CN111384991B - Radio frequency device - Google Patents

Abstract

The application is entitled "apparatus with partitioned radio frequency antenna and matching network and related methods". An apparatus includes a Radio Frequency (RF) circuit for transmitting or receiving an RF signal. The apparatus also includes a loop antenna for transmitting or receiving RF signals. The apparatus also includes an impedance matching circuit coupled to the RF circuit and to the loop antenna. The impedance matching circuit includes lumped reactive components.

Description

Radio frequency device

Cross Reference to Related Applications

This patent application is a continuation-in-part of U.S. patent application Ser. No. 15/250,719 (filed 8/29/2016 entitled "Apparatus with Partitioned Radio Frequency Antenna Structure and Associated Methods", attorney docket No. SILA 381). Furthermore, the present patent application relates to U.S. patent application Ser. No. 16/237,511 (filed on date 31 at 12 of 2018, entitled "Apparatus for Antenna Impedance-Matching and Associated Methods", attorney docket No. SILA 411). The aforementioned patent application is incorporated by reference herein in its entirety for all purposes.

Technical Field

The present disclosure relates generally to Radio Frequency (RF) signal transmission/reception techniques, lines, systems, and related methods. More particularly, the present disclosure relates to RF devices having a sectorized antenna structure and matching network to provide improved features, and related methods.

Background

With the increasing expansion of wireless technologies, such as Wi-Fi, bluetooth, and mobile or wireless internet of things (IoT) devices, more and more devices or systems incorporate Radio Frequency (RF) lines, such as receivers and/or transmitters. To reduce the cost, size, and inventory of materials and increase the reliability of such devices or systems, various circuits or functions have been integrated into Integrated Circuits (ICs). For example, ICs typically include receiver and/or transmitter circuitry. Transmitters and receivers of various types and lines are used. The transmitter uses RF signals to send or transmit information via a medium (e.g., air). A receiver at another point or location receives the RF signal from the medium and then recovers the information.

In order to transmit or receive RF signals, a typical wireless device or apparatus uses an antenna. An RF module including a transmission/reception line is sometimes used. The exemplary RF module 5 shown in fig. 1 includes an RF circuit 6, a resonator 8, and a radiator 9. Typically, the resonator 8 and the radiator 9 are included in an RF module. In other words, the structure forming the resonator 8 and the radiator 9 is included in the RF module 5.

The description in this section and any corresponding figures are included as background information material. The materials in this section should not be considered as an admission that such materials constitute prior art to the present patent application.

Disclosure of Invention

According to one exemplary embodiment, various apparatuses and related methods are contemplated. According to one exemplary embodiment, an apparatus includes an RF circuit for transmitting or receiving an RF signal. The apparatus also includes a loop antenna for transmitting or receiving RF signals. The apparatus also includes an impedance matching circuit coupled to the RF circuit and the loop antenna. The impedance matching circuit includes lumped reactive components.

According to another exemplary embodiment, an apparatus includes a module and a substrate coupled to the module. The module includes an RF circuit for transmitting or receiving RF signals, and a first portion of a loop antenna for transmitting or receiving RF signals. The substrate includes a second portion of the loop antenna.

According to another exemplary embodiment, an apparatus includes a module and a substrate coupled to the module. The module includes an RF circuit for transmitting or receiving RF signals, and a portion of an impedance matching circuit coupled to the RF circuit. The substrate includes another portion of the impedance matching circuit.

Drawings

The drawings illustrate only exemplary embodiments and therefore should not be considered limiting of the scope of the application or the claims. Those of ordinary skill in the art will understand that the disclosed concepts lend themselves to other equally effective embodiments. In the drawings, the same reference numerals used in more than one drawing denote the same, similar or equivalent functions, components or blocks.

Fig. 1 illustrates a conventional RF module.

Fig. 2 shows a circuit arrangement for an RF device (or a part of an RF device) according to an exemplary embodiment.

Fig. 3 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 4 illustrates an RF device having a sectorized antenna structure, according to one exemplary embodiment.

Fig. 5 illustrates an RF device having a sectorized antenna structure according to another exemplary embodiment.

Fig. 6 illustrates an RF device having a sectorized antenna structure according to another exemplary embodiment.

Fig. 7 shows a flowchart of a process for making a module with a partitioned antenna structure, according to an example embodiment.

Fig. 8 shows a flowchart of a process of fabricating an RF device with a sectorized antenna structure, according to another example embodiment.

Fig. 9 illustrates an RF device having a sectorized antenna structure according to another exemplary embodiment.

Fig. 10 illustrates an RF device having a sectorized antenna structure according to another exemplary embodiment.

Fig. 11 shows a circuit arrangement for an RF device (or a part of an RF device) according to an exemplary embodiment.

Fig. 12 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 13 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 14 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 15 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 16 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 17 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 18 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 19 illustrates a layout for an RF device (or a portion of an RF device) according to one example embodiment.

Fig. 20 illustrates a layout for an RF device (or a portion of an RF device) according to one example embodiment.

Fig. 21 shows a flow chart of current in an RF device (or a portion of an RF device) according to one example embodiment.

Fig. 22 illustrates a layout for an RF device (or a portion of an RF device) according to one example embodiment.

Fig. 23 shows a circuit arrangement for an antenna matching line according to an exemplary embodiment.

Fig. 24 shows a circuit arrangement for an antenna matching line according to another exemplary embodiment.

Fig. 25 shows a circuit arrangement for an antenna matching line according to another exemplary embodiment.

Fig. 26 shows a circuit arrangement for an RF device (or a part of an RF device) according to another exemplary embodiment.

Fig. 27 illustrates a system for radio frequency communication according to an example embodiment.

Detailed Description

One aspect of the present disclosure relates generally to RF devices having a sectorized antenna structure to provide improved features and related methods. As described below, according to this aspect, in the RF device according to the exemplary embodiment, the antenna structure is divided. More specifically, a portion of the resonator and radiator structure is included in one device (e.g., one module), and the remainder or additional portion of the resonator and radiator structure is fabricated or machined or included external to the device (e.g., external to the module).

Fig. 2 depicts a circuit arrangement 10 for an RF device (or a portion of an RF device) according to one example embodiment. More specifically, circuit arrangement 10 shows electrical connections and couplings between the various parts of the RF device.

The circuit arrangement 10 comprises an antenna structure 15. The antenna structure 15 comprises a chip antenna 20 coupled to a resonator 25. Typically, resonator 25 comprises a device, component, or apparatus that naturally oscillates at certain frequencies (e.g., the frequency at which the RF device transmits RF signals or the frequency at which the RF device receives RF signals). In an exemplary embodiment, the reactance of one or more features or devices or a portion of the substrate (on which the various components of the circuit arrangement 10 are disposed or fixed) or substrate layout, matching component(s) (e.g., inductor (s)) capacitor(s) (not shown), and/or chip antenna 20 form a resonator 25.

Referring again to fig. 2, resonator 25 is coupled to a radiator 30. Generally, the radiator 30 includes a device, component, or apparatus that converts conductive RF energy (e.g., received from the RF circuitry 35 or from a communication medium such as air or free space) into radiated RF energy. In an exemplary embodiment, one or more features or devices or portions of a substrate (on which the various components of the circuit arrangement 10 are disposed or secured) or substrate layout, the chip antenna 20, and/or a surrounding ground plane (e.g., a ground plane formed in or on the substrate on which the circuit arrangement 10 comprised by the substrate is disposed or secured) form the radiator 30.

Referring again to fig. 2, rf circuitry 35 is coupled to antenna structure 15 via link 40. In an exemplary embodiment, the RF circuitry 35 may include Transmit (TX), receive (RX), or transmit and receive (transceiver) lines. In the transmit mode, the RF circuitry 35 transmits RF signals using the antenna structure 15. In the receive mode, RF circuitry 35 receives RF signals via antenna structure 15. In transceiver mode, RF circuit 35 may receive RF signals during some periods and alternatively transmit RF signals during other periods (or perform transmission or reception as desired). Thus, the transceiver mode may be regarded as combining the transmit mode and the receive mode in a time division multiplexed manner.

Link 40 provides electrical coupling to provide RF signals from RF circuitry 35 to antenna structure 15 or alternatively to provide RF signals from antenna structure 15 to RF circuitry 35 (in transmit mode and receive mode, respectively). Typically, the links 40 constitute transmission lines. In an exemplary embodiment, the link 40 may have or include various forms, devices, or structures. For example, in some embodiments, link 40 may comprise a coaxial line or structure. As another example, in some embodiments, link 40 may include a strip line or microstrip structure (e.g., two conductors arranged in a lengthwise parallel fashion).

Regardless of the form of the link 40, the link 40 is coupled to the antenna structure 15 at a feed point or node 45. In some embodiments, the feed point 45 may include a connector, such as an RF connector. In some embodiments, the feed point 40 may include electrical couplings (e.g., points/nodes/pads, etc.) to couple the link 40 to the chip antenna 20. The feed point 45 provides an RF signal to the chip antenna 20 (during transmit mode) or from the chip antenna 20 to the link 40 (during receive mode).

In an exemplary embodiment, the chip antenna 20 may constitute various desired chip antennas. As known to those of ordinary skill in the art, a chip antenna is a passive electronic component having a relatively small physical size. Referring to fig. 2, the chip antenna 20 forms an antenna structure 15 together with a resonator 25 and a radiator 30. As described above, the antenna structure 15 transmits RF signals from the RF circuit 35 or provides RF signals received from a communication medium (e.g., air) to the RF circuit 35. In some embodiments, an antenna other than a chip antenna may be used. The embodiment shown in fig. 2 uses a chip antenna 20 because of its relatively small size, relatively low cost, and relatively easy availability.

Generally, in exemplary embodiments, the structures used to fabricate or implement resonator 25 and radiator 30 may overlap or have common elements. For example, as described above, in some embodiments, resonator 25 and radiator 30 may include one or more features or devices of a substrate (on which various components of a circuit arrangement or RF device are disposed or fixed) or substrate layout. In this case, the resonator 25 and the radiator 30 may be combined.

Fig. 3 shows a circuit arrangement 60 for an RF device (or part of an RF device) according to an exemplary embodiment, comprising a combined resonator and radiator, i.e. resonator/radiator 50. More specifically, the circuit arrangement 60 shows electrical connections or couplings between the various parts of the RF device. The circuit arrangement 60 has the same or similar features as described above with respect to the circuit arrangement 10 (see fig. 2), except for the combined resonator and radiator.

As described above, fig. 2 and 3 illustrate an electrical topology of an RF device according to one exemplary embodiment. Fig. 4, 5 and 6 illustrate or add physical features or configurations of an RF device according to one example embodiment. More specifically, fig. 4, 5 and 6 show a partition of the resonator 25 and the radiator 30 (similar partitions can be applied to a combined resonator and radiator, such as resonator/radiator 50 (see fig. 3)).

In an exemplary embodiment, a physical carrier, device, housing, or other physical entity is used to house or include or support the antenna structure 15. In some embodiments, the antenna structure 15 (chip antenna 20, resonator 25 and radiator 30 in the embodiment of fig. 2, or chip antenna 20 and resonator/radiator 50 in the embodiment shown in fig. 3) is included or housed in a module. Fig. 4 shows such a module marked 80.

In some embodiments, the module 80 includes a physical device or component, such as a substrate (not shown), to which various components (e.g., the chip antenna 20) are secured or which supports the various components. In various embodiments, the substrate provides physical support for the various components of the module 80. Additionally, in some embodiments, the substrate provides a mechanism for electrically coupling the various components of the module 80. For example, the substrate may include conductive traces to couple the chip antenna 20 to a resonator and/or a radiator.

In exemplary embodiments, the substrate may be manufactured in various ways as desired. For example, in some embodiments, the substrate may constitute a Printed Circuit Board (PCB). As will be appreciated by those of ordinary skill in the art, the PCB provides the mechanisms or features for the various components of the electrical coupling module 80, such as traces, vias, and the like. PCB mechanisms or features may also be used to implement a portion of the resonator and/or radiator (or combined resonator/radiator), e.g., trace, matching component, ground plane, etc.

In an exemplary embodiment, one or more materials for manufacturing the PCB may be selected based on various considerations and properties. For example, the PCB material may be selected to provide certain physical properties, such as sufficient strength for supporting the various components in the module 80. As another example, PCB materials may be selected to provide certain electrical properties, such as dielectric constants for providing desired electrical characteristics (e.g., reactance at a given or desired frequency).

As described above, the exemplary embodiments include a sectorized antenna structure. Referring again to fig. 4, the antenna structure 15 (not labeled in fig. 4) includes a sectorized resonator and a sectorized radiator. More specifically, the antenna structure 15 includes a portion of a resonator in the module 80. Thus, the resonator is physically divided into two parts (or pieces or segments). One of these parts is contained in module 80 and is labeled 85A. In other words, portion 85A is smaller than the entire (or complete) resonator. The resonator element or portion 85A may comprise a portion of the overall resonator structure, e.g., one or more matching components, a portion of the overall ground plane, etc. The second portion of the resonator is not included in the module 80, but is fabricated using a structure external to the module 80 as described in detail below. The two parts of the resonator together form the whole or complete resonator.

Similarly, the antenna structure 15 (not labeled in fig. 4) comprises a portion of a radiator in the module 80. In other words, the radiator is physically divided into two parts (or pieces or segments). One of these parts is contained in module 80 and is labeled 90A in fig. 4. Thus, portion 90A is smaller than the entire (or complete) radiator. The radiator part or portion 90A may comprise a portion of the overall radiator structure, e.g. one or more matching components, a portion of the overall ground plane, etc. The second portion of the radiator is not included in the module 80, but is manufactured using a structure external to the module 80 as described in detail below. The two parts of the radiator together form the whole or complete radiator.

It should be noted that in some embodiments, the resonators or radiators are divided, but not all resonators or radiators are divided. For example, in some embodiments, the resonators are partitioned as described above, but the radiators are not partitioned and contained in module 80 (even where the radiators may have relatively little efficiency). As another example, in some embodiments, the radiator is divided as described above, but the resonator is not divided and contained in the module 80.

As described above, in some embodiments, the resonator and the radiator are combined (e.g., resonator/radiator). In such an embodiment, the antenna structure 15 (not labeled in fig. 4) comprises a portion of a resonator/radiator in the module 80. In other words, the resonator/radiator is physically divided into two parts (or pieces or segments). One of these parts is contained in a module 80. The resonator/radiator portions included in the module 80 may include a portion of the overall resonator/radiator structure, e.g., one or more matching components, a portion of the overall ground plane, etc. The second part of the resonator/radiator is not included in the module 80 but is manufactured using a structure external to the module 80.

It should be noted that in the embodiment shown in fig. 4, RF circuit 35 is not physically contained in module 80. Instead, RF circuitry 35 is external to module 80 and coupled to chip antenna 20 via link 40. In some embodiments, as with link 40, RF circuitry 35 is physically contained in module 80. Fig. 5 depicts an example of such an embodiment. In the embodiment of fig. 5, RF circuitry is contained in module 80 and coupled to chip antenna 20 via link 40 (which is also contained in module 80). Link 40 may be used external to module 80 to allow communication with RF circuitry 35 (e.g., to provide signals to transmit or receive RF signals that have been received). Inclusion of RF circuitry 35 in module 80 facilitates authentication of module 80 for a given standard or protocol as desired.

As described above, the antenna structure 15 includes a portion of the resonator 85A and a portion of the radiator 90A. The remainder or part of the resonator and radiator are fabricated outside of the module 80. In some embodiments, the remainder is fabricated using features or devices in the substrate to which the module 80 is coupled or secured. Fig. 6 depicts an example of such an embodiment.

More specifically, the apparatus 100 in fig. 6 shows the RF module 80 coupled to or secured to a substrate 105. In addition to the module 80, the substrate 105 may be coupled to or secured to other devices, features, subsystems, circuits, etc., as desired. In an exemplary embodiment, the substrate 105 may be manufactured in various ways as desired. For example, in some embodiments, the substrate may constitute a PCB (generally indicated at 105). As will be appreciated by one of ordinary skill in the art, the PCB provides some mechanism or feature (such as a trace, via, etc.) to electrically couple the module 80 to other devices, features, subsystems, circuits, etc.

PCB (or substrate in general) 105 features (or mechanisms or devices or components or parts) may also be used to implement the second part of the resonator and radiator (or combined resonator/radiator). Examples of such features include traces, conductive regions, or conductive planes (such as ground planes), and the like. In the illustrated embodiment, features of the substrate 105 are used for a portion of the resonator (labeled 85B) and a portion of the radiator (labeled 90B). Resonator parts or portions 85A and 85B are coupled together (electrically and/or physically) to form an overall resonator (e.g., resonator 25 in fig. 2). Similarly, the radiator parts or portions 90A and 90B are coupled together (electrically and/or physically) to form an entire radiator (e.g., radiator 30 in fig. 2).

In an exemplary embodiment, one or more materials used to fabricate the substrate or PCB105 may be selected based on various considerations and properties. For example, the PCB material may be selected so as to provide certain physical properties, such as sufficient strength for supporting various components coupled or secured to PCB 105. As another example, the PCB material may be selected so as to provide certain electrical properties, for example, a dielectric constant for providing a desired electrical characteristic (e.g., reactance at a given or desired frequency), a desired overall resonator electrical characteristic, and/or a desired overall radiator electrical characteristic.

By dividing the resonator (e.g., resonator 25) and the radiator (e.g., radiator 30), the antenna structure 15 is partitioned. For example, referring to fig. 6, the resonator is divided into a portion 85A and a portion 85B. Additionally or alternatively, the radiator is divided into a portion 90A and a portion 90B. Assuming that the antenna structure 15 comprises a resonator and a radiator, the antenna structure 15 is divided as shown and described above. In embodiments where the resonator and radiator are combined, the resulting resonator/radiator of the division also results in the antenna structure 15 being divided.

A partitioned antenna structure according to an exemplary embodiment provides several features and attributes. For example, a sectorized antenna structure provides for efficient tuning of an antenna (e.g., chip antenna 20) rather than relying solely on techniques involving changing dielectric material in the relatively close proximity region of the antenna, changing packaging material (e.g., molding material) or dimensions, or changing the dimensions or characteristics of a substrate (e.g., PCB) to which module 80 is secured. Thus, even if relatively significant misalignment occurs due to various factors (e.g., whether molding and plastic layers are used in the module 80 or outside the module 80), effective or efficient tuning of the antenna for a given application using the module 80 is possible. Thus, tuning of the antenna may be achieved in a relatively flexible manner and at potentially lower costs (e.g., due to smaller module size, etc.).

Further, assuming that the module 80 includes portions of the resonators and radiators instead of the entire resonators and radiators, the module size is reduced. The reduced size of the module 80 provides for reduced board area, reduced cost, increased flexibility, and the like. For example, resonator portion 85B and radiator 90B, which are fabricated external to module 80 (e.g., using features or parts of substrate 105), may be sized or configured or fabricated to accommodate a desired RF frequency without changing the characteristics of module 80. In other words, the resonator portion 85B and the radiator portion 90B, which are fabricated external to the module 80 (e.g., using features or parts of the substrate 105), may be sized or configured or fabricated to provide efficient RF transmission or reception for particular characteristics of the module 80.

One aspect of the present application relates to a process for making or using a module, such as module 80. Fig. 7 shows a flowchart 120 of a process for making a module with a partitioned antenna structure, according to an example embodiment. At 125, RF circuitry (e.g., RF circuitry 35 described above) is fabricated and included in the module as needed. ( In embodiments where RF circuitry (e.g., a semiconductor die including the RF circuitry) has been fabricated, the fabricated RF circuitry may be contained in module 80. Furthermore, in embodiments where the RF circuitry is external to the module, block 125 may be eliminated. )

At 128, a chip antenna (e.g., chip antenna 20 described above) is fabricated and included in module 80 as desired. (in embodiments where a chip antenna has been manufactured (e.g., obtained as a separate component in a packaged form), the manufactured chip antenna may be contained in module 80.)

At 131, a portion or part of a resonator (e.g., resonator 25 in fig. 2) is manufactured and contained in module 80. This portion or part of the resonator may constitute, for example, portion 85A shown in fig. 5 and 6. In other words, the entire structure forming the resonator is divided into two parts as described above. One of these portions (e.g., portion 85A) is contained in module 80.

Alternatively or additionally, at 134, a portion or part of a radiator (e.g., radiator 30 in fig. 2) is manufactured and contained in module 80. This portion or part of the radiator may constitute, for example, portion 90A shown in fig. 5 and 6. (note that in embodiments using a combined resonator and radiator, a portion of the resonator/radiator is fabricated and contained in module 80). In other words, the entire structure forming the radiator is divided into two parts as described above. One of these portions (e.g., portion 90A) is contained in module 80.

Fig. 8 shows a flowchart 150 of a process for fabricating an RF device with a sectorized antenna structure, according to another example embodiment. The process shown in fig. 8 assumes that a portion of the resonator and a portion of the radiator (or a portion of the resonator/radiator) are contained in a module such as module 80 as described above (although the process may be used in other embodiments by making appropriate modifications as needed).

At 155, characteristics of portions of the resonator and radiator (e.g., portions 85B and 90B described above) that are external to the module (e.g., fabricated or included in substrate 105 in fig. 6) are determined or calculated. Such characteristics include the dimensions of various features (e.g., ground plane), material characteristics (e.g., dielectric constant), etc.

At 160, features of a substrate (e.g., substrate 105 described above) are used to fabricate portions of the resonator and radiator external to the module. At 165, the module is mounted to a substrate. At 170, the module is electrically coupled to the substrate, e.g., portion 85A is coupled to portion 85B, portion 90A is coupled to portion 90B, power and ground connections, RF signal paths, and the like. It should be noted that in some embodiments, mounting the module and electrically coupling the module to the substrate may be performed together (e.g., by soldering the module to the substrate).

One aspect of the present application relates to the use of substrate 105 to include circuitry in an RF device to provide most or all of the components (e.g., receiver, transmitter, transceiver) for an RF communication device. Fig. 9 illustrates an RF communication device 200 having a sectorized antenna structure in accordance with another exemplary embodiment.

As described above, the module 80 and portions 85B and 90B fabricated/contained in/on the substrate 105 provide RF circuitry for the RF device. In addition, the RF communication device 200 includes a baseband circuit 205 and a signal source/destination 210. In the illustrated embodiment, baseband circuitry 205 is included in module 80. Baseband circuitry 205 is coupled to RF circuitry 35 via link 220.

In the case of RF reception, baseband circuitry may receive signals from RF circuitry 35 using link 220 and convert those signals to baseband signals. As will be appreciated by those skilled in the art, the conversion may include frequency translation, decoding, demodulation, and the like. The resulting signal from the conversion is provided to the signal source/destination 210 via link 215. In the case of RF reception, the signal source/destination 210 may include a signal destination such as a speaker, a storage device, a control circuit, a transducer, and the like.

In the case of RF transmissions, the signal source/destination 210 may include a signal source such as a transducer, microphone, sensor, storage device, control circuitry, or the like. The signal source provides a signal for modulating the transmitted RF signal. Baseband circuitry 205 receives the output signals of the signal sources via link 215 and converts those signals to output signals that are provided to RF circuitry 35 via link 220. The conversion may include frequency translation, coding, modulation, etc., as will be appreciated by those skilled in the art. The RF circuit 35 uses a partitioned antenna structure to transmit RF signals via a medium such as air.

In some embodiments, the baseband circuitry 205 may be eliminated from the module 80 and instead attached to the substrate 105. For example, a semiconductor die or IC containing or integrated with baseband circuitry 205 may be attached to substrate 205 and may be coupled to module 80. Fig. 10 shows an RF communication device 240 comprising such an arrangement. As described above, link 220 provides a coupling mechanism between baseband circuitry 205 and RF circuitry 35. The RF communication device 240 provides the functionality described above in connection with fig. 10. Having baseband circuitry 205 included in module 80 will facilitate authenticating module 80 to a given standard or protocol as desired.

Another aspect of the present application relates to an apparatus, and an associated method, for an impedance matching circuit (or matching circuit or matching network or matching line or impedance matching network or impedance matching line) in an RF apparatus. As will be appreciated by those skilled in the art, the impedance matching circuit may be referred to simply as a "matching circuit" without loss of generality.

Impedance matching or impedance transformation circuits (referred to herein as matching circuits) are commonly used in RF devices (e.g., receivers, transmitters, and/or transceivers) to provide an interface or match between lines having different impedances.

More specifically, in the case of a purely resistive impedance, maximum power transfer occurs when the output impedance of the source circuit is equal to the input impedance of the load circuit. In the case of complex impedance, maximum power transfer occurs when the input impedance of the load circuit is the complex conjugate of the output impedance of the source circuit.

For example, consider an antenna having an impedance of 50 ohms (r=50Ω) coupled to a receive or Receiver (RX) circuit having an impedance of 50 ohms. In this case, since the output impedance of the antenna is equal to the input impedance of the RX circuit, maximum power transfer occurs without using an impedance matching circuit.

Consider now the case where an antenna with an impedance of 50 ohms (r=50Ω) is coupled to an RX circuit with an impedance of 250 ohms. In this case, maximum power transfer does not occur because the respective impedances of the antenna and the RX circuit are not equal.

However, the impedance of the antenna may be matched to the impedance of the RX circuit using an impedance matching circuit. Because of the use of an impedance matching circuit, maximum power transfer from the antenna to the RX circuitry can be achieved.

More specifically, an impedance matching circuit is coupled between the antenna and the RX circuit. The impedance matching circuit has two ports, one of which is coupled to the antenna and the other of which is coupled to the RX circuit.

At the port coupled with the antenna, the impedance matching circuit ideally presents a 50 ohm impedance to the antenna. As a result, maximum power transfer occurs between the antenna and the impedance matching circuit.

In contrast, at the port coupled with the RX circuit, the impedance matching circuit exhibits an impedance of 250 ohms to the RX circuit. Thus, maximum power transfer occurs between the impedance matching circuit and the RX circuit.

In practice, impedance matching circuits often do not perfectly match the impedance. In other words, the signal transmission from one network to another is not perfect and no 100% of the signal power is transmitted. As a result, reflections occur at interfaces between circuits or networks having imperfect matching impedances.

The reflection coefficient S11 may be used as a measure of the level of impedance matching or quality factor. A lower S11 indicates better power transfer (better impedance matching) and vice versa.

In an exemplary embodiment, an impedance matching circuit or an apparatus including an impedance matching circuit and related methods are disclosed. The cost of the impedance matching circuit is relatively low, which may be used with an RF Receiver (RX), an RF Transmitter (TX), and/or an RF transceiver.

Furthermore, the impedance matching circuit according to various embodiments may be adapted for various operating frequency ranges, power levels, and RX circuit or RX and TX circuit impedances. In addition, as will be appreciated by those skilled in the art, impedance matching circuits according to various embodiments may be used with various RX circuits or RX and TX circuit configurations (e.g., low IF receivers, direct conversion receivers or transmitters, etc.).

According to one aspect of the present application, a matching circuit is provided in an RF device that matches the impedance of an antenna (more particularly, a loop antenna in some embodiments, as described in detail below) to the impedance of the RF circuit. The matching circuit provides an impedance matching function without using a chip antenna or a ceramic antenna. In other words, according to this aspect of the present application, the RF device includes an RF circuit, a matching circuit, and an antenna.

Instead of using a chip antenna, a matching circuit is used that uses lumped components or elements, such as reactive components (inductor (s)) and capacitor(s). In some embodiments, the reactive component comprises a Surface Mount Device (SMD) component. However, as will be appreciated by those skilled in the art, other types of components may be used, depending on various factors. Examples of such factors include operating frequency, cost, available space, performance specifications, design specifications, available technology, etc., as will be appreciated by those skilled in the art.

The matching circuit avoids the use of chip antennas in such RF devices. Avoiding the use of chip antennas provides some benefits. For example, the overall cost of the RF device may be reduced by avoiding the use or elimination of chip antennas.

Fig. 11 depicts a circuit arrangement for an RF device (or a portion of an RF device) 300 according to an example embodiment. More specifically, the figure shows electrical connections or couplings between the various portions of the RF device 300. The RF device 300 includes a loop antenna 310, as described in detail below, the loop antenna 310 being formed in or on the substrate 105. RF circuit 35 is coupled to matching circuit 305 via link 40. In an exemplary embodiment, the RF circuitry 35 may include Transmit (TX), receive (RX), or transmit and receive (transceiver) lines. In transmit mode, RF circuitry 35 transmits RF signals using loop antenna 310. In the receive mode, RF circuit 35 receives RF signals via loop antenna 310. In transceiver mode, RF circuitry 35 may receive RF signals for some periods of time and alternatively transmit RF signals for other periods of time (or perform neither transmission nor reception as desired). Thus, the transceiver mode may be considered to combine the transmit mode and the receive mode in a time division multiplexed manner.

Link 40 provides electrical coupling to provide RF signals from RF circuit 35 to matching circuit 305 or to provide RF signals from antenna matching circuit 305 to RF circuit 35 (during transmit and receive modes, respectively). Typically, the links 40 constitute transmission lines. In exemplary embodiments, the link 40 may have or include a variety of forms, devices, or structures. For example, in some embodiments, link 40 may comprise a coaxial line or structure. As another example, in some embodiments, the link 40 may include a stripline or microstrip structure (e.g., two conductors arranged in a lengthwise parallel fashion). As will be appreciated by those skilled in the art, other types of structures may be used to implement link 40.

Regardless of the form of the link 40, the link 40 is coupled to the matching circuit 305 at a feed point or node 45. In some embodiments, the feed point 45 may include a connector, such as an RF connector. In some embodiments, the feed point 40 may include electrical couplings (e.g., points, nodes, solder joints, solder balls, vias, etc.) to couple the link 40 to the matching circuit 305. The feed point 45 provides an RF signal to the matching circuit 305 and ultimately to the loop antenna 310 (during transmit mode) or provides an RF signal from the loop antenna 310 that is provided by the matching circuit 305 to the link 40 (during receive mode).

In some embodiments, the matching circuit 305 may be formed in the substrate 105, formed on the substrate 105, or formed using various features of the substrate 105. Fig. 12 shows such an embodiment. In some embodiments, a module or semiconductor die such as an RF module is used. Fig. 13 shows such an embodiment.

Referring to fig. 13, various alternatives are contemplated and possible. For example, in some embodiments, the module 80 may have its own package. In such embodiments, the package of module 80 is mounted, attached, or attached to substrate 105 directly (e.g., soldered) or through the use of a carrier or the like. As another example, in some embodiments, the module 80 may be formed or attached to its own substrate. In such embodiments, the substrate of the module 80 is mounted, attached, or attached to the substrate 105 directly (e.g., soldered) or through the use of a carrier or the like.

In some embodiments, the matching circuit 305 is partitioned. In other words, a portion (or part) of the wiring for the matching circuit 305 is contained in the module 80, and another portion of the matching circuit 305 is contained in the substrate 105 or formed on the substrate 105 or formed using the substrate 105. Fig. 14 shows such an embodiment. In the embodiment of fig. 14, a portion 305A of the matching circuit 305 is contained in the module 80. For example, some reactive components of the matching circuit 305 may be included in the module 80. Referring again to fig. 14, another portion 305B of the matching circuit is implemented using the substrate 105. For example, the substrate 105 may include conductive traces or patterns to which some reactive components of the matching circuit 305 may be attached (e.g., soldered). These conductive traces or patterns (e.g., patterns of conductors formed in a PCB used to implement the substrate 105) couple the portion 305B of the matching circuit 305 to the loop antenna 310.

In some embodiments, loop antenna 310 is sectorized. In other words, a portion (or feature) of the loop antenna 310 is contained in the module 80, while another portion of the loop antenna 310 is contained in the substrate 105 or formed on the substrate 105 or formed using the substrate 105. Fig. 15 shows such an embodiment. In the embodiment of fig. 15, a portion 310A of loop antenna 310 is contained in module 80. For example, conductor traces or conductors or conductor patterns in module 80 may be used to implement portion 310A of loop antenna 310. Referring again to fig. 14, another portion 310B of the loop antenna 310 is implemented using the substrate 105. For example, the substrate 105 may include conductive traces or patterns for implementing or implementing the portion 310B of the loop antenna 310. These conductive traces or patterns (e.g., patterns of conductors formed in a PCB used to implement the substrate 105) couple the portion 310B of the loop antenna 310 to the matching circuit 305.

One aspect of the present application relates to including circuitry in an RF device using substrate 105 to provide some or all of the components for RF device (e.g., receiver, transmitter, transceiver) 300. Fig. 16 shows an RF communication device 300 (as described above in connection with fig. 13) with a matching circuit 305 included in a module 80 according to an exemplary embodiment. In addition, referring to fig. 16, the rf device 300 includes a baseband circuit 205 and a signal source/destination 210. In the illustrated embodiment, baseband circuitry 205 is external to module 80 and is coupled to RF circuitry 35 via link 220.

In the case of RF reception, baseband circuitry may receive signals from RF circuitry 35 using link 220 and convert the signals to baseband signals. As will be appreciated by those skilled in the art, the conversion may include frequency translation, decoding, demodulation, and the like. The resulting signal from this conversion is provided to the signal source/destination 210 via link 215. As will be appreciated by those skilled in the art, in the case of RF reception, the signal source/destination 210 may include a signal destination, e.g., a speaker, a memory device, a control circuit, a transducer, etc. In the case of RF transmissions, the signal source/destination 210 may include a signal source, such as a transducer, microphone, sensor, storage device, data source, control circuitry, or the like. The signal source provides a signal that is used to modulate the transmitted RF signal. Baseband circuitry 205 receives the output signals of the signal sources via link 215 and converts these signals to output signals that are provided to RF circuitry 35 via link 220. The conversion may include frequency translation, coding, modulation, etc., as will be appreciated by those skilled in the art. The RF circuit 35 uses the matching circuit 305 to provide RF signals to the loop antenna 310 for transmission via a medium such as air or vacuum.

In some embodiments, a portion or part of the matching circuit 305 is contained in the module 80, while another portion or part of the matching circuit 305 is external to the module 80. Fig. 17 shows such an embodiment. Similar to the embodiment of fig. 14, in the embodiment of fig. 17, a portion 305A of the matching circuit 305 is contained in the module 80. Another portion 305B of the matching circuit 305 is external to the module 80, for example implemented using the substrate 105 as described above.

In some embodiments, a portion (or part) of loop antenna 310 is contained in module 80, while another portion of loop antenna 310 is external to module 80. Fig. 18 shows such an embodiment. Similar to the embodiment of fig. 15, in the embodiment of fig. 18, a portion 310A of loop antenna 310 is contained within module 80. Another portion 310B of the loop antenna 310 is external to the module 80, for example implemented using the substrate 105 as described above.

Another aspect of the present application relates to the physical layout of the matching circuit 305 and the antenna loop 310. Fig. 19 shows a layout for an RF device (or a part of an RF device) according to an exemplary embodiment. More specifically, fig. 19 shows a loop antenna implemented as a printed loop substrate fringe-fringing field antenna. In other words, loop antenna 310 uses an exemplary conductive loop implemented as a conductive pattern or trace formed in or on substrate 105 (e.g., a PCB), thereby implementing a label printing loop. The conductive loop (e.g., the printed loop) is implemented at or near an edge of the substrate 105 (as shown in fig. 19), i.e., near one or more edges of the substrate 105 (as shown in fig. 19), or at one or more edges of the substrate 105, i.e., there is no (or little) gap between the conductive loop and the edge(s) of the substrate 105.

Portions of the substrate 105 are not used to implement the loop antenna 310, e.g., portions of the conductive layer on the PCB are peeled or trimmed to create the voids 330 (i.e., areas not covered by the conductive layer). Conductive patterns or traces 340 and 345 are used to implement the matching circuit 305. In the example shown, the RF feed is implemented using a conductive pattern 340 (i.e., a receiver (not shown) or transmitter (not shown) is coupled to the conductive pattern 340). The inductor L1 is coupled between the conductive pattern 340 and the loop antenna 310. The capacitor C1 couples the conductive pattern 340 to the conductive pattern 345. Capacitor C2 is coupled between conductive pattern 345 and loop antenna 310.

Thus, a matching circuit including the inductor L1 and the capacitors C1 and C2 is formed. The matching circuit formed in fig. 19 is merely illustrative and not limiting. As will be appreciated by those skilled in the art, other matching circuits may be implemented using lumped reactive components or elements as described above, by using such components and one or more patterns in or on the substrate 105. And a matching circuit. Loop antenna 310 is resonated by matching circuit 305. Other matching circuits may be implemented using lumped reactive components or elements, as described above, by using such components and one or more conductive patterns in the substrate 105 or on the substrate 105 to achieve a desired matching circuit. The loop antenna 310 is resonated by the matching circuit 305.

Referring again to fig. 19, a plurality of ground vias 335 are used to couple several points of the loop antenna 310 to a ground plane (not shown). The ground plane may be formed using one or more inner layers of the substrate 105 (e.g., inner layer(s) of a multi-layer PCB) or an underlying layer of the substrate 105 (e.g., an underlying layer or backside of a PCB). Fig. 20 shows a layout for such an arrangement. More specifically, the ground vias 335 couple the loop antenna 310 (partially shown using dashed lines because it is not located in the layers shown) to the conductive pattern 350. The conductive pattern 350 constitutes a ground plane and, as described above, may be implemented using one or more inner layers or sides or layers of the bottom or back of the substrate 105.

As described above, the loop antenna 310 is resonated by the matching circuit 305, which causes RF current. Fig. 21 shows an example of RF current distribution in the layout shown in fig. 19. Referring again to fig. 21, RF current 360 generally propagates along the top side of substrate 105, along the right side of substrate 105, along the bottom side of substrate 105, and along the left side of substrate 105, thereby generating RF radiation. As shown in fig. 21, some edge current flows along the top side or edge of the substrate 105. Such fringe currents generate fringe fields that also generate RF radiation. It should be noted that although the conductive loop is generally radiating, the primary radiator is along the edge(s) of the substrate 105 due to the relatively large size. Thus, without using a chip or ceramic antenna, loop antenna 310 uses the conductive loop and edge(s) of substrate 105 as radiators, which are driven by a matching circuit using lumped reactive components or elements.

The size of the conductive loop in the loop antenna 310 is generally dependent on the operating frequency (e.g., the frequency of the RF signal transmitted through the loop antenna 310, or the frequency of the RF signal received through the loop antenna 310). Accordingly, the dimensions of the conductive loop and/or substrate 105 may be selected to accommodate a desired operating frequency. Various shapes of conductive loops are also possible and contemplated. Some conductive loops may be shaped and sized to increase the bandwidth of loop antenna 310 or to accommodate a relatively limited area available around module 80 on substrate 105.

In general, several techniques may be used to improve the performance of loop antenna 310: (a) Relatively narrow traces relatively far from the module 80 are used in order to reduce the loop area/scale created by the self-capacitance; (b) Increasing the distance between conductive loop coupling mechanisms (pins, etc.) to reduce the parallel parasitic capacitance by the matching circuit 305; (c) increasing the conductive loop width and length to expand the bandwidth. It should be noted that a larger conductive loop area can be achieved in a number of ways, for example by widening the conductive loop or making it longer, which reduces the quality factor (Q) of the conductive loop, i.e. reduces the imaginary part of its impedance compared to the real part of its impedance.

As described above, in some embodiments, a portion of the matching circuit 305 (see, e.g., fig. 17) or a portion of the loop antenna 310 (see, e.g., fig. 18) is included in the module 80. In such an embodiment, another portion 305 of the matching circuit (see, e.g., fig. 17) or a portion of the loop antenna 310 (see, e.g., fig. 18) is located external to the module 80, e.g., formed using the substrate 105, respectively. Fig. 22 shows a layout of such an embodiment. More specifically, the module 80 is positioned relative to the substrate 105 (typically mounted or attached to the substrate 105). The module 80 is electrically coupled to a loop antenna 310. As noted in some embodiments, a portion of the matching circuit 305 is contained in the module 80, while another portion of the matching circuit 305 is disposed external to the module 80. Furthermore, as noted in some embodiments, a portion of loop antenna 310 is contained within module 80, while another portion of loop antenna 310 is disposed outside of module 80.

Another aspect of the present application relates to the topology of the matching circuit 305. Loop antenna 310 (e.g., a printed loop antenna) typically exhibits an inductive impedance. More specifically, by increasing the length, the conductive loop impedance approaches the high impedance point of the smith chart as the loop impedance approaches its own parallel resonance point. The parallel self-resonator is formed by a toroidal inductance and fringe field parasitic capacitance. For use as an antenna, a conductive loop is typically used below its self-resonant frequency, meaning that it exhibits an inductive impedance. However, the conductive loop may also be used above its self-resonant frequency, where it exhibits capacitive impedance. In either case, various matching circuits may be used with the loop antenna 310. Some examples are described and illustrated in U.S. patent application Ser. No. 16/237,511, referenced above.

Fig. 23 shows a matching circuit according to an exemplary embodiment. More specifically, the matching circuit 305 in fig. 23 includes a reactive network 450 coupled in series or cascade with a reactive network 550. As its name implies, reactive networks 450 and 550 include one or more inductors and/or capacitors. Reactive networks 450 and 550 may have various topologies, for example, as described and illustrated in U.S. patent application Ser. No. 16/237,511 referenced above.

Fig. 24 shows a matching circuit according to another exemplary embodiment, which uses a parallel resonant network and a reactance network. More specifically, the matching circuit 305 in fig. 24 includes a resonant network 500 coupled in parallel with (i.e., between) the RF port of the matching circuit 305. The resonant network 500 is also coupled to a reactive network 550. The reactive network 550 is coupled in series or in cascade with the antenna ports of the matching circuit 305. As its name implies, the resonant network 500 includes one or more inductors coupled with one or more corresponding capacitors to form a resonant circuit or tank (tank) or resonant network. The reactive network 550 and the resonant network 500 may have various topologies, for example, as described and illustrated in U.S. patent application Ser. No. 16/237,511 referenced above.

Fig. 25 shows a matching circuit according to another exemplary embodiment, which uses a series resonant network and a reactance network. More specifically, the matching circuit 305 in fig. 25 includes a resonant network 500 coupled in series with a reactive network 550. The reactive network 550 and the resonant network 500 may have various topologies, for example, as described and illustrated in U.S. patent application Ser. No. 16/237,511 referenced above.

Fig. 26 shows a circuit arrangement 600 for coupling to the matching network 305 of the loop antenna 310. One end of loop antenna 310 is coupled to ground (e.g., using a ground via as described above). The other end of loop antenna 310 is coupled to an antenna port of matching circuit 305. In the particular example shown, the matching circuit 305 generally has a topology similar to that in fig. 25. More specifically, the matching circuit 305 includes a resonance circuit 500, and the resonance circuit 500 uses an inductor L1 connected in series with a capacitor C1. The matching circuit 305 also includes a reactive network 550, the reactive network 550 including a single capacitor divided into four serially coupled (or cascade coupled) capacitors C2-C5 to reduce sensitivity to component variations or tolerances, for example, as described and illustrated in the above-referenced U.S. patent application No. 16/237,511. The example in fig. 26 does not use a parallel coupling network because in the particular case shown, the parallel parasitics (e.g., conductive loops, etc.) present in the circuit move the impedance close to the nominal resistance (e.g., 50Ω) circle of the smith chart. In other cases, parallel networks may be suitable and may be used, for example, as described and illustrated in U.S. patent application Ser. No. 16/237,511 referenced above.

As described above, the matching circuit 305 or the loop antenna 310 may be divided into, for example, a plurality of parts, respectively, one of which is included in a module (not shown) and the other of which is external to the module. Furthermore, while various embodiments are described with respect to loop antennas, other types of antennas may be used as will be appreciated by those of ordinary skill in the art. As will be appreciated by one of ordinary skill in the art, the choice of antenna depends on various factors, such as design specifications, performance specifications, cost, substrate characteristics and dimensions, module (if used) characteristics and dimensions, available technology, target market, target end user, and the like.

Antenna structures or loop antennas (which include loop conductors and substrate edges) according to example embodiments may be used in a variety of communication devices, systems, subsystems, networks, etc., as desired. Fig. 27 shows a system 250 for radio communication according to an exemplary embodiment.

The system 250 includes a transmitter 105A that includes an antenna structure 15 (not shown). The transmitter 105A transmits RF signals via the antenna structure 15 or the loop antenna 310. The RF signal may be received by receiver 105B, which includes antenna structure 15 (not shown) or loop antenna 310 (not shown). Additionally or alternatively, transceiver 255A and/or transceiver 255B may receive the transmitted RF signals via receiver 105D and receiver 105F, respectively. One or more of the receivers 105D and 105F include an antenna structure 15 (not shown) or a loop antenna 310 (not shown).

In addition to receiving capabilities, transceiver 255A and transceiver 255B may also transmit RF signals. More specifically, the transmitter 105C and/or the transmitter 105E in the transceivers 255A and 255B, respectively, may transmit RF signals. The transmitted RF signal may be received by receiver 105B (a stand-alone receiver) or via a receiver line of a non-transmitting transceiver. One or more of the transmitters 105C and 105E include an antenna structure 15 (not shown) or a loop antenna 310 (not shown).

Other systems or subsystems having varying configurations and/or capabilities are also contemplated. For example, in some example embodiments, two or more transceivers (e.g., transceiver 255A and transceiver 255B) may form a network, such as an ad hoc network. As another example, in some example embodiments, transceiver 255A and transceiver 255B may form part of a network, for example, in conjunction with transmitter 105A.

In an exemplary embodiment, the RF device including the antenna structure 15 may include various RF lines 35. For example, in some embodiments, direct conversion receiver and/or transmitter circuitry may be used. As another example, in some embodiments, a low Intermediate Frequency (IF) receiver and an offset Phase Locked Loop (PLL) transmitter line may be used.

In other embodiments, other types of RF receivers and/or transmitters may be used as desired. As will be appreciated by one of ordinary skill in the art, the choice of wiring for a given implementation depends on a variety of factors. These factors include design specifications, performance specifications, cost, IC, die, module or device area, available technology (e.g., semiconductor manufacturing technology), target market, target end user, etc.

In an exemplary embodiment, an RF device including antenna structure 15 or loop antenna 310 may communicate in accordance with or support various RF communication protocols or standards. For example, in some embodiments, RF communications according to Wi-Fi protocols or standards may be used or supported. As another example, in some embodiments, RF communications according to the bluetooth protocol or standard may be used or supported. As another example, in some embodiments, RF communication according to ZigBee protocols or standards may be used or supported. Other protocols or standards are contemplated and may be used or supported in other embodiments as desired.

In other embodiments, other types of RF communications according to other protocols or standards may be used or supported as desired. As will be appreciated by one of ordinary skill in the art, the choice of protocols or standards for a given implementation depends on a variety of factors. These factors include design specifications, performance specifications, cost, complexity, features (security, throughput), industry support or availability, target markets, target end users, target devices (e.g., ioT devices), and the like.

Referring to the drawings, one of ordinary skill in the art will recognize that the various blocks shown may primarily depict conceptual functions and signal flow. The actual circuit implementation may or may not contain separately identifiable hardware for the various functional blocks, and may or may not use the particular circuitry shown. For example, the functions of the various modules may be combined into one circuit module as desired. Furthermore, the functions of a single block may be implemented in several circuit blocks as desired. The choice of circuit implementation depends on various factors, such as the particular design and performance specifications of a given implementation. In addition to the embodiments in this disclosure, other modifications and alternative embodiments will be apparent to those of ordinary skill in the art. Accordingly, this disclosure teaches those skilled in the art the manner of implementing the disclosed concepts according to the exemplary embodiments and is to be construed as exemplary only. As will be appreciated by one of ordinary skill in the art, the drawings may or may not be drawn to scale where applicable.

The specific forms and embodiments shown and described constitute exemplary embodiments only. Various changes in the shape, size, and arrangement of parts may be made by those skilled in the art without departing from the scope of the disclosure. For example, persons skilled in the art may substitute equivalent elements for the elements illustrated and described. Moreover, those skilled in the art may use certain features of the disclosed concepts independently of the use of other features without departing from the scope of the disclosure.

Claims (19)

1. A radio frequency, RF, device, comprising:

a radio frequency, RF, circuit for transmitting or receiving RF signals;

a loop antenna for transmitting or receiving the RF signal;

an impedance matching circuit coupled to the RF circuit and to the loop antenna, wherein the impedance matching circuit comprises a lumped reactive element,

wherein the impedance matching circuit comprises a resonant network coupled to a reactive network.

2. The RF device of claim 1, wherein the resonant network comprises a series resonant circuit.

3. The RF device of claim 1, wherein the resonant network comprises a parallel resonant circuit.

4. The RF device of claim 1, wherein the impedance-matching circuit includes a first reactive network coupled to a second reactive network.

5. The RF device of claim 1, wherein the loop antenna comprises a conductive loop of a substrate.

6. The RF device of claim 5, wherein sides of the conductive loop are disposed along edges of the substrate.

7. The RF device of claim 5 wherein the matching circuit includes at least one conductive pattern coupled to the substrate of the lumped reactive component.

8. The RF device of claim 1, wherein the RF circuit and the first portion of the loop antenna are contained in a module, and further comprising a first substrate coupled to the module, the first substrate comprising the second portion of the loop antenna.

9. The RF device of claim 8, wherein the second portion of the loop antenna includes a conductive loop of the substrate.

10. The RF device of claim 9, wherein sides of the conductive loop are disposed along edges of the first substrate.

11. The RF device of claim 8, wherein the impedance matching circuit is also contained in the module and coupled to the first portion of the loop antenna.

12. The RF device of claim 11, wherein the module further comprises a second substrate, and wherein the impedance matching circuit and the first portion of the loop antenna are coupled to the second substrate.

13. The RF device of claim 11, wherein the impedance matching circuit comprises: (a) a first reactive network and a second reactive network; or (b) a resonant network coupled to the reactive network.

14. The RF device of claim 1, wherein the RF circuit and the first portion of the impedance matching circuit are contained in a module, and further comprising a first substrate coupled to the module, the first substrate comprising a second portion of the impedance matching circuit.

15. The RF device of claim 14, wherein the first portion of the impedance-matching circuit includes a first set of one or more lumped reactive components.

16. The RF device of claim 15, wherein the second portion of the impedance-matching circuit includes a second set of one or more lumped reactive components.

17. The RF device of claim 14, wherein the first substrate further comprises a loop antenna.

18. The RF device of claim 17, wherein the loop antenna includes a conductive loop of the first substrate.

19. The RF device of claim 14, wherein the module includes a second substrate, and wherein the first portions of the RF circuitry and the impedance matching circuitry are coupled to the second substrate.

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