition of the first through hole is prevented.
In the electronic device disclosed in the embodiment of the present invention, the conduit 220 made of hard material may be disposed in the sound guiding channel 210, and the conduit 220 may support the inner wall of the sound guiding channel 210, so as to prevent the sound guiding channel 210 from deforming or even collapsing due to the stress of the circuit board 200, such as extrusion; wherein, the hard material can be hard plastic or metal such as copper, iron and the like.
The circuit board 200 disclosed in the embodiment of the present invention may be a multilayer circuit board, wherein the multilayer circuit board means that the circuit board 200 has a plurality of circuit layers 204, and a dielectric layer is disposed between two adjacent circuit boards.
Specifically, as shown in fig. 1, fig. 2 and fig. 3, the multilayer circuit board is a four-layer circuit board, which includes a first dielectric layer 201, a second dielectric layer 202 and a third dielectric layer 203, wherein the top surface of the first dielectric layer 201, the space between the first dielectric layer 201 and the second dielectric layer 202, the space between the second dielectric layer 202 and the third dielectric layer 203, and the bottom surface of the third dielectric layer 203 are respectively covered with a circuit layer 204; the circuit layer 204 and the second dielectric layer 202 are formed with strip-shaped through holes distributed along the extending direction of the circuit board 200, and at least one of the first dielectric layer 201 and the third dielectric layer 203 is formed with through holes communicated with the strip-shaped through holes and can form a sound guide channel 210 with the strip-shaped through holes.
Therefore, the second dielectric layer 202 provided with the strip-shaped through holes, the first dielectric layer 201 arranged on the top side of the second dielectric layer 202 and the third dielectric layer 203 arranged on the bottom side of the second dielectric layer can enclose the sound guide channel 210 of the circuit board 200, which is more convenient for processing the circuit board 200 compared with the structure of the sound guide channel 210 formed by the circuit board 200 completely through the rotary holes, and can reduce the risk of damage to the circuit layer 204 caused by the circuit board 200 in the rotary hole process.
Correspondingly, holes are arranged at the positions of the circuit layer 204 on the top surface of the first dielectric layer 201 and the bottom surface of the third dielectric layer 203 corresponding to the through holes; it is easy to understand that the top surface of the first dielectric layer 201 and the bottom surface of the second dielectric layer 202 may not be covered with the circuit layer 204; alternatively, the multilayer circuit board 200 may be a five-layer circuit board 200, a six-layer circuit board 200, or the like; however, in order to avoid the structure of the circuit board 200 that forms the sound guide channel 210 completely by means of the turning holes, as shown in fig. 1, 2 and 3, the dielectric layers of the multilayer circuit board should be at least three layers.
In addition, the first sound guiding hole 211 may be disposed on the first dielectric layer 201, as shown in fig. 1, the second sound guiding hole 212 may be disposed on a side surface of the entire circuit board 200, or, as shown in fig. 2, the second sound guiding hole 212 may also be disposed on a surface where the first sound guiding hole 211 is located, that is, both the first sound guiding hole 211 and the second sound guiding hole 212 may be disposed on the first dielectric layer 201; in addition, the first and second sound guide holes 211 and 212 may also be disposed on the third dielectric layer 203.
It should be noted that the circuit board 200 may also be a single-layer or double-layer circuit board, and in the case of a single-layer or double-layer circuit board, the required sound guiding channel 210 may be formed by machining through drilling or cutting and filling.
In addition, the electronic device disclosed by the embodiment of the invention can be an electronic device such as a smart phone, a tablet computer, an electronic book reader and the like.
The embodiment of the invention also provides a circuit board manufacturing method, and the disclosed circuit board manufacturing method comprises the following steps:
(1) cutting and cutting the second dielectric layer 202 and the areas, which need to form the sound guide channels 210, on the circuit layer 204 covering the upper surface and the lower surface of the second dielectric layer 202 to form strip-shaped through holes in a preset shape;
(2) pressing the first dielectric layer 201, the second dielectric layer 202, the third dielectric layer 203 and the circuit layers 204 into the circuit board 200;
(3) performing a depth-fixed rotary hole on the circuit board 200, so that a through hole communicated with the strip-shaped through hole is formed on the surface of the circuit board 200, that is, an orifice of the sound guide channel 210 is formed, and the orifice comprises a first sound guide hole 211 and/or a second sound guide hole 212;
(4) cleaning the whole sound guide channel 210, and testing the tightness and sound guide performance of the sound guide channel 210; the foreign matters remained in the sound guide channel 210 in the manufacturing process are prevented from blocking the channel;
(5) the acoustic device 300 and other electronic components are mounted on the circuit board 200 in a package.
In the step (2), glue is generally required to be used for hot pressing in the pressing process between the dielectric layer and the circuit layer 204; therefore, in order to avoid the glue diffusion and the deformation of the strip-shaped through hole caused in the pressing process, the conduit 220 made of hard material can be preset in the strip-shaped through hole; or, the spacing distance between the glue layer and the strip-shaped through holes is increased.
Of course, the circuit board manufacturing method provided by the embodiment of the invention can also be applied to the manufacturing of other multilayer circuit boards comprising at least three dielectric layers.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (12)
1. An electronic apparatus, characterized by comprising a housing (100), a circuit board (200) and an acoustic device (300); the acoustic device is characterized in that the housing (100) is provided with an accommodating cavity and a first through hole, the accommodating cavity is communicated with the outside of the housing (100) through the first through hole, the circuit board (200) and the acoustic device (300) are arranged in the accommodating cavity, the circuit board (200) is provided with a sound guide channel (210), a first sound guide hole (211) and a second sound guide hole (212), the first sound guide hole (211) is communicated with the second sound guide hole (212) through the sound guide channel (210), the acoustic device (300) is located on one side of the circuit board (200) and is opposite to the first sound guide hole (211), and the second sound guide hole (212) is communicated with the first through hole.
2. The electronic device according to claim 1, wherein the housing (100) is provided with a jack (110), and a wall of the jack (110) is provided with the first through hole.
3. The electronic device according to claim 2, wherein a USB socket is disposed in the insertion hole (110), the USB socket has a USB port, and a side wall of the USB port has the first through hole.
4. The electronic device of claim 3, wherein the first through hole communicates with the second sound guiding hole (212) through a sound guiding structure.
5. The electronic device of claim 4, wherein the sound guide structure is a hollow pin (112) of the USB socket.
6. The electronic device according to claim 5, wherein the second sound guiding hole (212) and the first sound guiding hole (211) are located on the same surface of the circuit board (200), or the second sound guiding hole (212) and the first sound guiding hole (211) are located on two opposite surfaces of the circuit board (200), respectively.
7. The electronic device according to claim 5, wherein a bonding pad (230) is disposed on a surface of the circuit board (200) where the second sound guiding hole (212) is located, the bonding pad (230) is distributed around the second sound guiding hole (212) along a circumferential direction of the second sound guiding hole (212), and one end of the hollow pin (112) is welded to the bonding pad (230).
8. The electronic device of claim 3, wherein the second sound guiding hole (212) and the first sound guiding hole (211) are respectively located on two surfaces adjacent to the circuit board (200), and the second sound guiding hole (212) faces the first through hole.
9. The electronic device of claim 8, wherein a sidewall of the USB interface where the first through hole is located is attached to a surface of the circuit board (200) where the second sound guide hole (212) is located, and the first through hole and the second sound guide hole (212) are opposite and communicated.
10. The electronic apparatus according to claim 2, wherein an inner wall of the insertion hole (110) is provided with a second through hole (111), one end of the second through hole (111) communicates with the first through hole, and the other end of the second through hole (111) communicates with the outside of the housing (100).
11. The electronic device according to any one of claims 1 to 10, wherein a conduit (220) is disposed in the sound guide channel (210), and the conduit (220) is a rigid structure.
12. The electronic device of any of claims 1-10, wherein the circuit board (200) is a multilayer circuit board comprising a first dielectric layer (201), a second dielectric layer (202), and a third dielectric layer (203), wherein a wiring layer (204) is disposed between the first dielectric layer (201) and the second dielectric layer (202), and between the second dielectric layer (202) and the third dielectric layer (203); the circuit layer (204) and the second dielectric layer (202) are provided with strip-shaped through holes distributed along the extension direction of the circuit board (200), and at least one of the first dielectric layer (201) and the third dielectric layer (203) is provided with through holes communicated with the strip-shaped through holes and forms the sound guide channel (210) with the strip-shaped through holes.
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| CN202010238587.5A CN111405415B (en) | 2020-03-30 | 2020-03-30 | Electronic device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112738674A (en) * | 2020-12-29 | 2021-04-30 | Oppo（重庆）智能科技有限公司 | Electronic device |
| CN117135243A (en) * | 2023-02-13 | 2023-11-28 | 荣耀终端有限公司 | Electronic equipment |
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| CN112738674A (en) * | 2020-12-29 | 2021-04-30 | Oppo（重庆）智能科技有限公司 | Electronic device |
| CN117135243A (en) * | 2023-02-13 | 2023-11-28 | 荣耀终端有限公司 | Electronic equipment |
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| Publication number | Publication date |
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| CN111405415B (en) | 2021-12-21 |
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