CN111393797A - Preparation method of epoxy resin premix for improving anti-settling performance of filler - Google Patents
Preparation method of epoxy resin premix for improving anti-settling performance of filler Download PDFInfo
- Publication number
- CN111393797A CN111393797A CN202010226293.0A CN202010226293A CN111393797A CN 111393797 A CN111393797 A CN 111393797A CN 202010226293 A CN202010226293 A CN 202010226293A CN 111393797 A CN111393797 A CN 111393797A
- Authority
- CN
- China
- Prior art keywords
- filler
- epoxy resin
- preparation
- resin premix
- improving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides a preparation method of an epoxy resin premix for improving the anti-settling performance of a filler, belonging to the technical field of epoxy resin materials. The preparation method of the epoxy resin premix for improving the anti-settling performance of the filler comprises the following steps: and adding the resin or the curing agent, the filler and the liquid silane coupling agent into the stirrer, and stirring to obtain the epoxy resin premix. The invention prepares the epoxy resin premix with good anti-settling performance of the filler by treating the surface of the filler.
Description
Technical Field
The invention belongs to the technical field of epoxy resin materials, and particularly relates to a preparation method of an epoxy resin premix for improving the anti-settling performance of a filler.
Background
The epoxy resin premix is usually prepared from a filler and resin or a curing agent, and the filler is easy to precipitate in the using process, so that the performance of an electric power product is greatly influenced. In the prior art, in order to improve the anti-settling performance of the filler, two methods are mainly adopted: one way is to improve the anti-settling performance of the filler by increasing the mesh number of the filler, but this way is easy to agglomerate, not easy to disperse and has high production cost; the other way is to increase the anti-settling property of the filler by increasing the adding amount of the filler, but the way can increase the viscosity of the premix, and the production process is not easy to control, thereby affecting the performance of the final product.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides the preparation method of the epoxy resin premix for improving the anti-settling performance of the filler, which can effectively improve the anti-settling performance of the filler, and has the advantages of simple operation and low cost.
In order to achieve the purpose, the invention adopts the following technical scheme:
a preparation method of an epoxy resin premix for improving the anti-settling performance of a filler comprises the following steps: and adding the resin or the curing agent, the filler and the liquid silane coupling agent into the stirrer, and stirring to obtain the epoxy resin premix.
Further, the resin is liquid bisphenol A epoxy resin.
Further, the curing agent is an anhydride curing agent.
Further, the filler is inorganic oxide powder or high molecular compound powder.
Further, the liquid silane coupling agent is liquid modified 3-glycidyl ether oxypropyl trimethoxy silane.
Furthermore, the mesh number of the filler is 10-5000 meshes.
Further, the ratio of the filler to the liquid silane coupling agent ranges from 100: 50-100: 0.001.
further, the stirring temperature is 10-200 deg.C, the pressure is 0-10 MPA, and the time is not less than 0.5 h.
Compared with the prior art, the invention has the beneficial effects that:
the preparation method of the epoxy resin premix for improving the anti-settling performance of the filler, provided by the invention, is simple to operate and low in cost; the surface of the filler is treated by the coupling agent, so that the hydrophilic surface of the filler can be converted into an organophilic surface, the wettability of the organic polymer to the filler can be improved, firm bonding can be realized with the polymer, the anti-settling performance of the filler can be effectively improved, and the epoxy resin premix with excellent performance can be prepared.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following detailed description is given with reference to specific embodiments.
Example 1:
1kg of liquid bisphenol A type epoxy resin, 1kg of 400-mesh silicon micropowder and 15g of liquid modified 3-glycidyl ether oxypropyl trimethoxy silane are added into a stirrer, and the mixture is stirred for 2 hours under the conditions that the pressure is 0.1MPA and the temperature is 10 ℃ to obtain the epoxy resin premix.
Example 2:
1kg of liquid bisphenol A type epoxy resin, 1kg of 400-mesh silicon micropowder and 15g of liquid modified 3-glycidyl ether oxypropyl trimethoxy silane are added into a stirrer, and the mixture is stirred for 2 hours under the conditions that the pressure is 0.1MPA and the temperature is 200 ℃ to obtain the epoxy resin premix.
Example 3:
1kg of liquid bisphenol A type epoxy resin, 1kg of 400-mesh silicon micropowder and 15g of liquid modified 3-glycidyl ether oxypropyl trimethoxy silane are added into a stirrer, and the mixture is stirred for 2 hours under the conditions of the pressure of 5MPA and the temperature of 85 ℃ to obtain the epoxy resin premix.
Example 4:
1kg of liquid bisphenol A type epoxy resin, 1kg of 400-mesh silicon micropowder and 15g of liquid modified 3-glycidyl ether oxypropyl trimethoxy silane are added into a stirrer, and the mixture is stirred for 2 hours under the conditions of the pressure of 10MPA and the temperature of 200 ℃ to obtain the epoxy resin premix.
Example 5:
1kg of liquid bisphenol A type epoxy resin, 1kg of 400-mesh silicon micropowder and 15g of liquid modified 3-glycidyl ether oxypropyl trimethoxy silane are added into a stirrer, and the mixture is stirred for 2 hours under the conditions of the pressure of 10MPA and the temperature of 10 ℃ to obtain the epoxy resin premix.
Example 6:
1kg of liquid bisphenol A type epoxy resin, 1kg of 400-mesh silicon micropowder and 500g of liquid modified 3-glycidyl ether oxypropyl trimethoxy silane are added into a stirrer, and the mixture is stirred for 2 hours under the conditions of the pressure of 5MPA and the temperature of 85 ℃ to obtain the epoxy resin premix.
The epoxy resin premixes prepared in examples 1 to 6 and the epoxy resin premixes prepared without adding the liquid modified 3-glycidoxypropyltrimethoxysilane were tested, the epoxy resin premixes were placed in glass containers under the test condition of the ambient temperature of 23 ℃. + -. 0.5 ℃, and then sealed, kept still, and the time for the bottom layer of the epoxy resin premixes to settle was recorded, and the obtained test data are shown in the following table:
the greater the time at which settling begins to occur, the better the resistance of the filler to settling. As can be seen from the test data table, the epoxy resin premixes prepared in examples 1 to 6 exhibited a long settling time and the anti-settling property of the filler was good.
The above embodiments are merely preferred embodiments of the present disclosure, which are not intended to limit the present disclosure, and any modifications, equivalents, improvements and the like, which are within the spirit and principle of the present disclosure, should be included in the scope of the present disclosure.
Claims (8)
1. A preparation method of an epoxy resin premix for improving the anti-settling performance of a filler is characterized by comprising the following steps: and adding the resin or the curing agent, the filler and the liquid silane coupling agent into the stirrer, and stirring to obtain the epoxy resin premix.
2. The preparation method of the epoxy resin premix for improving the anti-settling property of the filler, according to claim 1, is characterized in that: the resin is liquid bisphenol A epoxy resin.
3. The preparation method of the epoxy resin premix for improving the anti-settling property of the filler, according to claim 1, is characterized in that: the curing agent is an anhydride curing agent.
4. The preparation method of the epoxy resin premix for improving the anti-settling property of the filler, according to claim 1, is characterized in that: the filler is inorganic oxide powder or high molecular compound powder.
5. The preparation method of the epoxy resin premix for improving the anti-settling property of the filler, according to claim 1, is characterized in that: the liquid silane coupling agent is liquid modified 3-glycidyl ether oxypropyl trimethoxy silane.
6. The preparation method of the epoxy resin premix for improving the anti-settling property of the filler, according to claim 1, is characterized in that: the mesh number of the filler is 10-5000 meshes.
7. The preparation method of the epoxy resin premix for improving the anti-settling property of the filler, according to claim 1, is characterized in that: the ratio of the filler to the liquid silane coupling agent ranges from 100: 50-100: 0.001.
8. the preparation method of the epoxy resin premix for improving the anti-settling property of the filler, according to claim 1, is characterized in that: the stirring temperature is 10-200 deg.C, pressure is 0-10 MPA, and time is not less than 0.5 h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010226293.0A CN111393797A (en) | 2020-03-26 | 2020-03-26 | Preparation method of epoxy resin premix for improving anti-settling performance of filler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010226293.0A CN111393797A (en) | 2020-03-26 | 2020-03-26 | Preparation method of epoxy resin premix for improving anti-settling performance of filler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111393797A true CN111393797A (en) | 2020-07-10 |
Family
ID=71425845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010226293.0A Withdrawn CN111393797A (en) | 2020-03-26 | 2020-03-26 | Preparation method of epoxy resin premix for improving anti-settling performance of filler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111393797A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938279A (en) * | 2012-11-26 | 2013-02-20 | 浙江理工大学 | Preparation method of heat-resistant epoxy resin insulator |
| CN104531027A (en) * | 2015-01-21 | 2015-04-22 | 广州聚合电子材料有限公司 | Epoxy resin encapsulating material as well as preparation method and application thereof |
| CN104877612A (en) * | 2015-06-15 | 2015-09-02 | 南京工业大学 | Heat-conducting insulating adhesive and preparation method thereof |
-
2020
- 2020-03-26 CN CN202010226293.0A patent/CN111393797A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938279A (en) * | 2012-11-26 | 2013-02-20 | 浙江理工大学 | Preparation method of heat-resistant epoxy resin insulator |
| CN104531027A (en) * | 2015-01-21 | 2015-04-22 | 广州聚合电子材料有限公司 | Epoxy resin encapsulating material as well as preparation method and application thereof |
| CN104877612A (en) * | 2015-06-15 | 2015-09-02 | 南京工业大学 | Heat-conducting insulating adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111205597B (en) | High-performance epoxy resin and preparation method thereof | |
| CN109880569B (en) | Epoxy resin modified MS sealant | |
| CN103965590B (en) | Epoxy resin composite material of a kind of coordination plasticizing and preparation method thereof | |
| WO2018223780A1 (en) | Epoxy resin composite and preparation method and use thereof | |
| CN110317562B (en) | Organic silicon modified epoxy pouring sealant | |
| CN115404025B (en) | Polyhydroxy cyclic polymer/polysiloxane modified epoxy resin, and preparation method and application thereof | |
| CN109836557B (en) | Toughened hydrophobic epoxy resin and preparation method thereof | |
| CN113861645B (en) | Rapidly degradable antibacterial plastic film and preparation method thereof | |
| CN116554836B (en) | Lead-acid storage battery sealant and preparation method thereof | |
| CN111393797A (en) | Preparation method of epoxy resin premix for improving anti-settling performance of filler | |
| CN106047271B (en) | A kind of low dielectric cyanate ester adhesive and preparation method thereof | |
| CN112457808A (en) | Low-warpage high-adhesion liquid mold sealing adhesive for gallium nitride power device and preparation method | |
| CN109439252B (en) | Epoxy resin sealant and preparation method and application thereof | |
| CN114437657B (en) | Preparation method of high-strength metal epoxy AB glue | |
| CN111205800A (en) | High-temperature-resistant waterproof adhesive and preparation method thereof | |
| CN114773790A (en) | Graphene epoxy resin high polymer material and preparation method and application thereof | |
| CN110591292B (en) | Underfill adhesive with high surface insulation resistance and preparation method thereof | |
| CN112980368A (en) | Adhesive for underwater polymer grouting and production method thereof | |
| CN114940808B (en) | Recyclable epoxy resin Vitrimer material and preparation method thereof | |
| CN111334028A (en) | Anti-ultraviolet high-thermal-conductivity modified polyurethane composite film material and preparation method thereof | |
| CN113773611B (en) | Vacuum infusion epoxy resin composite material for wind power blade and preparation method thereof | |
| CN114250050B (en) | Epoxy resin composition, preparation thereof and application thereof in IGBT semiconductor packaging | |
| CN115124958B (en) | Matte high-temperature-resistant and damp-heat-resistant double-component epoxy compound and preparation method thereof | |
| CN114836160B (en) | Room-temperature fast-curing high-elasticity wide-temperature broadband MS/epoxy damping adhesive and preparation method thereof | |
| CN117965120B (en) | High-stability low-heat-release structural adhesive system material and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200710 |