CN111390167A - Laser material increase and laser micro-nano processing integrated device and method - Google Patents

Laser material increase and laser micro-nano processing integrated device and method Download PDF

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Publication number
CN111390167A
CN111390167A CN202010156197.3A CN202010156197A CN111390167A CN 111390167 A CN111390167 A CN 111390167A CN 202010156197 A CN202010156197 A CN 202010156197A CN 111390167 A CN111390167 A CN 111390167A
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laser
powder
micro
nano
scanning
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杨亮
吴文杰
马红林
范树迁
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Chongqing Institute of Green and Intelligent Technology of CAS
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Chongqing Institute of Green and Intelligent Technology of CAS
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/32—Process control of the atmosphere, e.g. composition or pressure in a building chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/50—Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/20—Cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
    • B22F12/43—Radiation means characterised by the type, e.g. laser or electron beam pulsed; frequency modulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/44—Radiation means characterised by the configuration of the radiation means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/44—Radiation means characterised by the configuration of the radiation means
    • B22F12/45—Two or more
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/49—Scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/70—Gas flow means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B1/00—Producing shaped prefabricated articles from the material
    • B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/141—Processes of additive manufacturing using only solid materials
    • B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/01—Other methods of shaping glass by progressive fusion or sintering of powdered glass onto a shaping substrate, i.e. accretion, e.g. plasma oxidation deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

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  • Plasma & Fusion (AREA)
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Abstract

The invention belongs to the field of 3D printing and fine machining and manufacturing, and particularly relates to a device and a method for integrating laser material increase and laser micro-nano machining. According to the invention, laser material increase and surface structuring treatment are simultaneously carried out on line, so that the problems of part forming and surface functionalization are integrally solved, and the working procedure is simplified; and the material increase and the micro-nano processing are carried out on a two-dimensional plane based on a layering technology, so that the whole processing process is in an open space and is not limited by a three-dimensional space of an entity. Furthermore, the coaxial dynamic focusing scanning system designed by the invention realizes that the additive manufacturing and the micro-nano processing are in the same coordinate system, can be accurately positioned and controlled, has better compatibility and is easy to regulate and control.

Description

Laser material increase and laser micro-nano processing integrated device and method
This application will likely serve as a priority basis for subsequent patent applications (including, but not limited to, chinese invention patent applications, chinese utility model applications, PCT applications, foreign applications based on the paris convention).
Technical Field
The invention belongs to the field of 3D printing and fine machining and manufacturing, and particularly relates to a device and a method for integrating laser material increase and laser micro-nano machining.
Background
Due to the unique advantages of the additive manufacturing in terms of complex structure and personalized manufacturing, the additive manufacturing attracts more and more attention in the fields of aerospace, biomedical treatment and the like. However, the main concern of the current additive manufacturing technology is the formation of parts, and it is difficult to consider the functions of the surfaces of the parts, such as: wetting properties, optical properties, electromagnetic properties. When special requirements are made on the surface functions of the parts, the parts are usually required to be subjected to special functionalization treatment in an off-line post-treatment mode after additive manufacturing is finished. But the technical problems of difficult accurate positioning, lower efficiency, complex process, higher cost and the like in the prior art are not solved.
Laser micro-nano processing is one of important methods for manufacturing functional surfaces, but the main object of processing is a real object-free surface, and the processing of the surface and the inner side of a complex structure is greatly difficult due to the limitation of space.
In order to solve the technical problems, the invention provides an innovative technical scheme by combining laser micro-nano processing into a layered manufacturing technology of additive manufacturing.
Disclosure of Invention
In view of this, an object of the present invention is to provide an integrated apparatus for laser additive manufacturing and laser micro-nano machining.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a laser additive manufacturing and laser micro-nano processing integrated device comprises a double-beam coaxial dynamic focusing scanning system, a gas control system, a powder laying system, a mechanical movement system, a laser selective melting system, a laser micro-nano processing system and a software control system;
the gas control system is used for vacuumizing a printer cavity of the integrated device and introducing protective gas; the powder paving system is used for paving powder materials in the printer cavity; the mechanical motion system controls the mechanical motion of other systems in the integrated device by controlling the lifting of the lifting table and the operation of the powder scraping device;
the double-beam coaxial dynamic focusing scanning system is used for regulating and controlling two beams of laser beams with different functions; the selective laser melting system comprises the double-beam coaxial dynamic focusing scanning system and a selective laser melting laser, and is used for layering and forming the powder material to obtain a formed part; the laser micro-nano processing system comprises the double-beam coaxial dynamic focusing scanning system and a laser for laser micro-nano processing and is used for processing the side wall and the surface of the formed part to form a preset patterned micro-nano structure;
the software control system is used for controlling the whole integrated process, including controlling the vacuumizing, introducing protective gas and monitoring the oxygen content; controlling the powder paving system to pave the powder material and the setting of the thickness of the powder material layer; controlling the planning of the preset scanning path of the selective laser melting system and the setting of scanning parameters; and controlling the preset structured patterns and the setting of processing parameters of the laser micro-nano processing system.
Furthermore, the double-beam coaxial dynamic focusing scanning system can focus the laser beams on the two optical paths after being respectively expanded by the beam expander and then by the dynamic focusing mirror, then the two laser beams are combined by the dichroic mirror, and finally the two laser beams are scanned by the two-dimensional scanning galvanometer.
Further, the selective laser melting system further comprises a first water cooler and a first optical assembly.
Further, the laser for selective laser melting is continuous laser or pulse laser with pulse width more than 1us, and the wavelength range of the laser for selective laser melting is 300nm-10.6 μm.
Further, the laser micro-nano processing system further comprises a second water cooling machine and a second optical assembly.
Further, the laser for laser micro-nano processing is a pulse laser with the pulse width of more than 1fs and less than 100ns, and the wavelength range of the laser for laser micro-nano processing is 13.5nm-1080 nm.
Further, the planning of the predetermined scanning path for selective laser melting and the setting of the scanning parameters comprise laser power, scanning speed and scanning interval for selective laser melting; the preset structured patterns and the processing parameters for the laser micro-nano processing comprise laser power, pulse width, pulse action time, speed and spacing for the laser micro-nano processing.
The invention also aims to provide a method for integrating laser additive manufacturing and laser micro-nano processing. In order to realize the purpose, the technical scheme is as follows:
a method for integrating laser additive manufacturing and laser micro-nano processing comprises the following steps:
s100, filling powder materials into a powder storage device, establishing a geometric model of the powder materials according to solid parts, slicing the geometric model to discretize the geometric model, and generating an ST L format file;
s102, planning a first scanning path for selective laser area melting or sintering and a second scanning path for laser micro-nano processing structured patterns according to the slicing result;
s104, vacuumizing the forming cavity, and then introducing protective gas;
s106, laying powder materials on the substrate in the forming cavity to form a powder layer;
s108, melting or sintering the powder material by utilizing a laser selective area, and scanning and forming the powder layer according to the first scanning path to obtain a primary formed part;
s110, carrying out single-layer side wall structuring treatment on the preliminarily formed part by using pulse laser according to the second scanning path, and carrying out structuring treatment on the surface of the whole preliminarily formed part on the top layer of the preliminarily formed part to enable the preliminarily formed part to obtain a surface function;
s112, reducing the thickness of a layer of powder on the basis of the powder layer, and repeating the steps S106-S110 until a completely formed part with a micro-nano structure on the side wall is obtained;
and S114, processing the laser micro-nano structure on the upper surface of the completely formed part according to the second scanning path by using the pulse laser.
The integration is based on layered manufacturing, and selective laser melting/sintering of powder forming and surface functionalized laser micro-nano processing are alternately carried out.
Further, the integration method is based on layered manufacturing, and the step S108 and the step S110 are performed alternately.
Further, the powder material is one or more of metal powder, plastic powder, polymer powder, ceramic powder and glass powder.
Further, the powder material is spherical particles with the diameter of 1-500 μm; the thickness of the laid powder material of step 106 is 20 μm to 1000 μm.
Further, the structure size of the laser micro-nano processing is 1nm-1000 μm; the surface functions include specific surface wetting properties, optical properties and/or electromagnetic properties.
Further, the surface wettability properties comprise (super) hydrophobic, (super) hydrophilic, (super) oleophobic, (super) oleophilic, hydrophobic oleophilic, hydrophilic oleophobic, hydrophobic oleophobic, hydrophilic oleophilic, anti-icing and/or anti-fogging properties; the optical properties include enhanced light absorption, reduced light reflection, structural color, and/or super-surface structural properties; the electromagnetic properties include electromagnetic absorption and/or electromagnetic shielding properties.
The invention has the beneficial effects
The technical scheme of the invention aims to develop a composite technology of laser additive manufacturing and laser micro-nano processing, and maximize respective advantages. Meanwhile, the integrated technology is beneficial to promoting the wider application of additive manufacturing and micro-nano processing technology. The method is mainly characterized in that: firstly, laser material increase and surface structuring are carried out on line simultaneously, so that the problems of part forming and surface functionalization are integrally solved, and the working procedures are simplified; secondly, in the composite manufacturing, the material adding and micro-nano processing are carried out on a two-dimensional plane based on a layering technology (as shown in fig. 2), the whole processing process is in an open space, the limitation of a solid three-dimensional space can be avoided, and the design and the operation are simple; thirdly, the coaxial dynamic focusing scanning system designed by the invention realizes that the additive manufacturing and the micro-nano processing are in the same coordinate system, and can carry out accurate positioning and control; fourthly, the coaxial dynamic focusing scanning system realizes that both additive manufacturing and micro-nano processing use laser, has better compatibility and is easy to regulate and control.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive exercise.
Fig. 1 is a flow chart of a method for integrating laser additive manufacturing and laser micro-nano processing.
Fig. 2 is a schematic diagram of an integrated process of laser additive manufacturing and laser micro-nano machining.
Fig. 3 is a schematic diagram of an integrated device for laser additive manufacturing and laser micro-nano machining.
Fig. 4 is a diagram showing the structure and performance of the surface of a printed material.
Summary of part names represented by the numbers in the drawings:
1. a laser for selective laser melting; 2. a first beam expander; 3. a first dynamic condenser; 4. a laser for laser micro-nano processing; 5. a second beam expander; 6. a second dynamic condenser; 7. a beam combining mirror; an X-Y scanning galvanometer; 9. a powder storage device; 10. a powder scraper; 11. a powder bed; 12. printing a workpiece; 13. a lifting platform; 14. an optical cavity; 15. vacuumizing the interface; 16. an inert gas inlet is formed; 17. a printing cavity; 18. and (4) a computer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The examples are given for the purpose of better illustration of the invention, but the invention is not limited to the examples. Therefore, those skilled in the art should make insubstantial modifications and adaptations to the embodiments of the present invention in light of the above teachings and remain within the scope of the invention.
Example 1
As shown in fig. 1. A laser additive manufacturing and laser micro-nano processing integrated method comprises the following steps:
(1) establishing a geometric model of the solid part according to the solid part, slicing and discretizing the geometric model to generate an ST L (STereo lithography) format file (S100);
(2) scanning strategies (including, for example, scanning paths) for laser melting/sintering of selected regions and strategies for laser micro-nano machining patterning are planned (S102).
(3) Vacuumizing the forming cavity (also called as a printing cavity) and then introducing protective gas (S104);
(4) spreading powder by using a powder spreading device (S106);
(5) scanning and forming the powder layer according to the scanning path planned in the step S102 by using selective laser melting/sintering to obtain a current forming layer (S108);
(6) processing the micro-nano structure on the side wall of the front forming layer by using pulse laser according to the patterning strategy planned in the step S102 (S110);
(7) reducing the thickness of a layer of powder by the lifting device, and repeating the steps S106-S110 until a three-dimensional solid part (namely a 'forming part') with a patterned micro-nano structure on the side wall is obtained;
(8) and (3) carrying out micro-nano structure processing on the upper surface of the formed part by using pulse laser.
As shown in fig. 2. The integration process is based on a layered forming technology and is finished by alternately performing (i) selective laser melting/sintering and (ii) functionalized surface laser micro-nano processing.
The powder is one or more mixed powder materials of metal powder plastic powder, polymer powder, ceramic powder and glass powder material; the powder is spherical particles with the diameter of 1-500 mu m; the thickness of the spread powder is 20-1000 μm
The laser micro-nano processing structure has the size of 1nm-1000 mu m, and the functions of the laser micro-nano processing structure comprise special surface wettability, optical performance and electromagnetic performance.
The surface wettability of the invention comprises (super) hydrophobicity, (super) hydrophilicity, (super) oleophobicity, (super) oleophilicity, hydrophobic oleophilicity, hydrophilic oleophobicity, hydrophobic oleophobicity, and hydrophilic oleophilicity; optical properties include light absorption, structural color, superstructure characterization; electromagnetic properties include electromagnetic absorption.
Example 2
As shown in fig. 3. A device combining laser additive manufacturing and laser micro-nano processing comprises a double-beam coaxial dynamic focusing scanning system (figures 3: 2, 3 and 5-8), a gas control system (figures 3:15 and 16), a powder laying system (figures 3:9-11), a mechanical movement system (figures 3:10 and 13), a laser selective area melting system (figures 3:1-3, 7 and 8), a laser micro-nano processing system (figures 3:4-8) and a software control system (figures 3: 18).
(1) A gas control system that evacuates the printing chamber 17 and introduces a protective gas (e.g., nitrogen);
(2) the powder laying system is used for laying powder;
(3) a mechanical motion system for controlling the lifting of the lifting table 13 and the operation of the scraper (which may also be called "powder scraper") 10;
(4) the double-beam coaxial dynamic focusing scanning system is used for focusing, combining and scanning two beams of laser beams with different functions;
(5) the selective laser melting/sintering system comprises a selective laser melting laser 1, a water cooling machine and an optical assembly, and is used for layering and forming powder materials;
(6) the laser micro-nano processing system comprises a laser 4 for laser micro-nano processing, a water cooling machine and an optical assembly, and is used for processing the surface of a material after the powder material is formed in a layered mode to form a preset patterned micro-nano structure;
(7) a software control system for controlling the whole composite processing process, including the steps of vacuumizing the printing cavity 17, introducing protective gas and monitoring the oxygen content; controlling the settings of the spread powder and the thickness of the powder layer; controlling the planning of the laser selection area to melt the predetermined scanning path and the setting of the scanning parameters (such as laser power, scanning speed and scanning distance); and controlling the setting of the preset structured pattern and processing parameters (such as laser power, pulse width, pulse acting time, speed and interval) of the laser micro-nano processing.
The double-beam coaxial dynamic focusing scanning system of the invention comprises: the laser on the two light paths is respectively expanded by beam expanding lenses (2 and 5) and then focused by dynamic focusing lenses (3 and 6), then two beams of laser are combined by a dichroic mirror, and finally scanning is realized by a two-dimensional scanning galvanometer 8 (namely an X-Y scanning galvanometer).
The laser 1 for selective laser melting/sintering is continuous laser or pulse laser with pulse width more than 1us, and the wavelength range is 300nm-10.6 μm; the laser 4 for laser micro-nano processing is a pulse laser with 1fs < pulse width <100 ns.
Example 3
With reference to fig. 1-3, in this embodiment, a method for integrating laser additive manufacturing and laser micro-nano processing is used to manufacture cylinders with a diameter of 15mm and a height of 5mm and different optical and surface wettability properties on the surface, and the specific steps are as follows:
firstly, spherical particle titanium powder with the diameter of 30-50 mu m is selected and filled into a powder storage device 9; establishing 4 cylinder models with the diameter of 15mm and the height of 5mm by using CAD software; slicing the models by using slicing software; planning a laser selective area melting path and a laser micro-nano processing path according to the segmentation result, and programming related programs to input into a computer software control system 18; then, vacuumizing the printer cavity 17 and introducing nitrogen to ensure that the oxygen content of the printer cavity 17 is lower than 0.1 percent; then, a powder scraping device 10 (also called as a "powder scraping knife" or a "powder scraper") is used for spreading powder on the substrate, wherein the thickness of the powder is 50 microns; then, the laser 1 for selective laser melting is started to perform selective powder forming, and the parameters are as follows: laser power 200W, spot size 95 μm, wavelength 1070nm, scanning speed 500mm/s, line spacing 120 μm. After laser forming is finished, starting a laser 4 for laser micro-nano processing to carry out structuring processing on a single-layer side wall according to a planned scanning strategy, wherein the parameters are set to be 50W in power, 10ns in pulse width, 200KHz in frequency, 45 mu m in spot size and 532nm in wavelength. After the laser micro-nano processing of the layer is finished, the lifting platform 13 is lowered by 50um and then powder is spread, and the operation is repeated until a complete three-dimensional solid part is obtained. And finally, processing micro grooves with different scales on the upper surface of the formed part by using pulse laser. Here, the line pitch of the micro grooves is 100 μm, 200 μm, and 300 μm, respectively. The surface structure of the final shaped article and its properties are shown in fig. 4, and the surface exhibits, for example, different structural colors and wettability (both of which are one of the functional surfaces).
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (13)

1. The integrated device for laser additive manufacturing and laser micro-nano machining is characterized by comprising a double-beam coaxial dynamic focusing scanning system, a gas control system, a powder laying system, a mechanical movement system, a laser selective melting system, a laser micro-nano machining system and a software control system;
the gas control system is used for vacuumizing a printer cavity of the integrated device and introducing protective gas; the powder paving system is used for paving powder materials in the printer cavity; the mechanical motion system controls the mechanical motion of other systems in the integrated device by controlling the lifting of the lifting table and the operation of the powder scraping device;
the double-beam coaxial dynamic focusing scanning system is used for regulating and controlling two beams of laser beams with different functions; the selective laser melting system comprises the double-beam coaxial dynamic focusing scanning system and a selective laser melting laser, and is used for layering and forming the powder material to obtain a formed part; the laser micro-nano processing system comprises the double-beam coaxial dynamic focusing scanning system and a laser for laser micro-nano processing and is used for processing the side wall and the surface of the formed part to form a preset patterned micro-nano structure;
the software control system is used for controlling the whole integrated process, including controlling the vacuumizing, introducing protective gas and monitoring the oxygen content; controlling the powder paving system to pave the powder material and the setting of the thickness of the powder material layer; controlling the planning of the preset scanning path of the selective laser melting system and the setting of scanning parameters; and controlling the preset structured patterns and the setting of processing parameters of the laser micro-nano processing system.
2. The device as claimed in claim 1, wherein the dual-beam coaxial dynamic focusing scanning system is capable of expanding the laser beams on the two optical paths through a beam expander and then focusing the expanded laser beams through a dynamic focusing lens, and then combining the two laser beams through a dichroic mirror and finally realizing scanning through a two-dimensional scanning galvanometer.
3. The apparatus of claim 1, wherein the selective laser melting system further comprises a first water cooler and a first optical assembly.
4. The apparatus according to claim 3, wherein the selective laser melting laser is a continuous laser or a pulse laser having a pulse width of more than 1us, and the wavelength of the selective laser melting laser is in a range of 300nm to 10.6 μm.
5. The apparatus of claim 1, wherein the laser micro-nano machining system further comprises a second water-cooled machine and a second optical assembly.
6. The device according to claim 5, wherein the laser for laser micro-nano machining is a pulse laser with a pulse width of more than 1fs and less than 100ns, and the wavelength range of the laser for laser micro-nano machining is 13.5nm-1080 nm.
7. The apparatus of claim 1, wherein the planning of the selective laser melting predetermined scan path and the setting of the scan parameters include laser power, scan speed and scan pitch for selective laser melting; the preset structured patterns and the processing parameters for the laser micro-nano processing comprise laser power, pulse width, pulse action time, speed and spacing for the laser micro-nano processing.
8. A method for integrating laser additive manufacturing and laser micro-nano machining is characterized by comprising the following steps:
s100, filling powder materials into a powder storage device, establishing a geometric model of the powder materials according to solid parts, slicing the geometric model to discretize the geometric model, and generating an ST L format file;
s102, planning a first scanning path for selective laser area melting or sintering and a second scanning path for laser micro-nano processing structured patterns according to the slicing result;
s104, vacuumizing the forming cavity, and then introducing protective gas;
s106, laying powder materials on the substrate in the forming cavity to form a powder layer;
s108, melting or sintering the powder material by utilizing a laser selective area, and scanning and forming the powder layer according to the first scanning path to obtain a primary formed part;
s110, carrying out single-layer side wall structuring treatment on the preliminarily formed part by using pulse laser according to the second scanning path, and carrying out structuring treatment on the surface of the whole preliminarily formed part on the top layer of the preliminarily formed part to enable the preliminarily formed part to obtain a surface function;
s112, reducing the thickness of a layer of powder on the basis of the powder layer, and repeating the steps S106-S110 until a completely formed part with a micro-nano structure on the side wall is obtained;
and S114, processing the laser micro-nano structure on the upper surface of the completely formed part according to the second scanning path by using the pulse laser.
9. The method of claim 8, wherein the integration method is based on a layered manufacturing, and the step S108 and the step S110 are alternately performed.
10. The method of claim 8, wherein the powder material is one or more of a metal powder, a plastic powder, a polymer powder, a ceramic powder, a glass powder.
11. The method of claim 10, wherein the powder material is spherical particles having a diameter of 1 μ ι η to 500 μ ι η; the thickness of the laid powder material of step 106 is 20 μm to 1000 μm.
12. The method of claim 8, wherein the laser micro-nano machining has a structural size of 1nm to 1000 μm; the surface functions include specific surface wetting properties, optical properties and/or electromagnetic properties.
13. The method of claim 12, wherein the surface wettability properties comprise (super) hydrophobic, (super) hydrophilic, (super) oleophobic, (super) oleophilic, hydrophobic oleophilic, hydrophilic oleophobic, hydrophobic oleophobic, hydrophilic oleophilic, anti-icing and/or anti-fogging properties; the optical properties include enhanced light absorption, reduced light reflection, structural color, and/or super-surface structural properties; the electromagnetic properties include electromagnetic absorption and/or electromagnetic shielding properties.
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