Disclosure of Invention
The application aims to provide a laser leveling jig, a clamp, a clamping method and an optical device coupling welding device, so that the bottom surface of the laser is in a horizontal state before welding.
First aspect, this application embodiment provides a laser instrument pushes away flat tool, including main part and boss, the main part has and pushes away the plane, and the laser instrument mating holes has been seted up to the main part, and the laser instrument mating holes runs through and pushes away the plane, and the axis perpendicular to of laser instrument mating holes pushes away the plane. The boss sets up in the laser instrument cooperation downthehole, and the boss including be used for with laser instrument complex boss face, boss face with push away the plane parallel, and boss face and the thickness that pushes away planar interval and be less than the laser instrument.
In some embodiments, the boss includes a first boss and a second boss, the second boss is located between the first boss and the push-flat surface, the first boss protrudes from the second boss along a radial direction of the laser fitting hole, the boss surface includes a first boss surface formed on the first boss and a second boss surface formed on the second boss, and the first boss surface and the second boss surface are parallel to each other and are spaced apart along an axial direction of the laser fitting hole.
In some embodiments, the opening of the laser mating hole is provided with a chamfer.
In some embodiments, the chamfer is a round chamfer or a tapered chamfer.
In some embodiments, the boss surrounds the clearance hole.
In some embodiments, the diameter of the laser mating hole is 0.01mm to 0.02mm larger than the outer diameter of the laser.
In some embodiments, the body further comprises a fixing surface opposite to the pushing plane, and the fixing surface and the pushing plane are parallel to each other.
In a second aspect, an embodiment of the present application provides a laser fixture, which includes a chuck and the above leveling jig, wherein the chuck has an expandable or reducible clamping space, and an entrance for a laser to extend into the clamping space is formed on an end surface of the chuck. When the push plane approaches the end face in a manner parallel to the end face, the axis of the inlet and the axis of the laser fitting hole are parallel to each other.
In a third aspect, an embodiment of the present application provides an optical device coupling welding apparatus, including an installation platform, the above-mentioned laser fixture, and at least one welding gun, where the installation platform is provided with an installation seat; the laser clamp is arranged on the mounting seat.
In a fourth aspect, an embodiment of the present application provides a laser clamping method, including the following steps:
providing the laser clamp; embedding a laser into a laser matching hole of the leveling jig, enabling the laser to be abutted against the boss surface, and at least partially protruding out of the leveling plane; loosening the clamp, extending the part of the laser protruding out of the push plane into the clamping space, and enabling the end face to be attached to the push plane; the locking clamp clamps the part of the laser protruding from the push plane; and removing the leveling jig.
The application provides a laser instrument pushes away flat tool, anchor clamps, clamping method and optical device coupling welding set, through setting up the plane and the boss face of pushing away that are parallel to each other, when centre gripping laser instrument, make the laser instrument stretch into in the laser instrument mating hole and the laminating of boss face, when pushing away the plane and laminating completely with the chuck, can be in order to guarantee that the terminal surface of laser instrument is completely parallel with the terminal surface of chuck, can be in order to guarantee the terminal surface level of laser instrument this moment, and then reduce the welding among the welding process and become.
These and other aspects of the present application will be more readily apparent from the following description of the embodiments.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 shows a mechanism of a laser 300(LD), and referring to fig. 1, the laser 300 includes a laser body 310 and a lens 320, wherein a housing of the laser body 310 is substantially cylindrical, the laser body 310 has a bottom surface 301 and a top surface 302 opposite to each other, and wherein the bottom surface 301 and the top surface 302 are substantially parallel to each other. In some embodiments, the columnar laser body 310 may be a cylinder. In this embodiment, the housing of the laser body 310 is formed with a step, and a step surface 303 of the step faces the bottom surface 301. The laser body 310 is formed with a first portion 311 and a second portion 312 separated and connected by a step surface 303, wherein the top surface 302 is located at the first portion 311, the bottom surface 301 is located at the second portion 312, the step surface 303 is located between the top surface 302 and the bottom surface 301, and the outer diameter of the first portion 311 is larger than the outer diameter of the second portion 312. The laser 300 further comprises a cylindrical surface 304, the cylindrical surface 304 being connected between the bottom surface 301 and the step surface 303 and being located at an outer wall of the second portion 312.
Lens 320 is mounted on bottom surface 301 of laser body 310 with the focal point of lens 320 approximately on the central axis of laser body 310, and the size of bottom surface 301 of laser body 310 is larger than the size of lens 320, i.e. lens 320 is disposed on only a portion of bottom surface 301, wherein lens 320 may be an aspheric lens 320.
In some cases, the laser 300 may have some defects in the manufacturing process, such as the laser body 310 of the laser 300 is tilted, for example, the step surface 303 and the bottom surface 301 are non-parallel, if the laser 300 is directly clamped on the chuck, the bottom surface 301 of the laser 300 is tilted to a greater degree than the horizontal, so that it is difficult to couple with the substrate during the coupling welding.
Fig. 2 shows a structure of an adjusting ring 200, the adjusting ring 200 is a part of a laser 300 welding process, referring to fig. 2, the adjusting ring 200 is a substantially cylindrical structure, and one end of the adjusting ring is provided with a boss having a boss surface 210 and a connecting surface 220, which are opposite to each other, the laser 300 can penetrate into the adjusting ring 200, and the bore diameter of the inner bore of the adjusting ring 200 is slightly larger than the outer diameter of the laser 300.
In general, the production flow of the laser 300 is as follows: the laser 300(LD) is installed to the upper chuck to clamp, the adjusting ring 200 is sleeved into the LD, the upper chuck moves downwards, so that the bottom surface 301 of the LD is contacted with the inner side boss surface 210 of the adjusting ring 200, and in the process of continuously pressing down the upper chuck, the bottom surface 220 of the adjusting ring is contacted with the upper surface of the BASE (BASE), and the laser is pressed down for a certain distance, so that the bottom surface 301 of the LD, the bottom surface 220 of the adjusting ring and the surface of the BASE are contacted. At this moment, the BASE is clamped by the lower chuck, the lower chuck is fixed by the floating ball, and the floating ball can incline, so that the angle adaptation can be carried out when the LD is pressed down.
The lasers 300 are then lifted upward to perform XYZ three-dimensional coupling (coupling: i.e., adjusting the spatial position of the lasers 300 to direct the laser light emitted by the lasers 300 to the ferrule receiving opening on the substrate, the position at which each laser 300 needs to be coupled is different because the focal length and polarization of each laser 300 is different). At this time, the adjusting ring 200 is freely placed on the surface of the substrate by gravity only. After the coupling is complete, the torch welds the stationary laser 300, the tuning ring 200, and the substrate. Therefore, it is desirable to ensure that the upper surface of the substrate is horizontal and the bottom surface 301 of the laser 300 is horizontal to avoid skewing of the tuning ring 200. After the adjusting ring 200 is tilted, the stress in the three welding directions is not uniform, and the relative positions of the laser 300 and the substrate before and after welding are changed, so that the welding is enlarged, and the production yield is low. Therefore, the inventor proposes a leveling jig, a fixture, a clamping method and an optical device coupling welding device for the laser 300 in the embodiment of the application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
Referring to fig. 3, the present embodiment provides a laser leveling jig 100, which can be used for leveling a laser 300 shown in fig. 1. The laser leveling jig 100 comprises a main body 110 and a boss 120, wherein the main body 110 is provided with a leveling surface 111 and a fixing surface 112, the leveling surface 111 and the fixing surface 112 are both located on the outer surface of the main body 110, and the leveling surface 111 and the fixing surface 112 are located at opposite positions. The push plane 111 has an area greater than or equal to the top surface of the laser. The main body 110 is provided with a laser fitting hole 101, and the laser fitting hole 101 may be a blind hole or a through hole, into which a laser can extend, so that the aperture of the laser fitting hole 101 is matched with the outer diameter of the housing of the laser.
The laser fitting hole 101 penetrates the push plane 111, and the axis of the laser fitting hole 101 is perpendicular to the push plane 111. That is, the laser fitting hole 101 is formed on the body 110 in a perpendicular manner to the push plane 111, so that the laser can be inserted into the laser fitting hole 101 in a perpendicular manner to the push plane 111, and the push plane 111 is kept parallel to both the bottom surface and the top surface of the laser.
The boss 120 is disposed in the laser fitting hole 101, and the boss 120 includes a boss surface 123 for fitting with the laser, the boss surface 123 is parallel to the push plane 111, and a distance between the boss surface 123 and the push plane 111 is smaller than a thickness of the laser. That is, the axis of the laser fitting hole 101 is perpendicular to the boss surface 123, and when the laser is fitted into the laser fitting hole 101, the bottom surface 301 of the laser can be completely attached to the boss surface 123. When the housing of the laser is uniformly cylindrical, the cylindrical surface 304 is a uniform cylindrical surface, and there may be only one of the boss 120 and the boss surface 123.
The spacing between mesa 123 and push plane 111 is less than the thickness of the laser, which is the spacing between the bottom and top surfaces of the laser. Thus, when the laser is inserted into the laser fitting hole 101 and the bottom surface of the laser is abutted against the boss surface 123, at least a part of the laser is located outside the body 110. In this embodiment, when the laser is inserted into the laser fitting hole 101, the first portion of the laser may partially protrude from the push plane 111.
The boss 120 may be formed in a ring shape, and the boss surface 123 may be a ring surface, and the boss 120 may also be formed by a plurality of independent sub-bosses, and the plurality of independent sub-bosses may be spaced apart from each other, and at this time, the boss surface 123 is formed by a plurality of independent sub-bosses together. The boss 120 defines a clearance hole 130, and the clearance hole 130 is used for protecting a lens of the laser, and when the laser is embedded into the laser matching hole 101, the lens can go deep into the clearance hole 130 to protect the lens. The aperture of the keep-off hole 130 may be larger than the maximum diameter of the lens.
In some embodiments, the boss 120 includes a first boss 121 and a second boss 122, the second boss 122 is located between the first boss 121 and the push plane 111, the first boss 121 protrudes from the second boss 122 in a radial direction of the laser fitting hole 101, the boss plane 123 includes a first boss plane 1211 formed on the first boss 121, a second boss plane 1221 formed on the second boss 122, and a connecting plane 1231 connected between the first boss plane 1211 and the second boss plane 1221, wherein the connecting plane 1231 may be a cylindrical curved surface, and a region surrounded by the connecting plane 1231 is coaxial with the laser fitting hole 101. The first projection surface 1211 and the second projection surface 1221 are parallel to each other and spaced apart from each other in the axial direction of the laser fitting hole 101. Meanwhile, the first projection surface 1211 and the second projection surface 1221 are parallel to the push plane 111, wherein the first projection surface 1211 and the second projection surface 1221 can be exposed from the laser fitting hole 101. The spacing between the first land 1211 and the second land 1221 may be equal to or substantially equal to the spacing between the bottom surface and the step surface of the laser.
When the laser is inserted into the laser fitting hole 101, since the push plane 111 is parallel to the first boss 1211, the bottom surface 301 of the laser can be attached to the first boss 1211, the cylindrical surface 304 of the laser fits to the connecting surface 1231, and the gap between the cylindrical surface 304 and the connecting surface 1231 is small, so that the cylindrical surface 304 of the laser can be limited or positioned by the connecting surface 1231, thereby preventing the laser from being skewed.
When the quality of the laser is excellent, the step surface 303 is substantially parallel to the bottom surface 301, the step surface may be attached to the second land surface 1221, and the push flat surface 111 may be parallel to the bottom surface when the bottom surface may be attached to the first land surface 1211. When the quality of the laser is poor, for example, the step surface 303 is tilted with respect to the bottom surface 301 of the laser, in the annular structure surrounded by the second boss 122, the connecting surface 1231 is used for cooperating with the cylindrical surface 304 of the laser to define the degree of freedom of the laser in the circumferential direction, and the second boss surface 1221 can carry the first portion of the laser to define the degree of freedom of the laser in the axial direction. At this time, since the first portion 311 of the laser protrudes from the push plane in a relatively skewed manner, when the clamping is performed, the end surface of the clamp can approach and clamp the first portion 311 in parallel with the push plane 111, and at the same time, the bottom surface 301 of the laser can be kept in parallel with the end surface of the clamp, so that the clamping posture can be maintained correctly, and therefore, even if the quality of the laser varies, the clamped effect is not affected when the clamp is performed.
In order to facilitate the laser to be quickly and accurately embedded into the laser matching hole 101, in some embodiments, a chamfer is provided at an opening of the laser matching hole 101, so that when the laser is embedded, the laser can be accurately and quickly embedded into the laser matching hole 101 corresponding to the laser matching hole 101. As an example, the chamfer may be a round chamfer or a tapered chamfer, and both the round chamfer and the tapered chamfer have the advantages of convenient processing, and smooth effect, and are more convenient for the matching of the leveling jig 100 and the laser.
It will be appreciated that the aperture of the laser mating hole 101 is matched to the dimensions of the laser itself. As an example, in the present embodiment, the aperture of the laser fitting hole 101 is larger than the outer diameter of the laser by 0.01mm to 0.02mm, wherein the aperture of the laser fitting hole 101 is the diameter of the region surrounded by the connection surface 1231. It will be appreciated that the aperture of the laser fitting hole 101 may not be exactly the same throughout its axial direction here to fit with the laser. For example, in the present embodiment, since the first step and the second step are provided, the aperture diameter of the laser fitting hole 101 at the second boss 122 is larger than the aperture diameter of the laser fitting hole 101 at the first boss 121. Set up like this, it can supply the laser instrument to insert, can make again when the laser instrument imbeds laser instrument mating holes 101 after, great clearance can not appear, avoids the laser instrument to appear rocking in laser instrument mating holes 101. Specifically, in this embodiment, the aperture of the second step is Φ 5.71+0.005/-0mm, the aperture of the first step is Φ 4 ± 0.1mm, the aperture of the opening chamfer of the laser fitting hole 101 is Φ 6.7 ± 0.05mm, and the distance between the first step surface and the push plane 111 is Φ 2.9 ± 0.005 mm. It can be seen that the aperture of the second boss 122 and the distance from the first step 1211 to the push-flat surface 111 need to be controlled more precisely, since the aperture of the second boss 122 determines whether the laser matching hole 101 can be inserted when the quality of the laser is defective.
In some embodiments, the fixing surface 112 and the pushing plane 111 are parallel to each other, which is advantageous in that when the pushing jig 100 is used, the fixing surface 112 of the jig can be placed on the horizontal platform, at this time, the fixing surface 112 is located on the horizontal plane, so that the pushing plane 111 is kept horizontal, at this time, after the laser is embedded into the laser matching hole 101 and the bottom surface of the laser is attached to the first boss surface 1211, the bottom surface 301 of the laser is kept horizontal at this time, and the chuck is directly used to clamp the portion of the laser protruding from the pushing plane 111, so that the clamping of the laser is more convenient.
The laser leveling jig 100 provided in this embodiment may be applied to assist the laser to maintain horizontal during clamping, so as to ensure that the bottom surface 301 of the laser may be clamped in a horizontal posture, thereby reducing welding deformation during subsequent processes such as coupling and welding.
Referring to fig. 4, the embodiment further provides an optical device coupling welding apparatus 1 for welding and manufacturing various optical devices, where each optical device includes a laser, an adjusting ring and a substrate, after welding, the adjusting ring is sleeved on the laser, and the laser, the adjusting ring and the substrate are connected by welding.
Specifically, the optical device coupling welding apparatus 1 includes a mounting platform 10, a laser fixture 20, and a welding torch 30, wherein the welding torch 30 may be one or more. The mounting platform 10 is a horizontal platform, and provides a horizontal plane, the mounting platform 10 is provided with a mounting seat 11, the mounting seat 11 is used for mounting and setting the laser clamp 20, and the laser clamp 20 can be slidably set on the mounting seat 11 through a screw rod and the like.
Referring to fig. 5, the laser fixture 20 includes a chuck 21 and a laser leveling jig 100, wherein the chuck 21 has an expandable or contractible holding space, and an end surface 22 of the chuck 21 forms an entrance for the laser to extend into the holding space. In some embodiments, the collet 21 includes at least two clamping portions, a clamping space is formed between the at least two clamping portions, and the at least two clamping portions are selectively moved closer to or apart from each other to enlarge or reduce the clamping space. The cartridge 21 has an end face 22 at the inlet, the inlet extending through the end face 22, the end face 22 being perpendicular to the axis of the inlet. The collet 21 is mounted in such a manner that the axis of the inlet is perpendicular to the mounting platform 10 when mounted to the mounting base 11, and is movable in the vertical direction (Z direction).
The structure of the laser leveling tool 100 can refer to the content of the foregoing embodiments, and is not described herein. When the push flat surface 111 approaches the end surface 22 in parallel with the end surface 22, the axis of the entrance and the axis of the laser fitting hole 101 are parallel to each other. Thus, when the laser 300 is fitted into the laser fitting hole 101, the laser 300 can be held by the chuck 21 in such a manner that the end face 22 is parallel to and in contact with the push flat surface 111 while the laser 300 is held by the portion of the chuck 21 protruding from the push flat surface 111, and the bottom face 301 of the laser 300 can be kept parallel.
Meanwhile, the optical device coupling welding apparatus 1 may further include a substrate fixture 40, the substrate fixture 40 is configured to clamp a substrate, the substrate fixture 40 is disposed on the mounting platform 10 and is disposed opposite to the chuck 21 of the laser fixture 20, and the substrate fixture 40 is configured by a rotatable floating ball mechanism, so that the substrate fixture 40 may be horizontally adjusted according to a distribution condition of the vertical pressure, and the substrate clamped on the substrate fixture 40 may be kept horizontal. The welding guns 30 are mounted to the mounting platform 10 and are used to perform a welding operation, the number of the welding guns 30 being, for example, 3, and the 3 welding guns 30 are arranged in an annular array along the axis of the entrance of the collet 21.
When the optical device coupling welding device 1 provided by the embodiment performs optical device welding, since the laser 300 can be horizontally clamped by the chuck 21, the welding variable is lower during welding, and the yield is higher during welding of the optical device.
Referring to fig. 6, the embodiment further provides a laser clamping method, including the following steps:
step S110 provides the laser holder 20.
The structure of the laser clamp is as in the previous embodiments, and is not described herein again.
And S120, embedding the laser 300 into the laser fitting hole 101 of the leveling jig 100, enabling the laser 300 to be abutted against the boss surface 123 and at least partially protruding out of the leveling surface 111.
In this embodiment, when the laser instrument embedding pushes away flat tool's laser instrument fit hole for the bottom surface and the first boss face of laser instrument offset and laminate, the cylindrical surface and the connection face of laser instrument paste mutually.
And S130, loosening the clamp 20, extending the part of the laser 300 protruding out of the push plane 111 into the clamping space, and attaching the end face 22 to the push plane 111. The end face, the push plane and the bottom surface of the laser are all kept parallel, so that the bottom surface of the laser can be always kept in a horizontal state.
In step S140, the locking clamp 20 clamps the portion of the laser 300 protruding from the push plane 111.
Step S150, removing the leveling jig 100.
When the laser clamped by the mode is used for coupling welding, the bottom surface of the laser is in contact with the boss surface inside the adjusting ring, the connecting surface of the adjusting ring is in contact with the surface of the substrate, and the substrate fixture for fixing the substrate is supported by the floating ball.
According to the laser clamped in the mode, the bottom surface of the laser can be always kept in a horizontal state, so that the welding variable can be reduced in the subsequent welding process of the optical device, and the yield is improved. Even if the laser with a skew is used, the laser leveling jig 100 can assist the chuck to clamp, so that the bottom surface of the laser can be kept in a horizontal state (at this time, the part of the laser extending into the chuck is clamped by the chuck in a manner of being skewed with respect to the axis of the chuck).
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.