Disclosure of Invention
In view of the above problems in the prior art, the present invention provides a method for laminating a thin film solar device that is not easily adhered, and a thin film solar device manufactured by using the method.
In order to achieve the above object, the present invention provides a method for laminating a thin film solar module, comprising:
the method comprises the following steps that a first anti-sticking layer, a solar module main body and a second anti-sticking layer are sequentially laid on a substrate to form a laminated structure, wherein the solar module main body comprises a flexible front plate, a first adhesive film layer, a photovoltaic chip, a second adhesive film layer and a flexible back plate which are sequentially arranged;
sealing the laminated structure in an enclosed space formed between the cover film and the substrate by the cover film;
and heating the solar component main body, and vacuumizing the closed space to press the film and the substrate on the solar component main body.
In some embodiments, the lamination method further comprises:
and laying a first air guide layer between the first anti-sticking layer and the solar assembly main body, and laying a second air guide layer between the solar assembly main body and the second anti-sticking layer.
In some embodiments, the sealing the laminated structure within the enclosed space formed between the cover film and the substrate by the cover film includes:
arranging an adhesive part on the periphery of the substrate;
and covering the laminated structure with the coating film, and bonding the coating film and the substrate through the adhesive part to form the closed space between the coating film and the substrate.
In some embodiments, before the heat treatment of the solar module main body, the method further comprises:
and carrying out pre-vacuum treatment on the closed space to fix the laminated structure.
In some embodiments, the enclosed space is subjected to a vacuum treatment to a vacuum degree of the enclosed space of-0.05 MPa to-0.15 MPa; and/or
The temperature for heating the solar component main body is 60-150 ℃; and/or
The time of the vacuum pumping treatment and the heating treatment is 10min to 30 min.
In some embodiments, the enclosed space is subjected to a vacuum treatment to a vacuum degree of-0.1 MPa; and/or
The temperature for heating the solar component main body is 80 ℃; and/or
The time of the vacuum pumping treatment and the heating treatment is 20 min.
In some embodiments, the substrate is a steel plate, an iron plate, an aluminum plate, or a glass plate; and/or
The first anti-sticking layer and the second anti-sticking layer are nylon cloth layers or fiber cloth layers; and/or
The laminated film is a nylon polyester film, a nylon film or a modified nylon film; and/or
The first air guide layer and the second air guide layer are polyester breathable felt, nylon breathable felt or fiber breathable felt.
In some embodiments, the adhesive portion is a pressure sensitive tape.
The embodiment of the invention also provides a thin film solar module prepared by adopting the laminating method.
In some embodiments, the flexible front sheet is selected from one of a fluorine-based resin film, a PET film, a PEN film, a PC film, and a PMMA film; and/or
The first adhesive film layer and the second adhesive film layer are selected from one of a POE adhesive film layer, a PVB adhesive film layer, an EVA adhesive film layer, a TPU adhesive film layer, a TPO adhesive film layer and an organic silicon adhesive film layer; and/or
The photovoltaic chip is a CIGS chip, a GaAs chip or a CdTe chip; and/or
The flexible back plate is selected from one of a fluorine resin film, a TPT film, a PET film, an aluminized PET film, a PEN film, a PC film and a PMMA film.
Compared with the prior art, according to the laminating method of the thin-film solar module, the first anti-sticking layer and the second anti-sticking layer are respectively arranged on the two sides of the solar module main body, so that the problem of sticking of the flexible front plate and the flexible back plate can be avoided during heating treatment and pressing treatment, bubbles between layers can be well eliminated due to the heating treatment and the pressing treatment under the vacuum condition, and the yield is high.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention.
This document provides an overview of various implementations or examples of the technology described in this disclosure, and is not a comprehensive disclosure of the full scope or all features of the disclosed technology.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
To maintain the following description of the embodiments of the present invention clear and concise, a detailed description of known functions and known components of the invention have been omitted.
Fig. 1 is a flowchart of a method for laminating a thin film solar module according to an embodiment of the present invention, and referring to fig. 1, the method for laminating a thin film solar module according to an embodiment of the present invention specifically includes the following steps:
s1, paving a first anti-sticking layer, a solar module main body and a second anti-sticking layer in sequence on the substrate to form a laminated structure, wherein the solar module main body comprises a flexible front plate, a first adhesive film layer, a photovoltaic chip, a second adhesive film layer and a flexible back plate which are arranged in sequence. The substrate is used for bearing the first anti-sticking layer, the solar assembly main body and the second anti-sticking layer.
And S2, sealing the laminated structure in a closed space formed between the coating film and the substrate through the coating film. That is, the cover film is covered on the laminated structure, and a closed space is formed between the cover film and the substrate to seal the laminated structure within the closed space.
And S3, heating the solar module main body, and vacuumizing the closed space to enable the film and the substrate to be pressed on the solar module main body.
Specifically, the solar module body may be subjected to a heating treatment in an oven, for example, that is, after the coating film is laid, the entire structure including the substrate, the laminated structure, and the coating film may be put in the oven and subjected to a heating treatment in the oven. Meanwhile, the closed space can be vacuumized through a vacuumizing device carried by an oven, so that the film and the substrate can be pressed on the solar component body under the action of atmospheric pressure, and the solar component body is pressed together. After the pressing treatment is completed, the solar component main body is taken out from between the first anti-sticking layer and the second anti-sticking layer after being cooled to normal temperature, and the solar component main body forms a thin film solar component.
According to the laminating method of the thin-film solar module, the first anti-sticking layer and the second anti-sticking layer are respectively arranged on the two sides of the solar module main body, so that the problem of sticking of the flexible front plate and the flexible back plate can be avoided during heating treatment and pressing treatment, bubbles between layers can be well eliminated due to the heating and pressing treatment under the vacuum condition, and the yield is high.
As shown in fig. 2, the laminating method may further include: and a first air guide layer is laid between the first anti-sticking layer and the solar assembly main body, and a second air guide layer is laid between the solar assembly main body and the second anti-sticking layer. Namely, a first anti-sticking layer, a first air guide layer, a solar component main body, a second air guide layer and a second anti-sticking layer are sequentially laid on the substrate. Through setting up first air guide layer and second air guide layer, when the evacuation was handled, the air in the enclosure space was derived more evenly, thoroughly to make pressfitting solar module main part that tectorial membrane and base plate can be even, and can avoid the bubble to appear between the layer of solar module main part. Specifically, the first air guide layer and the second air guide layer can be polyester breathable felt, nylon breathable felt or fiber breathable felt.
In some embodiments, prior to heat treating the solar module body, the lamination process may further comprise: the enclosed space is pre-vacuumed to fix the laminate structure. For example, before the substrate, the laminated structure and the structure composed of the film are placed in an oven, the enclosed space is pre-vacuumized by, for example, a vacuum pump, so that the film and the substrate can fix the laminated structure, and dislocation among layers of the laminated structure is avoided in the moving process of placing the laminated structure in the oven and the like.
In some embodiments, the substrate may be a steel plate, an iron plate, an aluminum plate, a glass plate, or other high temperature resistant sheet. Because the substrate is used for bearing the first anti-sticking layer, the solar assembly main body and the second anti-sticking layer, if the thickness of the substrate is too thin, the strength is lower, the supporting effect is poorer, if the thickness of the substrate is too thick, the heat conduction effect is poorer, so that the difference between the internal temperature of the solar assembly main body and the preset heating temperature is larger, and the thickness of the substrate can be 1mm to 10mm, preferably 2mm to 5mm, so that the substrate keeps moderate structural strength and heat conduction effect. The substrate has an area size at least sufficient to carry a solar module body and can be placed in a heating device such as an oven. Under the size requirement that can put into heating device is satisfied, also can be set up big enough to can bear the weight of the multichip solar energy component main part simultaneously, thereby can laminate the multichip solar energy component main part simultaneously, with improvement production efficiency, do not specifically limit to the area of base plate here.
In some embodiments, the first and second release layers may be nylon cloth layers or fiberglass cloth layers. Nylon cloth and glass fiber cloth are all high temperature resistant and all have better non-adhesion, are difficult to soften in the heating process, even when taking place to soften at flexible front bezel and flexible backplate, nylon cloth and glass fiber cloth are because of its non-adhesion, also are difficult to take place to glue with flexible front bezel and flexible backplate even, can effectively guarantee thin-film solar module's quality.
In some embodiments, step S2 may specifically include the following steps: s21, arranging an adhesive part on the periphery of the substrate; and S22, covering the laminated framework with the coating, and adhering the coating to the substrate through the adhesive part to form a closed space between the coating and the substrate.
Specifically, this sticky portion can be pressure sensitive tape, and pressure sensitive tape has better viscosity, can be in the same place the firm bonding of tectorial membrane and base plate, avoids gas leakage to appear in evacuation in-process closed space. In addition, the pressure-sensitive adhesive tape is high-temperature resistant, is not easy to soften in the heating treatment process, and can avoid air leakage of a closed space caused by softening of the pressure-sensitive adhesive tape in the heating process.
In the process of adhering the pressure-sensitive adhesive tape, an exhaust tube and a spiral vacuum tube can be adhered on the pressure-sensitive adhesive tape. The exhaust tube is used for being connected with a vacuum pump during pre-vacuum treatment, and the exhaust tube needs to be sealed after the pre-vacuum treatment is completed so as to avoid air leakage during the vacuum treatment. The spiral vacuum tube is used for connecting with a vacuumizing device such as an oven for self-carrying during vacuumizing treatment so as to vacuumize the closed space through the spiral vacuum tube.
The film may be nylon polyester film, nylon film or modified nylon film. The nylon polyester film, the nylon film or the modified nylon film has higher high temperature resistance, can still keep stable at higher temperature, and avoids air leakage in the heating treatment process.
In some embodiments, the vacuum degree in the closed space can be controlled between-0.05 MPa and-0.15 MPa when the closed space is vacuumized; the temperature for heating the solar component main body can be controlled to be 60-150 ℃; the time of the vacuum treatment and the heating treatment is 10min to 30 min. Preferably, the vacuum degree of the closed space can be controlled to be-0.1 MPa when the closed space is vacuumized, the temperature for heating the solar module main body can be 80 ℃, and the time for vacuuming and heating can be 20 min. Under the conditions of the vacuum degree, the heating temperature and the time, the formed thin-film solar module is not easy to be adhered, the pressing effect is good, and the yield is high.
Fig. 3 is a schematic structural diagram of a thin film solar module according to an embodiment of the present invention, the thin film solar module according to the embodiment of the present invention is manufactured by applying the above-mentioned lamination method, and as shown in fig. 3, the thin film solar module includes a solar module main body, and the solar module main body includes a flexible front plate 1, a first adhesive film layer 2, a photovoltaic chip 3, a second adhesive film layer 4, and a flexible back plate 5, which are sequentially laid.
Because the lamination method is not easy to generate adhesion, bubbles are not easy to generate between layers of the thin-film solar module prepared by the lamination method, the phenomenon of uneven surface caused by adhesion is not easy to generate, and the yield is high.
In some embodiments, the flexible front plate 1 may be selected from one of a fluorine-based resin film, a PET film, a PEN film, a PC film, and a PMMA film, and the present embodiment employs a fluorine-based resin film including ethylene-tetrafluoroethylene, polytetrafluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, polychlorotrifluoroethylene, tetrafluoroethylene-hexafluoropropylene, and tetrafluoroethylene-perfluoroalkyl vinyl ether. The fluorine resin film has the characteristics of excellent high and low temperature resistance, dielectric property, chemical stability, weather resistance, incombustibility, non-adhesiveness, low friction coefficient and the like, and the application of the fluorine resin film as the flexible front plate 1 can improve the durability and the service life of the thin film solar module.
In some embodiments, the first and second adhesive film layers 2 and 4 may be selected from one of a high polymer of ethylene and butylene (POE) adhesive film layer, a polyvinyl butyral (PVB) adhesive film layer, an Ethylene Vinyl Acetate (EVA) adhesive film layer, a polyurethane (TPU) adhesive film layer, a Thermoplastic Polyolefin (TPO) adhesive film layer, and a silicone adhesive film layer. What this embodiment adopted is POE glued membrane layer, and POE glued membrane layer's melting point is lower, uses it as the glued membrane layer, and required heat treatment temperature is lower, is difficult to cause flexible front bezel 1 and flexible backplate 5 to take place the adhesion.
In some embodiments, the photovoltaic chip 3 can be a Copper Indium Gallium Selenide (CIGS) chip, a gallium arsenide (GaAs) chip, or a cadmium telluride (CdTe) chip, with a CIGS chip being the choice in this embodiment.
In some embodiments, the flexible backsheet 5 may be selected from one of a fluorine-based resin film, a TPT film, a PET film, an aluminum-plated PET film, a PEN film, a PC film, and a PMMA film. In this embodiment, a TPT film is selected as the flexible backsheet 5.
The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more versions thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. In addition, in the above-described embodiments, various features may be grouped together to streamline the disclosure. This should not be interpreted as an intention that a disclosed feature not claimed is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the scope of the present invention is defined by the claims. Various modifications and equivalents may be made by those skilled in the art within the spirit and scope of the present invention, and such modifications and equivalents should also be considered as falling within the scope of the present invention.