CN111380637A - Demolding force testing device and testing method thereof - Google Patents
Demolding force testing device and testing method thereof Download PDFInfo
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- CN111380637A CN111380637A CN201811641323.3A CN201811641323A CN111380637A CN 111380637 A CN111380637 A CN 111380637A CN 201811641323 A CN201811641323 A CN 201811641323A CN 111380637 A CN111380637 A CN 111380637A
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- pressure sensor
- force
- ejection assembly
- mold
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
Abstract
The application provides a demolding force testing device and a testing method thereof. This demolding force testing arrangement includes: a mold, wherein a product to be demolded is placed in the mold; one end of the ejection assembly penetrates through the mold and is movably connected with the product to be demoulded; the pressure sensor is arranged at the other end of the ejection assembly and positioned outside the mold, applies acting force to the ejection assembly to enable the ejection assembly to eject the product to be demoulded out of the mold, and detects the force value of the demoulding force of the ejection assembly to eject the product to be demoulded out of the mold. The mold release force test method uses the mold release force test apparatus. The ejection force of the product during demolding is measured by arranging the pressure sensor, so that the demolding force of the product is quantitatively judged.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to a demolding force testing device and a testing method thereof.
Background
In the subsequent semiconductor packaging and plastic packaging process, the demolding force applied to demolding different plastic packaging material products is different, and the product demolding condition can be judged only by the appearance qualitative method in the prior art, but the product demolding force cannot be judged quantitatively. Therefore, when the products produced by the two plastic packaging materials can be smoothly demoulded, the size of the demoulding stress borne by the two products cannot be judged; the demoulding force can generate different stresses in the product, and the product performance is influenced.
Disclosure of Invention
The invention provides a demoulding force testing device and a testing method thereof.
In order to achieve the above object, an embodiment of the present invention provides a device for testing a mold release force. The demolding force testing device comprises:
a mold, wherein a product to be demolded is placed in the mold;
one end of the ejection assembly penetrates through the mold and is movably connected with the product to be demoulded;
the pressure sensor is arranged at the other end of the ejection assembly and positioned outside the mold, applies acting force to the ejection assembly to enable the ejection assembly to eject the product to be demoulded out of the mold, and detects the force value of the demoulding force of the ejection assembly to eject the product to be demoulded out of the mold.
Optionally, the demolding force testing device further comprises a base and a counter plate, the mold is arranged above the base, the counter plate is located below the base, the pressure sensor is installed on the counter plate, one end of the ejection assembly is close to the pressure sensor, the pressure sensor is far away from the direction of the pressure sensor, the base and the mold are sequentially penetrated and arranged, and the other end of the ejection assembly is abutted against the upper surface of the pressure sensor.
Optionally, the demolding force testing device further comprises a reset elastic body, the reset elastic body is arranged between the base and the counter plate, and two ends of the reset elastic body are respectively abutted against the base and the counter plate.
Optionally, the demolding force testing device further comprises a pressure sensor fixing plate, wherein the pressure sensor fixing plate is mounted on the counter-pushing plate and is driven by the counter-pushing plate to move towards the direction close to the mold; the pressure sensor is fixed on one surface, facing the ejection assembly, of the pressure sensor fixing plate, and at least part of the pressure sensor protrudes out of the outer edge of the pressure sensor fixing plate.
Optionally, a heat insulation block is arranged between the pressure sensor and the pressure sensor fixing plate.
Optionally, the pressure sensor fixing plate is fixed on the counter plate through a fixing member; and a heat insulation gasket is arranged between the pressure sensor fixing plate and the counter push plate, and the fixing piece penetrates through the heat insulation gasket.
Optionally, the ejection assembly is connected with the pressure sensor fixing plate through a limit screw; the limiting screw comprises a head portion, a cylindrical portion and a threaded portion, the head portion, the cylindrical portion and the threaded portion are sequentially connected, the outer diameter of the head portion is larger than that of the cylindrical portion, the outer diameter of the cylindrical portion is larger than that of the threaded portion, the head portion is arranged in a guide groove of the pressure sensor fixing plate in a sliding mode, a limiting portion is arranged at one end, close to the ejection assembly, of the guide groove, the limiting portion limits the head portion to move towards the ejection assembly, the threaded portion is in threaded connection with the ejection assembly, and the length of the cylindrical portion ensures an axial moving space of the ejection assembly.
Optionally, the ejection assembly comprises an ejector rod and a first ejector rod base plate, one end of the ejector rod is movably connected with the product to be demoulded, and the other end of the ejector rod penetrates out of the die and is installed on the first ejector rod base plate.
Optionally, the ejection assembly further comprises an ejector rod heat insulation plate and a second ejector rod base plate, the second ejector rod base plate is arranged between the first ejector rod base plate and the pressure sensor, and the ejector rod heat insulation plate is arranged between the first ejector rod base plate and the second ejector rod base plate.
Optionally, the demolding force testing device further comprises a controller and a display, the display is used for displaying the detection result of the pressure sensor, and the pressure sensor and the display are both electrically connected with the controller.
The application also provides a demolding force testing method, the demolding force testing method uses the demolding force testing device, and the demolding force testing method comprises the following steps:
installing the ejection assembly at a detection position on the mold, and correspondingly installing the pressure sensor;
applying an acting force to the ejection assembly through the pressure sensor so that the ejection assembly ejects the product to be demoulded out of the mould, wherein the pressure sensor detects a force value of a reaction force of the product to be demoulded to the ejection assembly, and the force value of the reaction force is the force value of the demoulding force;
when the force value of the demolding force is stable, reading is carried out.
In the mold release force testing device of the embodiment, the ejection force of the product in the mold release process is measured by arranging the pressure sensor, so that the mold release force of the product is quantitatively judged.
Drawings
FIGS. 1-3 are structural views of an exemplary embodiment demold force testing apparatus;
wherein, fig. 1 is a partial internal structural view of a release force testing apparatus;
fig. 2 is a partially enlarged view of a portion D in fig. 1;
fig. 3 is a schematic view of the distribution of pressure sensors.
Description of the reference numerals
Product to be demolded 11
First ram backing plate 22
Ejector rod heat insulation plate 23
Pressure sensor fixing plate 40
Back-push plate 60
Heat insulating gasket 82
Fixing member 91
Head 921
Screw portion 923
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of the terms "a" or "an" and the like in the description and in the claims of this application do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "plurality" includes two, and is equivalent to at least two. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
Fig. 1 to 3 are structural views of an exemplary embodiment of a mold release force testing apparatus.
The embodiment of the invention provides a demolding force testing device. The demolding force testing device comprises a mold 10, an ejection assembly 20, a pressure sensor 30, a pressure sensor fixing plate 40, a base 50, a counter plate 60 and a reset elastic body 70. Inside the mould 10 a product 11 to be demoulded is placed.
The die 10 is disposed above the base 50, the counter plate 60 is disposed below the base 50, the pressure sensor 30 is mounted on the counter plate 60, and the counter plate 60 drives the pressure sensor 30 to move toward the die 10. The reset elastic body 70 is arranged between the base 50 and the counter plate 60, and two ends of the reset elastic body 70 respectively abut against the base 50 and the counter plate 60. By providing the restoring elastic body 70, the counter plate 60 can be pushed back to the initial position when the counter plate 60 is not in operation, thereby restoring the position. In the present embodiment, the return elastic body 70 is a return spring.
The pressure sensor 30 abuts against the ejection assembly 20 and is located outside the mold 10, the pressure sensor 30 applies a force to the ejection assembly 20 to enable the ejection assembly 20 to eject the product 11 to be demolded out of the mold 10, and detects a force value of a demolding force of the ejection assembly 20 to eject the product 11 to be demolded out of the mold 10. Like this, drive pressure sensor 30 through setting up counter plate 60 and remove to the direction that is close to mould 10 to pressure sensor 30 can exert the effort to ejecting subassembly 20, so that ejecting subassembly 20 will treat that demoulding product 11 ejects out mould 10, and simultaneously, treat that demoulding product 11 can produce a reaction force to ejecting subassembly 20, the waiting that demoulding product 11 that pressure sensor 30 detected is the power value of the reaction force of ejecting subassembly 20, promptly. It should be noted that, generally, the whole process of the semiconductor subsequent packaging and plastic packaging process is in a high-temperature processing environment, so the location where the pressure sensor 30 is disposed is particularly critical, and if the location is located at one end of the ejector rod 21 assembly located in the mold 10, due to the high-temperature environment, the working effect of the pressure sensor 30 will be seriously affected, and the service life of the pressure sensor 30 will be shortened. In the embodiment, the pressure sensor 30 is arranged outside the mold 10, so that the working effect of the pressure sensor 30 is improved, and the service life of the pressure sensor 30 is prolonged; simultaneously, this kind of mode of setting can compromise different ejector pin 21 models, need not match ejector pin 21's size, and it is more convenient to use.
One end of the ejection assembly 20 sequentially penetrates through the base 50 and the mold 10 from the direction close to the pressure sensor 30 to the direction far away from the pressure sensor 30, and is movably connected with the product 11 to be demolded, and the other end of the ejection assembly 20 abuts against the upper surface of the pressure sensor 30.
Specifically, the ejector assembly 20 includes an ejector pin 21, a first ejector pin backing plate 22, an ejector pin heat insulating plate 23, and a second ejector pin backing plate 24. One end of the ejector rod 21 is movably connected with the product 11 to be demoulded, and the other end of the ejector rod 21 penetrates out of the mould 10 and is arranged on the first ejector rod backing plate 22. The second ejector pin backing plate 24 is arranged between the first ejector pin backing plate 22 and the pressure sensor 30, and the ejector pin heat insulation plate 23 is arranged between the first ejector pin backing plate 22 and the second ejector pin backing plate 24. Thus, the acting force received by the mandril 21 is more balanced by arranging the first mandril base plate 22; by arranging the ejector rod heat insulation plate 23, the influence of a high-temperature processing environment on the pressure sensor 30 can be well obstructed, so that the pressure sensor 30 is better protected.
The pressure sensor 30 is fixed on the surface of the pressure sensor fixing plate 40 facing the ejection assembly 20, and the pressure sensor 30 at least partially protrudes from the outer edge of the pressure sensor fixing plate 40. The pressure sensor fixing plate 40 is mounted on the counter plate 60 and moves in a direction approaching the mold 10 by the counter plate 60. A heat insulating block 81 is provided between the pressure sensor 30 and the pressure sensor fixing plate 40. Specifically, the pressure sensor fixing plate 40 is provided with a mounting groove 41, and the pressure sensor 30 is fixed in the mounting groove 41. Thus, the second jack panel 24 is acted by the portion protruding from the outer edge of the pressure sensor fixing plate 40; by providing the heat insulating block 81, a high-temperature processing environment can be well blocked, thereby better protecting the pressure sensor 30.
The pressure sensor fixing plate 40 is fixed on the counter plate 60 through a fixing member 91; a heat insulation gasket 82 is arranged between the pressure sensor fixing plate 40 and the counter plate 60, and the fixing member 91 is arranged through the heat insulation gasket 82.
The ejection assembly 20 is connected with the pressure sensor fixing plate 40 through a limit screw 92. The limit screw 92 comprises a head 921, a cylindrical part 922 and a thread part 923 which are connected in sequence, the outer diameter of the head 921 is larger than that of the cylindrical part 922, the outer diameter of the cylindrical part 922 is larger than that of the thread part 923, the head 921 is slidably arranged in a guide groove 42 of the pressure sensor fixing plate 40, a limit part 43 is arranged at one end of the guide groove 42 close to the ejection assembly 20, the limit part 43 limits the head 921 to move towards the ejection assembly 20, the thread part 923 is in threaded connection with the ejection assembly 20, and the length of the cylindrical part 922 ensures the axial movement space of the ejection assembly 20. In this way, by providing the stopper screw 92 and fitting the stopper screw 92 to the pressure sensor fixing plate 40 and the ejector assembly 20, the ejector assembly 20 can be moved in the direction of the mold 10 when receiving the force of the pressure sensor 30 while ensuring a certain movement space between the axial direction of the stopper screw 92 and the pressure sensor fixing plate 40 and being always located at the same position with respect to the pressure sensor 30 in the other direction.
In this embodiment, the demolding force testing apparatus further includes a controller (not shown) and a display (not shown), the display is used for displaying the detection result of the pressure sensor 30, and both the pressure sensor 30 and the display are electrically connected to the controller.
The application also provides a demolding force testing method, the demolding force testing method uses the demolding force testing device, and the demolding force testing method comprises the following steps:
step 101, installing an ejection assembly 20 at a detection position on a mold 10, and correspondingly installing a pressure sensor 30;
102, applying an acting force to the ejection assembly 20 through the pressure sensor 30 to enable the ejection assembly 20 to eject the product 11 to be demolded out of the mold 10, wherein the pressure sensor 30 detects a force value of a reaction force of the product 11 to be demolded to the ejection assembly 20, and the force value of the reaction force is the force value of the demolding force;
and 103, reading when the force value of the demolding force is stable.
When the number of the pressure sensors 30 is four, the pressure sensors 30 are spaced apart and arranged corresponding to the ejector assembly 20, as shown in fig. 3, and in order to more clearly show the positions of the pressure sensors 30, the pressure sensor fixing plate 40 in fig. 3 is removed, and the force value of the mold release force of the mold 10 is the sum of the detection results of the four pressure sensors 30. In other embodiments, the number of pressure sensors 30 is set according to the structure of the product 11 to be demolded, but may be other numbers, such as one, two, three, or more.
The invention monitors the ejection force of the ejector rod 21 when the product is demolded through the pressure sensor 30 to quantitatively measure the demolding force of the product, and further quantitatively judges the force value of the demolding force borne by the product during demolding. Thereby establishing a relatively quantitative corresponding relation between the ejection force of the ejector rod 21 and the demolding force of the product, and being a scientific judgment standard for judging demolding force.
In practical application, the same lead frame is used for measuring the demolding force of different plastic packaging materials, and the force value of the demolding force is as shown in the following table 1:
TABLE 1
| Plastic package material | 1 st time | 2 nd time | 3 rd time | 4 th time | 5 th time | Mean value of |
| WH-3100-J | 0.50Kg | 0.60Kg | 0.46Kg | 0.55Kg | 0.48Kg | 0.518kg |
| WH-1100-J | 0.40kg | 0.42kg | 0.38kg | 0.37kg | 0.45kg | 0.404kg |
WH-3100-J and WH-1100-J are both resin materials, but the specific models are different; the two resin materials were subjected to 5 mold release experiments, and the specific force values of the mold release force in each experiment are shown in the corresponding force values in table 1.
As can be seen from the above table, in the case of the same lead frame, the mold release force of the WH-3100-J resin product was larger than that of the WH-1100-J resin product. And the magnitude of the mold release force received by each molding compound at each time slightly fluctuates above and below the average value.
In addition, the mold release force measurements of the lead frames of the same molding compound, such as WH-3100-J resin material, from different manufacturers are shown in Table 2 below:
TABLE 2
As can be seen from the above table, when the same WH-3100-J resin material is used for producing products by lead frames of different manufacturers, the force values of the demolding force applied to the products during demolding are not very different.
Therefore, the demolding force of different plastic packaging materials can be preset according to experimental data, so that the product can be smoothly demolded from the mold, and the performance and the quality of the product are ensured.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.
Claims (11)
1. A mold release force testing apparatus, characterized in that the mold release force testing apparatus comprises:
a mold, wherein a product to be demolded is placed in the mold;
one end of the ejection assembly penetrates through the mold and is movably connected with the product to be demoulded;
the pressure sensor is arranged at the other end of the ejection assembly and positioned outside the mold, applies acting force to the ejection assembly to enable the ejection assembly to eject the product to be demoulded out of the mold, and detects the force value of the demoulding force of the ejection assembly to eject the product to be demoulded out of the mold.
2. The device for testing the demolding force as claimed in claim 1, wherein the device for testing the demolding force further comprises a base and a counter plate, the mold is arranged above the base, the counter plate is located below the base, the pressure sensor is mounted on the counter plate, one end of the ejection assembly sequentially penetrates through the base and the mold from the position close to the pressure sensor to the position far away from the pressure sensor, and the other end of the ejection assembly abuts against the upper surface of the pressure sensor.
3. The device for testing mold release force according to claim 2, further comprising a return elastic body disposed between the base and the counter plate, wherein two ends of the return elastic body respectively abut against the base and the counter plate.
4. The apparatus for testing mold release force according to claim 2, further comprising a pressure sensor fixing plate mounted on the counter plate and moving in a direction approaching the mold by the counter plate; the pressure sensor is fixed on one surface, facing the ejection assembly, of the pressure sensor fixing plate, and at least part of the pressure sensor protrudes out of the outer edge of the pressure sensor fixing plate.
5. The demold force testing apparatus according to claim 4, wherein a heat insulating block is provided between said pressure sensor and said pressure sensor fixing plate.
6. The demold force testing apparatus according to claim 4, wherein said pressure sensor fixing plate is fixed to said counter plate by a fixing member; and a heat insulation gasket is arranged between the pressure sensor fixing plate and the counter push plate, and the fixing piece penetrates through the heat insulation gasket.
7. The demold force testing apparatus according to claim 4, wherein said ejection assembly is connected to said pressure sensor fixing plate by a limit screw; the limiting screw comprises a head portion, a cylindrical portion and a threaded portion, the head portion, the cylindrical portion and the threaded portion are sequentially connected, the outer diameter of the head portion is larger than that of the cylindrical portion, the outer diameter of the cylindrical portion is larger than that of the threaded portion, the head portion is arranged in a guide groove of the pressure sensor fixing plate in a sliding mode, a limiting portion is arranged at one end, close to the ejection assembly, of the guide groove, the limiting portion limits the head portion to move towards the ejection assembly, the threaded portion is in threaded connection with the ejection assembly, and the length of the cylindrical portion ensures an axial moving space of the ejection assembly.
8. The device for testing the demolding force as claimed in claim 1, wherein the ejection assembly comprises an ejector rod and a first ejector rod backing plate, one end of the ejector rod is movably connected with the product to be demolded, and the other end of the ejector rod penetrates out of the mold and is mounted on the first ejector rod backing plate.
9. The apparatus for testing demold force according to claim 8, wherein the ejection assembly further comprises a lift pin heat insulation plate and a second lift pin backing plate, the second lift pin backing plate is disposed between the first lift pin backing plate and the pressure sensor, and the lift pin heat insulation plate is disposed between the first lift pin backing plate and the second lift pin backing plate.
10. The device for testing mold release force according to any one of claims 1 to 9, further comprising a controller and a display for displaying the detection result of the pressure sensor, wherein the pressure sensor and the display are electrically connected to the controller.
11. A mold release force test method using the mold release force test apparatus according to any one of claims 1 to 10, the mold release force test method comprising the steps of:
installing the ejection assembly at a detection position on the mold, and correspondingly installing the pressure sensor;
applying an acting force to the ejection assembly through the pressure sensor so that the ejection assembly ejects the product to be demoulded out of the mould, wherein the pressure sensor detects a force value of a reaction force of the product to be demoulded to the ejection assembly, and the force value of the reaction force is the force value of the demoulding force;
when the force value of the demolding force is stable, reading is carried out.
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| CN201811641323.3A CN111380637B (en) | 2018-12-29 | 2018-12-29 | Demolding force testing device and testing method thereof |
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| Publication number | Publication date |
|---|---|
| CN111380637B (en) | 2022-03-25 |
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