CN111341081A - Monitoring device, system and method - Google Patents

Abstract

The invention relates to the technical field of sensors and provides a monitoring device, a monitoring system and a monitoring method, wherein the monitoring device comprises a data acquisition component and a sensing component; the sensing assembly comprises a plurality of sensors, and at least one sensor is arranged outside the data acquisition assembly; the data acquisition assembly comprises a control module and a wireless communication module; the control module is detachably connected with at least a sensor arranged outside the data acquisition assembly, and the wireless communication module is connected with the control module; the control module is at least used for controlling the working state of the sensor and acquiring the data of the sensor; the wireless communication module is at least used for communicating with the remote control terminal; one data acquisition assembly can realize the control and communication of a plurality of sensors, thereby reducing the hardware cost; the data acquisition assembly uniformly transmits the monitoring data and the address data of the sensors, so that the data transmission frequency is reduced, and the communication pressure is relieved; the sensor adopts a detachable connection mode, so that the flexibility of sensor deployment is ensured.

Description

Monitoring device, system and method

Technical Field

The present invention relates to the field of sensor technology, and more particularly, to a monitoring device, system, and method.

Background

With the popularization of the internet of things, the requirement of data processing is higher and higher. Data processing is generally performed in equipment arranged in a data center machine room, and the environment of the machine room has great influence on the operation of the equipment, so that the environmental index of the data center machine room needs to be monitored so as to conveniently grasp and adjust the environment of the machine room in real time. The temperature of the machine room has a great influence on the operation of equipment, so that a temperature field in the machine room needs to be accurately monitored so as to accurately control the ambient temperature.

At present, when the temperature sensor is deployed, a set of processor, sensor, communication module and battery are often packaged into one sensor node. That is, each sensor needs to match the whole set of components, and the hardware cost is high. And the temperature sensors are independent from each other, and each sensor node can independently upload data to the gateway, so that the communication data volume is huge, and the communication efficiency and the communication stability cannot be guaranteed.

Disclosure of Invention

The invention aims to provide a monitoring device to solve the technical problems of low communication efficiency and low stability of a sensor in the prior art.

In order to achieve the purpose, the invention adopts the technical scheme that: the monitoring device comprises a data acquisition component and a sensing component;

the sensing assembly comprises a plurality of sensors, and at least one sensor is arranged outside the data acquisition assembly;

the data acquisition assembly comprises a control module and a wireless communication module;

the control module is detachably connected with at least one sensor arranged outside the data acquisition assembly and used for controlling the sensor and acquiring data of the sensor;

the wireless communication module is connected with the control module and at least used for communicating with a remote control terminal.

The invention also provides a monitoring system, which comprises the monitoring device and a remote control end, wherein a wireless communication module of the monitoring device is in wireless communication with the remote control end.

The invention also aims to provide a monitoring method, which comprises the following steps:

receiving a data acquisition instruction sent by a remote control terminal;

sending data reading signals to a plurality of sensors according to the data acquisition instruction so as to instruct the sensors to send monitoring data;

acquiring address data and monitoring data of each sensor;

and sending the address data and the monitoring data of each sensor to the remote control end.

The monitoring device provided by the invention has the beneficial effects that:

in the invention, one data acquisition component can realize the control and communication of a plurality of sensors, and compared with the scheme that each sensor needs to be matched with the whole set of components in the prior art, the hardware cost is reduced; the data acquisition assembly uniformly transmits the monitoring data and the address data of the sensors, so that the data transmission frequency is reduced, and the communication pressure is relieved; in addition, the sensor adopts a detachable connection mode, so that the flexibility of sensor deployment is ensured.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a first schematic structural diagram of a monitoring device according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a monitoring device according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a monitoring device according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a monitoring device provided in an embodiment of the present invention, the monitoring device being disposed on a cabinet;

fig. 5 is a schematic structural diagram of a connection between a monitoring device and a remote control end according to an embodiment of the present invention;

fig. 6 is a first schematic structural diagram of a temperature sensor in a monitoring device according to an embodiment of the present invention, where 6(a) is a first end face structural diagram, 6(b) is a side face structural diagram, and 6(c) is a second end face structural diagram;

fig. 7 is a schematic cross-sectional view of a housing unit of a temperature sensor in a monitoring device according to an embodiment of the present invention;

fig. 8 is a schematic diagram illustrating a connection between a sensing unit and a first conductive unit and a second conductive unit in a temperature sensor in a monitoring device according to an embodiment of the present invention;

fig. 9 is a first schematic diagram illustrating a first connection unit and a second connection unit of a temperature sensor in a monitoring device according to an embodiment of the present invention;

fig. 10 is a second schematic diagram of a first connection unit and a second connection unit in a temperature sensor in the monitoring device according to the embodiment of the present invention;

fig. 11 is a second schematic structural diagram of a temperature sensor in the monitoring device according to the embodiment of the present invention, in which 11(a) is a schematic structural diagram of a first end face, 11(b) is a schematic structural diagram of a side face, and 11(c) is a schematic structural diagram of a second end face;

fig. 12 is a schematic structural diagram of a connection of a temperature sensor in a monitoring device according to an embodiment of the present invention.

Fig. 13 is a schematic structural diagram of a first temperature sensor in the monitoring device according to the embodiment of the present invention;

fig. 14 is a schematic diagram of an explosive structure of a first temperature sensor in the monitoring device according to the embodiment of the present invention;

fig. 15 is a schematic structural diagram of a second temperature sensor in the monitoring device according to the embodiment of the present invention;

fig. 16 is a schematic diagram of an explosive structure of a second temperature sensor in the monitoring device according to the embodiment of the invention;

fig. 17 is a schematic structural diagram of a third temperature sensor in the monitoring device according to the embodiment of the present invention;

fig. 18 is a schematic view of a first structure in which temperature sensors are connected by connecting wires in the monitoring device according to the embodiment of the present invention;

fig. 19 is a schematic diagram of a second structure in which temperature sensors in the monitoring device according to the embodiment of the present invention are connected by a connection line;

fig. 20 is a schematic view of a third structure in which temperature sensors in the monitoring device provided by the embodiment of the invention are connected by connecting wires;

FIG. 21 is a schematic diagram of a temperature sensor connection in a monitoring device according to an embodiment of the present invention;

fig. 22 is a schematic flow chart of a monitoring method according to an embodiment of the present invention.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1, a monitoring device 10 for monitoring environmental indicators includes a data acquisition component 11 and a sensing component 12. The sensing assembly 12 includes a plurality of sensors 120, at least one sensor 120 being disposed outside the data acquisition assembly 11. The data acquisition assembly 11 comprises a control module 111 and a wireless communication module 112; the control module 111 is detachably connected with at least the sensor 120 arranged outside the data acquisition assembly 11, and the wireless communication module 112 is connected with the control module 111. The control module 111 may be fixedly connected to the sensor 120 disposed in the data acquisition assembly 11, or may be detachably connected thereto.

The sensor 120 is configured to obtain environmental index data, and the type of the sensor 120 and the type of the obtained data are different according to different environmental indexes. For example, when the environmental indicator is temperature, the sensor 120 may be a temperature sensor; when the environmental indicator is humidity, the sensor 120 may be a humidity sensor; when the environmental indicator is pressure, the sensor 120 is a pressure sensor or the like. Of course, the sensor 120 may be of other types, and is not limited herein. The sensor 120 may also integrate more than two sensors, thereby having more abundant functions and being capable of monitoring multiple indexes of the environment. Locate the outer sensor 120 of data acquisition component 11 and can dismantle with control module 111 and be connected, therefore its quantity can increase and decrease as required, and its position can carry out nimble design as required to can monitor each layer of rack respectively, monitor more comprehensively.

Referring to fig. 5, the control module 111 of the data acquisition assembly 11 is at least used for controlling the working state of the sensor 120 and acquiring the data of the sensor 120. The form of the control module 111 may be a main control chip, or may be other forms, which is not limited herein. The wireless communication module 112 is at least used for communicating with the remote control end 20, so as to receive the control signal sent by the remote control end 20 and send the data of the sensor 120 to the remote control end 20, thereby realizing the data synchronization of the sensor 120.

In one embodiment, the monitoring device 10 may be disposed in a cabinet of a data center room, and is used for monitoring the temperature of the cabinet. When arranging, only need locate corresponding position in the rack with data acquisition subassembly 11 among the monitoring devices 10, the different layers of rack then are located respectively to a plurality of sensors 120 of data acquisition subassembly 11 outside simultaneously, need not to carry out loaded down with trivial details wiring. The internet of things gateway is arranged in the machine room, the remote control end 20 can be a cloud server at the moment, and the wireless communication module 112 of the monitoring device 10 can be wirelessly connected with the internet of things gateway and connected with the remote control end 20 through the internet of things gateway. The number of monitoring devices 10 can be set as desired. For example, when a plurality of cabinets are provided in the machine room, one monitoring device 10 may be provided in each cabinet, one sensor 120 is correspondingly provided on each layer of each cabinet, and each monitoring device 10 may be wirelessly connected to the remote control end 20, so that the remote control end 20 may monitor and control each cabinet in real time.

The monitoring device 10 provided by the embodiment has at least the following beneficial effects:

at present, when the temperature sensor is deployed, the temperature sensor is usually a wired sensor, so that the wiring density is high, the space wiring is very complex, and the construction difficulty is high. For example, when temperature sensors are required to be arranged in a data center machine room, thousands or even tens of thousands of cabinets can be arranged in the data center machine room, in order to accurately monitor the temperature of each cabinet, the temperature sensors are required to be arranged in each cabinet, so that the number of the temperature sensors in one machine room is required to reach tens of thousands, the number is very large, the wiring amount is very large, a large number of cables are required to be consumed, the cable material cost is high, very high requirements are provided for space wiring, great difficulty is brought to actual construction, and the situations of wiring errors, wiring winding and the like are easy to occur. In case when a certain temperature sensor goes wrong, a large amount of time and manpower are consumed for carrying out later maintenance such as screening, removing, replacing and dismantling, and the time cost and the labor cost of the later maintenance are greatly increased.

This embodiment provides a completely new design. On one hand, by providing the control module 111 and the wireless communication module 112 in the monitoring devices 10, and providing a plurality of sensors 120 in each monitoring device 10, the sensors 120 can communicate with the remote control 20 through the wireless communication module 112. Because monitoring devices 10 can with remote control end 20 wireless communication, consequently need not to carry out the wiring operation again when setting up temperature sensor, the construction degree of difficulty greatly reduced has greatly saved the space in the data center computer lab, has avoided the appearance of the condition such as wiring mistake, wiring winding. Moreover, the monitoring devices 10 that this embodiment provided can save the cable, reduce material cost, also can greatly reduce artificial working strength and arrange the time, when maintaining in the later stage, if certain temperature sensor damages when needing to be changed or demolish, need not to carry out the screening of wiring, get rid of work, only need take off need change temperature sensor can, it is more convenient to maintain the operation, has reduced later maintenance's time cost and human cost. Meanwhile, the monitoring devices 10 are arranged in a wireless mode, so that space constraint is avoided, the monitoring devices 10 can also be effectively arranged in places where wired temperature sensors cannot be arranged, the arrangement range of the monitoring devices 10 is greatly expanded, and more accurate and comprehensive temperature monitoring can be carried out on all positions in a data center machine room.

On the other hand, taking the sensor 120 as a temperature sensor (it should be understood that when the sensor 120 is another type of sensor, the beneficial effects corresponding to the above temperature sensor can also be obtained), usually thousands or even tens of thousands of cabinets are closely arranged in the data center room, and each cabinet is provided with multiple layers, and when monitoring the temperature of the cabinets in the data center room, the temperature of each layer of each cabinet needs to be monitored. At present, the commonly used temperature sensors respectively perform data interaction with the remote control terminal 20, and the temperature sensors are independent from each other, which makes the data transmission and data throughput of the temperature sensors extremely large, so that the communication efficiency and the communication stability cannot be guaranteed. And every monitoring devices 10 is equipped with a plurality of temperature sensor in this embodiment, and every temperature sensor can correspond and set up in the different layers of rack, not only can realize carrying out temperature measurement to every layer of rack, obtains the temperature field of data center computer lab, and every monitoring devices 10 can carry out data processing to a plurality of temperature sensor moreover, and the quantity of the control module 111 that carries out data interaction with remote control end 20 that has significantly reduced has improved data transmission efficiency, and data transmission is more stable.

In one embodiment, the monitoring device 10 can be powered by an external power source, and the control module 111 is provided with a power interface for connecting with the external power source, and can control whether to power the wireless communication module 112 and the sensing assembly 12 through the control module 111.

Referring to fig. 1, in an embodiment, the data acquisition assembly 11 further includes a battery module 113, and the battery module 113 is connected to the control module 111 and is used for supplying power to the control module 111 and supplying power to the wireless communication module 112 and the sensing assembly 12 under the control of the control module 111. The battery in the battery module 113 may be in the form of a rechargeable battery, such as a lithium ion rechargeable battery; the battery may be a replaceable battery, such as a five-size battery or a seven-size battery, and the like, and is not limited herein. Through built-in battery module 113 in monitoring devices 10, need not the power supply of external cable, monitoring devices 10's an organic whole nature is higher, and overall structure is more succinct, and it is all more convenient to install and use.

It should be understood that the connection between the sensors 120 may take many forms.

Referring to fig. 2, in an embodiment, a plurality of sensors 120 are connected in series, and one sensor 120 is directly connected to the control module 111, and adjacent sensors 120 may be directly connected to each other or may be connected to each other by a connection line 130. When connected by the connection line 130, the length of the connection line 130 may be set as desired. The manner is favorable for increasing and decreasing the number of the sensors 120, and when the number of the sensors 120 needs to be increased, the sensors 120 with the corresponding number are connected to the tail end of the last sensor 120 in sequence; when the number of the sensors 120 needs to be reduced, the sensors 120 with the corresponding number only need to be sequentially taken down from the tail end, and the operation is simple and convenient.

Referring to fig. 3, in an embodiment, the plurality of sensors 120 are connected in parallel, that is, each sensor 120 is directly connected to the control module 111, and they do not affect each other, so that when one sensor 120 is damaged, it does not affect the other sensors 120, so as to ensure that the monitoring device 10 can still work smoothly, and only the damaged sensor 120 needs to be replaced in time after the problem is solved, so that the operation is simple and convenient.

In one embodiment, the plurality of sensors 120 are connected in series and then in parallel. For example, when the number of the sensors 120 is four, the sensors 120 may be divided into two groups, where two sensors 120 are connected in series in each group, and each group is directly connected to the control module 111, so that the sensors 120 may be distributed and controlled in groups. Of course, the number of groups into which the plurality of sensors 120 are divided, and the number of sensors 120 connected in series in each group may be set according to the circumstances, and is not limited herein.

Referring to fig. 2 and 4, for example, the cabinet 40 has four layers (numbered as a first cabinet layer 41, a second cabinet layer 42, a third cabinet layer 43, and a fourth cabinet layer 44 from top to bottom), and each layer needs to be monitored by a sensor 120; the number of the sensors 120 is four, and for convenience of description, the four temperature sensors are respectively a first sensor, a second sensor, a third sensor and a fourth sensor which are sequentially connected in series. Wherein, the first sensor is arranged in the data acquisition assembly 11, and the second sensor to the fourth sensor are arranged outside the data acquisition assembly 12. The data acquisition assembly 11 with the first sensor is arranged on the first layer 41 of the cabinet, the second sensor is arranged on the second layer 42 of the cabinet, the third sensor is arranged on the third layer 43 of the cabinet, and the fourth sensor is arranged on the fourth layer 44 of the cabinet. Two adjacent sensors are connected through a connecting wire 130, and the length of the connecting wire 130 corresponds to the height between two adjacent layers in the cabinet. At this time, the control module 111 may acquire data of the first to fourth sensors and transmit the data to the remote control 20 through the wireless communication module 112; meanwhile, the control module 111 may also control the first sensor to the fourth sensor respectively according to the control signal sent by the remote control terminal 20. It should be understood that the number of layers of the cabinet can be set as desired, and the number of sensors 120 can also be set as desired, and is not limited to the above.

Further, in consideration of the number of the sensors 120, it is necessary to distinguish the sensors 120 so that the control module 111 can correspond to the measurement area when acquiring the data of the sensors 120. At this time, address data may be written in different sensors 120, for example, different user bytes may be written in, and when the control module 111 acquires data of the sensors 120, the control module simultaneously reads the user bytes corresponding to the sensors 120, so that the different sensors 120 can be distinguished. For example, when the number of the sensors 120 is four, the user bytes corresponding to the first sensor to the fourth sensor are 0000, 0001, 0002, and 0003, respectively, and when the control module 111 reads the data of the first sensor, the user byte 0001 of the reader is simultaneously used, so that the read data can be determined as the data of the first sensor, and the environment index of the corresponding position can be obtained according to the position where the first sensor is located; the situations of the second sensor to the fourth sensor are analogized, and the description is omitted here.

Further, when the arrangement of the monitoring device 10 is performed, the sensors 120 need to be correspondingly arranged to the corresponding positions of the cabinet. For example, a cabinet is provided with four layers; when the number of the sensors 120 is four, the labels of different colors can be correspondingly attached to different sensors (for example, the first sensor corresponds to the label of the first color, the second sensor corresponds to the label of the second color, the third sensor corresponds to the label of the third color, the fourth sensor corresponds to the label of the fourth color, and the first color, the second color, the third color and the fourth color are different from each other), so that the situation of disorder placement can not occur when the sensors are arranged, and the arrangement efficiency is greatly improved.

Further, the specific type of the wireless communication module 112 may be set as needed, and may include, for example, at least one of a bluetooth module, a WIFI module, a 2.4G wireless communication module, a long-distance radio communication module (LoRa communication module), and a GPRS module, so as to wirelessly communicate with the remote control terminal 20. When the wireless communication module 112 has a plurality of types, it can have more abundant remote communication modes, and greatly expand the application scenarios thereof.

Referring to fig. 2 and 4, in an embodiment, the cabinet has four layers (numbered as a first layer of cabinet, a second layer of cabinet, a third layer of cabinet and a fourth layer of cabinet from top to bottom), and each layer needs to be provided with a temperature sensor to monitor the temperature; the sensors 120 are temperature sensors, and the number of the temperature sensors is four, and the temperature sensors are respectively a first temperature sensor 121, a second temperature sensor 122, a third temperature sensor 123 and a fourth temperature sensor 124 which are sequentially connected in series. The first temperature sensor 121 is disposed in the data acquisition assembly 11, and the second to fourth temperature sensors 122 to 124 are disposed outside the data acquisition assembly 12. Data acquisition component 11 with first temperature sensor 121 locates the rack one deck, and second temperature sensor 122 locates the rack two decks, and third temperature sensor 123 locates the rack three deck, and fourth temperature sensor 124 then locates the rack four decks.

The user bytes corresponding to the first to fourth temperature sensors 121 to 124 are 0000, 0001, 0002, and 0003, respectively. The first temperature sensor 121 is correspondingly labeled with a label of a first color, the second temperature sensor 122 is correspondingly labeled with a label of a second color, the third temperature sensor 123 is correspondingly labeled with a label of a third color, and the fourth temperature sensor 124 is correspondingly labeled with a label of a fourth color, wherein the first color, the second color, the third color and the fourth color are different from each other.

Two adjacent temperature sensors are connected through a connecting wire 130, the length of the connecting wire 130 corresponds to the height between two adjacent layers in the cabinet, for example, the length can be 0.5m, the height between one layer of the cabinet and the ground is 2m, the height between the second layer of the cabinet and the ground is 1.5m, the height between the third layer of the cabinet and the ground is 1.0m, and the height between the fourth layer of the cabinet and the ground is 0.5 m. It is thus known that the temperature measured by each temperature sensor is from a specific location in the cabinet.

The control module 111 can acquire data of the first to fourth temperature sensors 121 to 124 and transmit the data to the remote control terminal 20 through the wireless communication module; meanwhile, the control module 111 may also control the first temperature sensor 121 to the fourth temperature sensor 124 according to the control signal sent by the remote control terminal 20.

It should be understood that the sensor 120 may be of other types, and is not limited to the temperature sensor described above, and is not limited thereto.

When the sensor 120 is a temperature sensor, its specific structure may be set as desired.

Referring to fig. 6 and 7, in one embodiment, the temperature sensor includes a housing unit 31, a sensing unit 32, a first conductive unit 33, a second conductive unit 34, a first connection unit 35, and a second connection unit 36. The housing unit 31 includes a housing 311, and the sensing unit 32 is disposed in the housing 311 for detecting temperature. The first conductive unit 33 is disposed in the housing 311 and electrically connected to the sensing unit 32, the second conductive unit 34 is disposed in the housing 311 and electrically connected to the sensing unit 32, and the first conductive unit 33 is electrically connected to the second conductive unit 34. The first connection unit 35 and the second connection unit 36 are provided in the housing 311, and the plurality of temperature sensors may be connected through the first connection unit 35 and the second connection unit 36 thereof.

Referring to fig. 7, the sensing unit 32 further includes a temperature sensing element 320, and a ground pin 321, a data pin 322 and a power pin 323 connected to the temperature sensing element 320, wherein the data pin 322 is used for transmitting a data signal to the temperature sensing element 320 and outputting the data signal of the temperature sensing element 320. The first and second conductive elements 33 and 34 each include a first conductive end, a second conductive end, and a third conductive end. Referring to fig. 6 and 8, for convenience of description, in one embodiment, the first conductive unit 33 includes a first ground terminal 331, a first data terminal 332 and a first power terminal 333, and the second conductive unit 34 includes a second ground terminal 341, a second data terminal 342 and a second power terminal 343. The first ground 331, the second ground 341 and the ground pin 321 are electrically connected to each other, the first data terminal 332, the second data terminal 342 and the data pin 322 are electrically connected to each other, and the first power terminal 333, the second power terminal 343 and the power pin 323 are electrically connected to each other. When a plurality of temperature sensors are connected, the path formed by the first conductive unit 33 and the second conductive unit 34 corresponds to a bus line on which the respective temperature sensing elements 320 are connected in parallel. The first ground terminal 331, the first data terminal 332, the first power terminal 333, the second ground terminal 341, the second data terminal 342, and the second power terminal 343 are preferably metal terminals (e.g., copper terminals) with good conductivity.

In one embodiment, the sensing unit 32 is a DS18B20 temperature sensor, which is a digital temperature sensor having at least the following features: (1) the adaptive voltage range is wide and can reach 3.0V-5.5V, and an external power supply can supply power through a data line; (2) due to the unique single-wire interface mode, when the DS18B20 is connected with a control unit (such as a microprocessor), the two-way communication between the control unit and the DS18B20 can be realized only by one data wire (3) the DS18B20 supports the multipoint networking function, and a plurality of DS18B20 can be connected on a unique bus in parallel to realize the multipoint temperature measurement of the networking; (4) the temperature range is-55-125 ℃, the precision is plus or minus 0.5 ℃ at-10-85 ℃, the measurement temperature range is wide, and the precision is high; (5) the temperature can be rapidly converted into the digital temperature, the digital temperature is directly output by the measuring result, and the anti-interference error correction capability is extremely strong in the transmission process. Of course, in other embodiments, the sensing unit 32 may be other types of sensors, and is not limited herein.

Referring to fig. 6, in one embodiment, the housing 311 is a cylinder and includes a first end 3111 and a second end 3112 opposite to each other and a side 3110, and the first end 3111 and the second end 3112 are connected by the side 3110. The side surface 3110 may have a circular or elliptical cross-sectional shape, and the cross-sectional shape thereof is adapted to the shapes of the first and second end surfaces 3111 and 3112.

In one embodiment, the housing 311 is a polygonal column including a first face 3111 and a second face 3112 opposite to each other, the first face 3111 and the second face 3112 are connected by a side face 3110, the number of rectangles included in the side face 3110 can be set as required, and the shape of the first face 3111 and the second face 3112 is adapted to the cross-sectional shape of the side face 3110. For example, when the first end face 3111 and the second end face 3112 are both quadrangular, the side face 3110 includes a first side face, a second side face, a third side face and a fourth side face which are connected in sequence, and the housing 3111 is a quadrangular prism. For another example, when the first end face 3111 and the second end face 3112 are both triangular, the side face 3110 includes a first side face, a second side face, and a third side face connected in sequence, and in this case, the housing 3111 is a triangular prism. Of course, the first end face 3111 and the second end face 3112 may be other polygonal shapes, and are not limited herein.

Of course, the housing 311 may have other shapes, and is not limited to the above-mentioned shape, and is not limited thereto.

In one embodiment, the housing 311 is a plastic housing, i.e., made of plastic, such as PVC (polyvinyl chloride), which is light and low cost, and can also provide good protection. The housing 311 may also be made of a metal material, which has a hard texture, a high strength, a stable chemical property, and a good heat conduction effect, and has a better heat conduction effect and a better protection effect. Of course, the housing 311 may be made of other materials, and is not limited to the above.

Referring to fig. 7, further, the housing unit 31 further includes a heat conduction layer 312, and the heat conduction layer 312 is filled between the sensing unit 32 and the housing 311. Optionally, the heat conducting layer 312 is made of heat conducting silica gel, so that on one hand, a good heat conducting effect can be achieved, so that external heat in contact with the shell 311 can be conducted to the sensing unit 32 through the heat conducting layer 312, and the temperature measuring accuracy of the sensing unit 32 is improved; on the other hand, it can fill the gap between the housing 311 and the sensing unit 32, so that the sensing unit 32 can be well protected and fixed. Of course, the heat conductive layer 312 may be made of other materials, and is not limited herein.

In one embodiment, the first conductive unit 33 and the first connection unit 35 are disposed on one end surface of the housing 311, the second conductive unit 34 and the second connection unit 36 are disposed on the other end surface of the housing 311, and the first connection unit 35 of one temperature sensor can be connected with the second connection unit 36 of another temperature sensor in a matching manner, so that the connection of a plurality of temperature sensors can be realized.

Referring to fig. 6, the housing 311 includes a first end surface 3111 and a second end surface 3112 opposite to each other, wherein the first conductive unit 33 and the first connection unit 35 are disposed on the first end surface 3111, and the second conductive unit 34 and the second connection unit 36 are disposed on the second end surface 3112, so that the two ends of the housing 311 are sequentially connected to each other. Of course, the following may also be provided: the first conductive unit 33 and the first connection unit 35 are disposed on the first end face 3111 or the second end face 3112, the second conductive unit 34 and the second connection unit 36 are disposed on the side face 3110, and the first connection unit 35 of one temperature sensor and the second connection unit 36 of the other temperature sensor are connected in a fitting manner. At this time, the two temperature sensors connected with each other are not on the same straight line, but can be perpendicular to each other; when the plurality of temperature sensors are connected in sequence, the plurality of temperature sensors can be arranged in a ladder shape, so that the requirement of a specific use environment is met.

Of course, the first connecting unit 35 and the second connecting unit 36 may be arranged in other manners, and are not limited to the above-mentioned case, and are not limited herein.

Referring to fig. 12, when the first connection unit 35 of one temperature sensor is connected to the second connection unit 36 of another temperature sensor in a matching manner, because the first conductive unit 33 and the second conductive unit 34 in each temperature sensor are electrically connected, the plurality of temperature sensors connected in sequence are electrically connected, and at this time, when the control module 111 needs to perform operations such as data reading, control, power supply and the like on the temperature sensors, only the first conductive unit 33 or the second conductive unit 34 of the temperature sensor located at the end portion needs to be connected to the control module 111, so that the control module 111 can simultaneously and uniformly control the plurality of temperature sensors. Meanwhile, when the number of the temperature sensors needs to be increased, the temperature sensors needing to be increased are only required to be connected with the temperature sensors positioned at the end parts; in a similar way, when the number of the temperature sensors needs to be reduced, the temperature sensors only need to be taken down from the end part, so that the number of the temperature sensors can be increased and reduced at will according to needs, and the setting is convenient and flexible.

Referring to fig. 6, in an embodiment, the housing 311 may be a cylinder, the first conductive unit 33 and the first connection unit 35 may be disposed on the first end face 3111, and the second conductive unit 34 and the second connection unit 36 may be disposed on the second end face 3112, where the positions of the first conductive unit 33 and the second conductive unit 34 are mirror-symmetric, and the positions of the first connection unit 35 and the second connection unit 36 are mirror-symmetric, so as to ensure that when the first end face 3111 of one temperature sensor is butted with the second end face 3112 of another temperature sensor, the positions of the first connection unit 35 and the second connection unit 36 are corresponding, and the positions of the first conductive unit 33 and the second conductive unit 34 are corresponding, thereby facilitating connection.

The specific arrangement of the first conductive elements 33 and the second conductive elements 34 can be set according to the needs, and several setting manners are given below, but not limited to the following manners.

In one embodiment, the first ground terminal 331, the first data terminal 332 and the first power terminal 333 are aligned in a row, the second ground terminal 341, the second data terminal 342 and the second power terminal 343 are aligned in a row, and when the arrangement is performed, the positions of the first ground terminal 331 and the second ground terminal 341 are mirror-symmetric, the positions of the first data terminal 332 and the second data terminal 342 are mirror-symmetric, and the positions of the first power terminal 333 and the second power terminal 343 are mirror-symmetric, so that the relative positions are ensured when the connection is performed. Of course, when the first ground terminal 331, the first data terminal 332 and the first power terminal 333 are arranged, the relative order may be arbitrarily set as required, as long as the relative order corresponds to the relative order of the second ground terminal 341, the second data terminal 342 and the second power terminal 343.

Referring to fig. 8, in one embodiment, the first ground terminal 331, the first data terminal 332 and the first power terminal 333 are arranged in a triangle, the second ground terminal 341, the second data terminal 342 and the second power terminal 343 are arranged in a triangle, and when the arrangement is performed, the positions of the first ground terminal 331 and the second ground terminal 341 are mirror symmetric, the positions of the first data terminal 332 and the second data terminal 342 are mirror symmetric, and the positions of the first power terminal 333 and the second power terminal 343 are mirror symmetric, so that the relative positions are ensured to be accurate when the connection is performed. Triangular means that the three are not on the same straight line, and can form any triangle, preferably an equilateral triangle, so that the three have higher symmetry.

Further, the form of the first connecting unit 35 and the second connecting unit 36 may be provided as needed as long as the two can be connected in a fitting manner. Several arrangements are given below, but not limited to the following.

Referring to fig. 9, in an embodiment, the first connection unit 35 includes at least one first-type connection portion 371, the second connection unit 36 includes at least one second-type connection portion 372, the number of the first-type connection portion 371 of the first connection unit 35 and the number of the second-type connection portion 372 of the second connection unit 36 are corresponding, the first-type connection portion 371 and the second-type connection portion 372 are mirror-symmetrical, and the first-type connection portion 371 and the second-type connection portion 372 can be connected in a matching manner. When the number of the first-type connection portions 371 and the second-type connection portions 372 is one, the first-type connection portions 371 may be disposed in the middle of the first end surface 3111, and the second-type connection portions 372 may be disposed in the middle of the second end surface 3112, so as to ensure that the first conductive elements 33 and the second conductive elements 34 can be tightly connected when the first-type connection portions 371 and the second-type connection portions 372 are connected in a matching manner. Of course, the number of the first-type connecting portions 371 and the second-type connecting portions 372 may be plural, and the specific positions may be set as required, for example, the first-type connecting portions may be arranged in a line, or may be arranged in a triangle, a quadrangle, or the like.

Referring to fig. 10, in an embodiment, the first connection unit 35 further includes at least one second-type connection portion 372, and the second connection unit 36 further includes at least one first-type connection portion 371, which are corresponding in number and are mirror-symmetrical in position. When the first connection unit 35 includes a first connection portion 371 and a second connection portion 372, the first connection portion 371 and the second connection portion 372 may be disposed on the first end surface 3111 at a position close to the edge on the same diameter, so as to ensure that the first conductive unit 33 and the second conductive unit 34 can be connected tightly when the two temperature sensors are connected. Referring to fig. 11, when the first connection unit 35 includes a first connection portion 371 and two second connection portions 372, the first connection portion 371 and the second connection portions 372 are arranged in a triangle, and the first connection unit 35 and the first conductive unit 33 may be arranged in a triangle; the second connection unit 36 includes a second connection portion 372 and two first connection portions 371, the second connection portion 372 is mirror-symmetrical to the first connection portion 371 of the first connection unit 35, and the first connection portion 371 is mirror-symmetrical to the second connection portion 372 of the first connection unit 35. Of course, the number of the first-type connection portions 371 and the second-type connection portions 372 included in the first connection unit 35 and the second connection unit 36 may be set to be larger to ensure that the connection is tighter.

In the present embodiment, the first-type connection portion 371 and the second-type connection portion 372 are connected by magnetic attraction in consideration of connection stability and operation convenience, and several arrangements are given below, but not limited to the following.

In one embodiment, the first-type connection 371 is a magnetic connection, i.e., can be made of a magnet, and the second-type connection 372 is a metal connection, e.g., can be made of a ferrous material. Of course, it may be: the first connection 371 is a metal connection and the second connection 372 is a magnetic connection. When the magnetic connecting part is close to the metal connecting part, the magnetic connecting part can generate magnetic adsorption on the metal connecting part, so that the magnetic connecting part and the metal connecting part are tightly connected. When the two parts need to be separated, only acting force needs to be applied to the two parts, so that the two parts are far away, and the operation is simple and convenient.

In one embodiment, the first-type connection portions 371 and the second-type connection portions 372 are magnetic connection portions, and the connection sides of the first-type connection portions 371 and the second-type connection portions 72 are opposite in magnetism, for example, when the outward side of the first-type connection portions 371 is a north pole (N), the outward side of the second-type connection portions 372 is a south pole (S); alternatively, when the outward side of the first-type connection portion 371 is south pole, the outward side of the second-type connection portion 372 is north pole, so as to ensure that the two are attracted to each other and stably connected when they are close to each other.

Further, the first connection unit 35 and the second connection unit 36 may be disposed flush with the end surface of the housing 311, may be both protruding outward, may also be in a concave-convex fit, and the like, and may also be in other forms, which is not limited herein.

Referring to fig. 11, in one embodiment, the first connecting unit 35 is disposed in the housing 311, and an outward side thereof is flush with the first end face 3111; similarly, the second connection unit 36 is also disposed in the housing 311, and its outward side is flush with the second end face 3112. When the two are connected by magnetic attraction, not only the first connection unit 35 and the second connection unit 36 can be connected tightly and stably, but also the first end face 3111 and the second end face 3112 are tightly attached to each other, which is helpful for electrically connecting the first conductive unit 33 and the second conductive unit 34.

In one embodiment, the first connecting unit 35 is disposed on the first end face 3111 and protrudes outward, and the second connecting unit 36 is disposed on the second end face 3112 and protrudes outward, so that the two connecting units are clearly located when connecting, and the positioning connection is convenient.

Referring to fig. 6, in one embodiment, in order to prevent the reverse connection, the first connection portions 371 and the second connection portions 372 may be concave-convex. For example, the first type of connection portion 371 is a protrusion, and the second type of connection portion 372 is a groove; or, the first connecting portion 371 is a groove, the second connecting portion 372 is a protrusion, and the protrusion and the groove are matched, so that not only can the connection be ensured to be tight and stable, but also the reverse connection can be effectively prevented, and the alignment is accurate.

Of course, the shape of the first-type connecting portion 371 and the second-type connecting portion 372 may be set according to the requirement, and may be a polygon such as a triangle, a quadrangle, or a pentagon, or may be a circle, an ellipse, or the like, as long as the connection can be tight, and the shape is not limited herein.

Referring to fig. 6, 7 and 12, in one embodiment, the housing unit 11 includes a housing 311 and a heat conductive layer 112, the housing 311 is a cylinder and includes a first end face 3111, a second end face 3112 and a side face 3110 disposed between the first end face 3111 and the second end face 3112. The sensor unit 32 is disposed in the housing 311, and the heat conductive layer 112 is filled between the sensor unit 32 and the housing 311. The sensing unit 32 includes a temperature sensing element 320, and a ground pin 321, a data pin 322, and a power pin 323 connected to the temperature sensing element 320. The first conductive unit 33 is disposed on the first end surface 111 and includes a first ground terminal 331, a first data terminal 332 and a first power terminal 333, and the second conductive unit 34 is disposed on the second end surface 112 and includes a second ground terminal 341, a second data terminal 342 and a second power terminal 343. The first ground terminal 331, the second ground terminal 341 and the ground pin 321 are connected to each other, the first data terminal 332, the second data terminal 342 and the data pin 322 are connected to each other, and the first power terminal 333, the second power terminal 343 and the power pin 323 are connected to each other. The first conductive unit 33 and the second conductive unit 34 are mirror-symmetrical, the first ground terminal 331, the first data terminal 332 and the first power terminal 333 are arranged in a triangle, and the second ground terminal 341, the second data terminal 342 and the second power terminal 343 are arranged in a triangle. The first connecting unit 35 is disposed on the first end surface 111, the second connecting unit 36 is disposed on the second end surface 112, and the first connecting unit 35 and the second connecting unit 36 are mirror-symmetrical. The first connecting unit 35 comprises a first connecting portion 371 and two second connecting portions 372 which are arranged in a triangular shape, the second connecting unit 36 comprises a second connecting portion 372 and two first connecting portions 371 which are arranged in a triangular shape, the first connecting portions 371 are iron grooves, the second connecting portions 372 are protrusions made of magnetic materials, the first connecting portions 371 and the second connecting portions 372 can be connected in a matched mode, and the protrusions and the grooves are rectangular.

Referring to fig. 13 and 18, in an embodiment, the first connecting unit 35 and the second connecting unit 36 are both audio connectors, in this case, the first conductive unit 33 is disposed in the housing 311 and electrically connected to the first connecting unit 35, the second conductive unit 34 is disposed in the housing 311 and electrically connected to the second connecting unit 36, and the first connecting unit 35 and the second connecting unit 36 can be used to connect to the connecting line 130, so that the connection of the plurality of temperature sensors can be achieved.

In one embodiment, the first connecting unit 35 is disposed on the first end face 3111, and the second connecting unit 36 is disposed on the second end face 3112, in which case the first connecting unit 35 and the second connecting unit 36 may be disposed on the surface of the housing 311, or may be disposed inside the housing 311.

In one embodiment, the first connection unit 35 and the second connection unit 36 are disposed on a surface of the housing 311, for example, the first connection unit 35 is disposed on a surface of the first end face 3111 and protrudes outward, and the second connection unit 36 is disposed on a surface of the second end face 3112 and protrudes outward.

Referring to fig. 13 and 14, in an embodiment, the first connecting unit 35 and the second connecting unit 36 are both disposed in the housing 311, and at this time, the first end face 3111 is disposed with a first receiving groove 3113, and the first connecting unit 35 is received in the first receiving groove 3113; the second end face 3112 is provided with a second receiving slot 3114, and the second connection unit 36 is received in the second receiving slot 3114. The appearance of the temperature sensor is neat and beautiful, and the housing 311 can also protect the first connection unit 35 and the second connection unit 36.

Referring to fig. 17, in an embodiment, the first connecting unit 35 is disposed on a surface of the first end surface 3111 and protrudes outward, and the second connecting unit 36 is accommodated in the second accommodating groove 3114; alternatively, the first connection unit 35 is accommodated in the first accommodation groove 3113, and the second connection unit 36 is disposed on the surface of the second end face 3112 and protrudes outward.

Referring to fig. 18, in an embodiment, the audio connector is an audio female plug 381, and the audio female plug 381 has a plug hole 382. At this time, the connection line 130 is provided with an audio male connector 391 connected to the audio female connector 381. Optionally, the audio female head 381 is a 2.5mm audio female head or a 3.5mm audio female head, and is simple to manufacture, mature in process, low in cost and beneficial to popularization of products.

Referring to fig. 19, in one embodiment, the audio connector is an audio male connector 391, and the audio male connector 391 is provided with a plug 392. At this time, the connection line 130 is provided with an audio female plug 381 connected to the audio male plug 391. Optionally, the audio male head 391 is a 2.5mm audio female head or a 3.5mm audio male head, so that the audio male head is simple to manufacture, mature in process, low in cost and beneficial to popularization of products.

It should be understood that the types of the audio connectors of the first connection unit 35 and the second connection unit 36 may be the same or different, and may be set according to the needs, and are not limited herein.

Referring to fig. 13, 14 and 18, in an embodiment, the first connecting unit 35 and the second connecting unit 36 are audio female connectors 381, and the audio female connectors 381 are provided with inserting holes 382. Referring to fig. 12, the connecting line 130 has two audio male connectors 391 connected to the audio female connector 381, and the two audio male connectors 391 are disposed at two ends of the connecting line 130.

Referring to fig. 15, 16 and 19, in an embodiment, the first connecting unit 35 and the second connecting unit 36 are audio male connectors 391, and the audio male connectors 391 are provided with plugs 392. Referring to fig. 13, the connecting line 130 has two audio female connectors 381 connected to the audio male connector 391, and the two audio female connectors 381 are disposed at two ends of the connecting line 130.

Referring to fig. 17 and fig. 20, in an embodiment, the first connection unit 35 is an audio female plug 381, and the second connection unit 36 is an audio male plug 391; alternatively, the first connection unit 35 is an audio male connector 391, and the second connection unit 36 is an audio female connector 381. Referring to fig. 14, the connection line 130 has an audio female plug 381 and an audio male plug 391, and the audio female plug 381 and the audio male plug 391 are respectively disposed at two ends of the connection line 130.

It should be understood that when the first connecting unit 35 and the second connecting unit 36 are the audio female plug 381 and the audio male plug 162, respectively, the temperature sensors may be directly connected to each other without being connected by the connecting wire 130. For example, referring to fig. 21, the first connection unit 35 is an audio female plug 381, which can be disposed in the housing 311; the second connecting unit 36 is an audio male connector 391, which can be disposed on the surface of the second end face 3112. When two temperature sensors need to be connected, only the audio male plug 391 of one temperature sensor 10 needs to be correspondingly plugged into the audio female plug 381 of the other temperature sensor 10, and the connection operation is simple and convenient.

It should be understood that the structure of the temperature sensor is not limited to the above-mentioned case, and is not limited thereto. When the sensor 120 is another type of sensor, the specific structure thereof may be set as desired.

Referring to fig. 1 and fig. 5, the present embodiment is further directed to provide a monitoring system for monitoring an environmental index, where the type of the environmental index may be set according to a requirement, such as a temperature, a humidity, and a pressure of an environment. The monitoring system comprises at least one monitoring device 10 and a remote control end 20, wherein the wireless communication module 112 of the monitoring device 10 is in wireless communication with the remote control end 20, so that the wireless communication module can receive a control signal sent by the remote control end 20 and send data of the sensor 120 to the remote control end 20, and data synchronization of the sensor 120 is realized. According to different environmental indexes, the type of the sensor 120 in the monitoring device 10 is different, so as to realize corresponding monitoring functions.

In one embodiment, the monitoring device 10 may be disposed in a cabinet of a data center room, and is used for monitoring the temperature of the cabinet. When the arrangement is carried out, the monitoring device 10 only needs to be arranged at a corresponding position in the cabinet, and complex wiring is not needed. The internet of things gateway is arranged in the machine room, the remote control end 20 can be a cloud server at the moment, and the wireless communication module 112 of the monitoring device 10 can be wirelessly connected with the internet of things gateway and connected with the remote control end 20 through the internet of things gateway. The number of monitoring devices 10 can be set as desired. For example, when a plurality of cabinets are provided in the computer room, one monitoring device 10 may be provided in each cabinet, and the sensor 120 in each monitoring device 10 is respectively provided in different cabinet layers, and each monitoring device 10 may be wirelessly connected to the remote control terminal 20, so that the remote control terminal 20 may obtain a temperature field of the computer room in the data center, and implement real-time monitoring and control of each cabinet.

Referring to fig. 22, a monitoring method for monitoring an environmental index of a data center room is further provided in this embodiment, including:

step S10: receiving a data acquisition instruction sent by a remote control terminal;

step S20: sending data reading signals to a plurality of sensors according to the data acquisition instruction so as to instruct the sensors to send monitoring data;

step S30: acquiring address data and monitoring data of each sensor;

step S40: and sending the address data and the monitoring data of each sensor to a remote control end.

In one embodiment, the monitoring method may be implemented by the monitoring device 10 described above, namely: after receiving a data acquisition instruction sent by the remote control terminal 20, the data acquisition component 11 in the monitoring device 10 sends a data reading signal to the plurality of sensors 120 in the monitoring device 10; then, the address data and the monitoring data of each sensor 120 are acquired through the data acquisition assembly 11, so that the position of the sensor 120 can be obtained according to the address data, and the monitoring data are in one-to-one correspondence with the specific position; the data acquisition component 11 then transmits the address data and the monitoring data for each sensor 120 to the remote control 20.

In one embodiment, the sensor is a temperature sensor, and the monitoring data is temperature data of the position where the sensor is located; the address data is user bytes stored in the temperature sensor. For example, the monitoring method may be used to obtain a temperature field in a data center machine room, and since thousands or even tens of thousands of cabinets are usually arranged in the data center machine room, and each cabinet is provided with multiple layers, one monitoring device 10 may be arranged in each cabinet in the data center machine room, and meanwhile, a plurality of temperature sensors in the monitoring device 10 are respectively arranged on each layer, and each temperature sensor stores a corresponding user byte, and the data acquisition component 11 may determine the position of the temperature sensor according to the user byte, so as to correspond the position of the temperature sensor to the obtained monitoring data. The remote control terminal 20 obtains address data and monitoring data of the temperature sensors in all the monitoring devices 10, so that the temperature distribution condition of each position of the data center machine room space can be determined, a temperature field in the data center machine room is constructed, and real-time monitoring and control of each cabinet are realized. Of course, in other embodiments, the sensor may be of other types, and is not limited to the above-mentioned case, and is not limited herein.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. A monitoring device, characterized by: the device comprises a data acquisition component and a sensing component;

the sensing assembly comprises a plurality of sensors, and at least one sensor is arranged outside the data acquisition assembly;

the data acquisition assembly comprises a control module and a wireless communication module;

the control module is detachably connected with at least one sensor arranged outside the data acquisition assembly and used for controlling the sensor and acquiring data of the sensor;

the wireless communication module is connected with the control module and at least used for communicating with a remote control terminal.

2. The monitoring device of claim 1, wherein:

a plurality of the sensors are connected in series;

or, a plurality of said sensors are connected in parallel with each other;

or a plurality of sensors are connected in series and then connected in parallel.

3. The monitoring device of claim 1, wherein:

the wireless communication module comprises a Bluetooth module;

and/or the wireless communication module comprises a WIFI module;

and/or the wireless communication module comprises a 2.4G wireless communication module;

and/or, the wireless communication module comprises a long-range radio communication module;

and/or the wireless communication module comprises a GPRS module.

4. The monitoring device of claim 1, wherein:

the data acquisition assembly further comprises a battery module;

the battery module is connected with the control module and used for supplying power to the control module, the wireless communication module and the sensing assembly.

5. The monitoring device of claim 1, wherein:

the sensors are stored with address data, and the address data of each sensor are different from each other.

6. A monitoring device according to any one of claims 1 to 5, wherein:

the sensor is a temperature sensor;

the temperature sensor comprises a shell unit, a sensing unit, a first conductive unit, a second conductive unit, a first connecting unit and a second connecting unit;

the shell unit comprises a shell, and the sensing unit is arranged in the shell and used for detecting temperature;

the first conductive unit is arranged in the shell and is electrically connected with the sensing unit;

the second conductive unit is arranged in the shell and is electrically connected with the sensing unit;

the first conductive unit is electrically connected with the second conductive unit;

the first connecting unit and the second connecting unit are arranged in the shell.

7. The monitoring device of claim 6, wherein:

the second conductive unit is electrically connected with the first connecting unit, the second conductive unit is electrically connected with the second connecting unit, and the first connecting unit and the second connecting unit are audio connectors;

alternatively, the first and second electrodes may be,

the first conductive unit and the first connecting unit are arranged on one end face of the shell, the second conductive unit and the second connecting unit are arranged on the other end face of the shell, and the first connecting unit of one temperature sensor can be matched and connected with the second connecting unit of the other temperature sensor.

8. A monitoring system, characterized by: the monitoring device comprises at least one monitoring device as claimed in any one of claims 1 to 7 and a remote control end, wherein a wireless communication module of the monitoring device is in wireless communication with the remote control end.

9. A method of monitoring, characterized by: comprises that

Receiving a data acquisition instruction sent by a remote control terminal;

sending data reading signals to a plurality of sensors according to the data acquisition instruction so as to instruct the sensors to send monitoring data;

acquiring address data and monitoring data of each sensor;

and sending the address data and the monitoring data of each sensor to the remote control end.

10. The monitoring method of claim 9, wherein:

the sensor is a temperature sensor;

the monitoring data is temperature data;

the address data is user bytes stored in the temperature sensor.

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