CN111381642A

CN111381642A - Double-backboard structure and electronic equipment applying same

Info

Publication number: CN111381642A
Application number: CN202010356484.9A
Authority: CN
Inventors: 陈亚旭; 薛媛
Original assignee: Celestica Technology Consultancy Shanghai Co Ltd
Current assignee: Celestica Technology Consultancy Shanghai Co Ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-07-07

Abstract

The invention provides a double-backboard structure and electronic equipment using the same, wherein the double-backboard structure comprises: the first back plate is provided with a hollow area, and the front surface of the first back plate is provided with at least one connector which is used for being connected with a connector corresponding to a second assembly surface on the main board of the control module; the front surface of the second back plate is provided with at least one connector used for being connected with a connector corresponding to the first assembly surface on the main board of the control module, and the back surface is provided with a plurality of hard disk connectors used for being connected with the hard disk module; and at least one connector on the front surface of the second back plate is connected with a connector corresponding to the first assembly surface on the main board of the control module through the hollow area of the first back plate. The double-backboard structure can improve the number of the interconnected signal wires between the control modules on the premise of not increasing the width and the length of the case, effectively improve the fan-out density of the backboard signal wires near the connector and is beneficial to reducing the number of layers of required circuit boards.

Description

Double-backboard structure and electronic equipment applying same

Technical Field

The invention relates to the technical field of servers or memories, in particular to the technical field of backplanes.

Background

For a server or a storage with dual control modules, there is a common layout mode: two control modules, one side by side left to right in the chassis, are shown in fig. 1 as a top view of a dual control module (control module 21, control module 22) server system side by side left to right. Typically, the servers or memories of the two control modules, side-by-side, are connected together by a backplane that bridges the different modules in the system. These modules include: control module, hard disk, power module etc.. Each module is connected to the backplane by a different connector. Thus, there are many signals passing through this backplane. For example: the signal line from the control module to the hard disk, the interconnection signal line between the two control modules, the power supply module for supplying power to each module, and the like.

For a common server or storage enclosure size design, it is necessary to meet certain server rack standards, typically two standards, 19 "racks and 21" racks. Therefore, the server or memory chassis width is limited. A single backplane architecture is feasible for a side-by-side dual control module system when fewer signals need to pass through the backplane. However, a single backplane may not meet the system interconnection requirements when too many signal lines are required through the backplane, requiring more or larger connectors. The single backplane architecture may present the following three major problems for a side-by-side dual control module system.

1) Within the limited width, the number of connectors that can be placed on the control module motherboard and backplane is limited, which may not meet the actual needs. If a bulky connector is required to be placed in both of the square areas, as shown in fig. 2, the connector will interfere with the hard disk connector 11 on the back of the backplane. At this time, it is necessary to avoid interference by reducing the number of hard disks that can be supported. However, reducing the number of hard disks that can be supported reduces the overall cost/performance ratio of the server or storage, making it less preferred by the client.

2) When too many signal lines pass through the backplane, it is very difficult to fan out signal routing near the connector on the backplane.

As shown in fig. 3, the signal line fan-out space 13 is greatly compressed between the connector 12 on the front side of the backplane 1 and the hard disk connector 11 on the back side of the backplane due to the excessive number of signal connectors required. In this case, the number of signal lines capable of fanning out in one circuit board is reduced. Generally, it is necessary to increase the number of circuit board layers to meet the area requirement of signal fan-out. This increases the cost of the circuit board required. The high cost of the circuit board design will undoubtedly reduce the competitiveness of the product.

3) Other ways are used, such as: cables, perhaps solving both of the above problems, may require lengthening the entire chassis.

As shown in fig. 4, it is assumed that the control module 21 and the control module 22 are connected by a cable 23 to solve the above-described problem. However, the cable 23 and its assembly require a certain space. These extra spaces are obtained by lengthening the chassis. However, to match a standard server rack, the length of the server or memory chassis is limited. In other words, the space in which the cable 23 and its assembly can be provided is limited. When the space required for the cable 23 and its assembly exceeds the maximum limit, a cable connection solution will not be feasible.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a dual backplane structure and an electronic device using the same, which are used to solve the technical problem that a single backplane cannot be well connected with a dual control module in a matching manner in the prior art.

To achieve the above and other related objects, the present invention provides a dual-backplane structure, comprising: the first back plate is provided with a hollow area, and the front surface of the first back plate is provided with at least one connector which is used for being connected with a connector corresponding to a second assembly surface on the main board of the control module; the front surface of the second back plate is provided with at least one connector which is used for being connected with a connector corresponding to the first assembly surface on the main board of the control module, and the back surface of the second back plate is provided with a plurality of hard disk connectors which are used for being connected with the hard disk module; and at least one connector on the front surface of the second back plate is connected with a connector corresponding to the first assembly surface on the main board of the control module through the hollow area of the first back plate.

In an embodiment of the invention, a shape of an upper edge of the hollow area of the first backplane matches a shape of an upper surface of an integral connector passing through the hollow area on the main board of the control module.

In an embodiment of the present invention, the control module includes a first control module and a second control module; the connectors of the first back plate comprise a first connector and a second connector which are respectively connected with the connector in the first control module for connecting the second control module and the connector in the second control module for connecting the first control module.

In an embodiment of the invention, the first connector and the second connector in the first backplane are respectively installed at two ends of the first backplane; the length of the hollow area is matched with the length of a connector connected with the connector of the second backboard in the first control module or the second control module.

In an embodiment of the invention, the first back plate and the second back plate are respectively provided with a plurality of vent holes.

In an embodiment of the invention, in an overlapping area of the first backplane and the second backplane: the positions of the vent holes on the first back plate and the vent holes on the second back plate are overlapped.

In an embodiment of the invention, the first back plate and the second back plate are fixed by a plurality of screws or bolts.

An electronic device comprises a first control module, a second control module, a double-backboard structure and a hard disk module, wherein the first control module and the second control module are arranged side by side from left to right, the double-backboard structure is connected with the first control module and the second control module, and the hard disk module is connected with a second backboard in the double-backboard structure.

In an embodiment of the present invention, a connector of the first control module, which is used for connecting the second control module, is retracted inward by a predetermined distance relative to a motherboard of the first control module; a connector used for connecting the first control module in the second control module is retracted by the preset distance relative to a main board of the second control module; the vertical outer surface of the inwardly retracted connector in the first control module and the vertical outer surface of the inwardly retracted connector in the second control module form a second assembly surface; the vertical outer surface of the non-inwardly retracted connector of the first control module and the vertical outer surface of the non-inwardly retracted connector of the second control module form a first assembly face.

In an embodiment of the present invention, a length of a second backplane in the dual-backplane structure matches a total width of the first control module and the second control module; the length of the first backplane in the dual backplane structure matches the sum of the length of the inwardly retracted connectors in the first control module, the length of the inwardly retracted connectors in the second control module, and the distance between the inwardly retracted connectors in the first control module and the inwardly retracted connectors in the second control module.

As described above, the dual-backplane structure and the electronic device using the same of the present invention have the following advantages:

1. in the double-backboard structure, the interconnection signal lines are divided into different backboards, the number of the signal lines required to be carried by a single backboard is relatively reduced, the number of the interconnection signal lines among the control modules can be increased on the premise of not increasing the width and the length of a case, the fan-out density of the backboard signal lines near a connector is effectively improved, the wiring of a circuit board is simplified, the number of required circuit board layers is reduced, and the circuit board cost is reduced.

2. In the double-backboard structure, because the main board and the corresponding connector of the main board are only slightly retracted, the length of the case is not increased, the double-backboard structure can be well matched with a standard server frame, and has wider applicability.

Drawings

Fig. 1 to 4 are schematic diagrams showing a connection manner of a backplane in a dual control module in the prior art.

FIG. 5 is a schematic side view of the dual-backplane structure of the present invention.

FIG. 6 is a schematic view of the reverse structure of the first backplane of the dual-backplane structure of the present invention.

FIG. 7 is a schematic front view of a first backplane of a dual backplane structure of the present invention.

FIG. 8 is a schematic view of the reverse structure of the second back plate in the dual back plate structure of the present invention.

FIG. 9 is a schematic front view of a second backplane of the dual backplane structure of the present invention.

Fig. 10 is a schematic front view of a dual-backplane structure according to the present invention.

Fig. 11 is a schematic diagram showing the staggered arrangement of the connectors of the control module in the electronic device according to the present invention.

Fig. 12 is a schematic connection diagram of a dual-control module and dual-backplane structure in an electronic device according to the present invention.

Description of the element reference numerals

21. 22 control module

11 hard disk connector

12 connector

13 signal line fan-out space

23 Cable

100 double-backboard structure

110 first back plate

111 hollow region

112 first connector

113 second connector

114 vent hole

115 connecting hole

120 second back plate

121 connector

122 hard disk connector

123 vent hole

124 connecting hole

125 connector

210 first control Module

211 connector

212 connector

213 first assembling surface

214 second assembly surface

220 second control module

221 connector

222 connector

300 hard disk module

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.

Please refer to fig. 5 to 12. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.

The embodiment of the invention aims to provide a double-backboard structure and electronic equipment applying the same, which are used for solving the problems that the length of a case is influenced by a double-CPU arrangement mode, the number of CPUs cannot be flexibly configured, the heat dissipation performance cannot be flexibly configured and the like in the prior art.

The principle and the implementation of the dual-backplane structure and the electronic device using the same of the present embodiment will be described in detail below, so that those skilled in the art can understand the dual-backplane structure and the electronic device using the same without creative labor.

Example 1

As shown in fig. 5, the present embodiment provides a dual backplane structure 100, where the dual backplane structure 100 includes: a first backplane 110 and a second backplane 120.

Specifically, in the present embodiment, as shown in fig. 6 and 7, the first back plate 110 has a hollow area 111, and (as shown in fig. 11) the front surface is configured with at least one connector (connector 112 and connector 113) for connecting with a connector (connector 211 or connector 221 shown in fig. 12) corresponding to the second assembly surface 214 on the main board of the control module.

In the present embodiment, as shown in fig. 5, the second back plate 120 is mounted on the back surface of the first back plate 110. As shown in fig. 8 and 9, the front surface of the second backplane 120 is configured with at least one connector (connector 121, connector 125) for connecting with the connectors (connector 212 and connector 222) corresponding to the first assembly surface 213 on the motherboard of the control module, and the back surface is configured with a plurality of hard disk connectors 122 for connecting with the hard disk module 300. As shown in fig. 10, at least one connector (connector 121 or connector 125) on the front surface of the second backplane 120 is connected to a corresponding connector (connector 211 or connector 221 shown in fig. 12) on the first assembly surface 213 of the motherboard of the control module via the hollow region 111 of the first backplane 110.

That is, the second backplane 120 has a plurality of connectors (connectors 121, 125) on the front surface, and some of the connectors (connectors 121) are connected to the corresponding connectors (connectors 211 or connectors 221 shown in fig. 12) on the first assembly surface 213 of the motherboard of the control module through the hollow region 111 of the first backplane 110.

In the present embodiment, the control module has a first assembly surface 213 and a second assembly surface 214. That is, in the present embodiment, as shown in fig. 11, the connection surfaces of the connectors connected to the backplane in the control module connected to the dual backplane structure 100 are not all in the same plane. Some connectors (connectors 211, 221) are retracted inward a certain distance to be dislocated from other connectors (connectors 212, 222), so that the connectors of the control module connected to the backplane form two assembly planes: a first assembly face 213 and a second assembly face 214. The connectors (connectors 212, 222) that are not retracted and misaligned form the first assembly surface 213, and the connectors (connectors 211 and 221) that are retracted and misaligned form the second assembly surface 214.

The first backplane 110 is used to connect the connectors (connector 211, connector 221) on the motherboard of the control module. The second backplane 120 is used to connect non-staggered connectors (connectors 212, 222) on the motherboard of the control module.

Because the staggered connectors (the connector 211 and the connector 221) are arranged on the main board of the control module and only slightly retract, the first back board 110 and the second back board 120 do not increase extra chassis length, can be well matched with a standard server rack, and has wider applicability. However, it should be noted that the retraction distance of the misaligned connectors (the connector 211 and the connector 221) should not be too large, and it should be ensured that the gap between the first backplane 110 and the second backplane 120 is kept to a minimum under the premise of convenient fixing, so as to reduce the wind flow loss.

The "C" shaped configuration of the first backplane 110 forms a large hollow area 111 through which non-misaligned connectors (connectors 212, 222) on the control module motherboard may pass to directly connect to connectors (connector 121 or connector 125) on the second backplane 120. In the present embodiment, as shown in fig. 6 and 7, the shape of the upper edge of the hollow area 111 of the first back plate 110 matches the shape of the upper surface of the overall connector (connector 212 or connector 222) passing through the hollow area 111 on the main board of the control module.

That is, the lower edge (the upper edge of the hollow region 111) of the first back plate 110 is opened according to the overall shape of the connector (the connector 212) corresponding to the first assembling surface 213 of the hollow region 111 to be passed through in the main plate of the control module, the height of the hollow region 111 is set according to the overall height after the connector 121 of the second back plate 120 is connected to the connector 122 corresponding to the first assembling surface 213 of the hollow region 111 to be passed through in the main plate of the control module, and the height of the hollow region 111 is higher than the overall height after the connector 121 of the second back plate 120 is connected to the connector 212 corresponding to the first assembling surface 213 of the hollow region 111 to be passed through in the main plate of the control module.

In the present embodiment, as shown in fig. 12, the control modules include a first control module 210 and a second control module 220; the connectors of the first backplane 110 include a first connector 112 and a second connector 113, which are respectively connected to a connector 211 of the first control module 210 for connecting the second control module 220 and a connector 221 of the second control module 220 for connecting the first control module 210.

That is, the first backplane 110 is responsible for only two interconnection signal lines between the control modules. The remaining signal lines are interconnected through the second backplane 120. The interconnection signal lines are divided into different backplanes, and the number of signal lines required to be carried by a single backplane is relatively reduced. The number of layers of a single backboard is effectively reduced, so that the cost of the circuit board is reduced, the fan-out density of signal lines near the connector on the backboard is reduced, and the wiring of the circuit board is simplified.

As shown in fig. 12, the first control module 210 and the second control module 220 have the same structure, and a connector 211 of the first control module 210 for connecting the second control module 220 and a connector 221 of the second control module 220 for connecting the first control module 210 are respectively installed at the sides. The connector 211 of the first control module 210 for connecting the second control module 220 and the connector 221 of the second control module 220 for connecting the first control module 210 are respectively dislocated toward the inside of the motherboard to form a second assembly surface 214.

In this embodiment, the first connector 112 and the second connector 113 of the first backplane 110 are respectively installed at two ends of the first backplane 110; the length of the hollow region 111 matches the length of the connector (connector 212 or connector 222) of the first control module 210 or the second control module 220 connected to the connector (connector 121 or connector 125) of the second backplane 120.

If the connector 211 of the first control module 210 for connecting the second control module 220 and the connector 221 of the second control module 220 for connecting the first control module 210 are respectively installed at a position close to the side of the first control module 210, the first backplane 110 is installed at the first control module 210, as shown in fig. 12, so that the connector 212 of the first control module 210 is connected with the connector 121 of the second backplane 120 through the hollow region 111 of the first backplane 110. If the connector 211 of the first control module 210 for connecting the second control module 220 and the connector 221 of the second control module 220 for connecting the first control module 210 are respectively installed near the side of the second control module 220, the first backplane 110 is installed at the second control module 220, such that the connector 222 of the second control module 220 is connected with the connector 125 of the second backplane 120 through the hollow region 111 of the first backplane 110.

As shown in fig. 10 and 12, in the present embodiment, the length of the first backplane 110 matches the sum of the length of the inwardly-retracted connector 211 in the first control module 210, the length of the inwardly-retracted connector 221 in the second control module 220, and the distance between the inwardly-retracted connector 211 in the first control module 210 and the inwardly-retracted connector 221 in the second control module 220. The length of the second backplane 120 matches the total width of the first control module 210 and the second control module 220.

In this embodiment, the first back plate 110 is provided with a plurality of ventilation holes 114, and the second back plate 120 is provided with a plurality of ventilation holes. The vent holes 114 and the vent holes are respectively arranged in an array, and the shapes of the vent holes 114 and the vent holes are not limited to square, diamond and the like. Preferably, in the overlapping region of the first back-plate 110 and the second back-plate 120: the positions of the vent holes 114 on the first back plate 110 and the vent holes on the second back plate 120 are coincident in size, so that the influence of the first back plate 110 on the wind flow is reduced.

In this embodiment, the first back plate 110 is respectively provided with a plurality of connecting holes 115, the second back plate 120 is respectively provided with a plurality of connecting holes, and the first back plate 110 and the second back plate 120 are fixed by a plurality of screws or bolts. There is no signal line interconnection between the first backplane 110 and the second backplane 120.

Example 2

The present embodiment provides an electronic device, as shown in fig. 12, the electronic device includes a first control module 210 and a second control module 220 that are placed side by side from left to right, a dual backplane structure 100 as described in embodiment 1 that is connected to the first control module 210 and the second control module 220, and a hard disk module 300 that is connected to a second backplane 120 in the dual backplane structure 100.

In this embodiment, as shown in fig. 11 and fig. 12, the connector 211 of the first control module 210 for connecting with the second control module 220 is retracted inward by a predetermined distance relative to the main board of the first control module 210; the connector 221 of the second control module 220, which is used for connecting the first control module 210, is retracted inward by the preset distance relative to the main board of the second control module 220; the vertical outer surface of the inwardly retracted connector 211 in the first control module 210 and the vertical outer surface of the inwardly retracted connector 221 in the second control module 220 form a second assembly face 214; the vertical outer surface of the non-retracted connector 212 of the first control module 210 and the vertical outer surface of the non-retracted connector 222 of the second control module 220 form a first assembly face 213.

In the present embodiment, the length of the second backplane 120 in the dual-backplane structure 100 matches the total width of the first control module 210 and the second control module 220; the length of the first backplane 110 in the dual backplane structure 100 matches the sum of the length of the connectors 211 that are retracted in the first control module 210, the length of the connectors 221 that are retracted in the second control module 220, and the distance between the connectors 211 that are retracted in the first control module 210 and the connectors 221 that are retracted in the second control module 220.

In this embodiment, the electronic device is a server, a memory, an industrial computer, or the like. The electronic equipment is a double-control module server with the height of 2U or more than 2U, a memory, an industrial computer and the like.

The dual backplane structure 100 has been described in detail in embodiment 1, and the dual backplane structure 100 of the electronic device is not described herein in detail.

Furthermore, in order to highlight the innovative part of the present invention, the technical features that are not so closely related to solve the technical problems proposed by the present invention are not introduced in the present embodiment, but this does not indicate that there are no other structural and functional features present in the present embodiment.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.

In summary, in the dual-backplane structure of the present invention, the interconnection signal lines are divided into different backplanes, the number of signal lines required to be carried by a single backplane is relatively reduced, and on the premise of not increasing the width and length of the chassis, the number of interconnection signal lines between control modules can be increased, and the fan-out density of backplane signal lines near the connector can be effectively improved, so as to simplify the circuit board wiring, and also facilitate to reduce the number of required circuit board layers, thereby reducing the circuit board cost, and the dual-backplane structure is particularly suitable for servers, memories and other electronic devices of the left and right parallel dual-control modules; in the double-backboard structure, because the main board and the corresponding connector of the main board are only slightly retracted, the length of the case is not increased, the double-backboard structure can be well matched with a standard server frame, and has wider applicability. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A double-backboard structure is characterized in that: the dual backplane structure comprises:

the first back plate is provided with a hollow area, and the front surface of the first back plate is provided with at least one connector which is used for being connected with a connector corresponding to a second assembly surface on the main board of the control module;

the front surface of the second back plate is provided with at least one connector which is used for being connected with a connector corresponding to the first assembly surface on the main board of the control module, and the back surface of the second back plate is provided with a plurality of hard disk connectors which are used for being connected with the hard disk module; and at least one connector on the front surface of the second back plate is connected with a connector corresponding to the first assembly surface on the main board of the control module through the hollow area of the first back plate.

2. The dual backplane structure of claim 1, wherein: the shape of the upper edge of the hollow area of the first back plate is matched with the shape of the upper surface of the integral connector passing through the hollow area on the main plate of the control module.

3. The dual backplane structure of claim 1 or 2, wherein: the control module comprises a first control module and a second control module; the connectors of the first back plate comprise a first connector and a second connector which are respectively connected with the connector in the first control module for connecting the second control module and the connector in the second control module for connecting the first control module.

4. The dual backplane structure of claim 3, wherein: the first connector and the second connector in the first back plate are respectively arranged at two ends of the first back plate; the length of the hollow area is matched with the length of a connector connected with the connector of the second backboard in the first control module or the second control module.

5. The dual backplane structure of claim 1, wherein: the first back plate and the second back plate are respectively provided with a plurality of vent holes.

6. The dual backplane structure of claim 5, wherein: in the first backplane and the second backplane overlap region: the positions of the vent holes on the first back plate and the vent holes on the second back plate are overlapped.

7. The dual backplane structure of claim 1, wherein: the first back plate and the second back plate are fixed through a plurality of screws or bolts.

8. An electronic device, characterized in that: the electronic equipment comprises a first control module, a second control module, a double-backboard structure and a hard disk module, wherein the first control module and the second control module are arranged side by side from left to right, the double-backboard structure is connected with the first control module and the second control module, the double-backboard structure is defined by any one of claims 1 to 7, and the hard disk module is connected with a second backboard in the double-backboard structure.

9. The electronic device of claim 8, wherein: a connector used for connecting the second control module in the first control module is retracted inwards by a preset distance relative to a main board of the first control module; a connector used for connecting the first control module in the second control module is retracted by the preset distance relative to a main board of the second control module; the vertical outer surface of the inwardly retracted connector in the first control module and the vertical outer surface of the inwardly retracted connector in the second control module form a second assembly surface; the vertical outer surface of the non-inwardly retracted connector of the first control module and the vertical outer surface of the non-inwardly retracted connector of the second control module form a first assembly face.

10. The electronic device of claim 8, wherein: the length of a second backboard in the double-backboard structure is matched with the total width of the first control module and the second control module; the length of the first backplane in the dual backplane structure matches the sum of the length of the inwardly retracted connectors in the first control module, the length of the inwardly retracted connectors in the second control module, and the distance between the inwardly retracted connectors in the first control module and the inwardly retracted connectors in the second control module.