CN111399607B - Server case and movable perforated separation blade heat dissipation structure thereof - Google Patents
Server case and movable perforated separation blade heat dissipation structure thereof Download PDFInfo
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- CN111399607B CN111399607B CN202010152746.XA CN202010152746A CN111399607B CN 111399607 B CN111399607 B CN 111399607B CN 202010152746 A CN202010152746 A CN 202010152746A CN 111399607 B CN111399607 B CN 111399607B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 72
- 238000000926 separation method Methods 0.000 title claims description 8
- 230000007246 mechanism Effects 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 230000004888 barrier function Effects 0.000 claims description 7
- 230000004323 axial length Effects 0.000 claims description 3
- 230000008602 contraction Effects 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 230000033001 locomotion Effects 0.000 abstract description 10
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 10
- 230000005855 radiation Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000009975 flexible effect Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a movable perforated baffle heat dissipation structure, which comprises a baffle substrate, a movable through hole formed in the surface of the baffle substrate, a movable barrel telescopically arranged in the movable through hole, and a fixing and locking mechanism arranged on the surface of the baffle substrate and used for fixing the movable barrel at the current telescopic position, wherein a plurality of heat dissipation through holes with preset diameters are formed in the axial end face of the movable barrel. According to the movable perforated baffle plate heat dissipation structure provided by the invention, the server is ensured to have enough heat dissipation performance through the heat dissipation through holes formed in the movable barrel, and meanwhile, the distance between each heat dissipation through hole and the board card component is adjusted through the telescopic motion of the movable barrel in the movable through hole, so that the movable perforated baffle plate heat dissipation structure can easily meet the safety standard requirement, and the diameter of the heat dissipation through hole does not need to be changed. The invention also discloses a server case, which has the beneficial effects as described above.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a movable radiating structure with an open-pore baffle. The invention also relates to a server chassis.
Background
With the development of the electronic technology in China, more and more electronic devices have been widely used.
Servers are important components in electronic devices, and are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server is divided into a file server, a database server, an application server, a WEB server and the like according to different service types provided by the server. The main components of the server include a processor, a hard disk, a memory, a system bus, etc., similar to a general computer architecture.
In the big data era, a large number of IT devices are centrally located in a data center. These data centers include various types of servers, storage, switches, and a large number of cabinets and other infrastructure. Each type of IT equipment is composed of various hardware boards, such as a computing module, a memory module, a chassis, a fan module, and the like.
With the increasing performance of servers, high power consumption and high power servers are becoming the mainstream of the server market. While the performance of the server is concerned, the safety requirements of the product are higher and higher. Safety regulations mainly consider several aspects of the product: electrical safety, fire safety, mechanical safety, etc. With the beginning of popularization and execution of a new safety standard (EN62368), the diameter of a fireproof opening hole in a certain distance (15mm) around a board card component cannot exceed 3mm, so that flame can be effectively prevented from spreading outwards from a server.
However, in the prior art, the fireproof holes formed in the blocking plates on the server chassis have a diameter of generally 5mm in order to meet the requirement of heat dissipation, and cannot meet the requirement of safety standards. However, if the diameter of the fireproof hole is directly changed from 5mm to 3mm, the heat dissipation area is too small, the heat dissipation performance is insufficient, and the heat dissipation performance of the server is greatly affected. Experimental data shows that after the aperture of the fireproof hole is changed, the highest temperature of components such as a CPU (central processing unit) can be as high as nearly 90 degrees, performance is very easy to reduce, and even the risk of breakdown exists.
Therefore, how to meet the requirement of safety standards on the diameter of the fireproof hole of the board card component within a certain distance on the basis of ensuring that the heat dissipation performance of the server is not reduced is a technical problem faced by technical personnel in the field.
Disclosure of Invention
The invention aims to provide a movable perforated baffle heat dissipation structure which can meet the requirement of safety standards on the diameter of a fireproof hole of a board card component within a certain distance on the basis of ensuring that the heat dissipation performance of a server is not reduced. Another object of the present invention is to provide a server chassis.
In order to solve the technical problem, the invention provides a movable perforated baffle heat dissipation structure, which comprises a baffle substrate, a movable through hole formed in the surface of the baffle substrate, a movable barrel telescopically arranged in the movable through hole, and a fixing and locking mechanism arranged on the surface of the baffle substrate and used for fixing the movable barrel at the current telescopic position, wherein a plurality of heat dissipation through holes with preset diameters are formed in the axial end face of the movable barrel.
Preferably, the movable through hole is a rectangular through hole, and the cross section of the movable cylinder is rectangular and has the same shape as the surface of the movable through hole.
Preferably, the telescopic direction of the movable cylinder is perpendicular to the surface of the baffle base plate.
Preferably, the axial length of the movable cylinder is greater than 15 mm.
Preferably, each heat dissipation through hole is a round hole, and the diameter of the heat dissipation through hole is 3-5 mm.
Preferably, a plurality of clamping grooves are formed in the side wall of the movable barrel body along the axial direction, and the fixing and locking mechanism is matched and fixed with the corresponding clamping grooves in the clamping mode of the movable barrel body.
Preferably, the locking mechanism comprises a clamping mounting seat which is arranged on the surface of the baffle plate substrate and is positioned at the side edge of the movable through hole, and a buckle which is arranged on the clamping mounting seat in a turnable manner and is used for forming clamping fit with the clamping groove.
Preferably, the rear end of the side wall of the movable cylinder is provided with a stop piece which is used for abutting against the back surface of the stop piece base plate to limit the maximum extending length of the stop piece base plate.
Preferably, the front end of the side wall of the movable cylinder body is provided with a buckle slot which is convenient for grasping and applying force to push and pull axially.
The invention also provides a server case, which comprises a case body and a movable perforated separation blade heat dissipation structure arranged on the case body, wherein the movable perforated separation blade heat dissipation structure is specifically the movable perforated separation blade heat dissipation structure.
The invention provides a movable perforated baffle heat dissipation structure which mainly comprises a baffle substrate, a movable cylinder and a fixing and locking mechanism. The baffle base plate is a main body structure of the baffle heat dissipation structure, is generally detachably arranged on a box body of the server case, and is mainly used for providing protection and reinforcement for the box body. A movable through hole is formed in the surface of the baffle plate substrate, and the movable cylinder is arranged in the movable through hole and can perform telescopic motion in the movable through hole. Meanwhile, the axial end face (namely the outer end face) of the movable cylinder body is provided with heat dissipation through holes with preset diameters, so that the heat dissipation performance of the server is met through the heat dissipation through holes. The locking mechanism is arranged on the surface of the baffle base plate and is mainly used for fixing the movable barrel at the current telescopic position. So, if the distance of each heat dissipation through-hole of seting up on the activity barrel and the integrated circuit board components and parts of server machine incasement is located ann's rule standard, and when the diameter of heat dissipation through-hole was greater than ann's rule standard requirement, only need the activity barrel of stretching out in the activity through-hole, will move about the barrel and outwards stretch out certain distance, drive each heat dissipation through-hole and outwards remove certain distance for each heat dissipation through-hole and integrated circuit board components and parts's distance is in ann rule standard distance range outside can. Therefore, the movable perforated baffle plate heat dissipation structure provided by the invention ensures that the server has enough heat dissipation performance through the heat dissipation through holes arranged on the movable barrel, and simultaneously adjusts the distance between each heat dissipation through hole and the board card component through the telescopic motion of the movable barrel in the movable through hole, so that the movable perforated baffle plate heat dissipation structure easily meets the safety standard requirement and does not need to change the diameter of the heat dissipation through hole.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
Fig. 2 is a back view of fig. 1.
Fig. 3 is a schematic view of the side wall structure of the movable cylinder shown in fig. 1.
Fig. 4 is a detailed structural schematic diagram of the locking mechanism shown in fig. 1.
Wherein, in fig. 1-4:
a baffle base plate-1, a movable cylinder-2 and a locking mechanism-3;
the heat dissipation structure comprises a movable through hole-101, a heat dissipation through hole-201, a clamping groove-202, a stopping sheet-203, a handle groove-204, a clamping mounting seat-301 and a clamping buckle-302.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention, and fig. 2 is a back view of fig. 1.
In an embodiment of the present invention, the movable perforated barrier heat dissipation structure mainly includes a barrier substrate 1, a movable cylinder 2 and a locking mechanism 3.
The baffle substrate 1 is a main structure of the baffle heat dissipation structure, is generally detachably arranged on a box body of a server case, and is mainly used for providing protection and reinforcement for the box body.
A movable through hole 101 is opened on the surface of the baffle substrate 1, and the movable cylinder 2 is disposed in the movable through hole 101 and can perform telescopic movement in the movable through hole 101. Meanwhile, heat dissipation through holes 201 of a preset diameter are formed in an axial end face (i.e., an outer end face) of the movable cylinder 2, so that heat dissipation performance of the server is satisfied by the respective heat dissipation through holes 201. The locking mechanism 3 is arranged on the surface of the baffle base plate 1 and is mainly used for fixing the movable cylinder 2 at the current telescopic position.
So, if the distance of each heat dissipation through-hole 201 that sets up on the activity barrel 2 and the integrated circuit board components and parts in the server machine incasement is located ann's rule standard, and when the diameter of heat dissipation through-hole 201 was greater than ann's rule standard requirement, only need flexible barrel 2 in activity through-hole 101, outwards stretch out certain distance with activity barrel 2, drive each heat dissipation through-hole 201 and outwards remove certain distance for each heat dissipation through-hole 201 and integrated circuit board components and parts's distance is outside ann's rule standard distance range can.
Therefore, the movable perforated separation blade heat radiation structure provided by the embodiment guarantees that the server has enough heat radiation performance through each heat radiation through hole 201 arranged on the movable barrel 2, and simultaneously adjusts the distance between each heat radiation through hole 201 and the board card component through the telescopic motion of the movable barrel 2 in the movable through hole 101, so that the movable perforated separation blade heat radiation structure easily meets the requirement of safety standard, and the diameter of the heat radiation through hole 201 does not need to be changed.
In a preferred embodiment of the baffle substrate 1, the baffle substrate 1 may be a rectangular plate, and the thickness thereof is thin, and may be 2 to 3 mm. Meanwhile, the movable through-hole 101 may be specifically formed at the center position of the flap substrate 1, and may be a generally rectangular through-hole. Accordingly, the cross-sectional shape of the movable cylinder 2 is a rectangular shape, i.e., a rectangular cylinder, which is the same as the surface shape of the movable through-hole 101, and thus, it is ensured that the movable cylinder 2 smoothly performs telescopic movement in the movable through-hole 101. Of course, the shape of the movable through hole 101 is not fixed, and may be circular or the like, and the movable cylinder 2 may be cylindrical or the like.
In a preferred embodiment of the movable cylinder 2, the telescopic direction of the movable cylinder 2 in the movable through hole 101 may be perpendicular to the surface of the baffle substrate 1, that is, along the axial direction, so that the distance between the movable cylinder 2 and the board components can be adjusted with maximized efficiency when the movable cylinder 2 performs telescopic motion.
Meanwhile, considering the safety standard requirement, in this embodiment, the axial length of the movable cylinder 2 is greater than 15mm, which is equivalent to that the maximum telescopic distance of the movable cylinder 2 is 15mm, and the distance value is the limit distance in the safety standard requirement, so that the safety standard requirement can be still guaranteed to be satisfied under the condition that the distance between the heat dissipation through hole 201 and the board card component is the minimum value (namely zero).
In a preferred embodiment with respect to the heat dissipating through-holes 201, each heat dissipating through-hole 201 may be embodied as a circular hole, which may facilitate the determination and adjustment of the diameter. Of course, each heat dissipating through hole 201 may also be rectangular or hexagonal, and the size of the aperture may be determined according to the circumscribed circle. Generally, the aperture size of each heat dissipation through hole 201 is between 3mm and 5mm, and in order to improve the heat dissipation performance of the server as much as possible, the maximum value of each heat dissipation through hole 201, that is, 5mm, can be selected.
As shown in fig. 3, fig. 3 is a schematic side wall structure view of the movable cylinder 2 shown in fig. 1.
For the convenience solid locking mechanism 3 is fixed with flexible activity barrel 2 after stretching out and drawing back, a plurality of joint groove 202 has been seted up along axial direction on the lateral wall of activity barrel 2 to this embodiment, should solid locking mechanism 3 specifically be connected with the lateral wall joint of activity barrel 2 through the joint cooperation between certain joint groove 202 that corresponds simultaneously, and then fix activity barrel 2 at current position and flexible length. Of course, after the locking mechanism 3 is unlocked, the locking mechanism 3 is released from the clamping with the clamping groove 202, and the movable barrel 2 can continue to perform the telescopic motion.
As described above, each of the engaging grooves 202 may be formed from the front end of the side wall of the movable cylinder 2 to the rear end along the axial direction, and the distance between two adjacent engaging grooves 202 may be fixed, so that the engaging grooves 202 are uniformly arranged along the axial direction. Preferably, but interval 1mm between two adjacent joint grooves 202, so set up, when the concertina movement through activity barrel 2 and the interval of adjustment heat dissipation through-hole 201 and integrated circuit board components and parts, can adjust step by step for the unit precision by 1mm, until interval between them satisfies ann's rule standard requirement.
Meanwhile, when the movable cylinder 2 is a rectangular cylinder, it has four side walls, so that a clamping groove 202 can be formed on each side wall or on a part of the side walls, and accordingly, the number and the arrangement positions of the locking mechanisms 3 are changed synchronously. Certainly, for the operation of the operator, the clamping groove 202 may be formed in only one of the side walls of the movable cylinder 2, and meanwhile, the locking mechanism 3 may be formed only by arranging one blocking piece substrate 1, so that the operator can complete the clamping unlocking operation between the movable cylinder 2 and the locking mechanism 3 with one hand, and complete the push-pull telescopic operation of the movable cylinder 2 with one hand (the other hand).
Further, in order to facilitate the operator to perform the push-pull telescopic operation on the movable barrel 2, a handle fastening groove 204 is formed at the front end of the side wall of the movable barrel 2 in this embodiment. Specifically, the handle groove 204 can be grasped by fingers of an operator, so that friction is improved, and the operator can conveniently pull out or push the movable barrel 2 into the movable through hole 101 by applying force after buckling the movable barrel.
In addition, in order to prevent the movable cylinder 2 from falling from the movable through hole 101 due to excessive force or the like when the worker pushes and pulls the telescopic movable cylinder 2, the stopper piece 203 is provided at the rear end position of the side wall of the movable cylinder 2 in the present embodiment. Specifically, the stopping piece 203 is mainly used for abutting against the back surface of the baffle base plate 1, so as to limit the movable cylinder 2 to continue moving outwards, and further prevent the movable cylinder 2 from falling off when the movable cylinder 2 extends outwards.
As shown in fig. 4, fig. 4 is a specific structural schematic diagram of the locking mechanism 3 shown in fig. 1.
In a preferred embodiment with respect to the locking mechanism 3, the locking mechanism 3 mainly comprises a snap mount 301 and a snap 302. The clamping mounting seat 301 is disposed on the surface of the baffle substrate 1 and is mainly used for mounting the buckle 302, and the buckle 302 is mainly used for forming clamping fit with the clamping groove 202. In order to facilitate the clamping fit or unlocking between the buckle 302 and the clamping groove 202, the clamping mounting seat 301 may be specifically disposed at a side position of the movable through hole 101, so as to be adjacent to the side wall of the movable cylinder 2. The latch 302 is reversibly provided on the latch mount 301, and is mainly used for engaging and disengaging with the latch groove 202 by its tilting movement. Generally, in a natural state, the buckle 302 is kept in clamping fit with the clamping groove 202 under the action of elastic force, and after the buckle 302 is subjected to force operation from an operator through button pressing and the like, the buckle is turned over and separated from the clamping groove 202, so that unlocking is realized.
The present embodiment further provides a server chassis, which mainly includes a box body and a movable perforated barrier heat dissipation structure disposed on the box body, wherein the specific content of the movable perforated barrier heat dissipation structure is the same as the related content, and is not described herein again.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and features disclosed herein.
Claims (8)
1. A movable perforated baffle heat dissipation structure is characterized by comprising a baffle substrate (1), a movable through hole (101) arranged on the surface of the baffle substrate (1), and a movable barrel (2) telescopically arranged in the movable through hole (101), and a fixing and locking mechanism (3) which is arranged on the surface of the baffle base plate (1) and is used for fixing the movable cylinder (2) at the current telescopic position, a plurality of heat dissipation through holes (201) with preset diameters are arranged on the axial end surface of the movable cylinder body (2), when the distance between each heat dissipation through hole (201) and the board card component in the box body is within the safety standard distance and the diameter of each heat dissipation through hole (201) is larger than the safety standard diameter, the movable cylinder (2) is extended outwards for a certain distance in the movable through hole (101), enabling the distance between each heat dissipation through hole (201) and the board card component to be outside the safety standard distance;
a plurality of clamping grooves (202) are axially formed in the side wall of the movable barrel (2), and the fixed locking mechanism (3) is used for fixing the movable barrel (2) through clamping matching with the corresponding clamping grooves (202);
the locking mechanism (3) comprises a clamping mounting seat (301) which is arranged on the surface of the separation blade substrate (1) and is positioned at the side edge of the movable through hole (101), and a clamping buckle (302) which is arranged on the clamping mounting seat (301) in a turnover mode and is used for forming clamping fit with the clamping groove (202).
2. The movable perforated baffle heat dissipation structure of claim 1, wherein the movable through hole (101) is a rectangular through hole, and the cross-sectional shape of the movable cylinder (2) is a rectangle identical to the surface shape of the movable through hole (101).
3. The movable perforated baffle heat dissipation structure of claim 2, wherein the expansion and contraction direction of the movable cylinder (2) is perpendicular to the surface of the baffle substrate (1).
4. The movable perforated baffle heat dissipation structure according to claim 3, wherein the axial length of the movable cylinder (2) is greater than 15 mm.
5. The movable perforated baffle plate heat dissipation structure of claim 4, wherein each of the heat dissipation through holes (201) is a circular hole with a diameter of 3-5 mm.
6. The movable perforated baffle heat dissipation structure of claim 1, wherein the rear end of the side wall of the movable cylinder (2) is provided with a stop piece (203) for abutting against the back surface of the baffle base plate (1) to limit the maximum extension length thereof.
7. The movable perforated baffle heat dissipation structure according to claim 6, wherein the front end of the side wall of the movable cylinder (2) is provided with a buckle slot (204) for facilitating grasping and force application for axial pushing and pulling.
8. A server case, comprising a case body and a movable perforated barrier heat dissipation structure disposed on the case body, wherein the movable perforated barrier heat dissipation structure is the movable perforated barrier heat dissipation structure according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010152746.XA CN111399607B (en) | 2020-03-06 | 2020-03-06 | Server case and movable perforated separation blade heat dissipation structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010152746.XA CN111399607B (en) | 2020-03-06 | 2020-03-06 | Server case and movable perforated separation blade heat dissipation structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111399607A CN111399607A (en) | 2020-07-10 |
| CN111399607B true CN111399607B (en) | 2021-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010152746.XA Active CN111399607B (en) | 2020-03-06 | 2020-03-06 | Server case and movable perforated separation blade heat dissipation structure thereof |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4089098B2 (en) * | 1999-08-18 | 2008-05-21 | 横河電機株式会社 | Printed circuit board cooling structure |
| CN1220926C (en) * | 2002-08-02 | 2005-09-28 | 纬创资通股份有限公司 | Radiator |
| US9690338B2 (en) * | 2015-02-10 | 2017-06-27 | ScienBiziP Consulting(Shenzhen)Co., Ltd. | Electronic device with cooling facility |
| CN205608643U (en) * | 2016-05-10 | 2016-09-28 | 绥化学院 | Heat dissipation formula computer machine case |
| CN208781144U (en) * | 2018-09-20 | 2019-04-23 | 贵州浪潮英信科技有限公司 | A kind of environment-friendly type facilitates the machine box for server of heat dissipation |
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