CN111384513A - Filter, communication equipment, and method for preparing dielectric block and filter - Google Patents
Filter, communication equipment, and method for preparing dielectric block and filter Download PDFInfo
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- CN111384513A CN111384513A CN201910217536.1A CN201910217536A CN111384513A CN 111384513 A CN111384513 A CN 111384513A CN 201910217536 A CN201910217536 A CN 201910217536A CN 111384513 A CN111384513 A CN 111384513A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2002—Dielectric waveguide filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
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Abstract
The application discloses a filter, communication equipment, a method for preparing a dielectric block and a filter. The filter includes: the dielectric block is provided with N cascaded hollow resonant cavities, and a first window is arranged between the two cascaded hollow resonant cavities; wherein N is a natural number greater than 1; wherein, the material of the filter at least comprises zinc oxide, silicon dioxide and magnesium oxide. By the method, the out-of-band rejection of the far end can be greatly improved, the clutter is pushed to a higher frequency, the interference of the adjacent frequency band is reduced, and the performance stability of the clutter is improved; and the filter has low dielectric constant, low loss and near-zero temperature coefficient, and the dielectric property of the filter can be improved.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to a filter applied to a 5G communications system, a communications device, and a method for manufacturing a dielectric block and a filter.
Background
With the rapid advance of communication technology, especially the coming 5G communication era, more demanding technical requirements are put on the system architecture, and high-efficiency and high-capacity communication is realized, and at the same time, the system module must be highly integrated, miniaturized, light-weighted and low-cost, for example, when the 5G Massive MIMO technology is used to realize system channel further expanding from the current 8 or 16 channels to 32, 64 or 128 channels, the overall system architecture size cannot be too large, and even a certain degree of miniaturization is also required, while the microwave filter is used as the core component of the system, its performance parameters, size and cost all have great influence on the system performance, architecture size and cost, especially, the MIMO system adopts more filter integration applications or the special requirements of the micro base station on the architecture size, and all needs the miniaturized filter to match the system design, therefore, how to miniaturize the size of the filter, facilitate system integration and cost optimization is the most urgent technical requirement for filter products.
The inventor of the application finds that the traditional metal cavity filter and the traditional dielectric filter have low performance such as frequency band interference, out-of-band rejection and the like in the long-term research and development process, and are difficult to adapt to the requirements of the 5G micro base station on the filter.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a filter, a communication device, a method for preparing a dielectric block and a filter, so as to solve the problems.
In order to solve the technical problem, the present application adopts a technical scheme that: there is provided a filter comprising: the dielectric block is provided with N cascaded hollow resonant cavities, and a first window is arranged between the two cascaded hollow resonant cavities; wherein N is a natural number greater than 1; wherein, the material of the filter at least comprises zinc oxide, silicon dioxide and magnesium oxide.
In order to solve the technical problem, the present application adopts a technical scheme that: there is provided a method of preparing a dielectric block, the method for preparing the above dielectric block, the method comprising: providing raw materials corresponding to zinc oxide, silicon dioxide and magnesium oxide; adding an organic solvent and grinding balls and carrying out primary ball milling; drying the slurry obtained by the primary ball milling, and calcining to obtain a ceramic body; crushing the ceramic body, adding an organic solvent and grinding balls, and performing secondary ball milling; drying the slurry obtained by secondary ball milling; mixing the obtained powder with a binder to form slurry, and granulating; dry-pressing and molding in a mold matched with the shape of the dielectric block; and removing the binder and sintering again to obtain the dielectric block.
In order to solve the technical problem, the present application adopts a technical scheme that: there is provided a method of manufacturing a filter, the method being for manufacturing the above filter, the method comprising: providing a dielectric block, wherein the dielectric block is prepared by the method; and covering a metal layer on the surface of the dielectric block to obtain the filter.
In order to solve the technical problem, the present application adopts a technical scheme that: there is provided a communication device comprising the above filter.
The beneficial effects of the embodiment of the application are that: different from the prior art, the filter of the embodiment of the application comprises: the dielectric block is provided with N cascaded hollow resonant cavities, and a first window is arranged between the two cascaded hollow resonant cavities; wherein N is a natural number greater than 1; wherein, the material of the filter at least comprises zinc oxide, silicon dioxide and magnesium oxide. In this way, the resonant cavity of the filter in the embodiment of the application is of a hollow structure, so that far-end out-of-band rejection can be greatly improved, clutter is pushed to higher frequency, adjacent frequency band interference is reduced, and the performance stability of the filter is improved; in addition, the material of the filter at least comprises zinc oxide, silicon dioxide and magnesium oxide, has low dielectric constant, low loss and near-zero temperature coefficient, and can improve the dielectric property of the filter.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic diagram of an embodiment of a filter according to the present application;
FIG. 2 is a schematic diagram of the filter of the embodiment of FIG. 1 taken along section AA';
FIG. 3 is a schematic diagram of the structure of the hollow resonator, the first window and the second window in the filter of FIG. 1;
FIG. 4A is a frequency response curve of a conventional filter;
FIG. 4B is a frequency response curve of the filter of the embodiment of FIG. 1;
FIG. 5 is a schematic flow chart diagram illustrating one embodiment of a method for forming a dielectric block according to the present application;
FIG. 6 is a schematic flow chart diagram of an embodiment of a method for making a filter according to the present application;
FIG. 7 is a schematic block diagram of an embodiment of a communication device of the present application;
figure 8 is a test result of the microwave dielectric properties of the material of the filter of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The microwave filter for communication is composed of a medium resonant cavity and an energy coupling structure, wherein the medium resonant cavity is sealed by all metals and has a certain size and quantity. If the resonant cavity adopts the ceramic material with high dielectric constant to replace the metal material, the effective size of the resonant cavity can be greatly compressed through the compression effect of the ceramic material with high dielectric constant on the microwave wavelength, so that the whole size of the filter is miniaturized, and the ceramic material is easy to mold, so that the batch production with lower cost can be realized, the ceramic filter is highly matched with the technical requirements of a 5G micro base station and an MIMO system, and higher attention and market application in related communication scenes can be obtained.
However, in the current 5G filter, ceramic materials are mainly sintered into a plurality of required ceramic unit modules, the surfaces of the ceramic unit modules are metalized through complex procedures, and then the ceramic unit modules are spliced and positioned by adopting a clamp and then sintered and formed at high temperature.
The above filter scheme has a number of disadvantages: 1) the clutter suppression performance of the filter with the solid ceramic structure is poor; 2) complex processes such as steel mesh silver coating, high-precision positioning and splicing of a clamp, secondary high sintering and the like are required, so that great challenges are brought to production; 3) the ceramic unit modules need to be spliced, key dimensions such as an energy coupling window and the like on the inner side of a splicing surface need to be controlled by steel mesh silk-screen silver paste, the silver paste generates a penetration effect in the printing and sintering processes, and the size precision control difficulty is high due to the limitation of a clamp assembly process and the influence of an operation process, so that the problems of unstable performance, poor consistency and the like in the production of a filter are finally caused; 4) the split splicing of the filters can cause the irregularity of the outer surface, the connection of the filters with front and rear end devices, the arrangement of a plurality of filters of a Massive MIMO system and the like, and meanwhile, the problems of uneven stress, easy breakage, production, processing, installation and the like caused by the irregularity of part of the structure can be caused; 5) the split splicing and forming process of the filter is complex, so that the filter is difficult to produce in mass.
To solve the above problems, the present application first proposes a filter, as shown in fig. 1 to 3, fig. 1 is a schematic structural diagram of an embodiment of the filter of the present application; FIG. 2 is a schematic diagram of the filter of the embodiment of FIG. 1 taken along section AA'; fig. 3 is a schematic structural diagram of a hollow resonant cavity, a first window and a second window in the filter of fig. 1. The filter 101 of the present embodiment includes: the dielectric block 102 is formed with N cascaded hollow resonant cavities 103, a first window 104 is arranged between the two cascaded hollow resonant cavities 103, and the two cascaded hollow resonant cavities 103 are connected through the first window 104; wherein N is a natural number greater than 1.
The filter 101 of the present embodiment has a hollow structure, as shown in fig. 4A and 4B, fig. 4A is a frequency response curve of a conventional filter; fig. 4B is a frequency response curve of the filter of the embodiment of fig. 1, and as can be seen from fig. 4A and 4B, the hollow structure of the filter 101 of this embodiment can greatly improve the far-end out-of-band rejection, push the clutter to a higher frequency, reduce the interference of the adjacent frequency band, and thus can improve the stability of the performance.
The first window 104 of the present embodiment is used to realize the coupling between the two cascaded hollow resonators 103; the width d1 of the first window 104 is smaller than the width d2 of the hollow cavity 103. Of course, in other embodiments, the size of the first window and the size of the hollow resonant cavity may not be limited
Optionally, the dielectric block 102 of the filter 101 of this embodiment is integrally formed, and the processes of split-splicing and secondary sintering forming of a plurality of dielectric blocks are not required, so that the structure and the production process can be simplified.
Alternatively, the material of the dielectric block 102 of the present embodiment may be a ceramic material. In other embodiments, the material of the dielectric block may also be other materials with high dielectric constant and low loss, such as glass, quartz crystal, or titanate.
Optionally, the two non-cascaded hollow resonant cavities 103 of the present embodiment are provided with a second window 105, and the two non-cascaded hollow resonant cavities 103 are connected through the second window 105, so as to implement cross coupling between the two non-cascaded hollow resonant cavities 103.
The second window 105 may implement a zero of the passband of the filter 101 to achieve better out-of-band rejection, etc.
Optionally, the height h1 of the second window 105 of the present embodiment is smaller than the height h2 of the hollow cavity 103; the width d3 of the second window 105 is smaller than the width d2 of the hollow cavity 103. Of course, in other embodiments, the size of the second window may not be limited to the size of the hollow cavity.
Optionally, in the embodiment, evanescent wave coupling is adopted between the two cascaded hollow resonators 103 and the two non-cascaded hollow resonators 103, so that window coupling accuracy can be improved.
Of course, in other embodiments, evanescent coupling may be selectively coupled between the two hollow resonators.
Optionally, the filter 101 of this embodiment further includes an input terminal 106 and an output terminal 107, where the input terminal 106 is connected to the first hollow cavity 103, and the output terminal 107 is connected to the nth hollow cavity 103.
Optionally, the input terminal 106 of the present embodiment includes a first probe 108, an end of the first probe 108 penetrates through the dielectric block 102 to the first hollow cavity 103, the output terminal 107 includes a second probe 109, and an end of the second probe 109 penetrates through the dielectric block 102 to the nth hollow cavity 103.
Optionally, N of the present embodiment is 8, wherein a second window 105 is disposed between the 3 rd hollow resonant cavity 103 and the 6 th hollow resonant cavity 103. Of course, in another embodiment, a second window may be disposed between other non-cascaded two hollow resonators, for example, a second window may be disposed between 1 hollow resonator and the 4 th hollow resonator, or a second window may be disposed between 5 hollow resonators and the 8 th hollow resonator.
Optionally, as shown in fig. 1, the filter 101 of this embodiment further includes a metal layer 110, and the metal layer 110 covers an outer surface of the dielectric block 102 to implement a completely enclosed electromagnetic field transmission structure.
The material of the metal layer 110 in this embodiment may be a metal material or an alloy, such as copper, silver, tin, or aluminum.
It should be noted that N in the present application may also be other natural numbers greater than 1; the N hollow resonant cavities can also realize filters with other topological structures; other arrangement modes can be realized for the N hollow resonant cavities; the hollow resonant cavity can also adopt other forms, such as U-shaped, N-shaped, C-shaped and the like.
The position and size of the first window and the second window are not limited to the above embodiments, and may be adjusted according to the actual electrical performance of the filter.
The cross-coupling (coupling between non-adjacent hollow resonators) topology of the present application is not limited to the coupling of the above-described embodiments, and may be cross-coupling between any two non-adjacent hollow resonators, cross-coupling between an input terminal and an output terminal, and cross-coupling between an input terminal or an output terminal and a certain hollow resonator.
The input/output terminals of the present application are not limited to be provided on the upper and lower surfaces of the dielectric block, and may be provided on the side surface of the dielectric block.
The input/output terminal of the present application is not limited to the above-described probe structure, but may also be a planar printed PCB, a microstrip line, or the like.
The material of the filter disclosed in the above embodiment may be ceramic, and the ceramic includes zinc oxide, silicon dioxide, and magnesium oxide. I.e., the ceramic consists essentially of the above-described components, it is understood that the ceramic may also contain small or trace amounts of other substances.
In some embodiments, the zinc oxide is present in a molar percentage of 20% to 70%.
In some embodiments, the silica is present in a mole percentage of 20% to 60%.
In some embodiments, the magnesium oxide is present in a molar percentage of 10% to 20%.
Wherein, mole percent refers to the percentage of the amount of the substance. For example, after mixing 1mol of substance a with 4mol of substance B, the molar percentage of substance a is equal to 1/(1+4) 20%, while the molar percentage of substance B is equal to 4/(1+4) 80%.
In some embodiments, the ceramic may further include a modifying additive, i.e., an additive capable of improving the properties of the ceramic. It should be understood that the modifying additive need not be in a liquid form, but may be in a solid form, etc. Specifically, the modifying additive may be CoO, NiO or MnO2That is, the modifying additive may include only CoO, NiO, or MnO2May also include two or three of them. Optionally, the proportion of the modifying additive can be 0-2 mol%. That is, the modifying additive is present in a molar percentage of no more than 2% of the total material.
The chemical composition of the ceramic can be expressed as xZnO-ySiO-zMgO2dMO, wherein the ratio of x, y, z and d is 0.2-0.7: 0.2-0.6: 0.1-0.2: 0-0.02, MO represents the modifying additive. For example, if the values of x, y, z and d are taken as 0.5, 0.3, 0.18 and 0.02, respectively, and CoO is selected as a modifying additive, the chemical composition of the ceramic can be expressed as 0.5ZnO-0.3SiO-0.18MgO20.02 CoO. Of course, the values of x, y, z and d may take other values within this range. The microwave dielectric properties of the ceramic can be further adjusted by varying the proportions between the chemical components of the ceramic.
According to the test results, the dielectric constant of the ceramic is 7 to 8, and the Q f value is 9000 to 105000 GHz. The microwave dielectric properties of the ceramic were tested at a test frequency of 12GHz, for example, using a network analyzer (Agilent 5071C), resulting in the test results shown in fig. 8.
The ceramics provided herein consist essentially of zinc oxide, silicon dioxide, and magnesium oxide, which have low dielectric constants, low losses, and near-zero temperature coefficients. Thus, the ceramics provided by the practice of the present application have improved dielectric properties of the filter.
The present application further provides a method for manufacturing a dielectric block, in which the dielectric block disclosed in the above embodiments is manufactured by the method for manufacturing a dielectric block, as shown in fig. 5, the method for manufacturing a dielectric block includes the following steps:
s501: raw materials corresponding to zinc oxide, silica and magnesium oxide are provided.
In some embodiments, the raw materials corresponding to zinc oxide, silica, and magnesium oxide may be oxides or carbonates of the corresponding metal elements. Wherein the oxides of the metal elements directly correspond to the components of the dielectric block to be produced, while carbonates of some metal elements can be converted into oxides of the metal elements under the conditions of heating and the like, and thus can also be used as raw materials. In other embodiments, the starting material may also be an alcoholate of the corresponding metal element, in which case the alcoholate of the metal may be converted to the desired oxide using a suitable chemical treatment. The specific method is well known in the art and will not be described herein.
In this embodiment, the molar percentage of the raw material corresponding to zinc oxide is 20 to 70%, the molar percentage of the raw material corresponding to silicon dioxide is 20 to 60%, and the molar percentage of the raw material corresponding to magnesium oxide is 10 to 20%. It should be understood that the above mole percentages refer to mole percentages after removal of impurities in the raw materials.
In this embodiment, raw materials may be prepared in accordance with the proportions of the components of the dielectric block. When the mole percentage of each component is known, the required mass of the raw material can be calculated according to parameters such as the molecular weight of each component, the purity of the raw material and the like. The mass required by each component is calculated according to the required mole number and molecular weight of each component, and the required mass of the raw material is calculated according to the required mass of each component and the purity of the raw material. This makes it possible to prepare raw materials of corresponding weights based on the results of the calculation.
In some embodiments, modifying additives may also be added to the raw materials. The modifying additive may be CoO, NiO or MnO2One or more of the above. The proportion of modifying additive to the total number of moles of all raw materials should generally not exceed 2%.
S502: adding an organic solvent and grinding balls and carrying out primary ball milling.
In step S502, deionized water, alcohol, acetone, etc. may be used as the organic solvent, zirconium balls, agate balls, etc. may be used as the grinding balls, and ceramic, polyurethane, nylon, etc. may be used in the grinding tank, and planetary mill, stirring mill, tumbling mill, vibrating mill, etc. may be used for the first ball milling. Wherein, in order to improve the ball milling effect, proper dispersant can be added or the pH value of the slurry can be adjusted.
In some embodiments, deionized water may be used as the organic solvent, and ZrO may be used2A grinding ball made of the material. In step S502, accurately weighed raw materials are poured into a ball mill pot, and deionized water and ZrO are added2Grinding balls, wherein the weight ratio of the raw materials to the deionized water to the grinding balls is 1:1.5:4, and performing ball milling for 4 hours.
S503: and drying the slurry obtained by the primary ball milling, and calcining to obtain the ceramic body.
And (3) uniformly mixing the ball-milled materials, discharging and drying, for example, drying the materials at 100-120 ℃.
After the ball milling is finished and the mixture obtained after drying is required to be calcined at a certain temperature to synthesize the ceramic body, wherein the calcining temperature and the heat preservation time depend on the corresponding formula. For example, in this embodiment, the slurry dried after ball milling may be calcined at 900 to 1050 ℃ for 2 to 8 hours to synthesize a ceramic body.
S504: and (3) crushing the ceramic body, adding an organic solvent and grinding balls, and carrying out secondary ball milling.
The synthesized ceramic body is pulverized. The method of pulverization is not limited in the present application, and for example, it may be pulverized using a pulverizer. In some embodiments, the crushed ceramic body may also be sieved (e.g., 40 mesh).
And pouring the crushed ceramic body into the ball milling tank again for secondary ball milling, wherein the process of the secondary ball milling can be similar to that of the primary ball milling. For example, the pulverized ceramic body may be ball milled for a second time for 24 hours while maintaining the ratio of the material, alcohol and grinding balls constant. It should be understood that the process of the second ball milling may be different from the first ball milling, for example, the time of the second ball milling may be shorter (or longer) than that of the first ball milling, and is not limited herein.
S505: and drying the slurry obtained by secondary ball milling.
Similarly, the ball-milled materials can be uniformly mixed, discharged and dried. In some embodiments, the dried slurry may also be screened (e.g., through a 40 mesh screen).
S506: mixing the obtained powder with a binder to form slurry, and granulating.
In some embodiments, the binder may be a 5 wt% polyvinyl alcohol solution (i.e., the polyvinyl alcohol in the binder is 5 wt%). The binder may account for 15% of the total mass of the mixed slurry.
In some embodiments, the granulated powder may also be sieved (e.g., 40 mesh).
S507: and (4) carrying out dry pressing forming in a die matched with the shape of the medium block.
Specifically, the granulated powder is placed in a mold matching the shape of the dielectric block, and is dry-pressed under a suitable pressure, for example, the powder may be dry-pressed under a pressure of 100 to 150 MPa.
In other embodiments, the shape of the mold may be selected as desired, for example, if testing is desired, a test-specific mold may be used to dry-press the powder into a round piece of phi 10 × 4.5.5 mm for ease of testing.
S508: the binder is removed and sintered again to obtain the dielectric block.
The temperature may be selected to be a suitable temperature for the heat preservation process to remove the binder introduced in step S506, and then the binder is sintered again to finally obtain the desired dielectric block. Specifically, in this embodiment, the molded material may be heat-preserved at 400-700 ℃ for 2-10 hours, and then sintered at 1100-1250 ℃ for 2-10 hours (e.g., sintered at 1150 ℃ for 2 hours). In this way, the adhesive added to the material in step S706 can be removed and a dielectric block of a desired shape can be obtained.
The present application further provides a method for manufacturing a filter according to a first embodiment, in which the filter disclosed in the above embodiment is manufactured by the method for manufacturing a filter, as shown in fig. 6, the method includes the following steps:
s601: a dielectric block is provided.
The dielectric block is prepared by the above-described method of preparing a dielectric block, i.e., the dielectric block prepared by the above-described steps S501 to S508. Wherein, the shape of the dielectric block is the same as the preset shape of the filter.
S602: and covering a metal layer on the surface of the dielectric block to obtain the filter.
The surface of the dielectric block is covered with a metal layer, so that an electromagnetic field is limited in the dielectric block, and the electromagnetic signal is prevented from leaking. The metal layer may be made of silver, copper, aluminum, titanium, tin or gold, and the metal layer may be coated on the surface of the dielectric block by electroplating, spraying or welding. .
The present application further provides a communication device, as shown in fig. 7, fig. 7 is a schematic structural diagram of an embodiment of the communication device of the present application. The communication device 701 of the present embodiment includes a filter 702.
The filter 702 of this embodiment is the filter of the above embodiments, and details about the structure and the operation principle of the filter 702 are omitted here.
Different from the prior art, the filter of the embodiment of the application comprises: the dielectric block is provided with N cascaded hollow resonant cavities, and a first window is arranged between the two cascaded hollow resonant cavities; wherein N is a natural number greater than 1. Through the mode, the resonant cavity of the filter is of the hollow structure, out-of-band rejection of the far end can be greatly improved, clutter is pushed to higher frequency, adjacent frequency band interference is reduced, and performance stability is improved.
In addition, the dielectric block of the filter is integrally formed, and a plurality of independent ceramic resonance modules do not need to be spliced, so that the structure and the production process of the filter can be simplified.
In addition, the method and the device can avoid the influence of a complex structure forming process on the electrical performance of the filter, reduce the sensitivity of the structure size to the performance, greatly improve the yield and efficiency of batch production, and realize the debugging-free, large-scale and low-cost production benefits of products; the method adopts evanescent mode coupling, can avoid the precision problem caused by window splicing, has diversified topological connection forms among the hollow resonant cavities, is easy to realize cross coupling and improve the frequency selection performance of the filter, has the size completely controlled by a forming die, avoids complex surface metallization and positioning clamping processes after forming, and has controllable size precision; the application can solve the problem of product batch, effectively reduce the production cost of the product and further promote the product competitiveness.
It should be noted that the above embodiments belong to the same inventive concept, and the description of each embodiment has a different emphasis, and reference may be made to the description in other embodiments where the description in individual embodiments is not detailed.
The protection circuit and the control system provided by the embodiment of the present application are described in detail above, and a specific example is applied in the description to explain the principle and the embodiment of the present application, and the description of the above embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A filter, characterized in that the filter comprises:
the dielectric block is provided with N cascaded hollow resonant cavities, and a first window is arranged between the two cascaded hollow resonant cavities;
wherein N is a natural number greater than 1;
wherein the material of the filter at least comprises zinc oxide, silicon dioxide and magnesium oxide.
2. The filter of claim 1, wherein the zinc oxide accounts for 20-70% of the mole percentage; the mole percentage of the silicon dioxide is 20-60%; the magnesium oxide accounts for 10 to 20 percent of the molar percentage.
3. The filter of claim 1, wherein the material of the filter further comprises a modifying additive, and the modifying additive is 0 to 2 mol%.
4. The filter according to claim 1, wherein two of said hollow resonator cavities that are not cascaded are provided with a second window; the height of the second window is smaller than that of the hollow resonant cavity.
5. The filter of claim 4, further comprising an input terminal and an output terminal, wherein the input terminal is connected to a first one of the hollow resonator cavities and the output terminal is connected to an Nth one of the hollow resonator cavities;
the N is 8; the second window is arranged between the 3 rd hollow resonant cavity and the 6 th hollow resonant cavity.
6. The filter according to claim 4, wherein the two cascaded hollow resonant cavities and/or the two non-cascaded hollow resonant cavities are coupled by evanescent mode.
7. The filter of claim 3, wherein the filter has a chemical composition of xZnO-ySiO-zMgO2dMO, wherein the ratio of x, y, z and d is 0.2-0.7: 0.2-0.6: 0.1-0.2: 0-0.02, MO represents the modifying additive.
8. A method of making a dielectric block, wherein the method is used to make a dielectric block according to any of claims 1-7, the method comprising:
providing raw materials corresponding to zinc oxide, silicon dioxide and magnesium oxide;
adding an organic solvent and grinding balls and carrying out primary ball milling;
drying the slurry obtained by the primary ball milling, and calcining to obtain a ceramic body;
crushing the ceramic body, adding an organic solvent and grinding balls, and performing secondary ball milling;
drying the slurry obtained by the secondary ball milling;
mixing the obtained powder with a binder to form slurry, and granulating;
dry-pressing and molding in a mold matched with the shape of the dielectric block; and
removing the binder and sintering again to obtain the dielectric block.
9. A method of making a filter, the method being for making a filter according to any one of claims 1 to 7, the method comprising:
providing a dielectric block prepared by the method of claim 8;
and covering a metal layer on the surface of the dielectric block to obtain the filter.
10. A communication device, characterized in that it comprises a filter according to any of claims 1-7.
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Cited By (1)
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| CN113314818A (en) * | 2021-07-29 | 2021-08-27 | 中兴通讯股份有限公司 | Multimode dielectric filter |
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| CN113314818B (en) * | 2021-07-29 | 2021-11-05 | 中兴通讯股份有限公司 | Multimode dielectric filter |
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