CN111334030A - 5G filter based on high-dielectric resin composite material and preparation method thereof - Google Patents

5G filter based on high-dielectric resin composite material and preparation method thereof Download PDF

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CN111334030A
CN111334030A CN202010158275.3A CN202010158275A CN111334030A CN 111334030 A CN111334030 A CN 111334030A CN 202010158275 A CN202010158275 A CN 202010158275A CN 111334030 A CN111334030 A CN 111334030A
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parts
oxide
filter
resin composite
resin
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邹敏昌
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Guangdong Siwei New Material Co ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/007Manufacturing frequency-selective devices
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2206Oxides; Hydroxides of metals of calcium, strontium or barium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/221Oxides; Hydroxides of metals of rare earth metal
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/221Oxides; Hydroxides of metals of rare earth metal
    • C08K2003/2213Oxides; Hydroxides of metals of rare earth metal of cerium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • C08K2003/2241Titanium dioxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2244Oxides; Hydroxides of metals of zirconium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets

Abstract

The invention relates to a 5G filter based on a high-dielectric resin composite material and a preparation method thereof, wherein the 5G filter is characterized in that: the adhesive comprises, by weight, 8-13 parts of a resin adhesive, 1-6 parts of a curing agent, 80-90 parts of a metal oxide, 1-3 parts of a dispersing agent and 1-3 parts of simethicone. The 5G filter has the characteristics of high size precision, high yield and the like.

Description

5G filter based on high-dielectric resin composite material and preparation method thereof
Technical Field
The invention relates to a 5G filter, in particular to a 5G filter based on a high-dielectric resin composite material and a preparation method thereof.
Background
The 5G filter in the antenna assembly of the 5G communication (fifth generation mobile communication) base station is not applicable to the traditional metal filter because the 5G filter needs to receive 5G high-frequency signals, and therefore the existing 5G filter is generally made of ceramic materials; the ceramic 5G filter has the characteristics of miniaturization (about 200 ceramic 5G filters can be used for one base station antenna component), integration, high dielectric constant, low dielectric loss and the like, and the ceramic 5G filter has excellent performance. However, the 5G filter made of the ceramic materials has some problems in production, and the accurate dimensional tolerance is difficult to determine due to the overlarge sintering shrinkage of the ceramic materials, so that the yield is not high; specifically, a traditional 5G filter made of ceramic materials is formed by mixing and calcining one or more than two metal oxides into a blank, the sizes of a blind hole and the whole size and shape in the 5G filter are determined according to circuit design and antenna required performance, the requirement on size precision is high, when the metal oxides are mixed and calcined to about 1500 ℃, a large shrinkage rate (15% -25%) is generated, so that uncertain factors are large during firing, the size is difficult to maintain a proper tolerance, the required tolerance range is difficult to control under the condition of no secondary processing such as cutting, and a ceramic material with high shrinkage rate is difficult to manufacture a product with accurate size, so that the qualification rate of finished products is generally low, and the manufacturing cost is high (the cost is higher when secondary cutting is performed).
Therefore, further improvements are needed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a 5G filter based on a high-dielectric resin composite material and a preparation method thereof, and the 5G filter has the characteristics of high dimensional accuracy, high yield and the like.
The purpose of the invention is realized as follows:
A5G filter based on high dielectric resin composite material is characterized in that: the adhesive comprises, by weight, 8-13 parts of a resin adhesive, 1-6 parts of a curing agent, 80-90 parts of a metal oxide, 1-3 parts of a dispersing agent and 1-3 parts of simethicone.
The resin binder is one or a mixture of more than two of epoxy resin, phenolic resin, polytetrafluoroethylene resin, polyamide-imide resin and saturated polyester resin.
The curing agent is polyamide or urotropine or a mixture of the two.
The metal oxide is one or a mixture of more than two of calcium oxide, barium oxide, boron oxide, zirconium oxide, samarium oxide, cerium oxide, titanium oxide and zinc oxide.
The preparation method of the 5G filter based on the high-dielectric resin composite material is characterized by comprising the following steps of: comprises the following steps
①, uniformly mixing the metal oxides, putting the metal oxides into a graphite crucible for calcination, taking out the metal oxides after the calcination, cooling the metal oxides, crushing the metal oxides into powder, and then putting the powder into a ball mill to grind the powder into ceramic clinker powder for later use;
②, mixing the resin binder and the curing agent, then adding the dispersant and the dimethyl silicone oil, uniformly stirring, adding the ceramic clinker powder, and stirring and wetting to form a paste mixture for later use;
step ③, putting the paste mixture into a metal mold, pressing the paste mixture on a pressing machine to obtain a shape required by the 5G filter, heating the metal mold within 20s after the pressing to solidify and form the paste mixture, and making the blank piece of the 5G filter with accurate size for later use;
and ④, spraying or soaking and coating the surface of the 5G filter blank by using conductive silver paste, and curing the conductive silver paste to obtain the 5G filter.
In step ①, the metal oxide is calcined in a graphite crucible at high temperature 1250-.
In step ①, a ball mill grinds 7-10 microns of ceramic clinker powder.
In step ③, the paste mix has a curing temperature of 200 ℃ ± 20 ℃.
In step ④, the curing temperature of the conductive silver paste is 200 ℃ +/-20 ℃, and the curing time is 10-30 min.
The invention has the following beneficial effects:
the resin material and the ceramic powder with high dielectric constant are mixed into the high dielectric resin composite material for die casting, the advantages of the resin material and the ceramic powder are effectively combined, the shrinkage rate of the high dielectric resin composite material is only 0.1-0.3%, the hardness is high, the chemical resistance is good, the size can be well controlled, and a 5G filter with high size precision can be die-cast according to requirements; compared with the traditional 5G filter, the filter has good shielding efficiency, better wave band waveform after the electromagnetic wave rectification treatment and low insertion loss rate.
Drawings
Fig. 1 is a schematic structural diagram of a 5G filter according to an embodiment of the invention.
Detailed Description
The invention is further described below.
The 5G filter based on the high-dielectric resin composite material is shown in figure 1, and has the length a of 30mm, the length b of 60mm and the height h of 20 mm; ten round holes 1, two round holes 2 and two square holes 3 have been seted up on the 5G wave filter, and a round hole 1 and No. two round holes 2 are the blind hole respectively, and square hole 3 is the through-hole, and the diameter of a round hole 1 is 1.5mm, and the degree of depth is 1mm, and the diameter of No. two round holes 2 is 0.5mm, and the degree of depth is 1mm, and the length of square hole 3 is 2mm, wide 1mm (the tolerance of above size is 0.02mm, 20 microns promptly). It can be seen that such fine size is difficult to grasp the process stability for the conventional 5G filter, but the 5G filter according to the present invention can solve the above problem.
The 5G filter comprises, by weight, 8-13 parts of resin binder, 1-6 parts of curing agent, 80-90 parts of metal oxide, 1-3 parts of dispersing agent (Z-03) and 1-3 parts of simethicone (500 CS).
The resin binder is one or a mixture of two or more of epoxy resin (a-128), phenol resin, polytetrafluoroethylene resin (PTFE), polyamideimide resin (PI), saturated polyester resin (PU), and the like.
Further, the curing agent is one or a mixture of more than two of polyamide (B10) or urotropine and the like.
Further, the metal oxide is calcium oxide (CaO), barium oxide (BaO), boron oxide (B)2O3) Zirconium oxide (ZrO)2) Samarium oxide (Sm)2O3) Cerium oxide (CeO)2) Titanium oxide (TiO)3) And zinc oxide (ZnO), and the like.
The following is illustrated with reference to specific examples:
in a first embodiment, the 5G filter according to this embodiment includes, by weight, 10 parts of epoxy resin, 5 parts of polyamide, 10 parts of calcium oxide, 15 parts of barium oxide, 5 parts of boron oxide, 10 parts of zirconium oxide, 1 part of samarium oxide, 2 parts of cerium oxide, 20 parts of titanium oxide, 20 parts of zinc oxide, 1 part of a dispersant, and 1 part of simethicone.
In a second embodiment, the 5G filter according to the present invention includes, by weight, 10 parts of epoxy resin, 5 parts of polyamide, 15 parts of calcium oxide, 20 parts of barium oxide, 5 parts of boron oxide, 15 parts of zirconium oxide, 2 parts of samarium oxide, 2 parts of cerium oxide, 10 parts of titanium oxide, 13 parts of zinc oxide, 1 part of a dispersant, and 2 parts of simethicone.
In a third embodiment, the 5G filter according to the present invention includes, by weight, 10 parts of epoxy resin, 5 parts of polyamide, 20 parts of calcium oxide, 15 parts of barium oxide, 10 parts of boron oxide, 20 parts of zirconium oxide, 2 parts of samarium oxide, 1 part of cerium oxide, 7 parts of titanium oxide, 8 parts of zinc oxide, 1 part of a dispersant, and 1 part of simethicone.
In a fourth embodiment, the 5G filter according to the present invention includes, by weight, 10 parts of epoxy resin, 5 parts of polyamide, 10 parts of calcium oxide, 10 parts of barium oxide, 5 parts of boron oxide, 8 parts of zirconium oxide, 10 parts of samarium oxide, 5 parts of cerium oxide, 15 parts of titanium oxide, 20 parts of zinc oxide, 1 part of a dispersant, and 1 part of simethicone.
In a fifth embodiment, the 5G filter according to the present invention includes, by weight, 10 parts of epoxy resin, 5 parts of polyamide, 10 parts of calcium oxide, 10 parts of barium oxide, 10 parts of boron oxide, 10 parts of zirconium oxide, 10 parts of samarium oxide, 10 parts of cerium oxide, 13 parts of titanium oxide, 10 parts of zinc oxide, 1 part of a dispersant, and 1 part of simethicone.
In a sixth embodiment, the 5G filter according to the present invention includes, by weight, 10 parts of epoxy resin, 5 parts of polyamide, 5 parts of calcium oxide, 10 parts of barium oxide, 5 parts of boron oxide, 5 parts of zirconium oxide, 15 parts of samarium oxide, 15 parts of cerium oxide, 15 parts of titanium oxide, 13 parts of zinc oxide, 1 part of a dispersant, and 1 part of simethicone.
Seventh embodiment, the 5G filter according to this embodiment includes, by weight, 10 parts of phenol resin, 1 part of urotropine, 10 parts of calcium oxide, 10 parts of barium oxide, 10 parts of boron oxide, 15 parts of zirconium oxide, 5 parts of samarium oxide, 5 parts of cerium oxide, 10 parts of titanium oxide, 20 parts of zinc oxide, 2 parts of a dispersant, and 2 parts of simethicone.
In an eighth embodiment, the 5G filter according to the present invention includes, by weight, 10 parts of phenolic resin, 1 part of urotropine, 15 parts of calcium oxide, 15 parts of barium oxide, 5 parts of boron oxide, 10 parts of zirconium oxide, 5 parts of samarium oxide, 15 parts of cerium oxide, 10 parts of titanium oxide, 10 parts of zinc oxide, 2 parts of a dispersant, and 2 parts of simethicone.
In a ninth embodiment, the 5G filter according to the present embodiment includes, by weight, 10 parts of phenolic resin, 1 part of urotropine, 5 parts of calcium oxide, 5 parts of barium oxide, 5 parts of boron oxide, 20 parts of zirconium oxide, 10 parts of samarium oxide, 10 parts of cerium oxide, 15 parts of titanium oxide, 15 parts of zinc oxide, 2 parts of a dispersant, and 2 parts of simethicone.
In an tenth embodiment, the 5G filter according to the present invention includes, by weight, 10 parts of phenol resin, 1 part of urotropine, 5 parts of calcium oxide, 5 parts of barium oxide, 10 parts of boron oxide, 15 parts of zirconium oxide, 5 parts of samarium oxide, 15 parts of cerium oxide, 15 parts of titanium oxide, 15 parts of zinc oxide, 2 parts of a dispersant, and 2 parts of simethicone.
Eleventh, the 5G filter according to this embodiment includes, by weight, 10 parts of phenol resin, 1 part of urotropine, 5 parts of calcium oxide, 10 parts of barium oxide, 10 parts of boron oxide, 10 parts of zirconium oxide, 5 parts of samarium oxide, 5 parts of cerium oxide, 20 parts of titanium oxide, 20 parts of zinc oxide, 2 parts of a dispersant, and 2 parts of simethicone.
Twelfth, the 5G filter according to the present embodiment includes, by weight, 10 parts of phenol resin, 1 part of urotropine, 10 parts of calcium oxide, 10 parts of barium oxide, 5 parts of boron oxide, 5 parts of zirconium oxide, 5 parts of samarium oxide, 5 parts of cerium oxide, 30 parts of titanium oxide, 15 parts of zinc oxide, 2 parts of a dispersant, and 2 parts of simethicone.
The formulations of the examples are shown in the following tables (tables 1 and 2)
TABLE 1
Name of material Example one Example two EXAMPLE III Example four EXAMPLE five EXAMPLE six
Epoxy resin A-128 10 10 10 10 10 10
Polyamide curing agent B10 5 5 5 5 5 5
CaO of calcium oxide 10 15 20 10 10 5
Barium oxide BaO 15 20 15 10 10 10
Boron oxide B2O3 5 5 10 5 10 5
Zirconium oxide ZrO2 10 15 20 8 10 5
Samarium oxide Sm2O3 1 2 2 10 10 15
Cerium oxide CeO2 2 2 1 5 10 15
Titanium oxide TiO3 20 10 7 15 13 15
Zinc oxide ZnO 20 13 8 20 10 13
Dispersant Z-03 1 1 1 1 1 1
Dimethylsilicone oil 500CS 1 2 1 1 1 1
TABLE 2
Name of material EXAMPLE seven Example eight Example nine Example ten EXAMPLE eleven Example twelve
Phenolic resin 10 10 10 10 10 10
Urotropine 1 1 1 1 1 1
CaO of calcium oxide 10 15 5 5 5 10
Barium oxide BaO 10 15 5 5 10 10
Boron oxide B2O3 10 5 5 10 10 5
Zirconium oxide ZrO2 15 10 20 15 10 5
Samarium oxide Sm2O3 5 5 10 5 5 5
Cerium oxide CeO2 5 15 10 15 5 5
Titanium oxide TiO3 10 10 15 15 20 30
Zinc oxide ZnO 20 10 15 15 20 15
Dispersant Z-03 2 2 2 2 2 2
Dimethylsilicone oil 500CS 2 2 2 2 2 2
Furthermore, the 5G filter is made by using epoxy resin as a resin binder, the dielectric constant is 80-90 (1 MHz), the electromagnetic wave shielding efficiency value is less than or equal to-1.2102 dB, and the performance requirement of the 5G filter is met. The 5G filter is made of phenolic resin serving as a resin binder, the dielectric constant is 95-105 (1 MHz), the electromagnetic wave shielding efficiency value is less than or equal to-1.2001 dB, and the performance requirement of the 5G filter is met.
The preparation method of the 5G filter based on the high-dielectric resin composite material comprises the following steps
①, uniformly mixing metal oxides, putting the metal oxides into a graphite crucible, calcining the metal oxides for 120min at the high temperature of 1250-;
step ②, mixing the resin binder and the curing agent, then adding the dispersant and the dimethyl silicone oil, stirring uniformly, wherein the liquid is a turbid milky uniform solution, adding the ceramic clinker powder, stirring and wetting to form a paste mixture for later use;
step ③, putting the paste mixture into a metal die, pressing the paste mixture on a pressing machine to obtain a shape required by the 5G filter, heating the metal die to 200 +/-20 ℃ within 20s after pressing and forming, and solidifying and forming the paste mixture, wherein the prepared blank is a 5G filter blank with accurate size for later use;
and ④, performing spraying or soaking coating treatment on the surface of the 5G filter blank by using low-temperature cured epoxy conductive silver paste, curing the conductive silver paste for 10-30min (epoxy resin curing for 30min and phenolic resin curing for 10 min) at the high temperature of 200 +/-20 ℃, and curing the conductive silver paste to obtain the 5G filter.
And welding the prepared 5G filter on a circuit board, and welding the 5G filter on the main board by using solder paste to form a 5G communication base station antenna assembly.
The foregoing is a preferred embodiment of the present invention, and the basic principles, principal features and advantages of the invention are shown and described. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are intended to illustrate the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, and the invention is intended to be protected by the following claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (9)

1. A5G filter based on high dielectric resin composite material is characterized in that: the adhesive comprises, by weight, 8-13 parts of a resin adhesive, 1-6 parts of a curing agent, 80-90 parts of a metal oxide, 1-3 parts of a dispersing agent and 1-3 parts of simethicone.
2. The high dielectric resin composite-based 5G filter according to claim 1, wherein: the resin binder is one or a mixture of more than two of epoxy resin, phenolic resin, polytetrafluoroethylene resin, polyamide-imide resin and saturated polyester resin.
3. The high dielectric resin composite-based 5G filter according to claim 1, wherein: the curing agent is polyamide or urotropine or a mixture of the two.
4. The high dielectric resin composite-based 5G filter according to claim 1, wherein: the metal oxide is one or a mixture of more than two of calcium oxide, barium oxide, boron oxide, zirconium oxide, samarium oxide, cerium oxide, titanium oxide and zinc oxide.
5. The method for preparing a 5G filter based on a high dielectric resin composite material as claimed in claim 1, wherein: comprises the following steps
①, uniformly mixing the metal oxides, putting the metal oxides into a graphite crucible for calcination, taking out the metal oxides after the calcination, cooling the metal oxides, crushing the metal oxides into powder, and then putting the powder into a ball mill to grind the powder into ceramic clinker powder for later use;
②, mixing the resin binder and the curing agent, then adding the dispersant and the dimethyl silicone oil, uniformly stirring, adding the ceramic clinker powder, and stirring and wetting to form a paste mixture for later use;
step ③, putting the paste mixture into a metal mold, pressing the paste mixture on a pressing machine to obtain a shape required by the 5G filter, heating the metal mold within 20s after the pressing to solidify and form the paste mixture, and making the blank piece of the 5G filter with accurate size for later use;
and ④, spraying or soaking and coating the surface of the 5G filter blank by using conductive silver paste, and curing the conductive silver paste to obtain the 5G filter.
6. The method as claimed in claim 5, wherein the metal oxide is calcined in a graphite crucible at 1250-1350 ℃ for 120min in ①.
7. The method for preparing a 5G filter based on a high dielectric resin composite material as claimed in claim 5, wherein the ceramic clinker powder of 7-10 μm is ground by a ball mill in step ①.
8. The method for preparing a 5G filter based on a high dielectric resin composite material as claimed in claim 5, wherein the curing temperature of the paste mixture is 200 ℃ ± 20 ℃ in step ③.
9. The method for preparing a 5G filter based on the high dielectric resin composite material according to claim 5, wherein in the step ④, the curing temperature of the conductive silver paste is 200 ℃ ± 20 ℃, and the curing time is 10-30 min.
CN202010158275.3A 2020-03-09 2020-03-09 5G filter based on high-dielectric resin composite material and preparation method thereof Withdrawn CN111334030A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111864329A (en) * 2020-08-03 2020-10-30 江西沃格光电股份有限公司 Dielectric resonator, preparation method thereof, dielectric filter and communication equipment

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005068298A (en) * 2003-08-25 2005-03-17 Fujikura Ltd High permittivity epoxy resin paste and electronic part
US20110128670A1 (en) * 2009-12-02 2011-06-02 Hae June Je High dielectric constant ceramic-polymer composites, embedded capacitors using the same, and fabrication method thereof
CN102794951A (en) * 2012-08-03 2012-11-28 浙江大学 Low loss high polymer-ceramic layered composite material used for microwave frequency band
CN103387704A (en) * 2013-08-02 2013-11-13 清华大学 Ceramic-polymer composite microwave material as well as preparation method and application methods thereof
CN104159968A (en) * 2011-12-20 2014-11-19 陶氏环球技术有限责任公司 Process for preparing cured epoxy composites
CN109534789A (en) * 2018-11-01 2019-03-29 华中科技大学 A kind of preparation method of Ceramic Dielectric Filter

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005068298A (en) * 2003-08-25 2005-03-17 Fujikura Ltd High permittivity epoxy resin paste and electronic part
US20110128670A1 (en) * 2009-12-02 2011-06-02 Hae June Je High dielectric constant ceramic-polymer composites, embedded capacitors using the same, and fabrication method thereof
CN104159968A (en) * 2011-12-20 2014-11-19 陶氏环球技术有限责任公司 Process for preparing cured epoxy composites
CN102794951A (en) * 2012-08-03 2012-11-28 浙江大学 Low loss high polymer-ceramic layered composite material used for microwave frequency band
CN103387704A (en) * 2013-08-02 2013-11-13 清华大学 Ceramic-polymer composite microwave material as well as preparation method and application methods thereof
CN109534789A (en) * 2018-11-01 2019-03-29 华中科技大学 A kind of preparation method of Ceramic Dielectric Filter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111864329A (en) * 2020-08-03 2020-10-30 江西沃格光电股份有限公司 Dielectric resonator, preparation method thereof, dielectric filter and communication equipment

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Application publication date: 20200626