CN111331708A - Water-soluble die material for resin-based composite material - Google Patents
Water-soluble die material for resin-based composite material Download PDFInfo
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- CN111331708A CN111331708A CN202010150405.9A CN202010150405A CN111331708A CN 111331708 A CN111331708 A CN 111331708A CN 202010150405 A CN202010150405 A CN 202010150405A CN 111331708 A CN111331708 A CN 111331708A
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- 239000000463 material Substances 0.000 title claims abstract description 51
- 239000000805 composite resin Substances 0.000 title claims abstract description 12
- 239000012700 ceramic precursor Substances 0.000 claims abstract description 34
- 239000000945 filler Substances 0.000 claims abstract description 34
- 239000007864 aqueous solution Substances 0.000 claims abstract description 16
- 238000001035 drying Methods 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- 238000003754 machining Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 125000003368 amide group Chemical group 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004005 microsphere Substances 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 239000002243 precursor Substances 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 11
- 239000002131 composite material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 229920003169 water-soluble polymer Polymers 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002195 soluble material Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003839 salts Chemical group 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/04—Apparatus or processes for treating or working the shaped or preshaped articles for coating or applying engobing layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/24—Apparatus or processes for treating or working the shaped or preshaped articles for curing, setting or hardening
- B28B11/243—Setting, e.g. drying, dehydrating or firing ceramic articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/30—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/30—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds
- C04B26/32—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Other silicon-containing organic compounds; Boron-organic compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/49—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Organo-clay compounds; Organo-silicates, i.e. ortho- or polysilicic acid esters ; Organo-phosphorus compounds; Organo-inorganic complexes
- C04B41/4905—Compounds having one or more carbon-to-metal or carbon-to-silicon linkages ; Organo-clay compounds; Organo-silicates, i.e. ortho- or polysilicic acid esters ; Organo-phosphorus compounds; Organo-inorganic complexes containing silicon
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/60—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only artificial stone
- C04B41/61—Coating or impregnation
- C04B41/62—Coating or impregnation with organic materials
- C04B41/64—Compounds having one or more carbon-to-metal of carbon-to-silicon linkages
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2201/00—Mortars, concrete or artificial stone characterised by specific physical values
- C04B2201/50—Mortars, concrete or artificial stone characterised by specific physical values for the mechanical strength
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The invention relates to a method for preparing a water-soluble mould material for a resin-based composite material, which belongs to the field of new materials and consists of a water-soluble ceramic precursor aqueous solution and a filler for a water-soluble mould, wherein the mass percentage concentration of the water-soluble ceramic precursor aqueous solution is 10-30%, and the solute mass of the ceramic precursor aqueous solution is 1-15% of the mass of the filler for the water-soluble mould.
Description
Technical Field
The invention relates to a method for manufacturing a water-soluble die material for a resin-based composite material, belonging to the field of new materials.
Background
The adhesive used in the traditional water-soluble material comprises inorganic salt and water-soluble polymer, and the salt core (core mold) made of the material has strong hygroscopicity, poor surface quality of the core and difficult guarantee of dimensional accuracy. The water-soluble polymer is a high molecular compound with hydrophilic groups, the frequently used water-soluble mould material of the resin-based composite material is polyvinyl alcohol, although the forming is easy, the glass transition temperature is low, the thermal stability is poor, and the polyvinyl alcohol has the phenomena of blackening, sintering and the like when the curing temperature exceeds 150 ℃, so that the mould material is difficult to completely clean when demoulding. For the molding process of composite materials with higher curing temperature, water-soluble materials like polyvinyl alcohol can not meet the use requirements, and a water-soluble polymer with higher temperature resistance is needed. With the continuous emergence of high temperature resistant and ablation resistant resin, the curing temperature is increased, which reaches 375 ℃ at most, and the prior art does not provide a high temperature resistant (over 375 ℃) water-soluble mold (core mold) material for resin-based composite materials and a method for manufacturing the water-soluble mold until now.
Disclosure of Invention
The invention aims to provide a water-soluble mould material for a resin-based composite material and a method for manufacturing the water-soluble mould, which aim to solve the problem of poor high-temperature resistance of the existing water-soluble mould (core mould) for the resin-based composite material.
The technical scheme adopted by the invention for solving the technical problems is as follows:
resin matrixThe water-soluble mold material for the composite material consists of a water-soluble ceramic precursor aqueous solution and a water-soluble mold filler; the mass percentage concentration of the water-soluble ceramic precursor aqueous solution is 10-30%; the structure of the ceramic precursor isThe structure is that the main chain is-O-A-O-, A is one of silicon and titanium, and can form A ceramic material precursor which is compounded by organic silicon and titanate through covalent bonds with oxygen, and the side chain B is grafted with A water-soluble substituent which is one of hydroxyl, carboxyl, amido and amido compounds or polymers thereof; the solute mass of the ceramic precursor water solution is 1-15% of the mass of the water-soluble mold filler; the water-soluble mold filler is one or a mixture of micron-sized silicon dioxide, micron-sized aluminum oxide and micron-sized titanium dioxide hollow ceramic microspheres.
Preferably, the water-soluble mould material also comprises an auxiliary filler for the water-soluble mould, and the mass of the auxiliary filler is 1-10% of that of the filler for the water-soluble mould; the auxiliary filler for the water-soluble die is micron-sized graphite powder or micron-sized metal powder.
The mold comprises the following steps:
(1) preparing materials: dissolving a ceramic precursor in water to prepare a water solution with the concentration of 10-30%, adding a water-soluble mold filler, wherein the mass of the water-soluble ceramic precursor is 1-15% of that of the water-soluble mold filler, and uniformly stirring to prepare a water-soluble mold material;
(2) preforming: putting the water-soluble mould material prepared in the step (1) into a mould for manufacturing a water-soluble mould or a core mould, and compacting to prepare the required shape of the water-soluble mould;
(3) and (3) drying: drying the preformed water-soluble mould prepared in the step (2) at the drying temperature of 100-200 ℃ until the preformed water-soluble mould is dried to prepare a formed water-soluble mould;
(4) and (3) machining: machining the surface of the dried preformed water-soluble mould to obtain a water-soluble mould with the geometric dimension precision of 0.01 mm;
(5) surface treatment: coating a ceramic precursor aqueous solution with the mass percentage concentration of 10-30% on the outer surface of the water-soluble mould after mechanical processing, and drying, wherein the dried coating forms a hard protective film on the outer surface of the water-soluble mould; and preparing the water-soluble mold.
Preferably, the method for manufacturing the water-soluble mold comprises the following steps: in the step (3), the drying temperature is 150 ℃.
Preferably, the method for manufacturing the water-soluble mold comprises the following steps: in the step (5), the mass percentage concentration of the water-soluble ceramic precursor aqueous solution is 15%.
The invention has the advantages that
(1) The water-soluble ceramic precursor adopted by the water-soluble mould material prepared by the invention is a substance with good thermal stability, can be dissolved when being heated to 800 ℃, has good high-temperature resistance, and is suitable for forming resin-based composite materials with high curing temperature.
(2) The adopted filler is inorganic filler, the core die prepared by the inorganic filler has light weight, small thermal expansion coefficient and appearance and size which can be machined according to requirements, the water-soluble die material containing the water-soluble ceramic precursor has certain mechanical strength, the compression strength of a cube with the side length of 25.4mm is tested, the compression strength reaches 8MPa or above, and the retention rate at 300 ℃ is still high.
(3) Compared with the traditional casting type water-soluble mould material added with gypsum powder, the casting type water-soluble mould material has the advantage that the compression strength of the water-soluble mould can be controlled by changing the preforming pressure under the condition of keeping the formula ratio unchanged.
Drawings
Fig. 1 is a flow chart of the process of making the water-soluble mold according to the present invention (steps one to five).
Detailed Description
Example 1
The preparation method of the mould comprises the following steps:
preparing materials: dissolving a ceramic precursor with an organic silicon structure as a main chain in water to prepare a 20% aqueous solution, adding a water-soluble mold filler, and uniformly stirring to prepare a water-soluble mold material, wherein the mass of the water-soluble ceramic precursor is 8% of that of the water-soluble mold filler;
the filler is: ordinary sand
Preforming: putting the water-soluble mould material prepared in the step (1) into a mould for manufacturing a water-soluble mould or a core mould, and compacting to prepare the required shape of the water-soluble mould;
and (3) drying: drying the preformed water-soluble mould prepared in the step (2) at the drying temperature of 150 ℃ until the preformed water-soluble mould is dried to prepare a formed water-soluble mould; and (3) machining: machining the surface of the dried preformed water-soluble mould to obtain a water-soluble mould;
surface treatment: coating a ceramic precursor aqueous solution with the mass percentage concentration of 20% on the outer surface of the water-soluble mould after mechanical processing, and drying, wherein the dried coating forms a hard protective film on the outer surface of the water-soluble mould; and preparing the water-soluble mold.
In the step (3), the drying treatment temperature is 150 ℃.
In the step (5), the mass percentage concentration of the water-soluble ceramic precursor aqueous solution is 15%.
Example 2
The filler for the water-soluble mold in the embodiment is one or a mixture of micron-sized silicon dioxide, micron-sized aluminum oxide and micron-sized titanium dioxide hollow ceramic microspheres. The other components are the same as those in the first embodiment.
Example 3
The filler for the water-soluble mold is formed by uniformly mixing any two or more than two of micron-sized silicon dioxide, micron-sized aluminum oxide and micron-sized titanium dioxide hollow ceramic microspheres according to any ratio.
Example 4
The water-soluble high molecular polymer aqueous solution according to the present embodiment is an aqueous solution of a water-soluble ceramic precursor having a main chain of an organic silicon structure at a concentration of 25% by mass, and the rest is the same as in example 1.
Example 5
In the present embodiment, the mass of the solute in the aqueous solution of the water-soluble ceramic precursor having the main chain of the organosilicon structure is 10% of the mass of the filler for the water-soluble mold. The rest is the same as example 1.
Example 6
The water-soluble mold material of the embodiment further comprises an auxiliary filler for the water-soluble mold, wherein the mass of the auxiliary filler for the water-soluble mold is 25% of that of the filler for the water-soluble mold; the auxiliary filler for the water-soluble die is micron-sized graphite powder. The rest is the same as example 1.
Example 7
Referring to fig. 1, the method for manufacturing a water-soluble mold according to the present embodiment is implemented as follows:
step one, batching: dissolving a water-soluble ceramic precursor with a main chain of-O-Ti-O-structure in water to prepare a water solution with the concentration of 10%, adding a water-soluble mold filler after the water-soluble ceramic precursor is completely dissolved, wherein the mass of the water-soluble ceramic precursor water solution is 15% of that of the water-soluble mold filler, and uniformly stirring to prepare a water-soluble mold material;
step two, preforming: putting the water-soluble mould material prepared in the step one into a mould for preparing a water-soluble mould or a core mould, and compacting to prepare the required shape of the water-soluble mould (the core mould), so that the workload of machining can be reduced; or the water-soluble mould material prepared in the step one is made into a preformed block, and the required shape of the water-soluble mould (core mould) is prepared by various machining means; in the preforming process, the larger the pressure applied to the die material is, the stronger the pressure resistance of the manufactured core die is;
step three, drying: drying the preformed water-soluble mould prepared in the third step at the drying temperature of 100 ℃ until the preformed water-soluble mould is dried to prepare a formed water-soluble mould; the drying time depends on the size of the sample to be dried, and the larger the size of the sample, the longer the drying time is needed; during drying, the preformed core mold can be placed into a drying oven for drying; the moisture in the composite must be completely dried out by drying, otherwise the performance of the composite is affected;
step four, machining: machining the surface of the pre-formed water-soluble mould after drying to obtain a water-soluble mould (core mould) with a precise geometric dimension; the pre-forming block can be processed by various machining means, and can be processed into various required shapes including various arcs; during machining, the direction of the cutter entering is taken into consideration, so that defects at edges and corners are avoided;
step five, surface treatment: coating a layer of water-soluble ceramic precursor water solution with the mass percentage concentration of 20% on the outer surface of the water-soluble mould (core mould) after machining, and drying, wherein the dried coating forms a hard protective film on the outer surface of the water-soluble mould (core mould); the desired water-soluble mold (mandrel) is produced.
The purpose of surface treatment after the mandrel is processed into a required shape is as follows: so as to avoid the problem that glue (the glue on the prepreg for composite material molding) seeps into tiny gaps of the water-soluble core mold material in the curing process and brings difficulty to the removal of the core mold material.
The water-soluble molds obtained in examples 1 to 7 were tested, heated to 500 deg.C, 600 deg.C, and 800 deg.C, respectively, and the dissolved state thereof was recorded, and the specific results are shown in Table 1, and the molds of examples 1 to 7 were tested for their compressive strength using a cube having a side length of 25.4mm, and the strength retention rates at 100 deg.C, 200 deg.C, and 300 deg.C were recorded, and the results are shown in Table 2.
TABLE 1
TABLE 2
Claims (7)
1. A water-soluble mould material for resin-based composite materials is characterized in that: consists of water-soluble ceramic precursor water solution and water-soluble mold filler; the mass percentage concentration of the water-soluble ceramic precursor aqueous solution is 10-30%; the structure of the ceramic precursor isThe structure is that the main chain is-O-A-O-, A is one of silicon and titanium, and can form A ceramic material precursor which is compounded by organic silicon and titanate through covalent bonds with oxygen, and the side chain B is grafted with A water-soluble substituent which is one of hydroxyl, carboxyl, amido and amido compounds or polymers thereof; the solute mass of the ceramic precursor water solution is 1-15% of the mass of the water-soluble mold filler; the water-soluble mold filler is one or a mixture of micron-sized silicon dioxide, micron-sized aluminum oxide and micron-sized titanium dioxide hollow ceramic microspheres.
2. The water-soluble mold material for resin-based composite materials according to claim 1, characterized in that: the water-soluble ceramic precursor water solution is a ceramic precursor water solution with the mass percentage concentration of 15%.
3. The water-soluble mold material for resin-based composite materials according to claim 1, characterized in that: the mass of the water-soluble ceramic precursor solute is 10% of the mass of the filler for the water-soluble mold.
4. The water-soluble mold material according to any one of claims 1 to 3, wherein: the water-soluble mould material also comprises an auxiliary filler for the water-soluble mould, and the mass of the auxiliary filler is 1-10% of that of the filler for the water-soluble mould; the auxiliary filler for the water-soluble die is micron-sized graphite powder or micron-sized metal powder.
5. A method of making a mould using the water soluble mould material according to any one of claims 1 to 3, characterised in that it consists of the steps of:
(1) preparing materials: dissolving a ceramic precursor in water to prepare a water solution with the concentration of 10-30%, adding a water-soluble mold filler, wherein the mass of the water-soluble ceramic precursor is 1-15% of that of the water-soluble mold filler, and uniformly stirring to prepare a water-soluble mold material;
(2) preforming: putting the water-soluble mould material prepared in the step (1) into a mould for manufacturing a water-soluble mould or a core mould, and compacting to prepare the required shape of the water-soluble mould;
(3) and (3) drying: drying the preformed water-soluble mould prepared in the step (2) at the drying temperature of 100-200 ℃ until the preformed water-soluble mould is dried to prepare a formed water-soluble mould;
(4) and (3) machining: machining the surface of the dried preformed water-soluble mould to obtain a water-soluble mould with the geometric dimension precision of 0.01 mm;
(5) surface treatment: coating a ceramic precursor aqueous solution with the mass percentage concentration of 10-30% on the outer surface of the water-soluble mould after mechanical processing, and drying, wherein the dried coating forms a hard protective film on the outer surface of the water-soluble mould; and preparing the water-soluble mold.
6. The method of making a water soluble mold as recited in claim 5, wherein: in the step (3), the drying temperature is 150 ℃.
7. The method of making a water soluble mold as recited in claim 5, wherein: in the step (5), the mass percentage concentration of the water-soluble ceramic precursor aqueous solution is 15%.
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CN101665609A (en) * | 2009-10-29 | 2010-03-10 | 哈尔滨玻璃钢研究院 | Water-soluble die material for resin matrix composite materials and method for manufacturing water-soluble die |
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