CN111403622A - O L ED display panel, manufacturing method thereof and display device - Google Patents

O L ED display panel, manufacturing method thereof and display device Download PDF

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Publication number
CN111403622A
CN111403622A CN202010221923.5A CN202010221923A CN111403622A CN 111403622 A CN111403622 A CN 111403622A CN 202010221923 A CN202010221923 A CN 202010221923A CN 111403622 A CN111403622 A CN 111403622A
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CN
China
Prior art keywords
cover plate
display panel
conductive spacer
display
packaging cover
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Granted
Application number
CN202010221923.5A
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Chinese (zh)
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CN111403622B (en
Inventor
齐永莲
曲连杰
张珊
赵合彬
尤杨
吕振华
石广东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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Priority to CN202010221923.5A priority Critical patent/CN111403622B/en
Publication of CN111403622A publication Critical patent/CN111403622A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/824Cathodes combined with auxiliary electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/828Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The invention provides an O L ED display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display, wherein the O L ED display panel comprises an O L ED display substrate and a packaging cover plate which is arranged opposite to the O L ED display substrate, a plurality of conductive spacers which are arranged in an array mode are arranged on the packaging cover plate, and a light-transmitting cathode of the O L ED display substrate is in contact with the conductive spacers.

Description

O L ED display panel, manufacturing method thereof and display device
Technical Field
The invention relates to the technical field of display, in particular to an O L ED display panel, a manufacturing method thereof and a display device.
Background
Currently, small-sized top-emitting AMO L ED (Active-matrix organic light-emitting diode) panels have been commercialized successfully and have gained most of the market share in mobile phone brands, and large-sized, e.g., 55 inches or more, bottom-emitting O L ED panels also occupy the television market.
Disclosure of Invention
The technical problem to be solved by the invention is to provide an O L ED display panel, a manufacturing method thereof and a display device, wherein the IR drop of the O L ED display panel can be reduced, and the electrical performance of the O L ED display panel can be improved.
To solve the above technical problem, embodiments of the present invention provide the following technical solutions:
in one aspect, an O L ED display panel is provided, which includes an O L ED display substrate and a package cover plate disposed opposite to the O L ED display substrate, wherein a plurality of conductive spacers are disposed on the package cover plate, and a light-transmissive cathode of the O L ED display substrate is in contact with the conductive spacers.
In some embodiments, the O L ED display panel further comprises:
the planar auxiliary electrode is positioned on the packaging cover plate, is positioned on one side of the conductive spacer facing the packaging cover plate, and is integrated with the conductive spacer.
In some embodiments, the O L ED display panel further comprises:
the auxiliary electrode is positioned on the packaging cover plate and is positioned between the conductive spacer and the packaging cover plate, and the orthographic projection of the auxiliary electrode on the packaging cover plate is positioned in the orthographic projection of the conductive spacer on the packaging cover plate.
In some embodiments, the conductive spacer includes a photoresist and nano-metal particles doped in the photoresist.
In some embodiments, the mass percentage of the nano-metal particles in the photoresist is 5% -20%.
In some embodiments, the diameter of the nano-metal particles is 20nm to 200 nm.
In some embodiments, the photoinitiator in the photoresist is present in an amount of no less than 5% by weight.
Embodiments of the present invention also provide a display device including the O L ED display panel as described above.
The embodiment of the invention also provides a manufacturing method of the O L ED display panel, which comprises the following steps:
providing a packaging cover plate;
forming a plurality of conductive spacers arranged in an array on the package cover plate;
the package cover plate was boxed with an O L ED display substrate such that the conductive spacer was in contact with the cathode of the O L ED display substrate.
In some embodiments, the method specifically comprises:
forming the conductive spacer and a planar auxiliary electrode positioned on one side of the conductive spacer, which faces the packaging cover plate, by a one-time composition process; or
Before the conductive spacer is formed, an auxiliary electrode is formed on the packaging cover plate, and the orthographic projection of the auxiliary electrode on the packaging cover plate is positioned in the orthographic projection of the conductive spacer on the packaging cover plate.
The embodiment of the invention has the following beneficial effects:
in the scheme, the plurality of conductive spacers are arranged on the packaging cover plate in an array mode, the light-transmitting cathode of the O L ED display substrate is in contact with the conductive spacers, so that the parallel connection with the cathode is realized through the conductive spacers, the resistance of the cathode can be reduced, the IR drop on the cathode is reduced, and the electrical performance of the O L ED display panel is improved.
Drawings
FIG. 1 is a schematic diagram of a top emission O L ED display panel;
FIGS. 2 and 3 are schematic diagrams illustrating the addition of nano-metal particles to a photoresist solution according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an embodiment of the present invention for coating a conductive spacer material on a package cover plate;
FIG. 5 is a schematic view of a layer of conductive spacer material exposed according to an embodiment of the present invention;
FIG. 6 is a schematic view of forming a conductive spacer according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of an O L ED display panel according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of an O L ED display panel according to another embodiment of the present invention.
Reference numerals
1 substrate
2 pixel definition layer
3 Anode
4 luminescent layer
5 cathode
6 packaging cover plate
7 auxiliary cathode
8 spacer
11 nano metal particles
12 Photoresist solution
13 Container
14 packaging cover plate
15 layer of conductive spacer material
16 mask plate
161 light transmitting area
162 opaque region
171 auxiliary electrode
172 conductive spacer
18 auxiliary electrode
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the embodiments of the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic structural diagram of a top emission O L ED display panel, the top emission O L ED display panel includes an O L ED display substrate and an encapsulation cover plate disposed opposite to the O L ED display substrate, the O L ED display substrate includes a substrate 1, a pixel defining layer 2 on the substrate 1, an anode 3, a light emitting layer 4 and a cathode 5, wherein the cathode 5 is a light-transmitting cathode, and an auxiliary cathode 7 may be formed on the encapsulation cover plate 6 to reduce a voltage Drop of the cathode 5, and the auxiliary cathode 7 is connected in parallel with the cathode 5, so as to reduce a resistance of the cathode 5 and further reduce an IR Drop on the cathode 5, but a special patterning process is required to fabricate the auxiliary cathode 7, which increases a complexity of a fabrication process of the O L ED display panel, and the auxiliary cathode 7 is a planar electrode and affects a transmittance of the O L ED display panel, wherein 8 is a non-conductive spacer, and the substrate 1 includes a substrate and a thin film transistor circuit on the substrate.
An embodiment of the present invention provides an O L ED display panel, as shown in fig. 7 and 8, including an O L ED display substrate and a package cover plate disposed opposite to the O L ED display substrate, where the O L ED display substrate includes a substrate 1, a pixel defining layer 2 on the substrate 1, an anode 3, a light emitting layer 4, and a cathode 5, where the cathode 5 is a light-transmitting cathode, the package cover plate 14 is disposed with a plurality of conductive spacers 172 arranged in an array, and the light-transmitting cathode 5 of the O L ED display substrate is in contact with the conductive spacers 172.
In the embodiment, the plurality of conductive spacers are arranged on the packaging cover plate in an array mode, the light-transmitting cathode of the O L ED display substrate is in contact with the conductive spacers, so that the parallel connection with the cathode is realized through the conductive spacers, the resistance of the cathode can be reduced, the IR drop on the cathode is reduced, the stability of display current is maintained, and the electrical performance of the O L ED display panel is improved.
In some embodiments, as shown in fig. 7, the O L ED display panel further comprises:
the auxiliary electrode 171 and the conductive spacer 172 are integrated, so that the auxiliary electrode 171 and the conductive spacer 172 can be simultaneously formed through one-time composition process, an additional process for manufacturing the auxiliary electrode is not needed, the manufacturing process of an O L ED display panel is simplified, the cost of the O L ED display panel is reduced, in addition, the auxiliary electrode 172 is planar, the area is large, and the resistance of the cathode 5 can be effectively reduced.
In some other embodiments, as shown in fig. 8, the O L ED display panel further includes:
an auxiliary electrode 18 located on the package cover 14, the auxiliary electrode 18 being located between the conductive spacer 172 and the package cover 14, an orthographic projection of the auxiliary electrode 18 on the package cover 14 being located within an orthographic projection of the conductive spacer 172 on the package cover 14.
The auxiliary electrode 18 can be made of metal, the auxiliary electrode 18 can be formed firstly, then the conductive spacer 172 is formed, the auxiliary electrode 18 is electrically connected with the cathode 5 through the conductive spacer 172, the resistance of the cathode 5 can be effectively reduced, and the uniformity of the brightness of the O L ED display panel is improved.
In some embodiments, the conductive spacer includes a photoresist and nano-metal particles doped in the photoresist. The mass percentage of the nano metal particles in the photoresist can be 5% -20%, and the diameter of the nano metal particles can be 20nm-200 nm.
In some embodiments, the photoinitiator in the photoresist is present in an amount of no less than 5% by weight.
Embodiments of the present invention also provide a display device including the O L ED display panel as described above.
The display device includes but is not limited to: radio frequency unit, network module, audio output unit, input unit, sensor, display unit, user input unit, interface unit, memory, processor, and power supply. It will be appreciated by those skilled in the art that the above described configuration of the display device does not constitute a limitation of the display device, and that the display device may comprise more or less of the components described above, or some components may be combined, or a different arrangement of components. In the embodiment of the present invention, the display device includes, but is not limited to, a display, a mobile phone, a tablet computer, a television, a wearable electronic device, a navigation display device, and the like.
The display device may be: the display device comprises a television, a display, a digital photo frame, a mobile phone, a tablet personal computer and any other product or component with a display function, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
The embodiment of the invention also provides a manufacturing method of the O L ED display panel, which comprises the following steps:
providing a packaging cover plate;
forming a plurality of conductive spacers arranged in an array on the package cover plate;
the package cover plate was boxed with an O L ED display substrate such that the conductive spacer was in contact with the cathode of the O L ED display substrate.
In the embodiment, the plurality of conductive spacers are arranged on the packaging cover plate in an array mode, the light-transmitting cathode of the O L ED display substrate is in contact with the conductive spacers, so that the parallel connection with the cathode is realized through the conductive spacers, the resistance of the cathode can be reduced, the IR drop on the cathode is reduced, and the electrical performance of the O L ED display panel is improved.
In some embodiments, the conductive spacer may be made of photoresist and nano metal particles doped in the photoresist. The mass percentage of the nano metal particles in the photoresist can be 5% -20%, and the diameter of the nano metal particles can be 20nm-200 nm.
In one embodiment, a method for manufacturing an O L ED display panel includes:
step 1, as shown in fig. 2 and 3, adding 5% -20% of nano metal particles 11 into a photoresist solution 12 contained in a container 13, and fully dispersing in a dispersion grinder to ensure that the nano metal particles 11 are fully dispersed in the photoresist solution 12, wherein the diameter of the nano metal particles 11 can be 20nm-200 nm;
because the exposure effect of the photoresist is affected by adding the nano metal particles 11, the proportion of the photoinitiator in the photoresist can be adjusted according to the concentration of the nano metal particles 11, for example, the proportion of the photoinitiator can be increased from 3% to about 5%, so that the photoresist can be fully exposed in the subsequent exposure process;
step 2, as shown in fig. 4, coating the uniformly mixed photoresist solution on the packaging cover plate 14 to form a conductive spacer material layer 15;
step 3, as shown in fig. 5, exposing the conductive spacer material layer 15 by using a mask 16, wherein the mask 16 comprises a light-transmitting region 161 and a partial light-transmitting region 162, and the light transmittance of the partial light-transmitting region 162 is smaller than that of the light-transmitting region 161;
the conductive spacer material layer 15 in different areas can have different exposure through the mask 16, and the conductive spacer 172 area corresponds to the light-transmitting area 161 for full exposure.
Step 4, as shown in fig. 6, after developing, forming a conductive spacer 172 and an auxiliary electrode 171 integrated with the conductive spacer 172;
the height of the conductive spacer 172 may be about 10um, and the thickness of the auxiliary electrode 171 may be 2-5 um.
Step 5, as shown in fig. 7, the O L ED display substrate and the cover plate 14 are aligned to each other, so that the conductive spacers 172 are fully contacted with the cathode 5 to form a parallel connection, thereby reducing the resistance of the cathode.
In another embodiment, a method for manufacturing an O L ED display panel includes:
step 1, as shown in fig. 8, forming an auxiliary electrode 18 on the package cover plate 14;
the auxiliary electrode 18 may be made of metal;
step 2, as shown in fig. 2 and 3, adding 5% -20% of the nano metal particles 11 into the photoresist solution 12 contained in the container 13, and fully dispersing in a dispersion grinder to ensure that the nano metal particles 11 are fully dispersed in the photoresist solution 12, wherein the diameter of the nano metal particles 11 can be 20nm-200 nm;
because the exposure effect of the photoresist is affected by adding the nano metal particles 11, the proportion of the photoinitiator in the photoresist can be adjusted according to the concentration of the nano metal particles 11, for example, the proportion of the photoinitiator can be increased from 3% to about 5%, so that the photoresist can be fully exposed in the subsequent exposure process;
step 3, coating the uniformly mixed photoresist solution on the packaging cover plate to form a conductive spacer material layer;
step 4, exposing the conductive spacer material layer by using a mask plate, wherein the mask plate comprises a light-transmitting area and a light-proof area;
step 5, after development, forming a conductive spacer 172 corresponding to the light-transmitting area, wherein the conductive spacer 172 covers the auxiliary electrode 18;
step 6, as shown in fig. 8, the O L ED display substrate and the cover plate 14 are aligned to each other, so that the conductive spacers 172 and the cathode 5 are fully contacted to form a parallel connection, thereby reducing the resistance of the cathode.
In this embodiment, a gray mask is not required for exposure, a common mask is used to make the conductive spacer, the auxiliary electrode 18 is connected with the cathode 5 through the conductive spacer 172, the cathode has low resistance after being connected in parallel, and the O L ED display panel has good brightness uniformity
In the embodiments of the methods of the present invention, the sequence numbers of the steps are not used to limit the sequence of the steps, and for those skilled in the art, the sequence of the steps is not changed without creative efforts.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the embodiments, since they are substantially similar to the product embodiments, the description is simple, and the relevant points can be referred to the partial description of the product embodiments.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (10)

1. An O L ED display panel, comprising an O L ED display substrate and a package cover plate arranged opposite to the O L ED display substrate, wherein the package cover plate is provided with a plurality of conductive spacers arranged in an array, and a light-transmitting cathode of the O L ED display substrate is in contact with the conductive spacers.
2. The O L ED display panel of claim 1, wherein the O L ED display panel further comprises:
the planar auxiliary electrode is positioned on the packaging cover plate, is positioned on one side of the conductive spacer facing the packaging cover plate, and is integrated with the conductive spacer.
3. The O L ED display panel of claim 1, wherein the O L ED display panel further comprises:
the auxiliary electrode is positioned on the packaging cover plate and is positioned between the conductive spacer and the packaging cover plate, and the orthographic projection of the auxiliary electrode on the packaging cover plate is positioned in the orthographic projection of the conductive spacer on the packaging cover plate.
4. The O L ED display panel according to any one of claims 1-3, wherein the conductive spacers comprise a photoresist and nano-metal particles doped in the photoresist.
5. The O L ED display panel according to claim 4, wherein the nano-metal particles are 5-20% by mass in the photoresist.
6. The O L ED display panel of claim 4, wherein the diameter of the nano-metal particles is 20nm-200 nm.
7. The O L ED display panel according to claim 4, wherein the photo-initiator is present in the photoresist in an amount of not less than 5% by mass.
8. A display device comprising the O L ED display panel of any one of claims 1-7.
9. A method for manufacturing an O L ED display panel is characterized by comprising the following steps:
providing a packaging cover plate;
forming a plurality of conductive spacers arranged in an array on the package cover plate;
the package cover plate was boxed with an O L ED display substrate such that the conductive spacer was in contact with the cathode of the O L ED display substrate.
10. The method for manufacturing the O L ED display panel according to claim 9, comprising:
forming the conductive spacer and a planar auxiliary electrode positioned on one side of the conductive spacer, which faces the packaging cover plate, by a one-time composition process; or
Before the conductive spacer is formed, an auxiliary electrode is formed on the packaging cover plate, and the orthographic projection of the auxiliary electrode on the packaging cover plate is positioned in the orthographic projection of the conductive spacer on the packaging cover plate.
CN202010221923.5A 2020-03-26 2020-03-26 OLED display panel, manufacturing method thereof and display device Active CN111403622B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US20080218066A1 (en) * 2007-03-08 2008-09-11 Samsung Electronics Co., Ltd. Organic light emitting diode display device and method of manufacturing the same
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CN106803547A (en) * 2017-02-15 2017-06-06 深圳市华星光电技术有限公司 The preparation method and structure of top-emitting OLED display device
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