CN111331782A - Solid earphone sleeve and manufacturing method thereof - Google Patents
Solid earphone sleeve and manufacturing method thereof Download PDFInfo
- Publication number
- CN111331782A CN111331782A CN202010150591.6A CN202010150591A CN111331782A CN 111331782 A CN111331782 A CN 111331782A CN 202010150591 A CN202010150591 A CN 202010150591A CN 111331782 A CN111331782 A CN 111331782A
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- Prior art keywords
- plate
- mold
- silica gel
- rubber
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1676—Making multilayered or multicoloured articles using a soft material and a rigid material, e.g. making articles with a sealing part
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
- B29K2083/005—LSR, i.e. liquid silicone rubbers, or derivatives thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3431—Telephones, Earphones
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a solid earphone sleeve and a manufacturing method thereof, wherein the manufacturing steps comprise that firstly, hard rubber is subjected to injection molding, then the hard rubber is placed into a rubber coating mold, liquid silica gel is injected into the rubber coating mold, low-temperature liquid silica gel coats the hard rubber and is subjected to high-temperature vulcanization molding, a product subjected to high-temperature vulcanization molding is taken out, dustproof oil is sprayed, a dustproof net is attached to the solid earphone sleeve, finally, a qualified product is filled into a packaging box and packaged, and the product is subjected to high-temperature vulcanization and integrated molding through the rubber coating mold; the invention has better noise reduction effect, is more comfortable to wear on ears, is not easy to damage, and can realize batch production for production enterprises.
Description
Technical Field
The invention relates to a manufacturing method of an earphone sleeve, in particular to a solid earphone sleeve and a manufacturing method thereof.
Background
With the rapid development of the electronic industry, electronic devices such as mobile phones and computers become essential items in daily life, most of the electronic equipment can be used together with the earphone, in order to continuously improve the user experience and meet the market demand, the quality and the process of the earphone are improved, most of the in-ear earphones need to be matched with earphone sleeves for use, common earphone sleeves in the market are provided with a cape, the earphone sleeves are embedded into ears and are fixedly connected with the inner walls of the ears in a fitting manner by utilizing the cape, the cape is a thin edge so as to ensure that the ears and the earphone sleeves are fixedly kept, so the hardness of the earphone sleeve is about 15-30 degrees, the earphone sleeve with the hardness is easy to cause discomfort of ears after being worn for a long time, and the bordure of this kind of earphone cover is extremely easy to damage, for this reason, we developed a solid earphone cover and manufacturing method.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a solid earphone sleeve and a manufacturing method thereof.
In order to achieve the purpose, the invention provides the following technical scheme: a solid earphone sleeve and a manufacturing method thereof comprise the following manufacturing steps:
1) injection molding the hard glue;
2) putting the hard rubber into a rubber coating mold;
3) injecting liquid silica gel into the rubber coating mold, coating the hard rubber with the liquid silica gel, and vulcanizing and molding at high temperature;
4) taking out the product formed by high-temperature vulcanization and spraying dustproof oil;
5) attaching a dust-proof net on the solid earphone sleeve;
6) and (5) packaging the qualified product into a packaging box and packaging.
Preferably, including cylinder board, fortune water board, last mould heat insulating board, cope match-plate pattern, medium plate, lower bolster, lower mould heat insulating board, backing plate and bottom plate, cylinder board below sets up fortune water board, fortune water board below sets up the mould heat insulating board, and mould heat insulating board below sets up the cope match-plate pattern on institute, the cope match-plate pattern below sets up the lower bolster, the medium plate sets up between cope match-plate pattern and the lower bolster, the lower bolster below sets up the lower mould heat insulating board, lower mould heat insulating board below sets up the backing plate, the backing plate below sets up the bottom plate, and wherein cope match-plate pattern, medium plate and lower bolster cooperation are used for cooling the shaping with liquid silica gel.
Preferably, the water transport plate is provided with a diversion lower plate and a diversion upper plate arranged above the diversion lower plate, an I-shaped flow channel is arranged between the diversion lower plate and the diversion upper plate, the air cylinder plate is provided with an air cylinder plate vertically penetrating through, and the air cylinder plate is communicated with the I-shaped flow channel.
Preferably, the cylinder board still is equipped with the cylinder, the cylinder below is equipped with the needle, and this needle runs through reposition of redundant personnel upper plate and is located the one corner on "worker" type runner, reposition of redundant personnel hypoplastron below is provided with cooling system, and this cooling system is located under the needle and link up mutually with "worker" type runner, cooling system runs through mould heat insulating board and upper die plate and inserts the medium plate.
Preferably, the middle plate is provided with a plurality of forming holes, the forming holes are distributed in an array, the upper template and the lower template are provided with forming grooves matched with the forming holes, the forming holes are communicated through a flow channel, and the flow channel is communicated with a cooling system.
Preferably, the upper template and the lower template are both provided with heating tubes.
Preferably, solid earphone sheath, including ebonite, dust-proof membrane and flexible glue layer, the ebonite is the ring form, the flexible glue layer vertically runs through and forms the earphone hole, and the downthehole inboard cladding of earphone on flexible glue layer connects the outer peripheral surface of ebonite, the terminal surface is connected in the ebonite to the dust-proof membrane laminating.
Preferably, the soft adhesive layer is formed by cooling liquid silica gel, and the hardness of the soft adhesive layer is 0-5 degrees.
Compared with the prior art, the invention has the beneficial effects that:
1. the earphone sleeve is provided with the soft rubber layer, the hardness of the soft rubber layer is 0-5 degrees, the earphone sleeve is inserted into an ear, the soft rubber layer can be attached to the inner wall of the ear, the earphone has a better noise reduction effect, a consumer has a better user wish, the hardness can enable the consumer not to feel uncomfortable even if the earphone sleeve is worn for a long time, and the soft rubber layer is not easy to damage and has a long service life.
2. According to the invention, the rubber coating die is provided with the middle plate, the middle plate is provided with the plurality of forming holes in an array manner, the upper die plate and the lower die plate are provided with the forming grooves matched with the plurality of forming holes, the matching tolerance of the upper die plate, the middle plate and the lower die plate is up to +/-0.01 mm, and the rubber coating die ensures the high manufacturability of products while ensuring the mass production of the products.
Drawings
FIG. 1 is a schematic structural view of an encapsulation mold of the present invention;
FIG. 2 is a cross-sectional view of an encapsulation die of the present invention;
FIG. 3 is a schematic view of a diverter lower plate of the present invention;
FIG. 4 is a schematic diagram of a middle plate according to the present invention;
fig. 5 is a cross-sectional view of a solid earphone sleeve of the present invention.
The reference numerals and names in the figures are as follows:
1. a cylinder plate; 2. a water carrying plate; 3. mounting a template; 4. a middle plate; 5. a lower template; 6. a base plate; 7. a base plate; 8. an upper die heat insulation plate; 9. a lower die heat insulation plate; 10. a rubber inlet pipe; 11. a cylinder; 12. a valve needle; 13. a cooling system; 14. a heat generating tube; 21. a shunt upper plate; 22. a diversion lower plate; 23. an I-shaped flow passage; 31. hard glue; 32. a soft adhesive layer; 33. a dust screen; 41. forming holes; 42. and a flow passage.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 5, an embodiment of the present invention includes: a solid earphone sleeve and a manufacturing method thereof comprise the following manufacturing steps:
1) injection molding the annular hard rubber 31;
2) placing the hard rubber 31 into a rubber coating die according to the position of the forming hole 41;
3) injecting liquid silica gel into the rubber coating mould, injecting the liquid silica gel at low temperature through a cooling system 13 and coating hard rubber, and vulcanizing and molding the liquid silica gel at high temperature through a heating tube 14;
4) taking out the product formed by high-temperature vulcanization and spraying dustproof oil;
5) attaching a dust-proof net 33 to the solid earphone sleeve;
6) and (5) packaging the qualified product into a packaging box and packaging.
Specifically, the rubber coating mould include cylinder board 1, fortune water board 2, go up mould heat insulating board 8, cope match-plate pattern 3, medium plate 4, lower bolster 5, lower mould heat insulating board 9, backing plate 6 and bottom plate 7, its characterized in that: the improved liquid silica gel vulcanizing machine is characterized in that a water transporting plate 2 is arranged below the air cylinder plate 1, an upper mold heat insulation plate 8 is arranged below the water transporting plate 2, an upper mold plate 3 is arranged below the upper mold heat insulation plate 8, a lower mold plate 5 is arranged below the upper mold plate 3, a middle plate 4 is arranged between the upper mold plate 3 and the lower mold plate 5, a lower mold heat insulation plate 9 is arranged below the lower mold plate 5, a base plate 6 is arranged below the lower mold heat insulation plate 9, a bottom plate 7 is arranged below the base plate 6, and the upper mold plate 3, the middle plate 4 and the lower mold plate 5 are matched for use and are used for vulcanizing liquid silica gel.
Specifically, water transport plate 2 is provided with reposition of redundant personnel hypoplastron 22 and sets up the reposition of redundant personnel upper plate 21 of reposition of redundant personnel hypoplastron 22 top, be equipped with "worker" type runner 23 between reposition of redundant personnel hypoplastron 22 and the reposition of redundant personnel upper plate 21, cylinder plate 1 is equipped with the income rubber tube 10 of the cylinder plate 1 that vertically runs through, and this income rubber tube 10 is link up with "worker" type runner 23 mutually, and liquid silica gel flows into "worker" type runner 23 from income rubber tube 10.
Specifically, the cylinder plate 1 is further provided with a cylinder 11, a valve needle 12 is arranged below the cylinder 11, the valve needle 12 penetrates through the upper diversion plate 21 and is located at one corner of the i-shaped flow passage 23, a cooling system 13 is arranged below the lower diversion plate 22, the cooling system 13 is located under the valve needle 12 and is communicated with the i-shaped flow passage 23, and the cooling system 13 penetrates through the upper mold insulation plate 8 and the upper mold plate 3 and is inserted into the middle plate 4.
Specifically, the middle plate 4 is provided with a plurality of forming holes 41, the forming holes 41 are distributed in an array, the upper template 3 and the lower template 5 are provided with forming grooves used in cooperation with the forming holes 41, the forming holes 41 are communicated through a flow channel 42, the flow channel 42 is communicated with the cooling system 13, and the "i" shaped flow channel 23 enables the liquid silica gel to flow into the middle plate 4 at a low temperature through the cooling system 13 and fills the flow channel 42 and the forming holes 41.
Specifically, the upper template 3 and the lower template 5 are both provided with heating tubes 14. The heating tube 14 generates heat to vulcanize the liquid silica gel at high temperature.
Specifically, a solid earphone sleeve include ebonite 31, dust-proof membrane 33 and flexible glue layer 32, ebonite 31 is the ring form, the flexible glue layer 32 vertically runs through and forms the earphone hole, and the downthehole inboard cladding of earphone of flexible glue layer 32 connects the outer peripheral surface of ebonite 31, the laminating of dust-proof membrane 33 is connected at ebonite 31 up end.
Specifically, the soft adhesive layer 32 is formed by vulcanizing liquid silica gel at a high temperature, the hardness of the soft adhesive layer 32 is 0-5 degrees, and earphone sleeves on the market can only be made of 15-30 degrees of raw material hardness of silica gel, so that the earphone sleeves can better fit the inner contour of ears and are more comfortable.
The working process of the rubber coating die comprises the following steps: the liquid silica gel flows into the I-shaped flow channel 23 from the rubber inlet pipe 10, the valve needle 12 is opened, the liquid silica gel flows into the middle plate 4 at a low temperature through the cooling system 13, the flow channel 42 and the forming hole 41 are filled with the liquid silica gel, then the valve needle 12 is closed, and the heating pipe 14 is heated to enable the liquid silica gel to be vulcanized and formed at a high temperature.
The core of the invention is that the product is attached to the ear cavity of the human body to the maximum extent to achieve a better noise reduction function, and meanwhile, the comfort level is not influenced, and the mass production result can be realized.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. A solid earphone sleeve and a manufacturing method thereof comprise the following manufacturing steps:
injection molding the hard glue;
putting the hard rubber into a rubber coating mold;
injecting liquid silica gel into the rubber coating mold, coating the hard rubber with the liquid silica gel, and vulcanizing and molding at high temperature;
taking out the product formed by high-temperature vulcanization and spraying dustproof oil;
attaching a dust-proof net on the solid earphone sleeve;
and (5) packaging the qualified product into a packaging box and packaging.
2. The encapsulation mould of claim 1, comprising a cylinder plate (1), a water transport plate (2), an upper mould insulation plate (8), an upper mould plate (3), a middle plate (4), a lower mould plate (5), a lower mould insulation plate (9), a backing plate (6) and a bottom plate (7), and is characterized in that: the improved liquid silica gel vulcanizing machine is characterized in that a water transporting plate (2) is arranged below the air cylinder plate (1), a mold heat insulating plate (8) is arranged below the water transporting plate (2), an upper mold plate (3) is arranged below the mold heat insulating plate (8), a lower mold plate (5) is arranged below the upper mold plate (3), a middle plate (4) is arranged between the upper mold plate (3) and the lower mold plate (5), a lower mold heat insulating plate (9) is arranged below the lower mold plate (5), a base plate (6) is arranged below the base plate (6), and the upper mold plate (3), the middle plate (4) and the lower mold plate (5) are matched for use and are used for high-temperature vulcanization molding of liquid silica gel.
3. The encapsulation die of claim 2, wherein: the water transport plate (2) is provided with a diversion lower plate (22) and a diversion upper plate (21) arranged above the diversion lower plate (22), an I-shaped runner (23) is arranged between the diversion lower plate (22) and the diversion upper plate (21), the air cylinder plate (1) is provided with a rubber inlet pipe (10) of the air cylinder plate (1) which longitudinally penetrates through, and the rubber inlet pipe (10) is communicated with the I-shaped runner (23).
4. The overmold die of claim 3, wherein: the cylinder board (1) is further provided with a cylinder (11), a valve needle (12) is arranged below the cylinder (11), the valve needle (12) penetrates through the upper shunting board (21) and is located at one corner of the I-shaped runner (23), a cooling system (13) is arranged below the lower shunting board (22), the cooling system (13) is located under the valve needle (12) and is communicated with the I-shaped runner (23), and the cooling system (13) penetrates through the upper die heat insulation board (8) and the upper die plate (3) and is inserted into the middle board (4).
5. The overmold die of claim 4, wherein: the middle plate (4) is provided with a plurality of forming holes (41), the forming holes (41) are distributed in an array mode, the upper template (3) and the lower template (5) are provided with forming grooves matched with the forming holes (41), the forming holes (41) are communicated through a flow channel (42), and the flow channel (42) is communicated with the cooling system (13).
6. The encapsulation die of claim 2, wherein: the upper template (3) and the lower template (5) are both provided with heating tubes (14).
7. A solid headphone cover according to claim 1 or 2, comprising a hard glue (31), a dust-proof membrane (33) and a soft glue layer (32), characterized in that: ebonite (31) are the ring form, soft glue layer (32) vertically runs through and forms the earphone hole, and the downthehole cladding of earphone of soft glue layer (32) connects ebonite (31) outer peripheral surface, dust-proof membrane (33) laminating is connected in ebonite (31) up end.
8. The solid headphone cover of claim 6, wherein: the soft rubber layer (32) is formed by liquid silica gel through high-temperature vulcanization, and the hardness of the soft rubber layer (32) is 0-5 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010150591.6A CN111331782A (en) | 2020-03-06 | 2020-03-06 | Solid earphone sleeve and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010150591.6A CN111331782A (en) | 2020-03-06 | 2020-03-06 | Solid earphone sleeve and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111331782A true CN111331782A (en) | 2020-06-26 |
Family
ID=71175983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010150591.6A Pending CN111331782A (en) | 2020-03-06 | 2020-03-06 | Solid earphone sleeve and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111331782A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114536647A (en) * | 2021-12-25 | 2022-05-27 | 东莞市金铂钰橡塑五金制品有限公司 | Mesh cloth ear cap forming method |
| CN114986790A (en) * | 2022-04-26 | 2022-09-02 | 东莞市信联兴电子有限公司 | Soft glue injection mold and soft glue coating method for neck earphone |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206364987U (en) * | 2017-01-04 | 2017-07-28 | 江西天键电声有限公司 | Improve the earphone of wear comfort |
| CN207039838U (en) * | 2017-07-21 | 2018-02-23 | 维沃移动通信有限公司 | A kind of earphone case and earphone |
| CN108058329A (en) * | 2017-11-28 | 2018-05-22 | 天津三卓韩橡塑科技股份有限公司 | A kind of earphone rubber coating forming mould structure |
| CN207617023U (en) * | 2017-10-24 | 2018-07-17 | 深圳市盼的科技有限公司 | A kind of open silica gel injection mold cavity structure |
-
2020
- 2020-03-06 CN CN202010150591.6A patent/CN111331782A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206364987U (en) * | 2017-01-04 | 2017-07-28 | 江西天键电声有限公司 | Improve the earphone of wear comfort |
| CN207039838U (en) * | 2017-07-21 | 2018-02-23 | 维沃移动通信有限公司 | A kind of earphone case and earphone |
| CN207617023U (en) * | 2017-10-24 | 2018-07-17 | 深圳市盼的科技有限公司 | A kind of open silica gel injection mold cavity structure |
| CN108058329A (en) * | 2017-11-28 | 2018-05-22 | 天津三卓韩橡塑科技股份有限公司 | A kind of earphone rubber coating forming mould structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114536647A (en) * | 2021-12-25 | 2022-05-27 | 东莞市金铂钰橡塑五金制品有限公司 | Mesh cloth ear cap forming method |
| CN114986790A (en) * | 2022-04-26 | 2022-09-02 | 东莞市信联兴电子有限公司 | Soft glue injection mold and soft glue coating method for neck earphone |
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Application publication date: 20200626 |
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| RJ01 | Rejection of invention patent application after publication |