CN111363631A - Degumming agent for deburring and preparation method and application thereof - Google Patents
Degumming agent for deburring and preparation method and application thereof Download PDFInfo
- Publication number
- CN111363631A CN111363631A CN201811599894.5A CN201811599894A CN111363631A CN 111363631 A CN111363631 A CN 111363631A CN 201811599894 A CN201811599894 A CN 201811599894A CN 111363631 A CN111363631 A CN 111363631A
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- CN
- China
- Prior art keywords
- solvent
- ether
- percent
- agent
- acid
- Prior art date
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- Granted
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 92
- 238000002425 crystallisation Methods 0.000 claims abstract description 52
- 230000008025 crystallization Effects 0.000 claims abstract description 52
- 239000002904 solvent Substances 0.000 claims abstract description 48
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 32
- 239000003112 inhibitor Substances 0.000 claims abstract description 32
- 150000001412 amines Chemical class 0.000 claims abstract description 30
- 239000012188 paraffin wax Substances 0.000 claims abstract description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229940099259 vaseline Drugs 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 239000004094 surface-active agent Substances 0.000 claims abstract description 15
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 13
- -1 alcohol amine Chemical class 0.000 claims description 55
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 21
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 17
- 239000002994 raw material Substances 0.000 claims description 17
- 235000002639 sodium chloride Nutrition 0.000 claims description 17
- 150000003839 salts Chemical class 0.000 claims description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 14
- 239000003906 humectant Substances 0.000 claims description 14
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 13
- 230000007797 corrosion Effects 0.000 claims description 13
- 238000005260 corrosion Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 12
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 12
- 239000002585 base Substances 0.000 claims description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 8
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 8
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims description 8
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 claims description 8
- 229920000768 polyamine Polymers 0.000 claims description 8
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 8
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 claims description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 6
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 claims description 6
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 claims description 6
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 6
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 6
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 claims description 6
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 6
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 6
- 235000011152 sodium sulphate Nutrition 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 5
- 239000003945 anionic surfactant Substances 0.000 claims description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 5
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 claims description 5
- 235000011187 glycerol Nutrition 0.000 claims description 5
- 150000002576 ketones Chemical class 0.000 claims description 5
- 239000002736 nonionic surfactant Substances 0.000 claims description 5
- 229920001223 polyethylene glycol Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 5
- 150000003457 sulfones Chemical class 0.000 claims description 5
- 150000003462 sulfoxides Chemical class 0.000 claims description 5
- 239000002562 thickening agent Substances 0.000 claims description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 claims description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 150000001299 aldehydes Chemical class 0.000 claims description 4
- 235000001014 amino acid Nutrition 0.000 claims description 4
- 229940024606 amino acid Drugs 0.000 claims description 4
- 150000001413 amino acids Chemical class 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 claims description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims description 4
- 235000015165 citric acid Nutrition 0.000 claims description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 claims description 4
- 229960002449 glycine Drugs 0.000 claims description 4
- 238000006197 hydroboration reaction Methods 0.000 claims description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 4
- 235000006408 oxalic acid Nutrition 0.000 claims description 4
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 4
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 4
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 4
- 238000012805 post-processing Methods 0.000 claims description 4
- 239000011591 potassium Substances 0.000 claims description 4
- 229910052700 potassium Inorganic materials 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 235000010265 sodium sulphite Nutrition 0.000 claims description 4
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 4
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 claims description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 4
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 claims description 3
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims description 3
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 claims description 3
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 3
- 150000002191 fatty alcohols Chemical class 0.000 claims description 3
- 150000002429 hydrazines Chemical class 0.000 claims description 3
- 150000002443 hydroxylamines Chemical class 0.000 claims description 3
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 claims description 3
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 claims description 3
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 claims description 3
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 3
- KIUKXJAPPMFGSW-DNGZLQJQSA-N (2S,3S,4S,5R,6R)-6-[(2S,3R,4R,5S,6R)-3-Acetamido-2-[(2S,3S,4R,5R,6R)-6-[(2R,3R,4R,5S,6R)-3-acetamido-2,5-dihydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-2-carboxy-4,5-dihydroxyoxan-3-yl]oxy-5-hydroxy-6-(hydroxymethyl)oxan-4-yl]oxy-3,4,5-trihydroxyoxane-2-carboxylic acid Chemical compound CC(=O)N[C@H]1[C@H](O)O[C@H](CO)[C@@H](O)[C@@H]1O[C@H]1[C@H](O)[C@@H](O)[C@H](O[C@H]2[C@@H]([C@@H](O[C@H]3[C@@H]([C@@H](O)[C@H](O)[C@H](O3)C(O)=O)O)[C@H](O)[C@@H](CO)O2)NC(C)=O)[C@@H](C(O)=O)O1 KIUKXJAPPMFGSW-DNGZLQJQSA-N 0.000 claims description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 claims description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 claims description 2
- NYCCIHSMVNRABA-UHFFFAOYSA-N 1,3-diethylimidazolidin-2-one Chemical compound CCN1CCN(CC)C1=O NYCCIHSMVNRABA-UHFFFAOYSA-N 0.000 claims description 2
- YJUUZFWMKJBVFJ-UHFFFAOYSA-N 1,3-dimethylimidazolidin-4-one Chemical compound CN1CN(C)C(=O)C1 YJUUZFWMKJBVFJ-UHFFFAOYSA-N 0.000 claims description 2
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 claims description 2
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 claims description 2
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 claims description 2
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 claims description 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 2
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims description 2
- MBDUIEKYVPVZJH-UHFFFAOYSA-N 1-ethylsulfonylethane Chemical compound CCS(=O)(=O)CC MBDUIEKYVPVZJH-UHFFFAOYSA-N 0.000 claims description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims description 2
- VTRRCXRVEQTTOE-UHFFFAOYSA-N 1-methylsulfinylethane Chemical compound CCS(C)=O VTRRCXRVEQTTOE-UHFFFAOYSA-N 0.000 claims description 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 2
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical group COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims description 2
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 claims description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 2
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 claims description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 2
- CAAMSDWKXXPUJR-UHFFFAOYSA-N 3,5-dihydro-4H-imidazol-4-one Chemical compound O=C1CNC=N1 CAAMSDWKXXPUJR-UHFFFAOYSA-N 0.000 claims description 2
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 2
- CYDQOEWLBCCFJZ-UHFFFAOYSA-N 4-(4-fluorophenyl)oxane-4-carboxylic acid Chemical compound C=1C=C(F)C=CC=1C1(C(=O)O)CCOCC1 CYDQOEWLBCCFJZ-UHFFFAOYSA-N 0.000 claims description 2
- ZNBNBTIDJSKEAM-UHFFFAOYSA-N 4-[7-hydroxy-2-[5-[5-[6-hydroxy-6-(hydroxymethyl)-3,5-dimethyloxan-2-yl]-3-methyloxolan-2-yl]-5-methyloxolan-2-yl]-2,8-dimethyl-1,10-dioxaspiro[4.5]decan-9-yl]-2-methyl-3-propanoyloxypentanoic acid Chemical group C1C(O)C(C)C(C(C)C(OC(=O)CC)C(C)C(O)=O)OC11OC(C)(C2OC(C)(CC2)C2C(CC(O2)C2C(CC(C)C(O)(CO)O2)C)C)CC1 ZNBNBTIDJSKEAM-UHFFFAOYSA-N 0.000 claims description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 2
- IVQGJZCJWJVSJX-UHFFFAOYSA-N 5-phenylbenzene-1,2,3-triol Chemical compound OC1=C(O)C(O)=CC(C=2C=CC=CC=2)=C1 IVQGJZCJWJVSJX-UHFFFAOYSA-N 0.000 claims description 2
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims description 2
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 claims description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 2
- 108010082495 Dietary Plant Proteins Proteins 0.000 claims description 2
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 2
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 2
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- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/14—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aliphatic hydrocarbons or mono-alcohols
- C11D1/146—Sulfuric acid esters
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- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/008—Polymeric surface-active agents
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/22—Sulfonic acids or sulfuric acid esters; Salts thereof derived from aromatic compounds
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
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- C11D3/04—Water-soluble compounds
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
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- C11D3/2068—Ethers
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2093—Esters; Carbonates
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2096—Heterocyclic compounds
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/32—Amides; Substituted amides
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
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- C—CHEMISTRY; METALLURGY
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/349—Organic compounds containing sulfur additionally containing nitrogen atoms, e.g. nitro, nitroso, amino, imino, nitrilo, nitrile groups containing compounds or their derivatives or thio urea
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- C11D2111/22—
Abstract
The invention discloses a degumming agent for deburring and a preparation method and application thereof. The degumming agent comprises the following components in percentage by mass: 20 to 70 percent of solvent, 10 to 50 percent of organic amine, 0.01 to 50 percent of reducing agent, 0.01 to 5 percent of inorganic base, 0.01 to 10 percent of surfactant, 0.1 to 5 percent of volatile crystallization inhibitor and water; the pH value of the degumming agent is 7.5-13.5, the volatilization crystallization inhibitor is a mixture of vaseline and chlorinated paraffin, and the mass ratio of the vaseline to the chlorinated paraffin is 1: 1-3: 1. the degumming agent disclosed by the invention has a removing effect on tape glue and flash, is free of crystals and has a long service life.
Description
Technical Field
The invention relates to a degumming agent for deburring and a preparation method and application thereof.
Background
In the process of packaging the semiconductor, various colloidal substances, such as tape glue (or tape glue film, generally silane resin) or flash (or burr or flash, generally epoxy molding compound), may remain on the plastic package body and the pins, and need to be removed. Otherwise, the frame deformation, the plating leakage and the plating layer defect in the packaging process are caused to affect the reliability of the product, the problems of product open circuit, insufficient soldering and the like are caused, the electrical conduction performance of the pin is affected, the rework and the chip function failure or even scrapping are seriously caused, and the complexity of the packaging process and the cost increase are brought. Therefore, tape stripping (tape) and flash stripping (deburr) are important process steps for the post-processing of semiconductor integrated circuit packages, especially for "flip-chip QFN" (FCQFN) packaging.
The conventional methods for removing tape glue (tape) or flash (deburr) include high-pressure water jet stripping, laser stripping, chemical stripping, and electrochemical stripping. The method for removing the photoresist by high-pressure water jet, the high-pressure water sand blast, the laser and the electrochemical methods has higher cost and is violent, and the chemical liquid photoresist removal gradually becomes the mainstream method due to low cost and mild conditions.
Chemical liquid medicine degumming also has the not good problem of effect, if liquid medicine life-span is short, liquid medicine gets rid of the power inadequately, liquid medicine has the damage to plastic-sealed body and substrate, the unable one-step method of liquid medicine gets rid of tap glue and flash (can only get rid of tap or flash alone, and can not get rid of tap glue and flash simultaneously) scheduling problem.
CN102864458A discloses an environment-friendly weak acid deburring softening solution, which comprises the following components in percentage by weight: 30-50% of dimethylacetamide, 30-50% of dimethyl sulfoxide, 0.5-1% of furfural, 0.5-1% of OP-10 surfactant and the balance of water. The softening liquid has the defect of short service life, the service life is about one week (paragraph [0022 ]), and the softening liquid is only used for deburring (flash).
CN102808190A discloses an environment-friendly weakly alkaline low-temperature deburring softening solution, which comprises the following components in percentage by mass: 10-35% of tetrahydrofuran, 10-35% of propylene glycol, 1-5% of alkylphenol polyoxyethylene, 5-20% of ethanolamine, 1-10% of N-methyldiethanolamine and the balance of water. The softening liquid is only used for deburring (flash).
CN1935939A discloses a deburring solution for integrated circuit packaging post-treatment, which adopts the following formula: 35% of ethylene glycol phenyl ether, 20% of diethylene glycol dibutyl ether, 15% of caprolactam, 10% of glycerol and 20% of isophorone. The deburring solution is used only for deburring (flash).
CN103128892A discloses a deflashing solution, which comprises 10-60% of 1, 3-dimethyl-2-imidazolidinone, 10-30% of ethanolamine, 10-60% of hexamethylphosphoric triamide and 0-10% of deionized water in percentage by mass. The deflashed solution is used only for deflashing.
CN102270587B discloses a flash softening liquid for plastic-packaged transistors, which contains amide compounds, alkyl ether and NH4F. An alkaline regulator and water. The softening liquid is only used for deburring (flash).
The degumming liquid in the current market still has the problem of volatilization and crystallization, and the volatilization crystals not only consume equipment for degumming, but also bring the problems of complicated steps for cleaning the volatilization crystals and the like.
Therefore, the development of a degumming solution for removing tape and/or flash after integrated circuit package treatment is urgently needed in the field, and the degumming solution has low volatility and is not easy to generate volatile crystals so as to solve the problems.
Disclosure of Invention
The invention aims to solve the technical problem that in the prior art, various colloidal substances such as tape glue or flash and the like are remained on pins in the process of packaging a semiconductor, and when the semiconductor is removed by using a chemical liquid medicine degumming method, the defects that chemical liquid medicine is easy to volatilize and crystallize, the service life is short, the removal force is insufficient, a plastic package body and a base material are damaged, the tape glue and the flash cannot be removed in one step and the like are overcome, and the degumming agent, the preparation method and the application thereof are provided. The degumming agent has long service life and no volatile crystal, and can be recycled within 3 months; the tape glue or the flash can be removed independently or simultaneously, and burrs of a subsequent electroplating process are reduced; no damage to the plastic package body and the base material.
The present invention mainly solves the above-mentioned problems by the following technical means.
The invention provides a degumming agent, which comprises the following raw materials in percentage by mass: 20 to 70 percent of solvent, 10 to 50 percent of organic amine, 0.01 to 50 percent of reducing agent, 0.01 to 5 percent of inorganic base, 0.01 to 10 percent of surfactant, 0.1 to 5 percent of volatile crystallization inhibitor and water; the pH value of the degumming agent is 7.5-13.5, the volatilization crystallization inhibitor is a mixture of vaseline and chlorinated paraffin, and the mass ratio of the vaseline to the chlorinated paraffin is 1: 1-3: 1; the mass percentage is the mass percentage of the mass of each component in the total mass of each component.
Wherein the mass fraction of the solvent can be 35% -55% (for example, 40%, for example, 45%) or 40% -50% (for example, 45%).
Wherein, the mass fraction of the organic amine can be 15-45%, and 20-40%, for example 35%.
Wherein, the mass fraction of the reducing agent can be 0.1-10% (such as 0.15%, and 5%), and can be 0.15-5%.
Wherein the inorganic base can be 0.1-4% (such as 0.15%, and also such as 0.35%), and also can be 0.15-0.35%.
Wherein the surfactant may be present in an amount of 0.1% to 5% (e.g., 0.15%, e.g., 3%) or 0.15% to 3% by mass.
Wherein the content of the volatilization crystallization inhibitor can be 2.0-3.0% (such as 2.5%), or 2.5%.
In the volatilization crystallization inhibitor, the mass ratio of the vaseline to the chlorinated paraffin can be 2: 1-3: 1, such as 2:1, and further such as 3: 1.
Wherein, the pH value of the degumming agent can be 8-12 (such as 10, such as 11) and can be 9-11 (such as 10).
The volatile crystallization inhibitor is free of paraffin. The CAS number for the paraffin is 8002-74-2.
Wherein the vaseline is vaseline conventional in the art, preferably vaseline (CAS number 8009-03-8).
The chlorinated paraffin can be a chlorinated paraffin conventional in the art, and can be one or more of chlorinated paraffin 42, chlorinated paraffin 52 and chlorinated paraffin 70, and can also be chlorinated paraffin 52(CAS number 63449-39-8).
Wherein, the solvent can be a conventional solvent in the field, and can also be one or more of an alcohol solvent, a ketone solvent, an ether solvent, a sulfoxide solvent, a sulfone solvent, an amide solvent and an ester solvent.
The alcohol solvent can be one or more of glycerol, methanol, ethanol, isopropanol, ethylene glycol, triethylene glycol, n-butanol, isobutanol and benzyl alcohol.
The ketone solvent can be one or more of acetone, imidazolidinone, pyrrolidone, imidazolidinone and isophorone. Wherein, the imidazolidinone can be one or more of 2-imidazolidinone, 1, 3-dimethyl-2-imidazolidinone and 1, 3-diethyl-2-imidazolidinone. The pyrrolidone can be one or more of N-methyl pyrrolidone, N-ethyl pyrrolidone, N-cyclohexyl pyrrolidone, 2-pyrrolidone and N-hydroxyethyl pyrrolidone. The imidazolinone can be 1, 3-dimethyl-2-imidazolinone.
The sulfoxide solvent can be one or more of dimethyl sulfoxide, diethyl sulfoxide and methyl ethyl sulfoxide.
The sulfone solvent can be one or more of methyl sulfone, ethyl sulfone and sulfolane.
The ether solvent can be one or more of tetrahydrofuran, ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, dipropylene glycol monoalkyl ether and tripropylene glycol monoalkyl ether. Wherein, the ethylene glycol monoalkyl ether can be one or more of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol phenyl ether and ethylene glycol monobutyl ether. The diethylene glycol monoalkyl ether can be one or more of diethylene glycol monomethyl ether, diethylene glycol monoethyl ether and diethylene glycol monobutyl ether. The propylene glycol monoalkyl ether can be one or more of propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether. The dipropylene glycol monoalkyl ether may be one or more of dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether and dipropylene glycol monobutyl ether. The tripropylene glycol monoalkyl ether is preferably tripropylene glycol monomethyl ether.
The amide may be dimethylformamide and/or dimethylacetamide.
The ester solvent can be one or more of ethyl acetate, ethyl lactate and glycol diacetate.
Wherein, the organic amine can be conventional organic amine in the field, and can be one or more of alcohol amine, organic polyamine, carboxyl-containing organic amine and quaternary ammonium base organic amine.
The alcohol amine can be one or more of ethanolamine, diethanolamine, triethanolamine, isopropanolamine, N-dimethylethanolamine and N-methyldiethanolamine.
The organic polyamine can be one or more of diethylenetriamine, pentamethyldiethylenetriamine and polyethylene polyamine.
The organic amine containing carboxyl can be one or more of 2-aminoacetic acid, 2-aminobenzoic acid, iminodiacetic acid, nitrilotriacetic acid and ethylenediamine tetraacetic acid.
The quaternary ammonium base organic amine can be one or more of tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide, trimethyl benzyl ammonium hydroxide, tetraethyl ammonium hydroxide and triethyl benzyl ammonium hydroxide.
Wherein, the reducing agent can be a reducing agent conventional in the art, and can be one or more of a hydroboration reducing agent (such as sodium borohydride and/or potassium borohydride), an oxide at a low chemical valence (such as hydrogen peroxide), a salt at a low chemical valence (such as one or more of sodium sulfite, sodium hypophosphite, ferrous sulfate and ferrous chloride), hydroxylamine, a hydroxylamine derivative (such as hydroxylamine sulfate and/or hydroxylamine hydrochloride), hydrazine hydrate, a hydrazine derivative (such as methanesulfonyl hydrazide and/or p-toluenesulfonate), an aldehyde reducing agent (such as one or more of formaldehyde, acetaldehyde, glucose and furfural) and a carboxylic acid reducing agent (such as one or more of oxalic acid, citric acid and vitamin C).
The inorganic base may be an inorganic base conventional in the art, and may also be one or more of a carbonate inorganic base (such as sodium carbonate and/or potassium carbonate), a bicarbonate inorganic base (such as sodium bicarbonate), a hydroxide inorganic base (such as one or more of sodium hydroxide, potassium hydroxide, barium hydroxide and calcium hydroxide), and ammonia water.
The surfactant may be a surfactant conventional in the art, and may be an anionic surfactant and/or a nonionic surfactant. The anionic surfactant can be one or more of perfluoroalkyl sulfonic acid potassium, secondary alkyl sodium sulfonate, dodecyl benzene sulfonic acid (LAS), fatty alcohol ether sodium sulfate (AES), ethoxylated fatty acid methyl ester sodium sulfonate (FMES), Alcohol Ether Carboxylate (AEC), alcohol ether phosphate, isooctanol sodium sulfate, MOA-3PK, MOA-5PK, phenol polyoxyethylene ether sodium sulfate and alkyl sulfonate. The nonionic surfactant can be one or more of polyethylene glycol, penetrant JFC, polyglycol ether, OP-10, hydroxyl polyether, polyvinyl alcohol (PVA), polyvinylpyrrolidone, Polyoxyethylene (POE), Polysiloxane (PSOA), fluorinated polyvinyl alcohol, fluorinated polyvinylpyrrolidone, fluorinated polyoxyethylene, fluorinated polysiloxane, fatty alcohol-polyoxyethylene ether, polyol ester and alkylphenol polyoxyethylene ether.
Wherein, the water is preferably deionized water, pure water or ultrapure water.
The degelling agent may further include one or more of fluoride, a metal corrosion inhibitor, and a humectant.
The mass fraction of the fluoride is 0-1% but not 0; and may be from 0.1% to 0.5%, for example 0.3%.
The fluoride may be one conventional in the art, and is preferably one or more of hydrogen fluoride, fluorosilicic acid, ammonium fluorosilicate, fluoroboric acid, ammonium fluoroborate, and a "salt of hydrogen fluoride with a base". Wherein, the alkali in the salt formed by the hydrogen fluoride and the alkali is preferably ammonia water, quaternary amine hydroxide or alcohol amine. The salt of hydrogen fluoride with a base is preferably ammonium hydrogen fluoride (NH)4HF2) Tetramethylammonium fluoride (N (CH)3)4F) And trishydroxyethyl ammonium fluoride (N (CH)2OH)3HF).
The mass fraction of the metal corrosion inhibitor is 0-1% but not 0; but also 0.1% -0.5%.
The metal corrosion inhibitor can be a conventional metal corrosion inhibitor in the field, and can also be one or more of biphenyltriol, catechol, oxalic acid, tartaric acid, succinic acid, maleic acid, acetic acid, citric acid, 3-amino-1, 2, 4-triazole, benzotriazole, glycine, alanine, leucine and isoleucine.
The mass fraction of the humectant may be 0 to 1% but not 0; but also 0.1% -0.5%.
The moisturizer may be conventional in the art and may be one or more of glycerin, butylene glycol, polyethylene glycol, propylene glycol, hexylene glycol, xylitol, polypropylene glycol, sorbitol, sodium lactate, urea, sodium pyrrolidone carboxylate, gelatin, hyaluronic acid, vitamins, and amino acids. Wherein, the amino acid humectant is preferably one or more of vegetable protein, soybean protein, animal protein and hydrolyzed protein.
The raw materials of the degumming agent preferably do not comprise thickening agents.
The thickener may be conventional in the art, preferably one or more of sodium sulfate, sodium chloride, borax, carboxymethyl cellulose (CMC), hydroxypropyl methyl cellulose (HPMC), methyl cellulose, hydroxyethyl cellulose, sodium alginate, sodium polyacrylate, polyacrylamide and polyvinyl alcohol.
In a preferred embodiment of the present invention, the degumming agent comprises the following raw materials by mass: 20 to 70 percent of solvent, 10 to 50 percent of organic amine, 0.01 to 50 percent of reducing agent, 0.01 to 5 percent of inorganic base, 0.01 to 10 percent of surfactant, 0.1 to 5 percent of volatile crystallization inhibitor and water; the pH value of the degumming agent is 7.5-13.5, the volatilization crystallization inhibitor is a mixture of vaseline and chlorinated paraffin, and the mass ratio of the vaseline to the chlorinated paraffin is 1: 3-1: 1; the mass percentage refers to the mass percentage of each component in the total mass of the components before the pH of the degumming agent is adjusted to be 7.5-13.5.
In a preferred embodiment of the present invention, the degumming agent comprises the following raw materials by mass: 20 to 70 percent of solvent, 10 to 50 percent of organic amine, 0.01 to 50 percent of reducing agent, 0.01 to 5 percent of inorganic base, 0.01 to 10 percent of surfactant, 0.1 to 5 percent of volatilization crystallization inhibitor, 0 to 1 percent of fluoride, 0 to 1 percent of metal corrosion inhibitor, 0 to 1 percent of humectant and water, wherein the sum of the mass fractions of the components is 100 percent; the pH value of the degumming agent is 7.5-13.5, the volatilization crystallization inhibitor is a mixture of vaseline and chlorinated paraffin, and the mass ratio of the vaseline to the chlorinated paraffin is 1: 1-3: 1; the mass percentage refers to the mass percentage of each component in the total mass of the components before the pH of the degumming agent is adjusted to be 7.5-13.5,
wherein when the raw materials comprise one or more of fluoride, a metal corrosion inhibitor and a humectant, the mass fractions of the fluoride, the metal corrosion inhibitor and the humectant are not 0 at the same time.
The invention also provides a preparation method of the degumming agent, which comprises the following steps of mixing the components to obtain the degumming agent.
When the pH value of the degumming agent is not in the range of 7.5-13.5, the degumming agent can be further adjusted by adopting an adjusting agent.
The adjustment can be carried out by a person skilled in the art according to the actual pH value of the degelling agent. For example, the conditioning is performed by using a conditioning agent, and the conditioning agent can use one or more of organic acid, inorganic base, strong base and weak acid salt and buffer solution. When the pH value of the degumming agent is too low, inorganic alkali and/or strong alkali weak acid salt can be used for adjusting; when the pH value of the degumming agent is too high, organic acid and/or inorganic acid can be used for adjustment; alternatively, to avoid drastic fluctuations in the pH of the degelling agent, adjustments may be made using buffer solutions conventional in the art.
Wherein, the solid component in the raw material components is preferably added into the liquid component and stirred uniformly.
Wherein, the raw materials in the degumming agent can be stored in a plurality of independent components in a packaged form.
The invention also provides application of the degumming agent in removing tape glue and/or flash in integrated circuit packaging post-treatment.
The application preferably comprises the following steps: and soaking the lead frame in the integrated circuit packaging post-treatment process in the degumming agent, then removing the degumming agent, and drying.
Wherein the soaking temperature can be the soaking temperature conventional in the field, preferably 60-130 ℃, more preferably 65-100 ℃, and most preferably 70-80 ℃.
Wherein, the soaking time can be the time conventional in the art, preferably 10-100min, more preferably 15-90min, and most preferably 30-85min (such as 40min, 50min or 80 min).
The method for removing the degumming agent can be a method conventional in the field, and the soaked lead frame is preferably rinsed with water.
After removing the adhesive, the operation of passing the soaked plastic package body through a water knife can be further included. The operation of the water knife may be conventional in the art.
The drying method may be a method conventional in the art, and preferably nitrogen blow drying.
In the application, the lead frames soaked in the degumming agent can be single-piece lead frames or a batch of lead frames (namely, a plurality of lead frames can be soaked in the degumming agent without limitation, and the number of the lead frames is determined according to the practical number of the lead frames capable of being soaked).
The method of packaging the integrated circuit may be a method of packaging an integrated circuit as is conventional in the art, and preferably a QFN package is used. The QFN package is preferably a flip-chip QFN (i.e., FCQFN).
In the present invention, the alcohol amine refers to a compound in which a hydrogen atom in an aliphatic hydrocarbon group, an alicyclic hydrocarbon group or an aromatic hydrocarbon in an alcohol compound molecule is substituted with one amino group.
In the present invention, the organic polyamine means an aliphatic compound having two or more amino groups in the molecule.
In the present invention, the organic amine containing a carboxyl group means a compound in which a hydrogen atom in an aliphatic hydrocarbon group, an alicyclic hydrocarbon group or an aromatic hydrocarbon in a carboxylic acid-based compound molecule is substituted with one amino group.
In the invention, the quaternary ammonium base organic amine is represented by the general formula R4NOH, wherein R is four same or different aliphatic or aromatic hydrocarbon groups.
In the present invention, the oxide at a low valence state means that the valence of oxygen element in the compound is-1.
In the present invention, the salt at a low valence state means that the valence of at least one element in the salt has a multiple valence state, and the valence is not the highest valence, for example, the valence of sulfur element in sodium sulfite is +4, and sodium sulfite is a reducing agent of the salt at a low valence state defined in the present invention.
In the invention, the QFN package is a Quad Flat No-lead package (Quad Flat No-lead package).
In the invention, the mass fraction of each component refers to the mass percentage of each component in the total mass of all raw material components.
In the invention, the room temperature is 10-30 ℃.
The above preferred conditions can be arbitrarily combined to obtain preferred embodiments of the present invention without departing from the common general knowledge in the art.
The reagents and starting materials used in the present invention are commercially available.
The positive progress effects of the invention are as follows:
1. the degumming agent has long service life and no crystal, and can be recycled within 3 months; tape glue or flash can be removed independently or simultaneously, and tin burrs of a subsequent electroplating process are reduced; no damage to the plastic package body (base material).
2. The degumming agent of the invention can realize safe, convenient and stable operation, low operation cost, high production efficiency, convenient automatic operation, no damage to a substrate and excellent electrical property, can be suitable for single-chip or batch processing, and can be widely applied to the post-processing of various integrated circuit packages, in particular to the post-processing of QFN packages.
3. The degumming agent has very wide market application prospect, solves the problems of microelectronic enterprises, plays a positive role in promoting the development of microelectronic industry in China, and also has higher economic benefit.
Detailed Description
The invention is further illustrated by the following examples, which are not intended to limit the scope of the invention. The experimental methods without specifying specific conditions in the following examples were selected according to the conventional methods and conditions, or according to the commercial instructions.
In the following examples or comparative examples, the preparation method of the degumming agent is to add the solid components in the raw material components of the degumming agent in the examples or comparative examples into the liquid components and stir the mixture evenly.
In the following examples and comparative examples, the operation temperature is not specifically limited, and the operation is carried out at room temperature.
In the following examples and comparative examples, water means deionized water; the vaseline is vaseline with CAS number of 8009-03-8.
Examples 1 to 9
TABLE 1 raw Material Components of degelling Agents
TABLE 2 Mass fractions of the raw material components and pH of the degelling agent
Examples 10 to 17
Examples 10 to 17 are based on example 2, the following components are added, and the amount of water is adjusted accordingly so that the sum of the mass fractions of the components is 100%, as shown in table 3.
Table 3 example 7-14 newly added raw material components and mass fractions
Note "/" indicates no addition of this component.
Comparative examples 1 to 7
TABLE 4 degumming agent raw material components
Note "/" indicates no addition of this component.
TABLE 5 Mass fractions of the raw materials and pH of the degelling agent
Comparative example 8
The deburring softener was prepared according to the composition and content in example 1 of patent CN 102864458A.
Comparative example 9
The deburring softener was prepared according to the composition and content in example 1 of patent CN 102808190A.
Comparative example 10
The deburring softening liquid was prepared according to the composition and content in the examples in patent CN 1935939A.
Comparative example 11
The deburring softener was prepared according to the composition and content in example 1 of patent CN 103128892A.
Comparative example 12
The deburring softener was prepared according to the composition and content in example 1 of patent CN 102270587A.
Comparative examples 13 to 24
TABLE 6 raw material composition of degelling agent
Application examples 1 to 18
Application of degumming agent in removing tape glue and/or flash in integrated circuit packaging post-treatment and electroplating process
Soaking the single lead frames (6cm by 6cm) subjected to molding (packaging) in the flip-chip QFN process in the degumming agent of each embodiment for the soaking time and temperature according to the application examples in the following table 7, and after the operation is finished, washing the single lead frames with pure water, passing through a water knife and drying the single lead frames with nitrogen.
Further, it is subjected to electrolytic tinning.
The effects of removing tape glue and/or flash and electrotinning in the integrated circuit package post-treatment were observed at 100 times using a metallographic microscope, see in particular table 7.
Method for accelerating crystallization of degelling agent
100ml of degumming agent is taken and placed in different quartz beakers (500ml), heating is carried out for 72h at 65 ℃, a funnel-shaped gas collecting hood is placed at the opening of the beaker during heating, and the outlet of the gas collecting hood is connected with ventilation equipment through a ventilation pipe. And heating for 72h, and observing crystallization conditions in the wall of the beaker, the gas-collecting hood and the ventilation pipe.
Service life of degumming agent
The service life of the degumming agent is the period that the degumming agent is used from a preparation tank (new degumming agent is poured into a clean soaking tank) to the next tank replacement (old degumming agent in the soaking tank is completely removed, then the tank is cleaned, and new degumming agent is poured), and the liquid level of the degumming agent in the soaking tank is reduced due to the volatilization of the degumming agent, the carrying of a sample strip (namely a lead frame) and other reasons, so that the new degumming agent is added every day to keep the liquid level in the soaking tank stable. Therefore, the service life is the period of changing the single-groove degumming agent.
TABLE 7
TABLE 8 meanings of symbols
| Severe residue of | × | Severe burrs | × |
| Moderate residue | △ | Medium burr | △ |
| Slight residue was found | ○ | Slight burr | ○ |
| Has no residue | ◎ | Without burr | ◎ |
From the above application examples (1-18), it can be seen that the degelling agent of the present invention has a better removal effect on tape gum and flash, and further a better tin plating effect, when observed by a metallographic microscope. Although slight residue and tin plating burrs occur when the single lead frame is immersed in the degelling agent for short time or immersed in the degelling agent containing the thickening agent, the using effect of the lead frame product is not influenced.
In the above application examples (1 to 18), the case where the lead frame before and after tin plating had a damaged matrix was not observed in metallographic microscope observation.
In addition, the operation of the single lead frame in each of the above application examples (1 to 18) was changed to a batch multi-chip operation, and the tape removal, flash removal, and subsequent tin plating effects were not affected.
In each of the above application examples (1-18), no crystallization occurred after heating the degelling agent at 65 ℃ for 72 hours.
Further carrying out a life test of the degumming agent, the degumming agent in each embodiment of the invention can be repeatedly recycled for more than 3 months, and the service life is longer.
Application examples 19 to 30
Comparative examples 1 to 12 the operation of the degelling agent in application examples 1 to 18 was performed according to the application of the degelling agent in the removal of tape glue and/or flash in the integrated circuit package post-treatment and the electroplating process.
And observing the effects of removing tape glue and/or flash and electrotinning in the integrated circuit packaging post-treatment by adopting a metallographic microscope, and particularly showing the effect in table 9.
TABLE 9
As can be seen from the above application examples (19 to 30), the degelling agents of comparative examples 1 to 12 are inferior in stripping of tape and flash, and thus in tin plating. When the lead frame was observed by a metallographic microscope, the matrix was observed to be damaged before and after tin plating.
Further life tests of the degumming agent show that the degumming agent in each comparative example can be repeatedly recycled for 2 months at most, and comparative examples 7 and 8 can be repeatedly recycled for even one week, so that the service life is short.
Application examples 31 to 54
The degelling agents obtained in comparative examples 1-24 were tested according to the method for accelerating the crystallization of the degelling agent, and the specific results are shown in table 10.
Watch 10
| Numbering | Source of formulation | Presence or absence of crystallization | Numbering | Source of formulation | Presence or absence of crystallization |
| 31 | Comparative example 1 | Has obvious crystallization | 43 | Comparative example 13 | Has slight crystallization |
| 32 | Comparative example 2 | Has obvious crystallization | 44 | Comparative example 14 | Has slight crystallization |
| 33 | Comparative example 3 | Has obvious crystallization | 45 | Comparative example 15 | Has slight crystallization |
| 34 | Comparative example 4 | Has obvious crystallization | 46 | Comparative example 16 | Has slight crystallization |
| 35 | Comparative example 5 | Has obvious crystallization | 47 | Comparative example 17 | Has obvious crystallization |
| 36 | Comparative example 6 | Has obvious crystallization | 48 | Comparative example 18 | Has slight crystallization |
| 37 | Comparative example 7 | Has obvious crystallization | 49 | Comparative example 19 | Has obvious crystallization |
| 38 | Comparative example 8 | Has obvious crystallization | 50 | Comparative example 20 | Has obvious crystallization |
| 39 | Comparative example 9 | Has obvious crystallization | 51 | Comparative example 21 | Has obvious crystallization |
| 40 | Comparative example 10 | Has obvious crystallization | 52 | Comparative example 22 | Has obvious crystallization |
| 41 | Comparative example 11 | Has obvious crystallization | 53 | Comparative example 23 | Has obvious crystallization |
| 42 | Comparative example 12 | Has obvious crystallization | 54 | Comparative example 24 | Has obvious crystallization |
As can be seen from table 10, the degelling agents without the volatilization crystallization inhibitor of the present invention all exhibited significant or slight crystallization; wherein, the mass ratio of the vaseline to the chlorinated paraffin in the volatilization crystallization inhibitor is not in the range of the invention, and the degumming agent also has slight crystallization.
Claims (10)
1. The degumming agent is characterized by comprising the following components in percentage by mass: 20 to 70 percent of solvent, 10 to 50 percent of organic amine, 0.01 to 50 percent of reducing agent, 0.01 to 5 percent of inorganic base, 0.01 to 10 percent of surfactant, 0.1 to 5 percent of volatile crystallization inhibitor and water; the pH value of the degumming agent is 7.5-13.5, the volatilization crystallization inhibitor is a mixture of vaseline and chlorinated paraffin, and the mass ratio of the vaseline to the chlorinated paraffin is 1: 1-3: 1; the mass percentage of each component is the mass percentage of each component in the total mass of all the components.
2. The degelling agent of claim 1, wherein the solvent is present in an amount of 35% to 55% by weight;
and/or the mass fraction of the organic amine is 15-45%;
and/or the mass fraction of the reducing agent is 0.1-10%;
and/or the mass fraction of the inorganic base is 0.1-4%;
and/or the mass fraction of the surfactant is 0.1-5%;
and/or, the content of the volatilization crystallization inhibitor is 2.0% -3.0%;
and/or the mass ratio of the vaseline to the chlorinated paraffin is 2: 1-3: 1;
and/or the pH value of the degumming agent is 8-12.
3. The degelling agent of claim 2, wherein the solvent is present in an amount of 40% to 50% by weight;
and/or the organic amine accounts for 20-40% by mass;
and/or the mass fraction of the reducing agent is 0.15-5%;
and/or the mass fraction of the inorganic base is 0.15-0.35%;
and/or the mass fraction of the surfactant is 0.15-3%;
and/or the content of the volatilization crystallization inhibitor is 2.5 percent;
and/or the pH value of the degumming agent is 9-11.
4. The degelling agent of claim 1 wherein the chlorinated paraffin is one or more of chlorinated paraffin 42, chlorinated paraffin 52, and chlorinated paraffin 70;
and/or the solvent is one or more of an alcohol solvent, a ketone solvent, an ether solvent, a sulfoxide solvent, a sulfone solvent, an amide solvent and an ester solvent;
and/or the organic amine is one or more of alcohol amine, organic polyamine, carboxyl-containing organic amine and quaternary ammonium base organic amine;
and/or the reducing agent is one or more of a hydroboration reducing agent, an oxide at a low valence, a salt at a low valence, hydroxylamine, a hydroxylamine derivative, hydrazine hydrate, a hydrazine derivative, an aldehyde reducing agent and a carboxylic acid reducing agent;
and/or the inorganic base is one or more of carbonate inorganic base, bicarbonate inorganic base, hydroxide inorganic base and ammonia water;
and/or the surfactant is an anionic surfactant and/or a nonionic surfactant.
5. The degelling agent of claim 4 wherein the chlorinated paraffin is chlorinated paraffin 52;
and/or, when the solvent is an alcohol solvent, the alcohol solvent is one or more of glycerol, methanol, ethanol, isopropanol, ethylene glycol, triethylene glycol, n-butanol, isobutanol and benzyl alcohol;
and/or, when the solvent is a ketone solvent, the ketone solvent is one or more of acetone, imidazolidinone, pyrrolidone, imidazolidinone and isophorone; wherein, the imidazolidinone is preferably one or more of 2-imidazolidinone, 1, 3-dimethyl-2-imidazolidinone and 1, 3-diethyl-2-imidazolidinone; the pyrrolidone is preferably one or more of N-methyl pyrrolidone, N-ethyl pyrrolidone, N-cyclohexyl pyrrolidone, 2-pyrrolidone and N-hydroxyethyl pyrrolidone; the imidazolinone is preferably 1, 3-dimethyl-2-imidazolinone;
and/or, when the solvent is a sulfoxide solvent, the sulfoxide solvent is one or more of dimethyl sulfoxide, diethyl sulfoxide and methyl ethyl sulfoxide;
and/or, when the solvent is a sulfone solvent, the sulfone solvent is one or more of methyl sulfone, ethyl sulfone and sulfolane;
and/or, when the solvent is an ether solvent, the ether solvent is one or more of tetrahydrofuran, ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether, propylene glycol monoalkyl ether, dipropylene glycol monoalkyl ether and tripropylene glycol monoalkyl ether; wherein, the ethylene glycol monoalkyl ether is preferably one or more of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol phenyl ether and ethylene glycol monobutyl ether; the diethylene glycol monoalkyl ether is preferably one or more of diethylene glycol monomethyl ether, diethylene glycol monoethyl ether and diethylene glycol monobutyl ether; the propylene glycol monoalkyl ether is preferably one or more of propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether; the dipropylene glycol monoalkyl ether is preferably one or more of dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether and dipropylene glycol monobutyl ether; the tripropylene glycol monoalkyl ether is preferably tripropylene glycol monomethyl ether;
and/or, when the solvent is an amide solvent, the amide solvent is dimethylformamide and/or dimethylacetamide;
and/or, when the solvent is an ester solvent, the ester solvent is one or more of ethyl acetate, ethyl lactate and ethylene glycol diacetate;
and/or, when the organic amine is alcohol amine, the alcohol amine is one or more of ethanolamine, diethanolamine, triethanolamine, isopropanolamine, N-dimethylethanolamine and N-methyldiethanolamine;
and/or, when the organic amine is organic polyamine, the organic polyamine is one or more of diethylenetriamine, pentamethyldiethylenetriamine and polyethylene polyamine;
and/or, when the organic amine is the organic amine containing carboxyl, the organic amine containing carboxyl is one or more of 2-aminoacetic acid, 2-aminobenzoic acid, iminodiacetic acid, nitrilotriacetic acid and ethylene diamine tetraacetic acid;
and/or, when the organic amine is a quaternary ammonium base organic amine, the quaternary ammonium base organic amine is one or more of tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylbenzylammonium hydroxide, tetraethylammonium hydroxide and triethylbenzylammonium hydroxide;
and/or, when the reducing agent is a hydroboration reducing agent, the hydroboration reducing agent is sodium borohydride and/or potassium borohydride;
and/or when the reducing agent is an oxide in a low valence state, the oxide in the low valence state is hydrogen peroxide;
and/or, when the reducing agent is a salt with a low valence, the salt with a low valence is one or more of sodium sulfite, sodium hypophosphite, ferrous sulfate and ferrous chloride;
and/or, when the reducing agent is hydroxylamine derivative, the hydroxylamine derivative is hydroxylamine sulfate and/or hydroxylamine hydrochloride;
and/or, when the reducing agent is a hydrazine derivative, the hydrazine derivative is methanesulfonyl hydrazide and/or p-toluenesulfonic acid hydrazide;
and/or, when the reducing agent is an aldehyde reducing agent, the aldehyde reducing agent is one or more of formaldehyde, acetaldehyde, glucose and furfural;
and/or, when the reducing agent is a carboxylic acid reducing agent, the carboxylic acid reducing agent is one or more of oxalic acid, citric acid and vitamin C;
and/or, when the surfactant is an anionic surfactant, the anionic surfactant is one or more of potassium perfluoroalkyl sulfonate, secondary alkyl sodium sulfonate, dodecylbenzene sulfonic acid, fatty alcohol ether sodium sulfate, ethoxylated fatty acid methyl ester sodium sulfonate, alcohol ether carboxylate, alcohol ether phosphate, isooctanol sodium sulfate, MOA-3PK, MOA-5PK, phenol polyoxyethylene ether sodium sulfate and alkyl sulfonate;
and/or, when the surfactant is a nonionic surfactant, the nonionic surfactant is one or more of polyethylene glycol, a penetrating agent JFC, polyethylene glycol ether, OP-10, hydroxyl polyether, polyvinyl alcohol, polyvinylpyrrolidone, polyoxyethylene, polysiloxane, fluorinated polyvinyl alcohol, fluorinated polyvinylpyrrolidone, fluorinated polyoxyethylene, fluorinated polysiloxane, fatty alcohol polyoxyethylene ether, polyol ester and alkylphenol polyoxyethylene ether.
6. The degelling agent of claim 1 further comprising one or more of a fluoride, a metal corrosion inhibitor, and a humectant.
7. The degelling agent of claim 6 wherein the mass fraction of fluoride is 0-1% but not 0; but also 0.1% -0.5%;
and/or the mass fraction of the metal corrosion inhibitor is 0-1% but not 0; but also 0.1% -0.5%;
and/or the mass fraction of the humectant is 0-1% but not 0; but also 0.1% -0.5%;
and/or the fluoride is one or more of hydrogen fluoride, fluosilicic acid, ammonium fluosilicate, fluoboric acid, ammonium fluoborate and a salt formed by hydrogen fluoride and alkali; wherein, the alkali in the salt formed by the hydrogen fluoride and the alkali is preferably ammonia water, quaternary amine hydroxide or alcohol amine; the salt formed by the hydrogen fluoride and the alkali is preferably one or more of ammonium bifluoride, tetramethylammonium fluoride and trihydroxyethylammonium fluoride;
and/or the metal corrosion inhibitor is one or more of biphenyltriol, catechol, oxalic acid, tartaric acid, succinic acid, maleic acid, acetic acid, citric acid, 3-amino-1, 2, 4-triazole, benzotriazole, glycine, alanine, leucine and isoleucine;
and/or the humectant is one or more of glycerin, butanediol, polyethylene glycol, propylene glycol, hexanediol, xylitol, polypropylene glycol, sorbitol, sodium lactate, urea, sodium pyrrolidone carboxylate, animal glue, hyaluronic acid, vitamins and amino acid humectants; wherein, the amino acid humectant is preferably one or more of vegetable protein, soybean protein, animal protein and hydrolyzed protein.
8. The degelling agent of claim 1 wherein the degelling agent does not include a thickening agent in the raw materials; the thickener is preferably one or more of sodium sulfate, sodium chloride, borax, methyl cellulose, hydroxypropyl methyl cellulose, hydroxyethyl cellulose, sodium alginate, sodium polyacrylate, polyacrylamide and polyvinyl alcohol.
9. The degumming agent as claimed in any one of claims 1 to 8, characterized in that it consists of the following components in mass fraction: 20 to 70 percent of solvent, 10 to 50 percent of organic amine, 0.01 to 50 percent of reducing agent, 0.01 to 5 percent of inorganic base, 0.01 to 10 percent of surfactant, 0.1 to 5 percent of volatilization crystallization inhibitor, 0 to 1 percent of fluoride, 0 to 1 percent of metal corrosion inhibitor, 0 to 1 percent of humectant and water, wherein the sum of the mass fractions of the components is 100 percent; the pH value of the degumming agent is 7.5-13.5, the volatilization crystallization inhibitor is a mixture of vaseline and chlorinated paraffin, and the mass ratio of the vaseline to the chlorinated paraffin is 1: 1-3: 1; (ii) a
Wherein when the raw materials comprise one or more of fluoride, a metal corrosion inhibitor and a humectant, the mass fractions of the fluoride, the metal corrosion inhibitor and the humectant are not 0 at the same time.
10. Use of the degelling agent of any of claims 1-9 in removing tape glue and/or flash in integrated circuit package post-processing.
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