CN111380625A - Highly integrated temperature sensor for deep sea application and production packaging process thereof - Google Patents
Highly integrated temperature sensor for deep sea application and production packaging process thereof Download PDFInfo
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- CN111380625A CN111380625A CN202010327717.2A CN202010327717A CN111380625A CN 111380625 A CN111380625 A CN 111380625A CN 202010327717 A CN202010327717 A CN 202010327717A CN 111380625 A CN111380625 A CN 111380625A
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
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- G—PHYSICS
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- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
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- G01K2215/00—Details concerning sensor power supply
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Abstract
The invention relates to the technical field of ocean observation, and discloses a highly integrated temperature sensor applied in deep sea. The invention also discloses a production packaging process of the highly integrated temperature sensor applied to deep sea. All parts of the whole temperature sensor are integrated into a whole, so that the structure is simplified, and the measurement precision and the anti-interference capability of the temperature sensor are improved.
Description
Technical Field
The invention relates to the technical field of ocean observation, in particular to a highly integrated temperature sensor applied to deep sea and a production and packaging process thereof.
Background
The temperature data is the basic parameter of physical ocean observation and the basic element of ocean dynamics, is the indispensable factor for calculating other physical parameters such as salinity, density and sound velocity, so the temperature data is widely applied to various detecting instruments, moving platforms, operating equipment, sailing ships, water body culture and even military weaponry. Therefore, the measurement accuracy of the temperature sensor for providing meaningful data support for marine science is generally required to be within +/-0.01 ℃ in conventional physical marine observation, and the measurement accuracy can reach +/-0.003 ℃ in the internationally better equipment. The operation of the conventional temperature sensor is generally classified into the following modes.
1. The temperature sensor is used as a main body, independently works in a self-contained mode, data exchange is not carried out with the outside in the working process, all working data are stored in the temperature sensor, after the working is finished, the working data are manually salvaged, the temperature sensor is connected with a computer through a communication cable, and all historical data are exported. Such sensors have poor real-time data.
2. An external temperature sensor finished product is directly hung, the sensor is tied on the main body by a physical reinforcing method, and a watertight cable is used between the sensor and the main body to realize the interactive communication of instructions and data. This approach is bulky.
3. By using an embedded integration mode, the shell structure of the temperature sensor and the shell structure of the temperature sensor are integrated together, so that higher integration level, more reliable connection effect and more excellent fluid characteristic can be obtained, and the appearance is more attractive.
Although the embedded temperature sensor is integrated with the main device in terms of structure, and the miniaturization of the overall volume is realized, the circuit of the sensor still needs to be positioned. Typically, the temperature sensitive portion of the temperature sensor is enclosed within a separate housing that is mounted to the instrument body. And the signal processing circuit board is independent of the temperature sensitive part and is arranged in the instrument main body circuit, and the signal processing circuit board and the instrument main body circuit are connected by adopting a cable.
The problems with such a form are: first, the difficulty of the overall instrument design is increased. The instrument body circuit board needs to open up a separate space for the temperature sensor circuit board, and a proper amount of mounting holes are needed for fixing the temperature sensor circuit board. Between the two circuit boards, board-to-board connectors are also required to communicate signals. Therefore, the space of the whole system cannot be made very small, and the design difficulty is increased for some systems with limited space and compact structure. Meanwhile, due to the requirement of structural installation reinforcement, the reliability is reduced, and for some conventional monitoring experiments such as impact vibration, additional consideration needs to be given to the place, otherwise, the circuit board is likely to fall off in the future use process. In addition, for the equipment, the problem of related integrated installation needs to be considered at the beginning of design, which increases the difficulty of instrument design. Secondly, the sensitive signal of the sensor is easily interfered, and the measurement precision is influenced. Because the sensing elements are separated in structure, the sensing elements at the front end and the circuit board need to be connected by wires, and signals of the sensing elements are connected into a processing circuit. In some applications, this leads may be relatively long and may pass through areas of harsh electrical environments, such as motor modules, rf module sections. Therefore, the analog signal of the sensitive element is transmitted in the wire, the signal strength is very weak, and the wire is easily influenced by the length of the wire, the size of the contact resistance and the strength of the space electromagnetic interference. In the application process of some instruments, the measurement accuracy of the sensor is seriously influenced and even cannot be used. Again, increasing the difficulty of sensor use and management. The sensitive element part of the sensor is mounted separately from the signal processing circuit board, so that one device is disassembled into two parts instead of one whole. During use and storage, the sensitive element parts and the processing circuit board must be placed in a pair and combination mode, and the corresponding relation between the sensitive element parts and the processing circuit board is guaranteed, so that the sequence of the sensitive element parts and the processing circuit board cannot be disturbed. Thereby increasing the difficulty of management. Finally, the structure of the sensitive element part is uncertain, so that the structure sizes of various application occasions are various, and the temperature sensor cannot be generalized.
Disclosure of Invention
(I) solving the problems
Aiming at the defects of the prior art, the invention provides the highly integrated temperature sensor for deep sea application, all parts of the whole temperature sensor are integrated into a whole, the structure is simplified, and the measurement precision and the anti-interference capability of the temperature sensor are improved.
(II) technical scheme
In order to achieve the purpose of increasing the practical use effect of the temperature probe, the invention provides the following technical scheme:
a highly integrated temperature sensor for deep sea application comprises a temperature sensor shell, a temperature sensitive element, a signal processing circuit board and a digital signal transmission cable, wherein the temperature sensitive element and the signal processing circuit board are packaged in the temperature sensor shell, and the digital signal transmission cable connects the signal processing circuit board with an equipment circuit main board; the temperature sensor shell comprises a signal processing circuit board cabin, an installation part and a temperature sensor probe, wherein the installation part is arranged in the middle of the signal processing circuit board cabin and the temperature sensitive element accommodating cavity, the signal processing circuit board cabin is filled with pouring sealant, the upper half part of the temperature sensor probe is filled with curable heat-conducting medium, and the lower half part of the temperature sensor probe is filled with pouring sealant.
Furthermore, the outer surface of the signal processing circuit board cabin is provided with threads, and the threads are in the form of watertight connectors.
Further, the mounting portion is hexagonal.
Furthermore, an O-shaped ring groove for placing an O-shaped ring is further formed in the outer surface of the joint of the signal processing circuit board cabin and the mounting part.
Furthermore, the temperature sensitive element comprises a temperature sensitive resistor and two metal guide wires, a shielding protective sleeve is arranged outside the metal guide wires, and the temperature sensitive resistor is arranged at the top in the temperature sensor probe.
Furthermore, the signal processing circuit board comprises an analog signal processing part, a digital signal processing part, a logic function processing part, a temperature sensitive element interface and a digital communication interface.
The invention also discloses a production packaging process of the highly integrated temperature sensor applied to deep sea, which comprises the following steps:
1) the processed temperature sensor shell is subjected to appearance inspection, so that material defects or processing errors are prevented;
2) cleaning the shell of the temperature sensor by ultrasonic waves, then cleaning the shell by clean water, and putting the shell into an oven for drying;
3) connecting a digital communication interface of a digital signal transmission cable to a signal processing circuit board, and welding four signal wires in the cable and relevant welding spots of the circuit board;
4) cutting the metal guide wire of the temperature sensitive element to a proper length, so that after welding, the temperature sensitive resistor is just positioned at the top of the temperature probe after the signal processing circuit board is placed in the circuit board cabin;
5) a shielding protective sleeve is additionally arranged outside a metal guide wire of the temperature sensitive element;
6) welding two metal guide wires in the processed temperature sensitive element on a signal processing circuit board to ensure that the temperature sensitive element is in a straightened state;
7) sucking a heat-conducting medium by using a needle head, and pushing the heat-conducting medium to a probe part of the temperature sensor;
8) putting a signal processing circuit board with a temperature sensitive element into a circuit board cabin, and simultaneously enabling a temperature sensitive resistor to enter the top of a temperature sensor probe and be completely immersed into a heat-conducting medium;
9) the mixture is placed in an upside-down hanging posture and stored for at least 24 hours until the performance of the heat-conducting medium is stable;
10) sucking the potting adhesive by using a needle head, pushing the potting adhesive into the signal processing circuit board cabin, controlling the flow of the potting adhesive to completely soak the circuit board and soak a part of the communication cable;
11) standing and storing for at least 24 hours until the pouring sealant is completely cured.
Furthermore, the sheathing mode of the step 5) is to firstly sheath a thin shielding protective sleeve on one of the conducting wires, then to close the two conducting wires together, and to wholly sheath a thick shielding protective sleeve outside, wherein the shielding protective sleeve needs to extend to the root of the temperature sensitive resistor.
Further, the heat-conducting medium in the step 7) is subjected to vacuum pumping treatment in advance.
Further, the pouring sealant in the step 10) is subjected to vacuum pumping treatment in advance.
(III) advantageous effects
Compared with the prior art, the invention provides a highly integrated temperature sensor for deep sea application, which has the following beneficial effects:
1. all parts of the whole temperature sensor are integrated into a whole, the sensor is only required to be screwed on the shell of the instrument equipment and a cable is connected to a circuit board of an instrument main body when being installed, and more components of other parts are not needed, so that the structure is simple and the installation is convenient;
2. because the sensor integrates the signal processing circuit inside, and no extra circuit board is needed outside, instrument equipment is not needed to provide a circuit board installation space, only a communication interface is needed to be reserved, and the complexity of the overall design of the instrument is reduced;
3. instrument equipment is not needed to provide a circuit board mounting space, the volume of the whole instrument can be further reduced, and the miniaturization design is easier;
3. the number of structural components of the system is reduced, the structural installation work is reduced, the reliability of the equipment is improved on the whole, and the risk of integral failure is reduced;
4. because the temperature sensor integrates the signal processing circuit in the sensor, the distance between the temperature sensitive element and the processing circuit is very close, the metal guide wire is always positioned in the metal shell of the sensor, and the weak signal on the guide wire is not easy to receive external interference. The method has better performance in the aspect of measurement accuracy;
5. the anti-interference capability of the sensor is improved. The sensor is finally provided for the cable of the instrument equipment, the inside of the cable is only provided with a power supply and a digital communication line, the power supply and the digital communication line have strong anti-jamming capability, the communication process is not easily influenced by environmental electronic interference, and the length of the communication cable can be greatly increased.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of a temperature sensor housing according to the present invention;
FIG. 3 is a schematic structural diagram of a temperature sensitive device according to the present invention;
FIG. 4 is a schematic diagram of a signal processing circuit board according to the present invention;
FIG. 5 is a schematic diagram of a signal processing circuit board of the present invention;
FIG. 6 is a schematic structural diagram of a digital signal transmission cable according to the present invention;
FIG. 7 is a schematic diagram of the connection structure of the present invention to a marine instrument.
The temperature sensor comprises a temperature sensor probe 1, a temperature sensitive element 2, a 3 mounting part, a 4 signal processing circuit board, a 5 signal processing circuit board cabin, a 6 digital signal transmission cable, 7 potting adhesive, 8 heat-conducting media, 9 threads, 10O-shaped rings, 11O-shaped ring grooves, 12 temperature sensitive resistors, 131 thin shielding protective sleeves, 132 thick shielding protective sleeves, 14 metal guide wires, 15 sensor terminal interfaces, 16 signal transmission cable bodies, 17 equipment terminal interfaces, 18 equipment circuit main boards and 19 highly integrated temperature sensors.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
a highly integrated temperature sensor for deep sea applications, as shown in fig. 1-7.
The whole sensor is generally divided into four parts, namely a temperature sensor shell, a temperature sensitive element 2, a signal processing circuit board 4 and a digital signal transmission cable 6.
The temperature sensor shell comprises a temperature sensor probe 1, a hexagonal mounting structure 3 and a signal processing circuit board cabin 5. The hexagonal mounting structure 3 is arranged between the temperature sensor probe 1 and the signal processing circuit board cabin 5. One side of the hexagonal mounting structure 3 is a sensor support surface. The outer surface of the signal processing circuit board cabin 5 is provided with a plurality of circles of fixed threads 9, and a universal watertight connector form for marine instruments is adopted. An O-shaped ring groove 11 for accommodating an O-shaped ring 10 is further formed in the outer surface of the joint of the signal processing circuit board cabin 5 and the hexagonal mounting structure 3.
The temperature sensitive element 2 consists of a temperature sensitive resistor 12, a metal guide wire 14 and an insulating sheath. The metal guide wires 14 have two, one of them is provided with a thinner shielding protection sleeve 131, then the two metal guide wires are combined, and the outer part is provided with a thicker shielding protection sleeve 132. One end of the shielding protective sleeve close to the temperature sensitive resistor 12 extends to the root of the metal guide wire, and a part is left at the other end.
The digital signal processing circuit board 4 comprises an analog signal processing part, a digital signal processing part, a logic function processing part, a temperature sensitive element interface and a digital communication interface.
Compared with the original independent circuit, the miniaturized circuit system adopts a high-integration microchip and a high-density wiring method, the design of a multilayer circuit board and a double-sided surface mounting mode, and meanwhile, a special bootloader is built inside a processing machine, so that a program is burnt and updated to use a working interface, an independent connector is not occupied, and the space occupation is reduced. Finally, the volume of the whole temperature signal processing circuit is reduced to 6mm x 22mm x 3mm (W x L x H), and the temperature signal processing circuit can be embedded into a very narrow space.
The circuit system is generally divided into a digital part and an analog part, and the digital part and the analog part are electrically isolated from each other, so that the precision of signal acquisition is ensured. The digital part comprises an MCU processor and is responsible for information processing, mathematical calculation, task management and the like, and the digital interface circuit converts the information of the processor into common RS232, RS485 or TTL level protocols and communicates with the outside through a communication cable. The digital power supply part is responsible for providing energy sources for different digital modules. The analog part comprises a signal conditioning circuit which is directly connected with the temperature sensitive element, drives and obtains a weak signal of the temperature sensitive element, and optimizes and conditions the weak signal. And the AD conversion module receives the conditioned analog signal, converts the conditioned analog signal into a digital signal and transmits the digital signal to the MCU processor. The analog power supply management supplies energy to different modules of the analog part, ensures the stability of voltage and current and reduces the introduction of noise.
The digital signal transmission cable consists of a sensor end interface 15, a cable main body 16 and an equipment end interface 17, wherein the cable main body internally comprises four wires.
The temperature sensitive resistor 12 of the temperature sensitive element is arranged at the inner top of the sensor probe 1, and two metal guide wires 14 are connected to the temperature sensitive element interface part of the signal processing circuit board 4. The space in which the temperature sensitive resistor is located is filled with a heat conducting medium 8 which can be cured. The upper half of the space in which the metal guide wire 14 is located is filled with a curable heat conducting medium, and the lower half is filled with a hard pouring sealant. The signal processing circuit board is arranged in the circuit board cabin of the sensor shell, a part of the transmission cable extends into the circuit board cabin and is connected to the digital communication interface part of the signal processing circuit board, and the whole inner space of the circuit board cabin is filled with hard pouring sealant 7.
The thread part of the sensor shell adopts the universal watertight connector form of the marine instrument, and the temperature sensor can be directly integrated and used as long as the marine instrument equipment is provided with a standard watertight connector position.
The various parts of the temperature sensor are integrated into one entity and no longer are discrete parts. When the temperature sensor is used, the whole temperature sensor 19 is directly installed in a reserved installation hole of instrument equipment and is screwed down, and the water tightness of the equipment is guaranteed. In the instrument equipment, the transmission cable 6 of the temperature sensor 19 is directly connected to the instrument main body circuit board 18 without any other matching circuit structure. Meanwhile, the power supply signal and the digital signal transmitted in the transmission cable 6 have strong anti-interference performance, the length of the transmission cable is greatly increased, and the transmission cable can span regions with complex electrical environments.
Example two:
a production and packaging process of a highly integrated temperature sensor for deep sea application comprises the following steps:
1) the processed temperature sensor shell is subjected to appearance inspection, so that material defects or processing errors are prevented;
2) putting a temperature sensor shell into an ultrasonic cleaning box, adding an oil stain cleaning agent, carrying out ultrasonic cleaning on the temperature sensor shell for half an hour, then cleaning the temperature sensor shell in clear water, and putting the temperature sensor shell into an oven for drying;
3) connecting a sensor end digital communication interface of a communication cable to a signal processing circuit board, and welding four signal wires in the cable and relevant welding spots of the circuit board;
4) cutting the metal guide wire of the temperature sensitive element to a proper length, so that after welding, the temperature sensitive resistor is just positioned at the top of the temperature probe after the signal processing circuit board is placed in the circuit board cabin;
5) a shielding sleeve sheath is additionally arranged outside the metal guide wires of the temperature sensitive element, the shielding sleeve sheath is additionally arranged in a mode that firstly, a thinner sheath is sleeved on one of the metal guide wires, then the two guide wires are closed, a thicker sheath is provided outside the whole body, the sheath needs to extend to the root of the temperature sensitive resistor, and only a small section is left at the other end of the sheath;
6) welding two metal guide wires exposed out of the processed temperature sensitive element on a signal processing circuit board to ensure that the temperature sensitive element is in a straightened state;
7) mixing a heat-conducting medium in a container, putting the container into a vacuum tank, vacuumizing for half an hour, and finally taking the heat-conducting medium out of the vacuum tank;
8) sucking the treated heat-conducting medium by using a needle head, and pushing the heat-conducting medium to a probe part of the temperature sensor;
9) carefully placing a signal processing circuit board with a temperature sensitive element into a circuit board cabin, and simultaneously enabling a sensitive resistor of the temperature sensitive element to enter the top of a temperature probe and be completely immersed into a heat-conducting medium;
10) the mixture is placed in an upside-down hanging posture and stored for 24 hours until the performance of the heat-conducting medium is stable;
11) dispensing the pouring sealant in another container, putting the container into a vacuum tank, vacuumizing for half an hour, and finally taking the pouring sealant out of the vacuum pipe;
12) sucking the pouring sealant by using a needle head, pushing the pouring sealant into a circuit board cabin of the temperature sensor shell, controlling the flow of the pouring sealant to completely soak the circuit board and soak a part of the communication cable;
13) placing the mixture in a proper posture, storing the mixture for 24 hours, and waiting for the pouring sealant to be completely cured;
14) and the whole temperature sensor is assembled.
The function of cleaning the entire sensor housing is to remove metal chips, cutting fluid, etc. remaining during the machining process. These materials may block the probe portion, damage the temperature sensitive element, affect the flow of the heat conducting medium and the potting adhesive, and prevent the adhesion of the potting adhesive to the metal housing.
The shielding sheath is used for preventing the metal guide wires of the two temperature sensitive elements from being conducted, preventing the metal guide wires from being communicated with the metal shell of the sensor and simultaneously combining the two metal guide wires into a whole.
The heat conducting medium is filled in the temperature sensor probe to increase the heat conducting rate of the sensor probe, so that the external temperature can enter the thermistor part of the temperature sensitive element more quickly. The time constant of the whole sensor is shortened, and the response rate of the sensor is improved.
The temperature sensor circuit board cabin is filled with pouring sealant so as to stabilize each part in the sensor and prevent position movement in the using process; sealing the heat conducting medium of the probe part to prevent the heat conducting medium from flowing; meanwhile, the electric part of the whole temperature sensor is sealed, so that the whole sensor can be immersed in a constant-temperature water tank for experiment, and liquid is prevented from entering a circuit board to damage the circuit.
Before the heat-conducting medium and the pouring sealant are filled, vacuumizing is performed to separate out gas in the sensor, so that the condition that the heat-conducting medium and the pouring sealant are pushed to the sensor without bubbles and are uniform in texture is guaranteed. When the pressure of the liquid is reduced, the volume of gas dissolved therein will precipitate, expand in volume, rise to the surface and break.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A highly integrated temperature sensor for deep sea applications, characterized in that: the temperature sensor comprises a temperature sensor shell, a temperature sensitive element, a signal processing circuit board and a digital signal transmission cable, wherein the temperature sensitive element and the signal processing circuit board are packaged in the temperature sensor shell, and the digital signal transmission cable connects the signal processing circuit board with an equipment circuit main board; the temperature sensor shell comprises a signal processing circuit board cabin, an installation part and a temperature sensor probe, wherein the installation part is arranged in the middle of the signal processing circuit board cabin and the temperature sensitive element accommodating cavity, the signal processing circuit board cabin is filled with pouring sealant, the upper half part in the temperature sensor probe is filled with curable heat-conducting medium, and the lower half part is filled with pouring sealant.
2. A highly integrated temperature sensor for deep sea applications according to claim 1, wherein: the outer surface of the signal processing circuit board cabin is provided with threads, and the threads are in a watertight connector form.
3. A highly integrated temperature sensor for deep sea applications according to claim 1, wherein: the mounting portion is hexagonal.
4. A highly integrated temperature sensor for deep sea applications according to claim 1, wherein: and an O-shaped ring groove for placing an O-shaped ring is further formed in the outer surface of the joint of the signal processing circuit board cabin and the mounting part.
5. A highly integrated temperature sensor for deep sea applications according to claim 1, wherein: the temperature sensitive element consists of a temperature sensitive resistor and two metal guide wires, a shielding protective sleeve is arranged outside the metal guide wires, and the temperature sensitive resistor is arranged at the top in the temperature sensor probe.
6. A highly integrated temperature sensor for deep sea applications according to claim 1, wherein: the signal processing circuit board comprises an analog signal processing part, a digital signal processing part, a logic function processing part, a temperature sensitive element interface and a digital communication interface.
7. The process for producing and packaging a highly integrated temperature sensor for deep sea applications as claimed in claims 1 to 6, wherein: the method comprises the following steps:
1) the processed temperature sensor shell is subjected to appearance inspection, so that material defects or processing errors are prevented;
2) cleaning the shell of the temperature sensor by ultrasonic waves, then cleaning the shell by clean water, and putting the shell into an oven for drying;
3) connecting a digital communication interface of a digital signal transmission cable to a signal processing circuit board, and welding four signal wires in the cable and relevant welding spots of the circuit board;
4) cutting the metal guide wire of the temperature sensitive element to a proper length, so that after welding, the temperature sensitive resistor is just positioned at the top of the temperature probe after the signal processing circuit board is placed in the circuit board cabin;
5) a shielding protective sleeve is additionally arranged outside a metal guide wire of the temperature sensitive element;
6) welding two metal guide wires in the processed temperature sensitive element on a signal processing circuit board to ensure that the temperature sensitive element is in a straightened state;
7) sucking a heat-conducting medium by using a needle head, and pushing the heat-conducting medium to a probe part of the temperature sensor;
8) putting a signal processing circuit board with a temperature sensitive element into a circuit board cabin, and simultaneously enabling a temperature sensitive resistor to enter the top of a temperature sensor probe and be completely immersed into a heat-conducting medium;
9) the mixture is placed in an upside-down hanging posture and stored for at least 24 hours until the performance of the heat-conducting medium is stable;
10) sucking the potting adhesive by using a needle head, pushing the potting adhesive into the signal processing circuit board cabin, controlling the flow of the potting adhesive to completely soak the circuit board and soak a part of the communication cable;
11) standing and storing for at least 24 hours until the pouring sealant is completely cured.
8. The process for producing and packaging a highly integrated temperature sensor for deep sea applications according to claim 7, wherein: the sheathing mode of the step 5) is that a thin shielding protective sleeve is sheathed on one conducting wire, then the two conducting wires are gathered, a thick shielding protective sleeve is sheathed outside the whole conducting wire, and the shielding protective sleeve needs to extend to the root of the temperature sensitive resistor.
9. The process for producing and packaging a highly integrated temperature sensor for deep sea applications according to claim 7, wherein: the heat-conducting medium in the step 7) is subjected to vacuum pumping treatment in advance.
10. The process for producing and packaging a highly integrated temperature sensor for deep sea applications according to claim 7, wherein: the pouring sealant in the step 10) is subjected to vacuum pumping treatment in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010327717.2A CN111380625A (en) | 2020-04-23 | 2020-04-23 | Highly integrated temperature sensor for deep sea application and production packaging process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010327717.2A CN111380625A (en) | 2020-04-23 | 2020-04-23 | Highly integrated temperature sensor for deep sea application and production packaging process thereof |
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| CA2596753A1 (en) * | 2006-08-11 | 2008-02-11 | Brian Rafael Shumaker | Multipoint digital temperature acquisition system |
| CN201583362U (en) * | 2010-02-04 | 2010-09-15 | 国家海洋技术中心 | High pressure resistant rapid response temperature sensor |
| DE212016000001U1 (en) * | 2015-06-08 | 2016-09-29 | Ema Precision Electronics (Suzhou) Co., Ltd. | Flow temperature sensor with acid-proof, alkali-resistant and fully metallic housing |
| WO2016197631A1 (en) * | 2015-06-08 | 2016-12-15 | 伊玛精密电子（苏州）有限公司 | Acid-base resistant all-metal flow temperature sensor |
| CN110657899A (en) * | 2019-10-31 | 2020-01-07 | 杭州浅海科技有限责任公司 | Packaging process of temperature sensor applied to ocean observation |
| CN211602215U (en) * | 2020-04-23 | 2020-09-29 | 杭州浅海科技有限责任公司 | Highly integrated temperature sensor for deep sea application |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2596753A1 (en) * | 2006-08-11 | 2008-02-11 | Brian Rafael Shumaker | Multipoint digital temperature acquisition system |
| CN201583362U (en) * | 2010-02-04 | 2010-09-15 | 国家海洋技术中心 | High pressure resistant rapid response temperature sensor |
| DE212016000001U1 (en) * | 2015-06-08 | 2016-09-29 | Ema Precision Electronics (Suzhou) Co., Ltd. | Flow temperature sensor with acid-proof, alkali-resistant and fully metallic housing |
| WO2016197631A1 (en) * | 2015-06-08 | 2016-12-15 | 伊玛精密电子（苏州）有限公司 | Acid-base resistant all-metal flow temperature sensor |
| CN110657899A (en) * | 2019-10-31 | 2020-01-07 | 杭州浅海科技有限责任公司 | Packaging process of temperature sensor applied to ocean observation |
| CN211602215U (en) * | 2020-04-23 | 2020-09-29 | 杭州浅海科技有限责任公司 | Highly integrated temperature sensor for deep sea application |
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