CN111403448A

CN111403448A - O L ED display device

Info

Publication number: CN111403448A
Application number: CN202010217524.1A
Authority: CN
Inventors: 李远航
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2020-03-25
Filing date: 2020-03-25
Publication date: 2020-07-10

Abstract

The application discloses O L ED display device, including TFT array substrate, O L ED device layer and encapsulation rete, O L ED device layer sets up on TFT array substrate, the encapsulation rete sets up on TFT array substrate and O L ED device layer, wherein, the encapsulation rete includes an organic packaging layer, anti blue light nanoparticle has in the organic packaging layer the O L ED display device that this application embodiment provided adds anti blue light nanoparticle in packaging structure for O L ED screen has anti blue light function and need not paste anti blue light protection film outward, further makes O L ED display screen more protect the eye, has more product competitiveness.

Description

O L ED display device

Technical Field

The application relates to the technical field of display, in particular to an O L ED display device.

Background

In the information age, people use portable products such as smart phones, tablets, electronic paper books and computers very commonly, however, multiple medical researches prove that a lot of eye diseases have a direct relation with the time for watching the portable electronic products such as the mobile phones, and especially the blue light emitted by the display terminal has great harm to the eyes. The blue light is used as a part of visible light, has a wavelength range of 400-500 nm, and has extremely high energy. With the widespread use of electronic products such as computers, mobile phones and tablets, unnatural light mainly based on blue light can cause irreversible damage to human eyes, which causes the problems of dryness, fatigue, lacrimation, myopia acceleration, macular diseases and the like.

More importantly, with the development of flexible O L ED (Organic light Emitting Diode) screens, the requirement on screen thickness reduction is higher and higher, the thickness of the externally-attached blue light prevention protective film is generally 500 mu m, the bending resistance is poorer, the external-attached protective film can cause the reduction of optical properties such as transmittance contrast and the like, the external-attached protective film obviously does not conform to the development trend of flexible O L ED panels, and the user experience is influenced.

In summary, in the conventional O L ED display device, the external blue-light-proof protective film is used to prevent the human eyes from being damaged by the blue light generated by the O L ED display device, and the thickness of the O L ED screen is increased, so that the O L ED display device has poor bending resistance, and user experience is further affected.

Disclosure of Invention

The embodiment of the application provides an O L ED display device, can make O L ED screen have anti blue light function and need not paste outer anti blue light protection film, with solve current O L ED display device, because adopt outer subsides to prevent the blue light protection film and avoid the injury that the blue light that O L ED display device produced led to the people's eye, the thickness of O L ED screen has been increased, lead to O L ED display device's resistant bending performance relatively poor, user experience's technical problem has further been influenced.

The embodiment of the application provides an O L ED display device, including TFT array substrate, O L ED device layer and encapsulation rete, O L ED device layer sets up on the TFT array substrate, the encapsulation rete sets up on TFT array substrate and O L ED device layer;

the packaging film layer comprises an organic packaging layer, and the organic packaging layer is provided with blue-light-resistant nano-particles.

In some embodiments, the anti-blue light nanoparticle includes an inside-out coated nanometal oxide, a light absorber, and an organic protective layer.

In some embodiments, the weight ratio of the nanometal oxide, the light absorber, and the organic protective layer is 1: (0.2-0.5): (0.5 to 1).

In some embodiments, the nano-metal oxide has a particle diameter in the range of 5 to 15 nanometers.

In some embodiments, the light absorber has a thickness in a range between 5 and 10 nanometers.

In some embodiments, the organic protective layer has a thickness in a range between 5 and 15 nanometers.

In some embodiments, the nano metal oxide is any one of indium oxide, tin oxide, zirconium dioxide, titanium oxide, holmium oxide, antimony trioxide and antimony pentoxide.

In some embodiments, the material of the organic protective layer is any one of acrylic resin, epoxy resin, and cellulose organic ester.

In some embodiments, the encapsulation film further includes a first inorganic layer disposed on the TFT array substrate and the O L ED device layer, and a second inorganic layer disposed on the organic encapsulation layer, wherein the first inorganic layer is made of any one of silicon nitride, silicon oxide, aluminum oxide, and silicon carbide, and the second inorganic layer is made of the same material as the first inorganic layer.

In some embodiments, the organic encapsulation layer is formed on the first inorganic layer by an inkjet printing process.

The O L ED display device that the embodiment of this application provided adds anti blue light nanoparticle in packaging structure for O L ED screen has anti blue light function and need not paste anti blue light protection film outward, further makes O L ED display screen more eyeshield, has more product competitiveness.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic cross-sectional structure diagram of an O L ED display device according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural diagram of a composite particle of a blue light resistant nanoparticle provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

This application embodiment is directed at current O L ED display device, owing to adopt outer subsides to prevent the injury that blue light protection film avoided O L ED display device to produce caused to the human eye, has increased the thickness of O L ED screen, and it is relatively poor to lead to O L ED display device's resistant bending performance, has further influenced user experience's technical problem, and this defect can be solved to this embodiment.

As shown in fig. 1, a schematic cross-sectional structure diagram of an O L ED display device provided in the embodiments of the present application, the O L ED display device includes a TFT array substrate 10, an O L ED device layer 20, and an encapsulation film layer 30, the O L ED device layer 20 is disposed on the TFT array substrate 10, and the encapsulation film layer 30 is disposed on the TFT array substrate 10 and the O L ED device layer 20;

the encapsulation film layer 30 includes a first inorganic layer 31, an organic encapsulation layer 32, and a second inorganic layer 33 stacked from bottom to top, where the organic encapsulation layer 32 has blue-light-resistant nanoparticles therein.

Specifically, the TFT array substrate 10 includes a flexible substrate 11, a blocking layer 12 disposed on the flexible substrate 11, a buffer layer 13 disposed on the blocking layer 12, an active layer 14 disposed on the buffer layer 13, a first gate insulating layer 15 disposed on the buffer layer 13 and covering the active layer 14, a first gate metal layer 17 disposed on the first gate insulating layer 15, a second gate insulating layer 16 disposed on the first gate insulating layer 15 and covering the first gate metal layer 17, a second gate metal layer 18 disposed on the second gate insulating layer 16, an interlayer insulating layer 19 disposed on the second gate insulating layer 16 and covering the second gate metal layer 18, a source/drain metal layer 110 disposed on the interlayer insulating layer 19, a planarization layer 111 disposed on the interlayer insulating layer 19 and covering the source/drain metal layer 110, and a gate electrode layer 17 disposed on the interlayer insulating layer, A pixel defining layer 112 disposed on the planarization layer 111 and a pixel supporting layer 113 disposed on the pixel defining layer 112; the source and drain metal layers 110 are in communication with the active layer 14 through vias.

Preferably, the material of the flexible substrate 11 is polyimide.

Preferably, the barrier layer 12 and the buffer layer 13 may be silicon nitride and silicon dioxide, and the barrier layer 12 and the buffer layer 13 serve to isolate the flexible substrate 11 and the active layer 14.

Preferably, the active layer 14 is a polysilicon layer, and the active layer 14 further includes a source heavily doped region and a drain heavily doped region respectively located at two outer sides.

Preferably, the first gate insulating layer 15 and the second gate insulating layer 16 serve as an interface between the active layer 14 and the first gate metal layer 17 or the second gate metal layer 18 to isolate the active layer 14 from a gate, and the first gate insulating layer 15 and the second gate insulating layer 16 may be silicon nitride or a layer of silicon nitride and a layer of silicon dioxide.

Preferably, the first gate metal layer 17 and the second gate metal layer 18 are made of aluminum or an aluminum alloy.

Preferably, the interlayer insulating layer 19 may be one layer or two layers; when the interlayer insulating layer 19 is a layer, this layer may be silicon oxide, silicon nitride, or aluminum oxide; when the interlayer insulating layer 19 is formed of two layers, the first layer is a silicon oxide film, and a second layer of silicon nitride is added to the silicon oxide film in order to improve the film quality.

Preferably, the source/drain metal layer 110 is made of copper or copper-aluminum alloy.

Preferably, the planarization layer 111 may be formed of resin.

Preferably, the pixel defining layer 112 may adopt an organic insulating material including, but not limited to, a polysiloxane-based material, an acrylic-based material, or a polyimide-based material, and the pixel defining layer 112 includes a retaining wall and an opening structure defined by the retaining wall.

Specifically, the O L ED device layer 20 includes an anode metal layer 21, an O L ED light emitting layer 22, and a cathode metal layer 23, where the anode metal layer 21 is disposed on the planarization layer 111 and is connected to the source/drain metal layer 110 through another via hole, the O L ED light emitting layer 22 is disposed on the anode metal layer 21 and is located in an opening structure inside the pixel defining layer 112, the cathode metal layer 23 is disposed on the O L ED light emitting layer 22, and two end boundaries of the cathode metal layer 23 are adjacent to the pixel supporting layer 113.

Specifically, the material of the anode metal layer 21 is a transparent conductive metal oxide, and preferably, the material of the anode metal layer 21 is Indium Tin Oxide (ITO).

Specifically, the O L ED light emitting layer 22 includes a plurality of red O L ED, green O L ED and blue O L ED arranged in an array.

Specifically, the cathode metal layer 23 is made of one or more of indium zinc oxide, indium tin oxide, and zinc oxide.

Specifically, the encapsulation film layer 30 is disposed on the TFT array substrate 10 and the O L ED device layer 20, the encapsulation film layer 30 includes a first inorganic layer 31, an organic encapsulation layer 32, and a second inorganic layer 33 stacked from bottom to top, and the organic encapsulation layer 33 has blue-light resistant nanoparticles therein.

Specifically, the first inorganic layer 31 is formed on the surface of the pixel defining layer 112 by a chemical vapor deposition method, the first inorganic layer 31 completely covers the pixel supporting layer 113 and the cathode metal layer 23, the material of the first inorganic layer 31 is any one of silicon nitride, silicon oxide, aluminum oxide and silicon carbide, and the first inorganic layer 31 is used for effectively preventing H2O/O2 from invading and effectively prolonging the service life of the O L ED screen.

Specifically, the organic encapsulation layer 32 is disposed on the surface of the first inorganic layer 31 by an inkjet printing process, the material of the organic encapsulation layer 32 is preferably acrylic resin, epoxy resin, silicone, and other resins and silicone-based organic compounds, and the main function of the organic encapsulation layer 32 is to encapsulate the O L ED device layer 20 and reduce damage to the O L ED structure and reduce internal stress between films.

Specifically, the second inorganic layer 33 is formed on the surface of the organic encapsulation layer 32 by a chemical vapor deposition method, the material of the second inorganic layer 33 is any one of silicon nitride, silicon oxide, aluminum oxide and silicon carbide, and the second inorganic layer 33 is used for effectively preventing the invasion of H2O/O2 and effectively prolonging the service life of the O L ED screen.

Fig. 2 is a schematic structural diagram of a composite particle of blue light resistant nanoparticles provided in the embodiments of the present application. The anti-blue light nanoparticles 40 are located within the organic encapsulation layer 32.

Specifically, the blue light resistant nanoparticle 40 includes an inside-out coated nano metal oxide 41, a light absorber 42, and an organic protective layer 43.

Specifically, the weight ratio of the nanometal oxide 41, the light absorber 42, and the organic protective layer 43 is 1: (0.2-0.5): (0.5 to 1).

Preferably, the diameter of the nano metal oxide 41 is in the range of 5 to 15 nm, and the nano metal oxide 41 is made of any one of indium oxide, tin oxide, zirconium dioxide, titanium sesquioxide, holmium sesquioxide, antimony trioxide and antimony pentoxide.

The thickness of the light absorbing agent 42 is preferably in the range of 5 to 10 nm, the light absorbing agent 42 is selected according to the wavelength range of the light emitted from the O L ED light-emitting layer 22, the light absorbing agent 42 can effectively absorb part of the violet light and the blue light emitted from the O L ED light-emitting layer 22, and the material of the light absorbing agent 42 can be salicylates, benzophenones, benzotriazoles, substituted propenoates, triazines and hindered amines.

Preferably, the thickness of the organic protection layer 43 ranges from 5 nm to 15 nm, and the material of the organic protection layer 43 is any one of acrylic resin, epoxy resin and organic cellulose ester.

The O L ED display device that this application embodiment provided organic packaging layer 32 is doped after anti blue light nanoparticle 40, the spectral range of separation expands to the blue light spectral region from the ultraviolet spectral region, under the condition that keeps high transmissivity, has the performance of distinguishing the absorption to different wave band blue light, and it can effectively make the transmissivity of wavelength 400nm ~ 450nm blue light be less than 40%, produces better blue light prevention effect.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The O L ED display device provided in the embodiments of the present application is described in detail above, and the principles and embodiments of the present application are explained herein by using specific examples, and the above description of the embodiments is only used to help understand the technical solutions and the core ideas of the present application, and it should be understood by those skilled in the art that the embodiments described in the foregoing embodiments may be modified or some technical features may be equivalently replaced, and the modifications or the replacements may not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An O L ED display device, comprising:

a TFT array substrate;

an O L ED device layer disposed on the TFT array substrate;

the packaging film layer is arranged on the TFT array substrate and the O L ED device layer;

2. The O L ED display device according to claim 1, wherein the anti-blue light nanoparticles comprise an inside-out coated nano metal oxide, a light absorber, and an organic protective layer.

3. The O L ED display device according to claim 2, wherein the weight ratio of the nano metal oxide, the light absorber and the organic protection layer is 1 (0.2-0.5) to (0.5-1).

4. The O L ED display device according to claim 2, wherein the nano metal oxide particles have a diameter in the range of 5 to 15 nm.

5. The O L ED display device according to claim 2, wherein the light absorber has a thickness in the range of 5 to 10 nanometers.

6. The O L ED display device according to claim 2, wherein the organic protective layer has a thickness in the range of 5 to 15 nm.

7. The O L ED display device according to claim 2, wherein the nano-metal oxide is any one of indium oxide, tin oxide, zirconium dioxide, titanium sesquioxide, holmium sesquioxide, antimony trioxide and antimony pentoxide.

8. The O L ED display device according to claim 2, wherein the organic protective layer is made of any one of acrylic resin, epoxy resin and organic cellulose ester.

9. The O L ED display device of claim 1, wherein the encapsulation film further comprises a first inorganic layer disposed on the TFT array substrate and the O L ED device layer, and a second inorganic layer disposed on the organic encapsulation layer, wherein the first inorganic layer is made of any one of silicon nitride, silicon oxide, aluminum oxide, and silicon carbide, and the second inorganic layer is made of the same material as the first inorganic layer.

10. The O L ED display device according to claim 1, wherein the organic encapsulation layer is formed on the first inorganic layer by an inkjet printing process.