CN111382826A - Anti-transfer electronic tag - Google Patents
Anti-transfer electronic tag Download PDFInfo
- Publication number
- CN111382826A CN111382826A CN201811632236.1A CN201811632236A CN111382826A CN 111382826 A CN111382826 A CN 111382826A CN 201811632236 A CN201811632236 A CN 201811632236A CN 111382826 A CN111382826 A CN 111382826A
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- China
- Prior art keywords
- antenna
- layer
- electronic tag
- transfer electronic
- melting point
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
Abstract
The invention provides an anti-transfer electronic tag, and relates to the technical field of electronic tags. The invention provides an anti-transfer electronic tag, which comprises: a base layer; the antenna layer is positioned on the base layer and comprises a first antenna and a second antenna which are connected with each other; the pin of the chip is connected with the antenna layer; the bottom glue layer is positioned on the antenna layer and one side of the chip far away from the substrate layer; wherein, prevent shifting electronic tags during operation, first antenna and second antenna combined work, cohesion F1 between first antenna and the stratum basale, cohesion F2 between first antenna and the second antenna, satisfy between the cohesion F3 between second antenna and the primer layer: f1 > F2, F3 > F2. According to the technical scheme, the anti-transfer electronic tag is low in cost and good in anti-transfer effect.
Description
Technical Field
The invention relates to the technical field of electronic tags, in particular to an anti-transfer electronic tag.
Background
Radio Frequency Identification (RFID) is a non-contact, automatic identification technology that can identify objects in motion and identify multiple tags simultaneously. The anti-transfer electronic tag is an electronic tag with large demand, when the anti-transfer electronic tag is torn off from an original attached object, the torn electronic tag can not be used continuously, and the anti-transfer electronic tag is widely applied to the tracing of articles such as tobacco, wine, medicines, cosmetics and automobile parts, the maintenance management link in the electronic industry, the novel unmanned retail industry and the like.
The current anti-transfer electronic tag mainly realizes anti-transfer through the following three technologies:
the first method is that an antenna prepared by an ultrathin aluminum foil is hot stamped on the surface of a base material, and then a fragile paper surface material is combined to be packaged into an anti-transfer electronic tag; the second is to print the antenna pattern directly on a fragile substrate using a conductive silver paste. The two schemes need to use the fragile paper plane materiel or the fragile base material, so that the direct material cost is increased, the fragile paper plane materiel or the fragile base material is damaged with high probability in the production, processing and mounting processes of the electronic tag, the cost is further increased, the price of the anti-transfer electronic tag is high, and the large-area popularization and use of the anti-transfer electronic tag are severely limited.
And thirdly, combining the aluminum etching antenna with a low-strength base material except fragile paper such as coated paper and pasting the electronic tag by using a strong back adhesive. When a lawbreaker tries to transfer the electronic tag, a large force is required, which may cause damage to a low-strength substrate such as coated paper, thereby causing the electronic tag to fail. The electronic tag does not need to use fragile paper plane materials or fragile base materials, so that the cost is low, but the anti-transfer effect of the electronic tag is limited, and lawless persons can successfully transfer the electronic tag without damaging the tag by blowing hot air, soaking in a solvent and the like.
Disclosure of Invention
The anti-transfer electronic tag provided by the invention has the advantages that the cost of the anti-transfer electronic tag is lower, and the anti-transfer effect is better.
The invention provides an anti-transfer electronic tag, which adopts the following technical scheme:
the transfer-proof electronic tag comprises:
a base layer;
the antenna layer is positioned on the base layer and comprises a first antenna and a second antenna which are connected with each other;
the pins of the chip are connected with the antenna layer;
the bottom glue layer is positioned on one sides, far away from the substrate layer, of the antenna layer and the chip;
when the anti-transfer electronic tag works, the first antenna and the second antenna work together, the bonding force between the first antenna and the substrate layer is F1, the bonding force between the first antenna and the second antenna is F2, and the bonding force between the second antenna and the primer layer is F3, so that the requirements that: f1 > F2, F3 > F2.
Optionally, a bonding force F1 between the first antenna and the base layer, and a bonding force F4 between the first antenna and the base layer satisfy: f1 > F4; the combination force F3 between the second antenna and the bottom glue layer and the combination force F5 between the second antenna and the base layer satisfy the following conditions: f3 > F5.
Optionally, the second antenna is connected to the first antenna in a plurality of dot structures.
Illustratively, the second antenna is connected to the first antenna in a 3-20 point structure.
The second antennas in a plurality of dot structures are distributed at the connection position of the antenna layer and the chip, and/or at the position of the electromagnetic coupling circuit.
Optionally, the melting point of the first antenna is higher than the operating temperature of the anti-transfer electronic tag, and the melting point of the second antenna is lower than the operating temperature of the anti-transfer electronic tag.
Furthermore, the first antenna is made of liquid metal with a melting point higher than room temperature, a composite material formed by adding functional powder into the liquid metal with the melting point higher than the room temperature, copper foil or aluminum foil after anodic oxidation treatment, and the second antenna is made of liquid metal with a melting point lower than the room temperature.
Further, the liquid metal with the melting point higher than the room temperature is one of bismuth indium tin alloy, indium simple substance, bismuth simple substance, tin simple substance and tin bismuth alloy; the liquid metal with the melting point lower than the room temperature is one of gallium-indium alloy, gallium-indium-tin alloy and gallium-tin alloy.
Optionally, the first antenna and the second antenna have the same thickness; the thickness of the first antenna is 1-10 microns.
Illustratively, the base layer is a PC, the first antenna is a bismuth indium tin eutectic alloy, the second antenna is a gallium tin eutectic alloy, and the primer layer is polyacrylate.
Illustratively, the substrate layer is coated paper, the first antenna is a bismuth-indium-tin eutectic alloy, the second antenna is a gallium-tin eutectic alloy, and the primer layer is polyacrylate.
Illustratively, the base layer is PET, the first antenna is copper foil, the second antenna is gallium indium tin eutectic alloy, and the primer layer is polyurethane.
The invention provides an anti-transfer electronic tag, which comprises a substrate layer, an antenna layer, a chip and a primer layer, wherein the antenna layer comprises a first antenna and a second antenna which are connected with each other, when the anti-transfer electronic tag works, the first antenna and the second antenna need to work together, the bonding force between the first antenna and the substrate layer is F1, the bonding force between the first antenna and the second antenna is F2, and the bonding force between the second antenna and the primer layer is F3: f1 is more than F2, F3 is more than F2, thus when a lawbreaker tries to tear off the anti-transfer electronic tag after the anti-transfer electronic tag is adhered on an object through the bottom glue layer, the first antenna and the second antenna are disconnected, at least part of the first antenna is kept on the basal layer and then is torn off, at least part of the second antenna is kept on the bottom glue layer and is deformed which cannot be recovered, so that the first antenna and the second antenna cannot work together, namely, the antenna layer cannot work, and the anti-transfer electronic tag fails.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an anti-transfer electronic tag according to an embodiment of the present invention;
fig. 2 is a schematic view of an anti-transfer electronic tag according to an embodiment of the present invention attached to an object;
fig. 3 is a schematic diagram illustrating a transferring process of the anti-transfer electronic tag according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a connection manner between a first antenna and a second antenna according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
An embodiment of the present invention provides an anti-migration electronic tag, and specifically, as shown in fig. 1, fig. 1 is a schematic structural diagram of the anti-migration electronic tag provided in the embodiment of the present invention, where the anti-migration electronic tag includes:
a base layer 1;
the antenna layer 2 is positioned on the base layer 1, the antenna layer 2 comprises a first antenna 21 and a second antenna 22 which are connected with each other, and when the anti-transfer electronic tag works, the first antenna 21 and the second antenna 22 work together, namely, the first antenna 21 and the second antenna 22 are not available;
a chip 3, wherein pins of the chip 3 are connected with the antenna layer 2;
the bottom glue layer 4 is positioned on one side, far away from the substrate layer 1, of the antenna layer 2 and the chip 3;
the bonding force F1 between the first antenna 21 and the substrate layer 1, the bonding force F2 between the first antenna 21 and the second antenna 22, and the bonding force F3 between the second antenna 22 and the primer layer 4 satisfy the following conditions: f1 > F2, F3 > F2.
The bonding force mentioned in the embodiment of the invention can be embodied by the anti-peeling strength and the adhesive force.
Certainly, in order to facilitate the use and transportation of the anti-transfer electronic tag, as shown in fig. 1, the anti-transfer electronic tag in the embodiment of the present invention may further include a release paper 5, where the release paper 5 is located on a side of the primer layer 4 away from the antenna layer 2 and the chip 3, as shown in fig. 2, fig. 2 is a schematic view of the anti-transfer electronic tag provided in the embodiment of the present invention being stuck on an object, and when the anti-transfer electronic tag is used, the anti-transfer electronic tag can be stuck on the object through the primer layer 4 only by tearing off the release paper 5.
Since the combination force F1 between the first antenna 21 and the substrate layer 1, the combination force F2 between the first antenna 21 and the second antenna 22, the combination force F3 between the first antenna 21 and the primer layer 4, the combination force F4 between the second antenna 22 and the primer layer 4, and the combination force F5 between the second antenna 22 and the substrate layer 1 satisfy the above relations, when a lawless person attempts to tear off the anti-transfer electronic tag after the anti-transfer electronic tag is attached to an object through the primer layer 4, as shown in fig. 3, fig. 3 is a schematic diagram of a transfer process of the anti-transfer electronic tag provided by an embodiment of the present invention, the first antenna 21 and the second antenna 22 will be disconnected, the first antenna 21 will be at least partially retained on the substrate layer 1 and then torn off, and the second antenna 22 will be at least partially retained on the primer layer 4 and will be deformed so that the first antenna 21 and the second antenna 22 cannot work together, namely, the antenna layer 2 cannot work, and the anti-transfer electronic tag is invalid, so that the anti-transfer electronic tag has a good anti-transfer effect, and the anti-transfer electronic tag does not need to use fragile base materials, so that the cost is low.
In addition, the anti-transfer electronic tag also has the advantages of simple processing technology, high yield, wide applicability of base materials, fixed-point positioning and damage and the like. In addition, the primer layer 4 in the anti-transfer electronic tag in the embodiment of the invention does not need to use a particularly strong primer, the primer is easy to clean, the anti-transfer electronic tag has a wider application range, and the anti-transfer electronic tag can be suitable for scenes needing to be replaced periodically, such as automobile annual inspection marks, fixed asset marks and the like.
Further, the bonding force F1 between the first antenna 21 and the base layer 1 and the bonding force F4 between the first antenna 21 and the primer layer 4 satisfy the following conditions: f1 > F4; the combination force F3 between the second antenna 22 and the bottom glue layer 4 and the combination force F5 between the second antenna 22 and the base layer 1 satisfy the following conditions: f3 > F5, so that when the anti-transfer electronic tag is torn off, the first antenna 21 will remain on the substrate 1 as much as possible or even all of it, and the second antenna 22 will remain on the primer layer 4 as much as possible or even all of it and will deform irrecoverably.
The following embodiments of the present invention will explain in detail the structures included in the anti-migration electronic tag.
Alternatively, the substrate layer 1 in the embodiment of the present invention may be a common substrate such as PET, PI, PVC, PBT, rubber, ABS, coated paper, printing paper, and the like.
Optionally, as shown in fig. 4, in the antenna layer 2 in the embodiment of the present invention, fig. 4 is a schematic diagram illustrating a connection manner of the first antenna and the second antenna provided in the embodiment of the present invention, and the second antenna 22 is connected to the first antenna 21 in a plurality of dot structures, at this time, the first antenna 21 is in surface contact with the substrate layer 1, and the first antenna 21 is in point contact with the second antenna 22, so that a bonding force F1 between the first antenna 21 and the substrate layer 1 can be achieved, and the bonding force F2 between the first antenna 21 and the second antenna 22 can more easily satisfy F1 > F2. The second antenna 22 may be connected to the first antenna 21 in one or more dot structures, preferably 3-20, so that even if one or more dot structures are not separated from the first antenna 21 during the process of tearing off the anti-transfer electronic tag, other dot structures may still be separated from the first antenna 21, thereby ensuring the anti-transfer effect.
Generally, an antenna of an electronic tag is composed of an electromagnetic coupling circuit and an electromagnetic reflection circuit, the former determines whether a chip in the electronic tag works, and the latter determines the distance of signal transmission, based on which, in the embodiment of the present invention, a plurality of second antennas 22 in a dot structure are selected to be distributed at the connection of the antenna layer 2 and the chip 3, and/or at the position of the electromagnetic coupling circuit, so that on one hand, the chip cannot work after the second antennas 22 are separated from the first antennas 21, and the anti-transfer effect is achieved, on the other hand, the significant change of impedance of the antenna layer 2 caused by the fact that the second antennas 22 are connected to the first antennas 21 in other ways can be avoided, and no adverse effect on the communication distance can be generated.
Optionally, in the embodiment of the present invention, the melting point of the first antenna 21 is higher than the operating temperature of the anti-transfer electronic tag, and the melting point of the second antenna 22 is lower than the operating temperature of the anti-transfer electronic tag, so that the relationship between the bonding force F1 between the first antenna 21 and the substrate layer 1, the bonding force F2 between the first antenna 21 and the second antenna 22, the bonding force F4 between the first antenna 21 and the primer layer 4, the bonding force F3 between the second antenna 22 and the primer layer 4, and the bonding force F5 between the second antenna 22 and the substrate layer 1 more easily satisfy the relationship of F1 > F2, F1 > F4, F3 > F2, and F3 > F5. For the anti-transfer electronic tag used at room temperature, in the embodiment of the present invention, the melting point of the first antenna 21 is selected to be higher than room temperature, and the melting point of the second antenna 22 is selected to be lower than room temperature.
The material of the first antenna 21 and the material of the second antenna 22 may be a single substance or an alloy satisfying the above conditions. Of course, the first antenna 21 or the second antenna 22 may be a composite material to which functional powder (for example, conductive filler) is added.
In a first example, the first antenna 21 is made of a liquid metal (melting point is below 300 ℃) with a melting point higher than room temperature, such as one of bismuth indium tin alloy, indium simple substance, bismuth simple substance, tin simple substance, and tin bismuth alloy, and the second antenna 22 is made of a liquid metal with a melting point lower than room temperature, such as gallium indium alloy, gallium indium tin alloy, gallium tin alloy, and the like.
In a second example, the first antenna 21 is made of a composite material in which functional powder is added to a liquid metal having a melting point higher than room temperature, and the second antenna 22 is made of a liquid metal having a melting point lower than room temperature.
In a third example, the material of the first antenna 21 is an aluminum foil after anodic oxidation treatment, and the material of the second antenna 22 is a liquid metal having a melting point lower than room temperature.
In a fourth example, the first antenna 21 is made of copper foil, and the second antenna 22 is made of liquid metal having a melting point lower than room temperature.
Optionally, in the embodiment of the present invention, the thicknesses of the first antenna 21 and the second antenna 22 are the same, so that the thickness of the antenna layer 2 is the same, the electrical connection between the first antenna 21 and the second antenna 22 is better, and the electrical performance of the antenna layer 2 is better. Preferably, the thickness of the first antenna 21 is 1 to 10 micrometers, and the thickness of the second antenna 22 is 1 to 10 micrometers, so that the first antenna 21 and the second antenna 22 have good electrical properties and are easy to manufacture.
Alternatively, the chip 3 may be connected to the first antenna 21 in the antenna layer 2, or may be connected to the second antenna 22, and in addition, the connection between the chip 3 and the antenna layer 2 may be reinforced by a common fixing adhesive or an anisotropic conductive adhesive. When the melting point of the first antenna 21 is higher than the room temperature and the melting point of the second antenna 22 is lower than the room temperature, the chip 3 is connected with the second antenna 22, so that the pin of the chip 3 can be immersed in the second antenna 22, and the two can be electrically connected well. At this time, the connection between the chip 3 and the antenna layer 2 may be reinforced by using a common fixing adhesive without using an anisotropic conductive adhesive with a high cost.
Optionally, the primer layer 4 in the embodiment of the present invention is a double-sided primer layer, one side of which is directly attached to the antenna layer 2 and the chip 3, and the other side of which is used for attaching the anti-transfer electronic tag to an object, and the operation is simple and the use is convenient. Illustratively, the primer layer is a polyurethane or polyacrylate.
Preferably, the bonding force F1 between the first antenna 21 and the substrate layer 1, the bonding force F2 between the first antenna 21 and the second antenna 22, and the bonding force F3 between the second antenna 22 and the primer layer 4 satisfy F1-F2 ≥ 9N/cm and F3-F2 ≥ 4N/cm, so that the anti-transfer electronic tag can better achieve the anti-transfer effect.
The embodiment of the invention provides an anti-transfer electronic tag, which comprises a substrate layer 1, an antenna layer 2, a chip 3 and a primer layer 4, wherein the antenna layer 2 comprises a first antenna 21 and a second antenna 22 which are connected with each other, when the anti-transfer electronic tag works, the first antenna 21 and the second antenna 22 need to work together, the bonding force between the first antenna 21 and the substrate layer 1 is F1, the bonding force between the first antenna 21 and the second antenna 22 is F2, and the bonding force between the second antenna 22 and the primer layer 4 is F3: f1 is greater than F2, F3 is greater than F2, so that when a lawbreaker tries to tear off the anti-transfer electronic tag after the anti-transfer electronic tag is adhered to an object through the primer layer 4, the first antenna 21 and the second antenna 22 are disconnected, at least part of the first antenna 21 remains on the substrate layer 1 and is then torn off, and at least part of the second antenna 22 remains on the primer layer 4 and is deformed irrecoverably, so that the first antenna 21 and the second antenna 22 cannot work together, that is, the antenna layer 2 cannot work, and the anti-transfer electronic tag fails.
In order to facilitate a person skilled in the art to better understand and implement the anti-transfer electronic tag in the embodiment of the present invention, several specific embodiments are provided in the following embodiments of the present invention.
Example 1
| Structure of the product | Material | Thickness (micron) |
| Base layer | PC | 100 |
| First antenna | Bismuth indium tin eutectic alloy | 15 |
| Second antenna | Gallium-tin eutectic alloy | 15 |
| Primer layer | Polyacrylate | 40 |
After the anti-transfer electronic tag is torn off, the first antenna is partially remained on the basal layer, the part of the first antenna is remained on the primer layer, the second antenna is completely remained on the primer layer, the basal layer is peeled off from the primer layer, the antenna layer is broken, and the anti-transfer electronic tag is invalid.
Example 2
The first antenna is partially remained on the substrate layer, the part of the first antenna is remained on the primer layer, the second antenna is completely remained on the primer layer, the substrate layer is peeled off from the primer layer, the antenna layer is broken, and the anti-transfer electronic tag is out of work.
Example 3
| Structure of the product | Material | Thickness (micron) |
| Base layer | PET | 150 |
| First antenna | Copper foil with back adhesive | 15 |
| Second antenna | Gallium indium tin eutectic alloy | 15 |
| Primer layer | Polyurethane | 30 |
The first antenna is partially remained on the substrate layer, the part of the first antenna is remained on the primer layer, the second antenna is completely remained on the primer layer, the substrate layer is peeled off from the primer layer, the antenna layer is broken, and the anti-transfer electronic tag is out of work.
The peel strength and adhesion tests above were referenced to the following criteria: peel resistance Standard GBT2792-2014 adhesion test Standard GBT 5210-2006.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An anti-transfer electronic tag, comprising:
a base layer;
the antenna layer is positioned on the base layer and comprises a first antenna and a second antenna which are connected with each other;
the pins of the chip are connected with the antenna layer;
the bottom glue layer is positioned on one sides, far away from the substrate layer, of the antenna layer and the chip;
when the anti-transfer electronic tag works, the first antenna and the second antenna work together, the bonding force between the first antenna and the substrate layer is F1, the bonding force between the first antenna and the second antenna is F2, and the bonding force between the second antenna and the primer layer is F3, so that the requirements that: f1 > F2, F3 > F2.
2. The anti-transfer electronic tag according to claim 1, wherein a bonding force F1 between the first antenna and the substrate layer and a bonding force F4 between the first antenna and the primer layer satisfy: f1 > F4; the combination force F3 between the second antenna and the bottom glue layer and the combination force F5 between the second antenna and the base layer satisfy the following conditions: f3 > F5.
3. The anti-transfer electronic tag according to claim 1 or 2, wherein the second antenna is connected to the first antenna in a plurality of dot structures.
4. The anti-transfer electronic tag according to claim 3, wherein the second antennas in a plurality of dot structures are distributed at the connection between the antenna layer and the chip and/or at the position of the electromagnetic coupling circuit.
5. The anti-transfer electronic tag according to claim 3, wherein the second antenna is connected to the first antenna in a 3-20 point structure.
6. The anti-transfer electronic tag according to claim 1, wherein the first antenna has a melting point higher than an operating temperature of the anti-transfer electronic tag, and the second antenna has a melting point lower than the operating temperature of the anti-transfer electronic tag.
7. The anti-transfer electronic tag according to claim 6, wherein the first antenna is made of a liquid metal having a melting point higher than room temperature, a composite material formed by adding functional powder to the liquid metal having a melting point higher than room temperature, a copper foil, or an aluminum foil after anodic oxidation treatment, and the second antenna is made of a liquid metal having a melting point lower than room temperature.
8. The anti-transfer electronic tag according to claim 7, wherein the liquid metal with a melting point higher than room temperature is one of bismuth indium tin alloy, indium simple substance, bismuth simple substance, tin bismuth alloy; the liquid metal with the melting point lower than the room temperature is one of gallium-indium alloy, gallium-indium-tin alloy and gallium-tin alloy.
9. The anti-transfer electronic tag according to claim 6, wherein the substrate layer is PC, the first antenna is a bismuth-indium-tin eutectic alloy, the second antenna is a gallium-tin eutectic alloy, and the primer layer is polyacrylate; or the substrate layer is coated paper, the first antenna is bismuth-indium-tin eutectic alloy, the second antenna is gallium-tin eutectic alloy, and the primer layer is polyacrylate; or the basal layer is PET, the first antenna is copper foil, the second antenna is gallium indium tin eutectic alloy, and the primer layer is polyurethane.
10. The anti-transfer electronic tag according to claim 1, wherein the first antenna and the second antenna have the same thickness; the thickness of the first antenna is 1-10 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811632236.1A CN111382826A (en) | 2018-12-29 | 2018-12-29 | Anti-transfer electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811632236.1A CN111382826A (en) | 2018-12-29 | 2018-12-29 | Anti-transfer electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111382826A true CN111382826A (en) | 2020-07-07 |
Family
ID=71220503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811632236.1A Pending CN111382826A (en) | 2018-12-29 | 2018-12-29 | Anti-transfer electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111382826A (en) |
-
2018
- 2018-12-29 CN CN201811632236.1A patent/CN111382826A/en active Pending
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