CN111337500A - Dispensing control method, display module and electronic equipment - Google Patents
Dispensing control method, display module and electronic equipment Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 78
- 239000003292 glue Substances 0.000 claims abstract description 95
- 239000000084 colloidal system Substances 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 239000004973 liquid crystal related substance Substances 0.000 claims description 72
- 239000000463 material Substances 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 10
- 230000002950 deficient Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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Abstract
本申请提供了一种点胶管控方法、显示模组及电子设备。点胶管控方法包括在基材的盲孔内的点胶位点胶,以形成胶体;在盲孔内确定预设干涉位置,使预设干涉位置位于点胶位与待安装于盲孔内的电子器件之间,且预设干涉位置与电子器件之间的间距大于或等于预设间距;确定胶体轮廓面上与预设干涉位置相对应的目标位置;检测目标位置是否位于点胶位与预设干涉位置之间,若检测结果为是,则点胶工序合格;若检测结果为否,则点胶工序不合格。本申请提供的点胶管控方法能够用于检测胶体与待安装于盲孔内的电子器件是否干涉。通过本申请提供的点胶管控方法管控的显示模组不会对电子器件干涉,电子设备良品率较高。
The present application provides a glue dispensing control method, a display module and an electronic device. The glue dispensing control method includes dispensing glue at a glue dispensing point in a blind hole of a substrate to form a colloid; determining a preset interference position in the blind hole so that the preset interference position is located between the glue dispensing position and the electronic device to be installed in the blind hole, and the distance between the preset interference position and the electronic device is greater than or equal to the preset distance; determining a target position on the contour surface of the colloid corresponding to the preset interference position; detecting whether the target position is located between the glue dispensing position and the preset interference position, if the detection result is yes, the glue dispensing process is qualified; if the detection result is no, the glue dispensing process is unqualified. The glue dispensing control method provided in the present application can be used to detect whether the colloid interferes with the electronic device to be installed in the blind hole. The display module controlled by the glue dispensing control method provided in the present application will not interfere with the electronic device, and the electronic device has a high yield rate.
Description
技术领域technical field
本申请涉及电子设备技术领域,具体涉及一种点胶管控方法、显示模组及电子设备。The present application relates to the technical field of electronic equipment, and in particular to a glue dispensing management and control method, a display module and electronic equipment.
背景技术Background technique
手机等电子设备为了实现更高的屏占比,将摄像头设置于显示屏的盲孔内,在盲孔的四周点胶进行密封,防止出现漏光现象影响摄像头的拍摄效果。然而,点胶后胶体是否会与摄像头干涉的问题关系到显示屏的良品率,因此,有必要对点胶工序进行管控以提升显示屏的良品率。In order to achieve a higher screen ratio for electronic devices such as mobile phones, the camera is set in the blind hole of the display screen, and glue is dispensed around the blind hole to prevent light leakage from affecting the shooting effect of the camera. However, whether the glue will interfere with the camera after dispensing is related to the yield rate of the display screen. Therefore, it is necessary to control the dispensing process to improve the yield rate of the display screen.
发明内容SUMMARY OF THE INVENTION
本申请提供了一种能够检测胶体与电子器件是否干涉的点胶管控方法、显示模组及电子设备。The present application provides a glue dispensing control method, a display module and an electronic device capable of detecting whether the colloid interferes with an electronic device.
一方面,本申请实施例提供了一种点胶管控方法,所述点胶管控方法包括在基材的盲孔内的点胶位点胶,以形成胶体;在所述盲孔内确定预设干涉位置,使所述预设干涉位置位于所述点胶位与待安装于所述盲孔内的电子器件之间,且所述预设干涉位置与所述电子器件之间的间距大于或等于预设间距;确定所述胶体轮廓面上与所述预设干涉位置相对应的目标位置;检测所述目标位置是否位于所述点胶位与所述预设干涉位置之间,若检测结果为是,则所述点胶工序合格;若检测结果为否,则所述点胶工序不合格。On the one hand, an embodiment of the present application provides a glue dispensing control method, the glue dispensing control method includes dispensing glue at a glue dispensing site in a blind hole of a substrate to form a colloid; determining a preset in the blind hole Interference position, so that the preset interference position is located between the dispensing position and the electronic device to be installed in the blind hole, and the distance between the preset interference position and the electronic device is greater than or equal to Preset spacing; determine the target position on the colloid contour surface corresponding to the preset interference position; detect whether the target position is located between the dispensing position and the preset interference position, if the detection result is If yes, the dispensing process is qualified; if the test result is No, the dispensing process is unqualified.
另一方面,本申请实施例还提供了一种显示模组,所述显示模组包括显示屏,所述显示屏包括基材和盲孔,所述显示模组通过所述的点胶管控方法进行管控。On the other hand, the embodiment of the present application also provides a display module, the display module includes a display screen, the display screen includes a substrate and a blind hole, and the display module is controlled by the dispensing method. control.
再一方面,本申请实施例还提供了一种电子设备,所述电子设备包括所述的显示模组及电子器件,所述电子器件设于所述盲孔内。In another aspect, an embodiment of the present application further provides an electronic device, the electronic device includes the display module and an electronic device, and the electronic device is disposed in the blind hole.
通过在基材的盲孔内的点胶位点胶,以形成胶体,再对点胶工序是否合格进行检测,判断胶体是否与电子器件干涉,从而能够提高产品的良品率且能够及时对不良产品进行调整。此外,在盲孔内确定预设干涉位置以及目标位置,通过判断目标位置与预设干涉位置之间的关系,从而能够对量产的产品进行检测,且检测工序简单、可靠。By dispensing glue at the dispensing site in the blind hole of the substrate to form a colloid, and then testing whether the dispensing process is qualified or not, it is judged whether the colloid interferes with the electronic device, so as to improve the yield of the product and timely detect the defective product. make adjustments. In addition, the preset interference position and the target position are determined in the blind hole, and the mass-produced product can be detected by judging the relationship between the target position and the preset interference position, and the detection process is simple and reliable.
附图说明Description of drawings
为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.
图1是本申请实施例提供的电子设备的结构示意图;1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;
图2是本申请实施例一提供的点胶管控方法的流程示意图;2 is a schematic flowchart of a dispensing management and control method provided in Embodiment 1 of the present application;
图3是本申请实施例一提供的点胶管控方法中基材与电子设备的结构示意图;3 is a schematic structural diagram of a substrate and an electronic device in the dispensing control method provided in Embodiment 1 of the present application;
图4是图3所示基材与电子设备A区域的局部放大图。FIG. 4 is a partial enlarged view of the substrate and the area A of the electronic device shown in FIG. 3 .
图5是本申请实施例二提供的点胶管控方法的流程示意图;5 is a schematic flowchart of a dispensing management and control method provided in Embodiment 2 of the present application;
图6是本申请实施例三提供的点胶管控方法的流程示意图;6 is a schematic flowchart of the dispensing management and control method provided in Embodiment 3 of the present application;
图7是本申请实施例三基材与电子设备A区域的局部放大图。FIG. 7 is a partial enlarged view of the substrate and the area A of the electronic device according to the third embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。本申请中的实施例可以适当的结合。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. The embodiments in this application can be appropriately combined.
如图1所示,本申请实施例提供了一种电子设备100。该电子设备100具有屏占比较高的特点。电子设备100可以是手机、平板电脑、笔记本电脑、智能手表等设备。本申请实施例以手机为例进行举例说明。手机等设备为了实现更高的屏占比,需要解决受话器、前置摄像头等的设置问题。As shown in FIG. 1 , an embodiment of the present application provides an
在一种提高电子设备100屏占比的方法中,通过将电子器件401隐藏于电子设备100的显示屏内,从而提高电子设备100的屏占比。In a method for increasing the screen ratio of the
换言之,本申请实施例提供的电子设备100具有显示屏和电子器件401,显示屏设有盲孔40,且电子器件401部分或全部隐藏于显示屏的盲孔40内。其中,电子器件401包括但不限于受话器、前置摄像头、麦克风、指纹识别模组、人脸识别模组、环境光传感器、距离传感器、天线模组、虹膜识别模组等。In other words, the
具体的,将电子器件401部分或全部隐藏于显示屏中是指在显示屏内部开设盲孔40,显示屏具有显示区103和非显示区104,电子器件401设于显示屏的显示区103,且位于显示屏的盲孔40内。相较于将电子器件401设置在非显示区104上的方式,能够增加显示屏显示区103的占比。Specifically, hiding part or all of the
本申请实施例以隐藏前置摄像头为例进行说明。对于水滴屏、刘海屏以及盲孔屏均是将前置摄像头隐藏于显示屏内。在该类电子设备100中由于在显示屏内开孔,孔周围会出现缝隙,容易漏光。对开孔后的显示屏的孔的四周进行点胶密封,保证前置摄像头的拍摄效果,是解决该类电子设备100的显示屏漏光的方法之一,还可以使显示屏各结构之间的连接可靠。但是,若点胶工序后的显示屏直接进行量产,则点胶工序的胶体存在与待安装的前置摄像头干涉的风险,不能保证显示屏量产后的良品率。The embodiment of the present application uses the hidden front camera as an example for description. For the water drop screen, Liu Haiping and blind hole screen, the front camera is hidden in the display screen. In the
为此,本申请提供了一种点胶管控方法,可以对点胶工序是否合格进行检测,以避免不合格的显示屏进入后续工序造成多次返工或资源浪费。通过本申请提供的点胶管控方法管控的显示模组和电子设备100不会对电子器件401干涉、良品率较高。下面将结合附图对本申请实施例提供的点胶管控方法进行详细的阐述。To this end, the present application provides a dispensing control method, which can detect whether the dispensing process is qualified or not, so as to avoid multiple rework or waste of resources caused by the unqualified display screen entering the subsequent process. The display module and the
如图2所示,图2为本申请实施例一提供的点胶管控方法的流程示意图。点胶管控方法至少包括以下步骤:As shown in FIG. 2 , FIG. 2 is a schematic flowchart of the dispensing management and control method provided by the first embodiment of the present application. The dispensing control method includes at least the following steps:
110:在基材的盲孔内的点胶位点胶,以形成胶体。110: Dispensing glue at the dispensing site in the blind hole of the substrate to form a colloid.
请参照图3及图4,本申请以液晶显示屏为例进行说明,后续不在赘述。液晶显示屏至少包括从上到下依次设置的玻璃盖板、液晶基板20、背光模组10和固定支架。其中,液晶基板20包括依次叠加设置的彩膜基板、液晶及薄膜晶体管阵列基板。而基材则表示液晶显示屏中的多层组件或表示整个的显示屏。Please refer to FIG. 3 and FIG. 4 , the present application takes a liquid crystal display screen as an example for description, and will not be described in detail in the following. The liquid crystal display screen includes at least a glass cover plate, a
基材的盲孔40可以设于液晶显示屏的一层或多层。举例而言,在液晶基板20中与背光模组中皆开设通孔,对于整个液晶显示屏而言,所开设的通孔为盲孔40。该方式中,光线经玻璃盖板射入前置摄像头,以使前置摄像头实现拍摄功能。在另一实施例中,也可以在背光模组10开设通孔,则光线经玻璃盖板和液晶基板20射入前置摄像头,使前置摄像头实现拍摄功能。当然,在其他实施例中,也可以是在液晶显示屏的玻璃盖板层、液晶基板20、背光模组10和固定层开设盲孔40,可以理解的,液晶显示屏的玻璃盖板层未完全贯穿。The
对于不同的开孔方式所对应的点胶位50不同。举例而言,当在液晶显示屏的液晶基板20和背光模组10开孔时,玻璃盖板层与液晶基板20之间的间隙会使光线出现漏光和背光现象。因此,需要对玻璃盖板层与液晶基板20之间进行点胶密封,此时点胶位50表示玻璃盖板层与孔内壁的连接处。在另一种实施方式中,在液晶显示屏的背光模组10开孔时,盲孔40贯穿背光模组10。液晶基板20与背光模组10之间的间隙使得光线在射入前置摄像头时出现漏光、偏光现象,需要对液晶基板20与背光模组10之间进行密封。此时,点胶位50为液晶基板20与孔内壁的连接处。The
可以理解的,当点胶位50不同时,所形成的胶体的位置不同。可以理解的,当点胶位50位于玻璃盖板层与孔内壁的连接处时,点胶工序所形成的胶体位于玻璃盖板与液晶基板20之间。当点胶位50位于液晶基板20与孔内壁的连接处时,点胶工序所形成的胶体位于液晶基板20与背光模组10之间。It can be understood that when the glue dispensing positions 50 are different, the positions of the formed gel are different. It can be understood that when the
120:在所述盲孔内确定预设干涉位置,使所述预设干涉位置位于所述点胶位与待安装于所述盲孔内的电子器件之间,且所述预设干涉位置与所述电子器件之间的间距大于或等于预设间距。120: Determine a preset interference position in the blind hole, so that the preset interference position is located between the dispensing position and the electronic device to be installed in the blind hole, and the preset interference position is The spacing between the electronic devices is greater than or equal to a preset spacing.
在盲孔40内确定预设干涉位置502是为了能够对需要量产的显示屏进行点胶工序的管控。预设干涉位置502位于点胶位50与待安装于所述盲孔40内的电子器件401之间是指当将电子器件401安装于盲孔40内时,预设干涉位置502位于点胶位50与电子器件401上最靠近点胶位50的位置之间,且预设干涉位置502位于点胶位50与电子器件401上最靠近点胶位50的位置的连线上。The
预设干涉位置502与电子器件401上最靠近点胶位50的位置之间的间距大于或等于预设间距。换言之,预设间距需要保证处于预设干涉位置502的胶体与电子器件401无干涉。该预设间距可以由厂家根据盲孔40的大小以及电子器件401的大小进行设置。而预设干涉位置502可根据预设间距进行确定。本申请中,预设间距为一个合理的范围值,该预设间距使得胶体的轮廓位于预设干涉位置502也不会与电子器件401干涉。同时也使得电子器件401与显示屏安装紧凑。The distance between the
130:确定所述胶体轮廓面上与所述预设干涉位置相对应的目标位置。130: Determine a target position on the colloid contour surface corresponding to the preset interference position.
由于将目标位置501与预设干涉位置502进行比较,确定点胶工序是否合格。因此,目标位置501与预设干涉位置502具有相对应的关系。在一种实施方式中,预设干涉位置502与目标位置501之间的相对应关系可以是目标位置501位于点胶位50与预设干涉位置502的连接线上。当预设干涉位置502确定后可以根据点胶位50和预设干涉位置502之间的连接线确定与相应的目标位置501。Since the
此外,由于目标位置501是胶体轮廓面上的点。因此,目标位置501存在两种情况。第一种为目标位置501位于点胶位50与预设干涉位置502之间。第二种,目标位置501位于点胶位50与预设干涉位置502的延长线上,且靠近预设干涉位置502。In addition, since the
140:检测所述目标位置是否位于所述点胶位与所述预设干涉位置之间,若检测结果为是,则所述点胶工序合格;若检测结果为否,则所述点胶工序不合格。140: Detecting whether the target position is located between the dispensing position and the preset interference position, if the detection result is yes, the dispensing process is qualified; if the detection result is no, the dispensing process Failed.
当目标位置501位于点胶位50与预设干涉位置502之间时,表示目标位置501与电子器件401之间的距离大于或等于预设干涉位置502与电子器件401之间的距离,由于预设干涉位置502与电子器件401无干涉,因此目标位置501处的胶体轮廓与电子器件401也无干涉,判断点胶工序合格。When the
当目标位置501位于点胶位50与预设干涉位置502的延长线上,且靠近预设干涉位置502时,表示目标位置501与电子器件401之间的距离小于预设干涉位置502与电子器件401之间的距离,因此目标位置501处的胶体与电子器件401相干涉,判断点胶工序不合格。When the
在一种实施方式中,检测所述目标位置501是否位于所述点胶位50与所述预设干涉位置502之间可以是比较目标位置501的坐标值与预设干涉位置502的坐标值大小。In one embodiment, detecting whether the
通过在基材的盲孔40内的点胶位50点胶,以形成胶体,再对点胶工序是否合格进行检测,判断胶体是否与电子器件401干涉,从而能够提高产品的良品率且能够及时对不良产品进行调整。此外,在盲孔40内确定预设干涉位置502以及目标位置501,通过判断目标位置501与预设干涉位置502之间的关系,从而能够对量产的产品进行检测,且检测工序简单、可靠。By dispensing glue at the dispensing
请参照图5,图5为本申请实施例二提供的点胶管控方法的流程示意图。点胶管控方法至少包括以下步骤:Please refer to FIG. 5 , which is a schematic flowchart of the dispensing management and control method provided by the second embodiment of the present application. The dispensing control method includes at least the following steps:
210:在背光模组上设置液晶基板,以形成基材;在所述基材上形成盲孔,使所述盲孔贯穿所述背光模组,及所述液晶基板朝向所述背光模组的表面形成所述盲孔的底面,使所述盲孔的孔内壁与所述液晶基板之间的连接处形成点胶位;在所述点胶位上点胶,以形成胶体。210 : disposing a liquid crystal substrate on the backlight module to form a base material; forming blind holes on the base material, so that the blind holes penetrate through the backlight module, and the liquid crystal substrate faces the backlight module. The bottom surface of the blind hole is formed on the surface, so that the connection between the inner wall of the blind hole and the liquid crystal substrate forms a glue dispensing position; glue is dispensed on the glue dispensing position to form a colloid.
其中,请参照图3所示,基材至少包括背光模组10和液晶基板20。液晶基板20包括依次叠加设置的彩膜基板、液晶及薄膜晶体管阵列基板。Wherein, please refer to FIG. 3 , the base material at least includes a
本申请实施例设基材的长度方向沿X轴方向。基材的厚度方向沿Y轴方向。In the embodiment of the present application, it is assumed that the length direction of the substrate is along the X-axis direction. The thickness direction of the base material is along the Y-axis direction.
图3中箭头所指方向为正向。The direction indicated by the arrow in Figure 3 is the positive direction.
液晶基板20和背光模组10沿Y轴正向依次排列。换言之,背光模组10包括底面101和相邻于底面101的侧面102。液晶基板20具有沿Y轴正向排列的第一端面201和第二端面202。背光模组10的底面101和液晶基板20的第二端面202相贴合。The
盲孔40贯穿背光模组10,液晶基板20朝向背光模组10的表面形成盲孔40的底面101。可以理解的,基材的盲孔40为设于背光模组10上的通孔。盲孔40的开口与背光模组10的底面101平齐,液晶基板20的第二端面202形成盲孔40的底面101。液晶基板20的第二端面202与背光模组10的底面101之间具有间隙。点胶密封该间隙时,点胶位50位于液晶基板20的第二端面202与盲孔40的孔内壁的连接处。The
当在液晶基板20的第二端面202与盲孔40的孔内壁的连接处点胶时,形成的胶体位于液晶基板20的第二端面202与背光模组10的底面101之间或液晶基板20的第二端面202与背光模组10的侧面102之间。When the glue is dispensed at the junction between the
220:在所述点胶阀的点胶口与所述点胶位之间的连线上确定预设干涉位置,使所述预设干涉位置与待安装于所述盲孔内的电子器件之间的间距大于或等于预设间距;所述预设干涉位置包括第一坐标和第二坐标,所述第一坐标为所述预设干涉位置与所述盲孔的孔内壁之间的距离;所述第二坐标为所述预设干涉位置与所述液晶基板之间的距离。220 : Determine a preset interference position on the connection line between the dispensing port of the dispensing valve and the dispensing position, so that the preset interference position and the electronic device to be installed in the blind hole are connected. The distance between them is greater than or equal to a preset distance; the preset interference position includes a first coordinate and a second coordinate, and the first coordinate is the distance between the preset interference position and the inner wall of the blind hole; The second coordinate is the distance between the preset interference position and the liquid crystal substrate.
本实施例中,请参照图3及图4所示,预设干涉位置502的确定基于胶的流动性原理。具体的,当通过点胶阀进行点胶工序时,点胶阀的位置固定。根据胶的流动性原理,与点胶阀的点胶口相对的位置为胶体轮廓面的最突出位置。胶体轮廓面的最突出位置也是最容易与待安装于所述盲孔内的电子器件干涉的位置。由于胶的流动性,该最突出位置始终位于点胶阀的点胶口与点胶位50的连接线上。换言之,所述预设干涉位置502也位于点胶阀的点胶口与点胶位50的连接线上。In this embodiment, please refer to FIG. 3 and FIG. 4 , the determination of the
由于预设干涉位置502位于点胶阀的点胶口和点胶位50的连接线上,且与待安装于盲孔40内的电子器件401之间的距离为预设距离。因此,当点胶阀和点胶位50的位置确定后,结合预设距离可以确定出预设干涉位置502。在一种实施例中,预设间距大于或等于0.15mm,且预设间距小于或等于0.3mm。Because the
若以点胶位50为原点,则第一坐标为预设干涉位置502的X坐标的绝对值。第二坐标为预设干涉位置502的Y坐标的绝对值。If the
230:在所述点胶阀的点胶口与所述点胶位之间的连线上确定目标位置,使所述目标位置位于所述胶体轮廓面与所述连线的交接点。230 : Determine a target position on the connecting line between the glue dispensing port of the glue dispensing valve and the glue dispensing position, so that the target position is located at the intersection point of the colloid contour surface and the connecting line.
请参照图3及图4所示,根据上述步骤202中已经确定的预设干涉位置502,可以确定与预设干涉位置502相对应的目标位置501位于点胶阀的点胶口与点胶位50之间的连接线上。而该连接线与胶体轮廓面的交接点所确定的目标位置501即为胶体轮廓面上最突出的点。Referring to FIGS. 3 and 4 , according to the
240:通过激光扫描所述第二道胶体的轮廓面,所述预设干涉位置与所述目标位置之间的目标距离;根据所述目标距离、所述第一坐标和所述第二坐标获取所述目标位置的第三坐标和第四坐标,所述第三坐标为所述目标位置与所述盲孔的孔内壁之间的距离;所述第四坐标为所述目标位置与所述液晶基板之间的距离。240 : Scan the contour surface of the second colloid by laser, and obtain the target distance between the preset interference position and the target position; obtain according to the target distance, the first coordinate and the second coordinate The third and fourth coordinates of the target position, the third coordinate is the distance between the target position and the inner wall of the blind hole; the fourth coordinate is the target position and the liquid crystal distance between substrates.
目标位置501为胶体轮廓面上的点,因此目标位置501与点胶工序时点胶的胶体量有关。当点胶工序完成后可以通过激光轮廓仪获取胶体的轮廓及尺寸。从而得到目标位置501的第三坐标和第四坐标。The
在一种实施方式中,通过预设干涉位置502向目标位置501的方向发出一束光线,当该束光线接触到胶体轮廓面时会向预设干涉位置502反射回相应的光线,通过发出光线和反射光线之间的时间差确定目标位置501与预设干涉位置502之间的距离。根据预设干涉位置502的坐标以及预设干涉位置502与目标位置501之间的距离可以得到目标位置501的第三坐标和第四坐标。In one embodiment, a beam of light is emitted in the direction of the
若以点胶位50为原点,则第三坐标为目标位置501的X坐标的绝对值。第四坐标为目标位置501的Y坐标的绝对值。If the
250:判断所述第三坐标是否小于或等于所述第一坐标,及所述第四坐标是否小于或等于所述第二坐标,当所述第三坐标小于或等于所述第一坐标,且所述第四坐标小于或等于所述第二坐标时,则确定所述点胶工序合格;当所述第三坐标大于所述第一坐标或所述第四坐标大于所述第二坐标时,则确定所述点胶工序不合格。250: Determine whether the third coordinate is less than or equal to the first coordinate, and whether the fourth coordinate is less than or equal to the second coordinate, when the third coordinate is less than or equal to the first coordinate, and When the fourth coordinate is less than or equal to the second coordinate, it is determined that the dispensing process is qualified; when the third coordinate is greater than the first coordinate or the fourth coordinate is greater than the second coordinate, Then it is determined that the dispensing process is unqualified.
本实施例中,第三坐标和第一坐标分别表示目标位置501、预设干涉位置502与坐标原点之间沿X轴方向的距离,第二坐标和第四坐标的坐标值为正数。第四坐标、第二坐标分别表示目标位置501、预设干涉位置502与坐标原点之间沿Y轴方向的距离,第二坐标和第四坐标的坐标值为正数。In this embodiment, the third coordinate and the first coordinate respectively represent the distance along the X-axis between the
在一种实施方式中,通过比较第一坐标和第三坐标的大小可以确定在沿X轴方向上,目标位置501是否位于点胶位50和预设干涉位置502之间,即在X轴方向上胶体是否会与电子器件401干涉。In one embodiment, by comparing the magnitudes of the first coordinate and the third coordinate, it can be determined whether the
通过比较第二坐标和第四坐标的大小可以确定在沿Y轴方向上,目标位置501是否位于点胶位50和预设干涉位置502之间,即在Y轴方向上胶体是否会与电子器件401干涉。By comparing the size of the second coordinate and the fourth coordinate, it can be determined whether the
当第三坐标小于或等于第一坐标,且第四坐标小于或等于第二坐标时,得到检测结果为是,判断点胶工序为合格,即胶体在X轴方向与Y轴方向上均与电子器件401无干涉。当先检测第一坐标与第三坐标的大小时,若第三坐标大于第一坐标,表示胶体在X轴方向与电子器件401相干涉,则无需再次比较第二坐标与第四坐标的大小,直接得到检测结果为否,判断点胶工序为不合格。而当先检测第二坐标与第四坐标的大小时,若第四坐标大于第二坐标,也无需再比较第一坐标与第三坐标的大小,直接得到检测结果为否,判断点胶工序为不合格。When the third coordinate is less than or equal to the first coordinate, and the fourth coordinate is less than or equal to the second coordinate, the detection result is yes, and it is judged that the dispensing process is qualified, that is, the colloid is in the X-axis direction and the Y-axis direction.
点胶工序不合格的产品为不良品,点胶工序合格的产品为良品,后续将良品与摄像头进行安装。Products that fail the dispensing process are defective products, and products that pass the dispensing process are good products, and the good products and cameras are installed later.
在另一种实施方式中,若取点胶位50为坐标原点,根据预设干涉位置502与目标位置501的确定方式,表明点胶位50、预设干涉位置502与目标位置501在同一直线上,则第三坐标小于或等于第一坐标时,可判断第四坐标也小于第二坐标,即直接得到检测结果为是。当第三坐标大于第一坐标时,可判断第四坐标大于第二坐标,直接得到检测结构为否。该实施方式中,仅需要确定X方向或Y方向中任意方向坐标的大小关系,因此能够缩短检测时间,进而提升点胶管控方法的效率。In another embodiment, if the
本实施例通过在背光模组10上开设盲孔40,使得在盲孔40周围所需设置的保护边减少,从而减少显示屏上的黑边,提升视觉效果。在点胶阀的点胶口与点胶位50之间的连接线上确定预设干涉位置502和目标位置501,得到的目标位置501为胶体轮廓面上的最高点,能够提高检测结果的准确性。此外,通过比较目标位置501与预设位置的坐标值大小,判断点胶工序是否合格,由于获取坐标值较容易,使得点胶管控方法容易实施。In this embodiment, the
请参照图6及图7所示,图6为本申请实施例三提供的点胶管控方法的流程示意图。本实施例与上述实施例二的不同在于,在液晶基板20与盲孔40的孔内壁的连接处点胶形成了两道胶体。Please refer to FIG. 6 and FIG. 7 . FIG. 6 is a schematic flowchart of the glue dispensing management and control method provided by the third embodiment of the present application. The difference between this embodiment and the second embodiment above is that two colloids are formed by dispensing glue at the connection between the
点胶管控方法至少包括以下步骤:The dispensing control method includes at least the following steps:
310:在背光模组上设置液晶基板,以形成基材;310: Disposing a liquid crystal substrate on the backlight module to form a base material;
在所述基材上形成盲孔,使所述盲孔贯穿所述背光模组,及所述液晶基板朝向所述背光模组的表面形成所述盲孔的底面,使所述盲孔的孔内壁与所述液晶基板之间的连接处形成点胶位;Blind holes are formed on the base material, so that the blind holes penetrate through the backlight module, and the bottom surface of the blind holes is formed on the surface of the liquid crystal substrate facing the backlight module, so that the holes of the blind holes are formed. A glue dispensing position is formed at the connection between the inner wall and the liquid crystal substrate;
经所述盲孔在所述液晶基板与所述背光模组之间形成第一道胶体;经所述盲孔在所述液晶基板与所述盲孔的孔内壁之间形成第二道胶体。A first colloid is formed between the liquid crystal substrate and the backlight module through the blind hole; a second colloid is formed between the liquid crystal substrate and the inner wall of the blind hole through the blind hole.
请参照图6及图7所示,其中,所述第一道胶体301密封连接所述液晶基板20与所述背光模组10的底面101(参照图3)。所述第二道胶体302密封连接所述液晶基板20与所述背光模组10的侧面102(参照图3)。Please refer to FIG. 6 and FIG. 7 , wherein the first colloid 301 seals and connects the
具体的,第一道胶体301位于液晶基板20的第二端面202与背光模组10的底面101之间。换言之,第一道胶体302大致与X轴平行。Specifically, the
在一种实施方式中,通过将所述基材倾斜第一角度,使所述点胶位50设于与点胶阀相对应的位置,旋转所述基材,以使所述点胶阀对所述点胶位50点胶,形成第一道胶体301,所述第一角度大于或等于0°,且所述第一角度小于或等于10°。在该实施方式中,通过固定点胶阀,使基材旋转,得到大致与X轴平行的第一道胶体301。该第一道胶体301在沿X轴方向上将液晶基板20与背光模组10密封。In one embodiment, by tilting the base material at a first angle, the
具体的,第二道胶体302位于液晶基板20的第二端面202与背光模组10的侧面102之间。换言之,第二道胶体302大致沿Y轴延伸。Specifically, the
在一种实施方式中,将所述基材倾斜第二角度,使所述第一道胶体301与所述盲孔40的孔内壁的连接处设于与点胶阀相对应的位置,旋转所述基材,以使所述点胶阀对所述第一道胶体301与所述盲孔40的孔内壁的连接处点胶,形成第二道胶体302,所述第二角度大于或等于40°,且所述第二角度小于或等于50°。在该实施方式中,通过固定点胶阀,使基材旋转,得到大致沿Y轴延伸的第二道胶体302。该第二道胶体302在沿Y轴方向上将液晶基板20与背光模组10密封。In one embodiment, the base material is inclined at a second angle, so that the connection between the
本实施例中,由于在液晶基板20与盲孔40的孔内壁的连接处依次点胶形成了第一道胶体301和第二道胶体302。可以理解的,第二道胶体302的轮廓面相较于第一道胶体301的轮廓面更接近电子器件401,即更容易与电子器件401干涉。因此,本实施例中,判断第二道点胶工序是否合格。因此,在后续的步骤中将胶体替换为第二道胶体302,点胶位50(参照图4)替换为第二道胶体302的第一点胶位503。其中,第一点胶位503位于第一道胶体301与盲孔40的孔内壁的连接处。第一点胶位503如图7所示。In this embodiment, the
320:在所述点胶阀的点胶口与所述第一点胶位之间的连线上确定预设干涉位置,使所述预设干涉位置与待安装于所述盲孔内的电子器件之间的间距大于或等于预设间距;确定所述预设干涉位置的第一坐标和第二坐标,所述第一坐标为所述预设干涉位置与所述背光模组的侧面之间的距离;所述第二坐标为所述预设干涉位置与所述液晶基板之间的距离。320: Determine a preset interference position on the connection line between the dispensing port of the dispensing valve and the first dispensing position, so that the preset interference position and the electronic device to be installed in the blind hole The spacing between the devices is greater than or equal to the preset spacing; determine the first and second coordinates of the preset interference position, and the first coordinate is between the preset interference position and the side surface of the backlight module distance; the second coordinate is the distance between the preset interference position and the liquid crystal substrate.
该步骤中将本申请实施二中的点胶位50替换为第二道胶体的第一点胶位503。具体的该步骤可以参考上述实施例中的步骤220,在此不再赘述。In this step, the
330:在所述点胶阀的点胶口与所述第一点胶位之间的连线上确定目标位置,使目标位置位于所述第二道胶体的轮廓面与所述连线的交接点。330: Determine a target position on the connecting line between the dispensing port of the dispensing valve and the first dispensing position, so that the target position is located at the intersection of the contour surface of the second colloid and the connecting line point.
该步骤中将本申请实施二中胶体替换为第二道胶体,点胶位50替换为第二道胶体302的第一点胶位503。具体的该步骤可以参考上述实施例中的步骤230,在此不再赘述。In this step, the colloid in the second embodiment of the present application is replaced with the second colloid, and the dispensing
340:通过激光扫描所述第二道胶体的轮廓面,所述预设干涉位置与所述目标位置之间的目标距离;根据所述目标距离、所述第一坐标和所述第二坐标获取所述目标位置的第三坐标和第四坐标,所述第三坐标为所述目标位置与所述盲孔的孔内壁之间的距离;所述第四坐标为所述目标位置与所述液晶基板之间的距离。340: Scan the contour surface of the second colloid with a laser, and obtain the target distance between the preset interference position and the target position; obtain according to the target distance, the first coordinate and the second coordinate The third and fourth coordinates of the target position, the third coordinate is the distance between the target position and the inner wall of the blind hole; the fourth coordinate is the target position and the liquid crystal distance between substrates.
该步骤中,通过激光扫描能够得到第一道胶体301和第二道胶体302的胶体轮廓面。具体的该步骤可以参考上述实施例中的步骤240,在此不再赘述。In this step, the colloid contour surfaces of the
350:确定所述第三坐标是否小于或等于所述第一坐标,及所述第四坐标是否小于或等于所述第二坐标,当所述第三坐标小于或等于所述第一坐标,且所述第四坐标小于或等于所述第二坐标时,检测结果为是;当所述第三坐标大于所述第一坐标或所述第四坐标大于所述第二坐标时,检测结果为否。350: Determine whether the third coordinate is less than or equal to the first coordinate, and whether the fourth coordinate is less than or equal to the second coordinate, when the third coordinate is less than or equal to the first coordinate, and When the fourth coordinate is less than or equal to the second coordinate, the detection result is yes; when the third coordinate is greater than the first coordinate or the fourth coordinate is greater than the second coordinate, the detection result is no .
具体的该步骤可以参考上述实施例中的步骤250,在此不再赘述。For the specific step, reference may be made to step 250 in the foregoing embodiment, and details are not described herein again.
通过在液晶基板20与背光模组10之间分别设置沿X轴的第一道胶体301和沿Y轴设置的第二道胶体302,使得液晶基板20与背光模组10之间的密封性能较佳,摄像头的拍摄效果提升。By disposing the
以上是本申请的部分实施方式,应当指出,对于本技术领域的普通技术人员来说。在不脱离本申请原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本申请的保护范围。本申请实施例的模块或单元可以根据实际需求组合或拆分。The above are some embodiments of the present application, and it should be pointed out to those of ordinary skill in the art. On the premise of not departing from the principles of the present application, several improvements and modifications can also be made, and these improvements and modifications are also regarded as the protection scope of the present application. The modules or units in the embodiments of the present application may be combined or split according to actual requirements.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111957537A (en) * | 2020-07-30 | 2020-11-20 | 深圳同兴达科技股份有限公司 | Blind hole dispensing method of LCD screen |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005321795A (en) * | 1998-12-18 | 2005-11-17 | Hitachi Ltd | Image display device |
TW200827040A (en) * | 2006-12-29 | 2008-07-01 | Ind Tech Res Inst | Real-time dispenser fault detection and classification method |
US20100110340A1 (en) * | 2005-05-19 | 2010-05-06 | Sharp Kabushiki Kaisha | Display |
CN107707695A (en) * | 2017-09-29 | 2018-02-16 | 努比亚技术有限公司 | Screen, terminal device and preparation method thereof comprehensively |
CN108956625A (en) * | 2018-07-20 | 2018-12-07 | Oppo广东移动通信有限公司 | Glue road detection method and glue road detection device |
CN109597236A (en) * | 2018-12-20 | 2019-04-09 | 华为技术有限公司 | The production method of liquid crystal display, electronic equipment and liquid crystal display |
CN109813725A (en) * | 2019-04-02 | 2019-05-28 | 东莞博美特自动化科技有限公司 | A kind of large scale glue defect inspection method |
CN110096176A (en) * | 2019-04-25 | 2019-08-06 | 京东方科技集团股份有限公司 | A kind of touch control display apparatus and preparation method thereof, terminal device |
CN110248075A (en) * | 2019-07-16 | 2019-09-17 | 北京博视智动技术有限公司 | Image acquiring device, method and system and dispensing quality determining method and system |
CN110278359A (en) * | 2019-06-28 | 2019-09-24 | Oppo广东移动通信有限公司 | Electronic equipment and its assemble method |
CN110412036A (en) * | 2019-06-25 | 2019-11-05 | 东莞市德普特电子有限公司 | A kind of bad AOI inspection method of dispensing of five axis circular hole dispenser |
CN110488526A (en) * | 2019-08-13 | 2019-11-22 | 武汉华星光电技术有限公司 | Display module and assemble method |
CN110555829A (en) * | 2019-08-12 | 2019-12-10 | 华南理工大学 | method for detecting chip dispensing condition |
CN110579898A (en) * | 2019-09-23 | 2019-12-17 | 武汉华星光电技术有限公司 | display module and dispensing method thereof |
CN110793485A (en) * | 2019-10-22 | 2020-02-14 | 武汉华星光电技术有限公司 | Method and device for measuring thickness of dispensing glue |
-
2020
- 2020-02-24 CN CN202010114152.XA patent/CN111337500B/en active Active
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005321795A (en) * | 1998-12-18 | 2005-11-17 | Hitachi Ltd | Image display device |
US20100110340A1 (en) * | 2005-05-19 | 2010-05-06 | Sharp Kabushiki Kaisha | Display |
TW200827040A (en) * | 2006-12-29 | 2008-07-01 | Ind Tech Res Inst | Real-time dispenser fault detection and classification method |
CN107707695A (en) * | 2017-09-29 | 2018-02-16 | 努比亚技术有限公司 | Screen, terminal device and preparation method thereof comprehensively |
CN108956625A (en) * | 2018-07-20 | 2018-12-07 | Oppo广东移动通信有限公司 | Glue road detection method and glue road detection device |
CN109597236A (en) * | 2018-12-20 | 2019-04-09 | 华为技术有限公司 | The production method of liquid crystal display, electronic equipment and liquid crystal display |
CN109813725A (en) * | 2019-04-02 | 2019-05-28 | 东莞博美特自动化科技有限公司 | A kind of large scale glue defect inspection method |
CN110096176A (en) * | 2019-04-25 | 2019-08-06 | 京东方科技集团股份有限公司 | A kind of touch control display apparatus and preparation method thereof, terminal device |
CN110412036A (en) * | 2019-06-25 | 2019-11-05 | 东莞市德普特电子有限公司 | A kind of bad AOI inspection method of dispensing of five axis circular hole dispenser |
CN110278359A (en) * | 2019-06-28 | 2019-09-24 | Oppo广东移动通信有限公司 | Electronic equipment and its assemble method |
CN110248075A (en) * | 2019-07-16 | 2019-09-17 | 北京博视智动技术有限公司 | Image acquiring device, method and system and dispensing quality determining method and system |
CN110555829A (en) * | 2019-08-12 | 2019-12-10 | 华南理工大学 | method for detecting chip dispensing condition |
CN110488526A (en) * | 2019-08-13 | 2019-11-22 | 武汉华星光电技术有限公司 | Display module and assemble method |
CN110579898A (en) * | 2019-09-23 | 2019-12-17 | 武汉华星光电技术有限公司 | display module and dispensing method thereof |
CN110793485A (en) * | 2019-10-22 | 2020-02-14 | 武汉华星光电技术有限公司 | Method and device for measuring thickness of dispensing glue |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111957537A (en) * | 2020-07-30 | 2020-11-20 | 深圳同兴达科技股份有限公司 | Blind hole dispensing method of LCD screen |
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