CN111383999B

CN111383999B - Sensor manufacturing method and sensor

Info

Publication number: CN111383999B
Application number: CN202010215690.8A
Authority: CN
Inventors: 邱文瑞; 王德信; 刘兵
Original assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Current assignee: Qingdao Goertek Intelligent Sensor Co Ltd
Priority date: 2020-03-24
Filing date: 2020-03-24
Publication date: 2022-11-22
Anticipated expiration: 2040-03-24
Also published as: CN111383999A

Abstract

The invention discloses a sensor manufacturing method and a sensor, wherein the manufacturing method comprises the following steps: arranging a first dielectric layer on the upper surface of a substrate, and arranging a second dielectric layer on the lower surface of the substrate; arranging a through hole penetrating through the substrate, the first dielectric layer and the second dielectric layer; removing the first medium layer, and arranging a waterproof breathable film on the upper surface of the substrate corresponding to the through hole; and arranging a third dielectric layer on the upper surface of the substrate, and removing the third dielectric layer corresponding to the through hole. The invention can effectively avoid the falling of the waterproof breathable film and ensure the waterproof effect of the sensor.

Description

Sensor manufacturing method and sensor

Technical Field

The invention relates to the technical field of sensor packaging, in particular to a sensor manufacturing method and a sensor.

Background

Present sensor is various, and the needs of a lot of sensors guarantee that external air can pierce through inside the sensor, but need avoid moisture infiltration to the sensor again simultaneously, for this reason has waterproof ventilated membrane at the bleeder vent of sensor corresponds the position and has attached, but because waterproof ventilated membrane sets up in the sensor outside, drops easily, leads to the sensor to lose water-proof effects.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

Disclosure of Invention

Based on this, to the problem that waterproof ventilated membrane drops easily, leads to the sensor to lose water-proof effects, it is necessary to provide a sensor manufacturing method and sensor, aims at effectively avoiding waterproof ventilated membrane to drop, guarantees the water-proof effects of sensor.

In order to achieve the above object, the present invention provides a method for manufacturing a sensor, the method comprising:

arranging a first dielectric layer on the upper surface of a substrate, and arranging a second dielectric layer on the lower surface of the substrate;

arranging a through hole penetrating through the substrate, the first dielectric layer and the second dielectric layer;

removing the first medium layer, and arranging a waterproof breathable film at a position, corresponding to the through hole, on the upper surface of the substrate;

and arranging a third dielectric layer on the upper surface of the substrate, and removing the third dielectric layer corresponding to the through hole.

Optionally, the step of providing a through hole penetrating through the substrate, the first dielectric layer, and the second dielectric layer includes:

selecting a first position, removing the first dielectric layer corresponding to the first position on the upper surface of the substrate, and removing the second dielectric layer corresponding to the first position on the lower surface of the substrate through photoetching, positioning and exposure;

and removing the substrate corresponding to the first position to form a through hole penetrating through the substrate, the first dielectric layer and the second dielectric layer.

Optionally, the substrate is a conductive substrate;

before the step of removing the first dielectric layer and arranging the waterproof breathable film at the position, corresponding to the through hole, of the upper surface of the substrate, the method comprises the following steps of:

and arranging a dividing structure to divide the substrate into a plurality of conductive areas.

Optionally, the dividing structure comprises a first dividing structure and a second dividing structure, and the plurality of conductive regions comprise a first conductive region and a second conductive region;

the step of providing a dividing structure to divide the substrate into a plurality of conductive regions comprises:

selecting a second position and a third position, and removing the first dielectric layer corresponding to the second position and the third position by adopting photoetching positioning exposure;

and removing the substrate at the second position and the third position by adopting chemical wet etching to form the first division structure and the second division structure, wherein the substrate is divided into the first conductive area and the second conductive area by the first division structure and the second division structure.

Optionally, after the step of providing the third dielectric layer on the upper surface of the substrate, the method includes:

setting a selected first wiring position on one side of the third dielectric layer of the substrate corresponding to the first conductive area, setting a selected second wiring position corresponding to the second conductive area, and removing the third dielectric layer at the first wiring position and the second wiring position;

and selecting a first conduction position on one side of the second dielectric layer of the substrate corresponding to the first conduction region, selecting a second conduction position corresponding to the second conduction region, and removing the second dielectric layer corresponding to the first conduction position and the second conduction position.

Optionally, after the step of "disposing a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the through hole position", the method includes:

arranging a first integrated circuit corresponding to the first conductive region and a second integrated circuit corresponding to the second conductive region on the upper surface of the third dielectric layer;

electrically connecting the first integrated circuit and the first conductive region via the first bond bit and electrically connecting the second integrated circuit and the second conductive region via the second bond bit.

Optionally, after the step of electrically connecting the first integrated circuit and the first conductive region through the first wire bit and electrically connecting the second integrated circuit and the second conductive region through the second wire bit, the method further comprises:

and an air pressure sensor or an inertial sensor is arranged on the second integrated circuit, and the air pressure sensor or the inertial sensor is electrically connected with the second integrated circuit.

Optionally, after the step of "providing a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the through hole position", the method further includes:

and a gas sensor is arranged on one side of the third medium layer and corresponds to the waterproof breathable film.

Optionally, after the step of "disposing a third dielectric layer on the upper surface of the substrate", the method further includes:

selecting a first shell attaching region and a second shell attaching region at the edge position of one side of the third medium layer of the substrate, and removing the third medium layer corresponding to the first shell attaching region and the second shell attaching region;

after the step of disposing a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the through hole, the method further includes:

and buckling a shell on one side of the third medium layer of the substrate, wherein the port wall of the shell is inserted in the first shell pasting area and the second shell pasting area.

Further, in order to achieve the above object, the present invention also provides a sensor comprising:

a substrate;

the second dielectric layer is arranged on the lower surface of the substrate;

the third dielectric layer is arranged on the upper surface of the substrate, the substrate is provided with a through hole, and the through hole penetrates through the second dielectric layer and the third dielectric layer; and

the waterproof breathable film covers the through hole, and the waterproof breathable film is arranged between the third medium layer and the substrate.

According to the technical scheme, a first medium layer and a second medium layer are respectively arranged on the upper surface and the lower surface of a substrate, through holes penetrating through the substrate, the first medium layer and the second medium layer are formed, the through holes are used for ventilation, after the first medium layer is removed, a waterproof breathable film is covered at the through holes, and the waterproof breathable film is fixed on the upper surface of the substrate through a third medium layer; the position of the third medium layer corresponding to the through hole is removed, so that the through hole can be smoothly ventilated. According to the technical scheme, the waterproof breathable film is fixed between the substrate and the third medium layer through the third medium layer, so that the waterproof breathable film is effectively prevented from falling off, and the waterproof effect of the sensor is further ensured.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic flow chart of a first embodiment of a sensor manufacturing method according to the present invention;

FIG. 2 is a schematic structural diagram of a substrate, a first dielectric layer and a second dielectric layer according to the present invention;

FIG. 3 is a schematic view of the structure of the present invention with through holes;

FIG. 4 is a schematic diagram of the present invention illustrating the removal of the first dielectric layer;

FIG. 5 is a schematic view of the structure of the waterproof and breathable film according to the present invention;

FIG. 6 is a schematic structural diagram of a third dielectric layer according to the present invention;

FIG. 7 is a schematic flow chart of a second embodiment of a method for manufacturing a sensor according to the present invention;

FIG. 8 is a schematic flow chart of a sensor manufacturing method according to a third embodiment of the present invention;

FIG. 9 is a schematic flow chart of a method for manufacturing a sensor according to a fourth embodiment of the present invention;

FIG. 10 is a schematic flow chart of a fifth embodiment of a method for manufacturing a sensor according to the present invention;

FIG. 11 is a schematic structural diagram of a first wiring bit, a second wiring bit, a first conduction bit, a second conduction bit, a first shell attaching region, a second shell attaching region and a third dielectric layer according to the present invention;

FIG. 12 is a schematic flow chart of a sixth embodiment of a method for manufacturing a sensor according to the present invention;

FIG. 13 is a schematic flow chart of a seventh embodiment of a sensor manufacturing method according to the present invention;

FIG. 14 is a schematic diagram of the present invention with a first integrated circuit, a second integrated circuit, and a gas sensor;

FIG. 15 is a schematic flow chart of a sensor manufacturing method according to an eighth embodiment of the present invention;

FIG. 16 is a schematic view of the present invention with an air pressure sensor or an inertial sensor;

FIG. 17 is a schematic flowchart of a ninth embodiment of a method for manufacturing a sensor in accordance with the present invention;

fig. 18 is a schematic structural view of the housing of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	Substrate	150	Second conductive area
110	A first dielectric layer	20	Through-hole
				120	A second dielectric layer	30	Waterproof breathable film
121	First conducting position	41	First position
				122	Second conducting position	42	Second position
130	A third dielectric layer	43	Third position
				131	First wiring position	51	First integrated circuit
132	Second wiring position	52	Second integrated circuit
				133	First shell region	60	Gas sensor
134	Second shell region	70	Outer casing
				140	First conductive area

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1, a first embodiment of the present invention provides a method for manufacturing a sensor, where the sensor includes a plurality of sensors, and the action principle of the sensor may also be various, such as a MEMS (micro electro mechanical System) microphone, where the MEMS microphone transmits sound to the inside through air, and the sound depends on air propagation, but an electronic component is disposed inside the MEMS microphone, and it is necessary to avoid moisture entering, so that a waterproof breathable film is disposed at a sound transmission port of the MEMS microphone, and the waterproof breathable film is used for isolating moisture and ensuring sound to pass through, and the method includes:

and step S10, arranging a first dielectric layer on the upper surface of the substrate, and arranging a second dielectric layer on the lower surface of the substrate.

Referring to fig. 2, the substrate 10 is mainly used for carrying a sensor, a first dielectric layer 110 is disposed on an upper surface of the substrate 10, and a second dielectric layer 120 is disposed on a lower surface of the substrate 10. The upper surface of the substrate 10 is used for packaging the sensor, and the first dielectric layer 110 and the second dielectric layer 120 are mainly used for protecting the upper and lower surfaces of the substrate 10. The first dielectric layer 110 and the second dielectric layer 120 may be made of the same material or different materials, and the first dielectric layer 110 and the second dielectric layer 120 have better affinity with the upper and lower surfaces of the substrate 10.

And step S20, arranging through holes penetrating through the substrate, the first dielectric layer and the second dielectric layer.

Referring to fig. 3, the through holes 20 are provided to allow air to pass therethrough, thereby ensuring that air can pass through the through holes 20 effectively. The through holes 20 are typically located near the edges of the substrate 10 and the middle of the substrate 10 is used to encapsulate other electronic components.

And S30, removing the first medium layer, and arranging a waterproof breathable film at the position, corresponding to the through hole, of the upper surface of the substrate.

Referring to fig. 4 and 5, the first dielectric layer 110 is removed, and the waterproof and breathable film 30 is disposed at the through hole 20. The interior of the sensor is located above the substrate 10, and the waterproof gas permeable membrane 30 is provided at the position of the through hole 20 corresponding to the upper surface of the substrate 10, whereby it is understood that the waterproof gas permeable membrane 30 is also provided in the interior of the sensor. Thereby avoiding the waterproof ventilated membrane from falling to the outside of the sensor. The waterproof breathable film 30 can be adhered to the through hole 20, and the sectional area of the waterproof breathable film 30 is larger than that of the through hole 20. Ensuring that the waterproof breathable film 30 can completely cover the through hole 20.

And S40, arranging a third dielectric layer on the upper surface of the substrate, and removing the third dielectric layer corresponding to the through hole.

Referring to fig. 6 and 11, in order to further protect the upper surface of the substrate 10, a third dielectric layer 130 is disposed, and the third dielectric layer 130 covers the upper surface of the substrate 10, so as to further improve the firmness of the waterproof breathable film 30, that is, ensure that the waterproof breathable film 30 is tightly attached to the through hole 20. In addition, the third dielectric layer 130 is different from the first dielectric layer 110, the third dielectric layer 130 has a better affinity with the upper surface of the substrate 10, and the third dielectric layer 130 also has a better affinity with the waterproof breathable film 30, so that the waterproof breathable film can be well fixed at the through hole 20.

In the technical solution of this embodiment, the upper and lower surfaces of the substrate 10 are respectively provided with the first dielectric layer 110 and the second dielectric layer 120, the through holes 20 penetrating through the substrate 10, the first dielectric layer 110 and the second dielectric layer 120 are formed, the through holes 20 are used for ventilation, after the first dielectric layer 110 is removed, the through holes 20 are covered with the waterproof breathable film 30, and the waterproof breathable film 30 is fixed on the upper surface of the substrate 10 by the third dielectric layer 130; the position of the third medium layer 130 corresponding to the through hole 20 is removed, so that the through hole 20 can ventilate smoothly. According to the technical scheme, the waterproof breathable film 30 is fixed between the substrate 10 and the third dielectric layer 130 through the third dielectric layer 130, so that the waterproof breathable film 30 is effectively prevented from falling off, and the waterproof effect of the sensor is ensured.

Referring to fig. 7, on the basis of the first embodiment of the present invention, a step S20 of providing a through hole penetrating through the substrate, the first dielectric layer and the second dielectric layer according to a second embodiment of the present invention includes:

step S210, selecting a first position, and removing the first dielectric layer corresponding to the first position on the upper surface of the substrate and the second dielectric layer corresponding to the lower surface of the substrate.

Specifically, referring to fig. 3, a first location 41 is selected, and a photolithographic locating technique is used to remove a first dielectric layer 110 of the substrate 10 and a second dielectric layer 120 of the substrate 10 corresponding to the first location 41. The photoetching positioning technology is a precise fine processing technology, generally uses ultraviolet light as an image information carrier, uses a photoresist technology etching agent as an intermediate medium to realize the transformation, transfer and processing of patterns, and finally transmits the image information to a medium layer. And removing the unmasked dielectric layer surface of the resist film layer by a chemical or physical method, thereby obtaining a pattern consistent with the pattern of the resist film layer on the dielectric layer surface.

In step S220, the substrate corresponding to the first position is removed, and a through hole penetrating through the substrate, the first dielectric layer and the second dielectric layer is formed. Specifically, after the first dielectric layer 110 and the second dielectric layer 120 are removed by chemical wet etching, the surface of the substrate 10 is exposed, and the chemical wet etching is to place an object to be etched in a liquid chemical etching solution for etching, and in the etching process, the etching solution gradually etches and dissolves the material in contact with the object by a chemical reaction. It can be seen that the via hole 20 is efficiently formed by the photolithographic position exposure technique and the chemical wet etching technique.

Referring to fig. 8, a third embodiment of the present invention is proposed on the basis of the first embodiment of the present invention, in which the substrate is a conductive substrate, the upper surface of the conductive substrate is used for mounting various electronic components, and the electronic components transmit signals to the outside through the conductive substrate, for example, the conductive substrate is a copper substrate or a silver substrate.

Removing the first medium layer, and before the step S30 of arranging the waterproof breathable film at the position, corresponding to the through hole, of the upper surface of the substrate, the method comprises the following steps:

step S50, a dividing structure is provided to divide the substrate into a plurality of conductive areas.

A plurality of electronic components, each of which is required to transmit a signal through a respective line, are disposed on the substrate 10, and for this purpose, the conductive substrate is divided according to the number of external electronic components required to be connected, and each of the electronic components is connected to a respective conductive region, and transmits an internal signal to the outside through the conductive region, or receives an external signal through the conductive region. Therefore, the substrate 10 not only has the function of supporting the whole sensor, but also can transmit internal and external signals, and ensures the smooth connection of the internal and external signals.

Referring to fig. 9, a fourth embodiment of the present invention is proposed on the basis of the third embodiment of the present invention, in which the dividing structure includes a first dividing structure (not shown) and a second dividing structure (not shown), for example, the first dividing structure and the second dividing structure are dividing grooves, the plurality of conductive regions include a first conductive region 140 and a second conductive region 150, and the first conductive region 140 and the second conductive region 150 are divided into independent conductive parts through the dividing grooves.

A step S50 of providing a dividing structure to divide the substrate into a plurality of conductive regions, includes:

and step S510, selecting a second position and a third position, and removing the first dielectric layer corresponding to the second position and the third position by adopting photoetching positioning exposure.

Specifically, the second position 42 and the third position 43 may be selected on both sides of the first position 41, or may be selected on the same side as the first position 41. Generally, the first position 41 is selected at the side of the sensor, so that the main electronic components are arranged at the same side of the first position 41, and therefore the second position 42 and the third position 43 are also selected at the same side of the first position 41, thereby ensuring that the electronic components corresponding to the second position 42 and the third position 43 can be connected with the outside through a short signal path.

Step S520, removing the substrate corresponding to the second position and the third position by using chemical wet etching to form a first dividing structure and a second dividing structure, wherein the first dividing structure and the second dividing structure divide the substrate into a first conductive region and a second conductive region.

Specifically, the first division structure and the second division structure may be division grooves, and the specific shapes of the division grooves may be set according to the design requirements of the first conductive region 140 and the second conductive region 150, so that various conductive region patterns with different sizes and complicated shapes may be formed. Likewise, the dividing structures are not limited to only the first dividing structure and the second dividing structure, and may be increased or decreased according to the requirement of the number of the conductive regions.

Referring to fig. 10 and 11, a fifth embodiment of the present invention is proposed on the basis of the fourth embodiment of the present invention, and includes, after the step of disposing the third dielectric layer on the upper surface of the substrate:

in step S410, a first wire connection bit is selected on one side of the third dielectric layer of the substrate corresponding to the first conductive region, a second wire connection bit is selected corresponding to the second conductive region, and the third dielectric layer corresponding to the first wire connection bit and the second wire connection bit is removed.

Specifically, the first contact bit 131 is selected according to the first conductive region 140, and the second contact bit 132 is selected according to the second conductive region 150. A portion of the third dielectric layer 130 corresponding to the upper surface of the first conductive region 140 is removed, exposing a small portion of the upper surface of the first conductive region 140 for connecting to a corresponding electronic device. Similarly, a portion of the third dielectric layer 130 corresponding to the upper surface of the second conductive region 150 is removed, and a small portion of the upper surface of the second conductive region 150 is exposed for connecting a corresponding electronic component. The third dielectric layer 130 may be removed by using a photolithography positioning exposure technique.

In step S420, a first conducting position is selected on one side of the second dielectric layer of the substrate corresponding to the first conducting region, a second conducting position is selected corresponding to the second conducting region, and the second dielectric layer corresponding to the first conducting position and the second conducting position is removed.

Specifically, in order to ensure smooth data transmission of signals, the upper surface of the first conductive region 140 is connected to a corresponding electronic component, and the lower surface of the first conductive region 140 is connected to the outside, that is, the first conducting bit 121 is selected on the lower surface of the first conductive region 140. The upper surface of the second conductive region 150 is connected to a corresponding electronic component, and the lower surface of the second conductive region 150 is connected to the outside, that is, the second conducting bit 122 is selected on the lower surface of the second conductive region 150. The sensor internal signal is transmitted to the outside through the first on bit 121 and the second on bit 122. The removing mode mainly adopts the photoetching positioning exposure technology.

In addition, it should be noted that the selection of the first and

second wire bits

131 and 132, and the selection of the first and second conducting

bits

121 and 122 may be performed separately or simultaneously, that is, the third dielectric layer 130 corresponding to the second and

third positions

42 and 43, and the second dielectric layer 120 corresponding to the first and second conducting

bits

121 and 122 are removed simultaneously by the positioning exposure.

Referring to fig. 12, on the basis of the fifth embodiment of the present invention, a sixth embodiment of the present invention is proposed, in which after the step S40 of disposing a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the through hole, the method includes:

in step S61, a first integrated circuit is disposed on the upper surface of the third dielectric layer corresponding to the first conductive region, and a second integrated circuit is disposed on the upper surface of the third dielectric layer corresponding to the second conductive region.

Specifically, an adhesive is disposed on the upper surface of the third dielectric layer 130 corresponding to the first conductive region 140, and the first integrated circuit 51 is attached to the upper surface of the first conductive region 140. An adhesive is disposed on the upper surface of the third dielectric layer 130 corresponding to the second conductive region 150, and the second integrated circuit 52 is attached to the upper surface of the second conductive region 150. The first integrated circuit 51 and the second integrated circuit 52 may be integrated circuits, and mainly aim to receive signals of corresponding electronic components, process and analyze the signals of the electronic components, and the like.

In step S62, the first integrated circuit and the first conductive area are electrically connected by the first bonding wire, and the second integrated circuit and the second conductive area are electrically connected by the second bonding wire.

Specifically, the first integrated circuit 140 and the first wire bit 131 are connected by means of gold wire bonding, so that the first integrated circuit 51 and the first conductive region 140 are electrically connected together. Similarly, the second integrated circuit 150 and the second connection bit 132 are connected by gold wire bonding, so that the second integrated circuit 52 and the second conductive region 150 are electrically connected together. The main functions of the first integrated circuit 140 and the second integrated circuit 150 are to collect and process data of the corresponding electronic components and to transmit data signals.

Referring to fig. 13, a seventh embodiment of the present invention is proposed on the basis of the sixth embodiment of the present invention, and after the step S62 of electrically connecting the first integrated circuit and the first conductive area through the first wire bit and electrically connecting the second integrated circuit and the second conductive area through the second wire bit, the method further includes:

and S63, arranging an air pressure sensor or an inertial sensor on the second integrated circuit, wherein the air pressure sensor or the inertial sensor is electrically connected with the second integrated circuit.

Specifically, referring to fig. 14, an adhesive is disposed on the second integrated circuit 52, and the air pressure sensor or the inertial sensor is disposed on the adhesive, and the air pressure sensor or the inertial sensor is electrically connected to the second integrated circuit 52 by a gold wire. The barometric sensor or the inertial sensor measures corresponding data and transmits the measurement result to the second integrated circuit 52, the second integrated circuit 52 transmits the measured data to the second conductive area 150 through the second connection bit 132, and the second conductive area 150 transmits a signal to the outside through the second conduction bit 122.

In addition, the invention also provides an embodiment, the waterproof breathable film is arranged between the first dielectric layer and the substrate, the third dielectric layer is arranged on the upper surface of the first dielectric layer, and the first integrated circuit and the second integrated circuit are arranged between the third dielectric layer and the first dielectric layer.

Referring to fig. 15 and 16, on the basis of any one of the first to seventh embodiments of the present invention, an eighth embodiment of the present invention is provided, wherein after the step S40 of disposing a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the through hole, the method further includes:

and step S70, arranging a gas sensor on one side of the third medium layer, wherein the gas sensor is arranged corresponding to the waterproof breathable film.

The surface of the third medium layer 130 corresponding to the through hole 20 is provided with an adhesive, the gas sensor 60 is arranged on the adhesive, and the gas sensor 60 correspondingly measures the air pressure passing through the waterproof breathable film 30 and transmits the measured signal to the outside.

Referring to fig. 17 and 18, a ninth embodiment of the present invention is provided on the basis of any one of the first to seventh embodiments of the present invention, and after the step of disposing the third dielectric layer on the upper surface of the substrate, the method further includes:

step S430, a first shell attaching region and a second shell attaching region are selected at an edge of one side of the third dielectric layer of the substrate, and the third dielectric layer corresponding to the first shell attaching region and the second shell attaching region is removed.

Specifically, the positions of the first shell attaching region 133 and the second shell attaching region 134 are selected and located on the side of the upper surface of the substrate 10, and the third dielectric layer 130 corresponding to the first shell attaching region 133 and the second shell attaching region 134 is removed by a photolithography positioning exposure technique. First and second mounting

locations

133 and 134 are used to provide mounting slots for mounting housing 60.

And arranging a third dielectric layer on the upper surface of the substrate, and after the step S40 of removing the third dielectric layer corresponding to the through hole, further comprising the following steps of:

and S80, buckling a shell on one side of the third medium layer of the substrate, and inserting a port wall of the shell into the first shell pasting area and the second shell pasting area.

Specifically, solder paste is disposed at positions corresponding to the first housing attaching area 133 and the second housing attaching area 134, the housing 70 is inserted into the first housing attaching area 133 and the second housing attaching area 134, and the housing 70 is fixed to the substrate 10 by soldering. The housing 70 is fixed by soldering, and the electronic components in the sensor are effectively protected by the support of the housing 70.

The present invention also provides a sensor comprising: a substrate 10, a second dielectric layer 120, a third dielectric layer 130 and a waterproof breathable film 30.

The second dielectric layer 120 is disposed on the lower surface of the substrate 10; the third dielectric layer 130 is disposed on the upper surface of the substrate 10, the substrate 10 is provided with a through hole 20, and the through hole 20 penetrates through the second dielectric layer 120 and the third dielectric layer 130; the waterproof breathable film 30 covers the through hole 20, and the waterproof breathable film 30 is arranged between the third medium layer 130 and the substrate 10.

According to the technical scheme, the waterproof breathable film 30 is fixed between the substrate 10 and the third dielectric layer 130 through the third dielectric layer 130, so that the waterproof breathable film 30 is effectively prevented from falling off, and the waterproof effect of the sensor is ensured.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of other like elements in a process, method, article, or system comprising the element.

The above-mentioned serial numbers of the embodiments of the present invention are only for description, and do not represent the advantages and disadvantages of the embodiments.

Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention or portions thereof contributing to the prior art may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) as described above and includes several instructions for enabling a terminal device (which may be a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A method of fabricating a sensor, the method comprising:

the substrate is a conductive substrate; arranging a dividing structure, and dividing the substrate into a plurality of conductive areas;

arranging a third dielectric layer on the upper surface of the substrate, and removing the third dielectric layer corresponding to the through hole;

the dividing structure comprises a first dividing structure and a second dividing structure, and the plurality of conductive regions comprise a first conductive region and a second conductive region;

the step of providing a dividing structure to divide the substrate into a plurality of conductive areas comprises:

and removing the substrate at the second position and the third position by adopting chemical wet etching to form the first segmentation structure and the second segmentation structure, wherein the first segmentation structure and the second segmentation structure divide the substrate into the first conductive area and the second conductive area.

2. The method of manufacturing a sensor according to claim 1, wherein the step of providing a via hole through the substrate, the first dielectric layer, and the second dielectric layer comprises:

3. The method of manufacturing a sensor according to claim 1, wherein the step of providing a third dielectric layer on the upper surface of the substrate comprises:

selecting a first wiring position on one side of the third dielectric layer of the substrate corresponding to the first conductive area, selecting a second wiring position corresponding to the second conductive area, and removing the third dielectric layer at the first wiring position and the second wiring position;

4. The method for manufacturing a sensor according to claim 3, wherein the step of providing a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the through hole includes:

the first integrated circuit and the first conductive region are electrically connected by the first bond site, and the second integrated circuit and the second conductive region are electrically connected by the second bond site.

5. The method of manufacturing a sensor of claim 4, wherein said step of electrically connecting said first integrated circuit to said first conductive region via said first bond site and said second integrated circuit to said second conductive region via said second bond site further comprises, after said step of electrically connecting said first integrated circuit to said first conductive region via said second bond site:

and an air pressure sensor or an inertial sensor is arranged on the second integrated circuit and is electrically connected with the second integrated circuit.

6. The method for manufacturing a sensor according to any one of claims 1 to 5, wherein after the step of providing a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the position of the through hole, the method further comprises:

7. The method for manufacturing a sensor according to any one of claims 1 to 5, wherein the step of providing a third dielectric layer on the upper surface of the substrate further comprises:

selecting a first shell attaching area and a second shell attaching area at the edge position of one side of the third medium layer of the substrate, and removing the third medium layer corresponding to the first shell attaching area and the second shell attaching area;

after the step of arranging a third dielectric layer on the upper surface of the substrate and removing the third dielectric layer corresponding to the through hole, the method further comprises the following steps:

8. A sensor, characterized in that the sensor comprises:

a substrate;

the second dielectric layer is arranged on the lower surface of the substrate;

the waterproof breathable film covers the through hole, and is arranged between the third dielectric layer and the substrate;

the substrate is also provided with a dividing structure which divides the substrate into a plurality of conductive areas; the dividing structure includes a first dividing structure and a second dividing structure, and the plurality of conductive regions includes a first conductive region and a second conductive region.