CN111330935A - Semiconductor laser electrode wire recycling device and method - Google Patents
Semiconductor laser electrode wire recycling device and method Download PDFInfo
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- CN111330935A CN111330935A CN201811545627.XA CN201811545627A CN111330935A CN 111330935 A CN111330935 A CN 111330935A CN 201811545627 A CN201811545627 A CN 201811545627A CN 111330935 A CN111330935 A CN 111330935A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004064 recycling Methods 0.000 title claims description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 87
- 238000010438 heat treatment Methods 0.000 claims abstract description 21
- 229910052738 indium Inorganic materials 0.000 claims abstract description 12
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000011084 recovery Methods 0.000 claims abstract description 11
- 238000003860 storage Methods 0.000 claims description 12
- 238000005485 electric heating Methods 0.000 claims description 10
- 210000000078 claw Anatomy 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 3
- 239000000155 melt Substances 0.000 abstract 1
- 230000002950 deficient Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 241000251468 Actinopterygii Species 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Optics & Photonics (AREA)
- Processing Of Solid Wastes (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The utility model provides a semiconductor laser electrode line recovery unit and recovery method, the electrical heating stick, the indium layer heating that the electrical heating stick will each heat sink surface melts, open mould strip actuating mechanism, its drive mould strip is followed the constant head tank and is followed the left right side motion, until a plurality of electrode lines are located cutting piece dead ahead, cutting piece actuating mechanism drive cutting piece moves forward, cutting piece promotes the electrode line and peels off from the insulating sheet on the heat sink, the electrode line after peeling off is promoted forward by the cutting piece and is dropped into in the receiver. Adopt mechanical structure, simple structure long service life, the maintenance is maintained conveniently, and the device adopts semi-automatization operation, and production efficiency is high, once can accomplish peeling off of the electrode line on a plurality of heat sinks, and production efficiency has improved tens of times. Meanwhile, the recovery yield of the electrode wire is greatly improved.
Description
Technical Field
The invention relates to the technical field of semiconductor lasers, in particular to a C-mount packaged semiconductor laser electrode wire recycling device.
Background
The semiconductor laser has the advantages of high efficiency, long service life, high light beam quality, good stability, compact structure and the like, and is widely applied to the fields of optical fiber communication, laser pumping, medical equipment, night vision illumination, laser printers and the like. With the increasing development and maturity of semiconductor technology, laser diodes have been greatly improved in terms of power, conversion efficiency, wavelength expansion, and operation lifetime. In recent years, the demand of high-power lasers is increasing day by day, the traditional TO56 packaging form cannot meet the heat dissipation demand of the high-power lasers, and the capacity of the C-mount packaged high-power semiconductor lasers is gradually expanded. The C-mount semiconductor laser is an industry standard semiconductor laser packaging structure and is characterized in that a layer of metal solder (generally metal indium) is evaporated on a heat sink, a laser chip is welded on the heat sink, an electrode wire is led out, and the electrode wire is welded at one end of the heat sink through an insulating sheet. The semiconductor laser is used as a high-precision electronic product, the quality requirement on an electrode wire is high, the manufacturing process is complex, and therefore the price cost of the electrode wire also accounts for a large part of the whole laser.
A plurality of working procedures are needed in the packaging process of a semiconductor laser, each working procedure can generate some lasers with poor performance, the number of defective products is increased along with the expansion of the packaging scale of the lasers, how to process the defective lasers becomes a new difficult problem, and if the defective lasers are directly scrapped, the waste of resources can be caused. If the most expensive electrode wire of a bad laser is recycled, resources can be saved and production cost can be reduced. The method adopted by the existing electrode recycling method is that a laser is placed on a heating table, the temperature is heated to 200 ℃, indium on the laser is melted, the indium attached to a heat sink is scraped by a blade with one hand, an electrode wire and the heat sink are peeled off, and the electrode is clamped and taken into a containing box by tweezers with one hand to recycle the electrode wire. The method for recycling the electrode wire is simple, but the pure manual operation efficiency is low, the electrode wire can only be recycled, and meanwhile, the electrode wire is easily damaged by tweezers and blades in the recycling process, so that the yield of the recycled electrode wire is low. When the electrode wire is recovered by the method, the temperature of the heating table is too high, the high temperature causes discomfort to an operator, meanwhile, if the operator accidentally touches the heating table, scalding is easily caused, in the scraping process of the electrode wire, the arm is easily scratched, and unsafe factors are more in the whole operation process. Therefore, an electrode wire recycling device which can operate in a semi-automatic mode, is simple in structure, high in production efficiency, convenient to operate, safe and reliable is needed, and meanwhile the recycling qualified rate of the electrode wire can be improved. The problem existing in the existing electrode wire recovery process is solved.
Disclosure of Invention
In order to overcome the defects of the technology, the invention provides the device for realizing the electrode wire recovery, which has high production efficiency, convenient operation, safety and reliability.
The technical scheme adopted by the invention for overcoming the technical problems is as follows:
a semiconductor laser electrode wire recovery device comprises:
the upper end of the base is vertically provided with a plurality of upright posts;
the workbench is horizontally arranged at the top end of each upright post, and a positioning groove is arranged above the workbench along the length direction of the workbench;
the die strip is internally provided with a clamping groove along the length direction, the width of the clamping groove is matched with the width of a heat sink of the laser, a plurality of heat sinks are inserted into the clamping groove side by side, the width of the die strip is matched with the width of the positioning groove, and the die strip is inserted into the positioning groove in a horizontally sliding manner;
the cutting piece is horizontally arranged at the upper end of the workbench, is positioned at the rear end of the positioning groove, and is arranged on the workbench and used for driving the cutting piece to move in the front-back direction;
the storage box is arranged on the workbench and is positioned at the front end of the positioning groove;
an electric heating rod arranged on the workbench and used for heating and melting the indium layer on the surface of each heat sink in the die strip
Mould strip actuating mechanism, its drive mould strip is just when cutting the piece to a plurality of heat sinks on the mould strip to the cutting piece from left right side motion along the constant head tank, and cutting piece actuating mechanism drive cutting piece moves forward, cuts cutting piece promotion and peels off and fall into the receiver through the adnexed electrode line of insulating piece on the heat sink that corresponds.
The die strip driving mechanism comprises a connecting rod horizontally and slidably arranged on a base, a fixed rod vertically arranged on the connecting rod, a pusher dog rotationally arranged at the head end of the fixed rod through a rotating shaft and a power system for driving the connecting rod to reciprocate left and right, wherein a long hole I is formed in the positioning groove, the long hole I at the head end of the pusher dog extends out, the length of the long hole I is larger than the distance between the connecting rod and the left and right in the horizontal direction, an inclined plane II is arranged at the left end of the pusher dog, a stop block and a clamping arm spring are arranged on the fixed rod, one end of the clamping arm spring is connected with the fixed rod, the other end of the clamping arm spring is connected with the pusher dog, a plurality of round holes are formed in the lower end of the die strip along the length direction of the die strip at intervals, when the connecting rod moves rightwards and the pusher dog is inserted into, the pusher dog compresses the arm lock spring.
The cutting blade driving mechanism comprises a guide rod vertically arranged on a base, a lifting block sleeved on the guide rod in a sliding manner, a bracket arranged at the upper end of a workbench and a spring I sleeved on the guide rod, wherein one end of the spring I is connected with the base, the other end of the spring I is connected with the lifting block, a conical cone is arranged on a connecting rod and is positioned under the lifting block, the left end and the right end of the bracket are respectively horizontally provided with a long hole II along the front-back direction, the left end and the right end of the cutting blade are respectively provided with a pin shaft II, the pin shafts II are inserted into the corresponding long holes II on the same side in a sliding manner, the spring II is arranged in the long hole II, one end of the spring II is connected with the pin shaft II, the other end of the spring II is connected with the bracket, the upper end surface of the lifting block is a guide inclined surface, the lower end surface, the conical surface of the cone drives the lifting block to slide upwards under the guidance of the guide rod and stretch the spring I, and when the lifting block moves upwards, the cutting blade is driven to move towards the front end through the matching of the guide inclined plane and the inclined plane I and stretch the spring II.
The power system comprises a motor arranged on a base, an eccentric wheel arranged on the motor and a connecting rod, wherein one end of the connecting rod is hinged with the connecting rod through a pin shaft I, the other end of the connecting rod is hinged with the eccentric wheel through a pin shaft I, and the hinged connection point of the connecting rod and the eccentric wheel is eccentrically arranged relative to the circle center of the eccentric wheel.
In order to reduce the friction force, the lower end of the lifting block is provided with a circular arc-shaped bulge.
In order to facilitate taking and placing of the heat sink, a plurality of pad feet are arranged at the lower end of the base, openings are respectively arranged at the left end and the right end of the clamping groove, and the width of each opening is smaller than that of the clamping groove.
In order to improve the cutting efficiency of the electrode wire, the head end of the cutting blade is provided with a cutting head with a triangular cross section.
In order to prevent the die strip from separating from the positioning groove, the die strip positioning device further comprises a support which is arranged on the workbench and is positioned at the rear end of the positioning groove, a roller is rotatably arranged on the support, and the lower end of the roller is in rolling friction contact with the upper end face of the die strip.
In order to facilitate the operation, the electric kettle also comprises a switch arranged at the upper end of the workbench, and the motor is connected to a power supply through the switch.
A method of recycling an electrode wire, comprising the steps of:
a) inserting heat sinks of a plurality of lasers into clamping grooves in the mold strip;
b) inserting the mould bar into a positioning groove in the workbench;
c) starting the electric heating rod, and heating and melting the indium layers on the surfaces of the heat sinks by the electric heating rod;
d) opening a die strip driving mechanism, and driving the die strip to move from left to right along the positioning groove until the plurality of electrode wires are positioned in front of the cutting piece;
e) the cutting blade driving mechanism drives the cutting blade to move forwards, the cutting blade pushes the electrode wire to be stripped from the insulating sheet on the heat sink, and the stripped electrode wire is pushed forwards by the cutting blade until the electrode wire falls into the storage box;
f) and e) repeating the steps d) to e) until all the electrode wires on the heat sinks in the mould strip are stripped and fall into a storage box.
The invention has the beneficial effects that: the electrical heating stick, the indium layer heating on each heat sink surface is melted to the electrical heating stick, open mould strip actuating mechanism, its drive mould strip is followed the constant head tank and is followed left right side motion, until a plurality of electrode wires are located the dead ahead of cutting piece, cutting piece actuating mechanism drive cutting piece moves forward, the cutting piece promotes the electrode wire and peels off from the insulating piece on the heat sink, the electrode wire after peeling off is promoted forward until dropping into in the receiver by the cutting piece. Adopt mechanical structure, simple structure long service life, the maintenance is maintained conveniently, and the device adopts semi-automatization operation, and production efficiency is high, once can accomplish peeling off of the electrode line on a plurality of heat sinks, and production efficiency has improved tens of times. This device safe and reliable, operator do not contact with heating device in the operation process, have avoided manual operation to cause discomfort and scald phenomenon because of the high temperature, and the electrode wire is peeled off the process and is adopted automatic operation, has avoided causing the arm fish tail phenomenon when manually scraping and getting the electrode wire. The thrust of cutting piece is even to in the whole cutting process, cutting piece not with electrode line direct contact, when having avoided manual cutting, the electrode line damage phenomenon that causes makes the great improvement of the recovery qualification rate of electrode line.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of the present invention with the mold strip removed;
FIG. 3 is a schematic perspective view II of the present invention;
FIG. 4 is a schematic perspective view of the cone portion of the present invention;
FIG. 5 is a schematic perspective view of a stent portion of the present invention;
FIG. 6 is a schematic perspective view of a cutting blade of the present invention;
FIG. 7 is a schematic perspective view of an electrical heating rod according to the present invention;
FIG. 8 is a schematic perspective view of a heat sink portion according to the present invention;
FIG. 9 is a schematic perspective view of a die strip portion of the present invention;
fig. 10 is a schematic perspective view of the present invention with heat sinks filled in the mold strip;
FIG. 11 is a schematic view of the moving state of the mold strip shifted by the shifting claw according to the present invention;
FIG. 12 is a schematic view of the pawl of the present invention retracted relative to the die strip;
in the figure, 1, a base 2, a foot pad 3, an upright post 4, a workbench 5, a storage box 6, a mold strip 7, an electrode wire 8, a motor 9, an eccentric wheel 10, a connecting rod 11, a pin shaft I12, a connecting rod 13, a fixed rod 14, a cone 15, a switch 16, an electric heating rod 17, a long hole I18, a pusher dog 19, a positioning groove 20, a support 21, a roller 22, a support 23, a cutting piece 24, a lifting block 25, a guide rod 26, a spring I27, a spring II 28, a pin shaft II 29, a slope I30, a cutting head 31, a heat sink 32, a clamping groove 33, an opening 35, a round hole 36, a rotating shaft 37, a clamping arm spring 38, a stop 39, a slope II 40, a protrusion 41 and.
Detailed Description
The present invention will be further described with reference to fig. 1 to 12.
A C-mount packaged semiconductor laser electrode wire recovery device comprises: the upper end of the base 1 is vertically provided with a plurality of upright posts 3; the workbench 4 is horizontally arranged at the top end of each upright post 3, and a positioning groove 19 is arranged above the workbench 4 along the length direction of the workbench; the die strip 6 is internally provided with a clamping groove 33 along the length direction, the width of the clamping groove 33 is matched with the width of a heat sink 31 of the laser, a plurality of heat sinks 31 are inserted into the clamping groove 33 side by side, the width of the die strip 6 is matched with the width of the positioning groove 19, and the die strip 6 is horizontally inserted into the positioning groove 19 in a sliding manner; the cutting blade 23 is horizontally arranged at the upper end of the workbench 4, the cutting blade 23 is positioned at the rear end of the positioning groove 19, and the cutting blade driving mechanism is arranged on the workbench 4 and used for driving the cutting blade 23 to move in the front-back direction; a storage box 5 mounted on the table 4 and located at the front end of the positioning groove 19; the electric heating rod 16 is arranged on the workbench 4 and used for heating and melting indium layers on the surfaces of the heat sinks 31 in the die strips 6 and driving the die strips, the die strips 6 are driven to move from left to right along the positioning grooves 19, when the heat sinks 31 on the die strips 6 are right opposite to the cutting sheets 23, the cutting sheet driving mechanism drives the cutting sheets 23 to move forwards, and the cutting sheets 23 push the electrode wires 7 attached to the corresponding heat sinks 31 through the insulating sheets 32 to be stripped and fall into the storage box 5. The electrical heating stick 16, the indium layer heating on each heat sink 31 surface is melted to the electrical heating stick 16, open mould strip actuating mechanism, its drive mould strip 6 is followed constant head tank 19 from the left side right side and is moved, until a plurality of electrode lines 7 are located cutting piece 23 dead ahead, cutting piece actuating mechanism drive cutting piece 23 moves forward, cutting piece 23 promotes electrode line 7 and peels off from insulating piece 32 on heat sink 31, electrode line 7 after peeling off is promoted forward until dropping into in receiver 5 by cutting piece 23. The above operation steps are repeated until all the electrode wires 7 on the heat sinks 31 in the mold strip 6 are peeled off and fall into the storage box 5. This C-mount encapsulation semiconductor laser electrode line recovery unit simple structure, production efficiency are high, convenient operation, safe and reliable, adopt mechanical structure, simple structure long service life, and maintenance is convenient, and the device adopts semi-automatization operation, and production efficiency is high, once can accomplish the peeling off of electrode line 7 on a plurality of heat sinks 31, and production efficiency has improved tens times. This device safe and reliable, operator do not contact with heating device in the operation process, have avoided manual operation to cause discomfort and scald phenomenon because of the high temperature, and electrode line 7 peels off the process and adopts automatic operation, has avoided manual scraping to cause the arm fish tail phenomenon when getting electrode line 7. Cutting blade 23's thrust is even to in the whole cutting process, cutting blade 23 not with electrode line 7 direct contact, when having avoided manual cutting, the electrode line 7 damage phenomenon that causes makes the great improvement of the recovery qualification rate of electrode line.
Example 1:
the mould strip driving mechanism can be a structure which comprises a connecting rod 12 horizontally and slidably arranged on a base 1, a fixed rod 13 vertically arranged on the connecting rod 12, a shifting claw 18 rotatably arranged at the head end of the fixed rod 13 through a rotating shaft 36 and a power system for driving the connecting rod 12 to reciprocate left and right, a long hole I17 is arranged in a positioning groove 19, the long hole I17 at the head end of the shifting claw 18 extends out, the length of the long hole I17 is larger than the distance of the connecting rod 12 moving left and right horizontally, an inclined surface II 39 is arranged at the left end of the shifting claw 18, a stop block 38 and a clamping arm spring 37 are arranged on the fixed rod 13, one end of the clamping arm spring 37 is connected with the fixed rod 13, the other end of the clamping arm spring is connected with the shifting claw 18, a plurality of round holes 35 are arranged at intervals along the length direction at the lower end of the mould strip 6, when the connecting rod 12 moves leftwards, under the guidance of the inclined plane II 39, the pusher 18 rotates through the rotating shaft 36 to be separated from the round hole 35, and the pusher 18 compresses the clamping arm spring 37. The power system drives the connecting rod 12 to reciprocate along the left-right direction, the connecting rod 12 drives the pusher dog 18 to move left and right in the long hole I17 through the fixed rod 13, when the connecting rod 12 moves towards the right side until the pusher dog 18 is positioned at the lower end of a round hole 35 at the lower end of the die strip 6, the pusher dog 18 rotates to be inserted into the round hole 35 under the elastic force of the clamping arm spring 37, at the moment, when the connecting rod 12 continues to move towards the right side, the pusher dog 18 is stopped by the stop block 38, the right side end of the pusher dog is contacted with the round hole 35, so that the die strip 6 is pushed to move towards the right side, when the connecting rod 12 moves towards the left side, the pusher dog 18 moves towards the left side relative to the round hole 35, the inclined plane II 39 at the left side end of the pusher dog is contacted with the round hole 35, under the guidance of the inclined plane II 39, the pusher dog 18 rotates, when the left side of the pusher dog 18 moves to the position right below the next round hole 35, the clamping arm spring 37 releases energy, the pusher dog 18 is driven to rotate again to enter the corresponding round hole 35, the connecting rod 12 can drive the die strip 6 to move towards the left side when moving towards the right again, and the die strip 6 is driven to gradually move transversely towards the right side along the positioning groove 19 through the left-right reciprocating motion of the connecting rod 12 until all the electrode wires 7 on the die strip 6 are stripped.
Example 2:
the cutting blade driving mechanism can be of a structure comprising a guide rod 25 vertically arranged on a base 1, a lifting block 24 slidably sleeved on the guide rod 25, a support 22 arranged at the upper end of a workbench 4 and a spring I26 sleeved on the guide rod 25, wherein one end of the spring I26 is connected with the base 1, the other end of the spring I26 is connected with the lifting block 24, a conical cone 14 is arranged on a connecting rod 12, the cone 14 is positioned under the lifting block 24, long holes II 41 are horizontally arranged at the left end and the right end of the support 22 along the front-back direction respectively, pin shafts II 28 are arranged at the left end and the right end of a cutting blade 23 respectively, the pin shafts II 28 are slidably inserted into the corresponding long holes II 41 at the same side, a spring II 27 is arranged in the long hole II 41, one end of the spring II 27 is connected with the pin shaft II 28, the other end of the spring is connected with the support, the inclined plane I29 is in sliding friction contact with the guide inclined plane, when the connecting rod 12 moves leftwards until the cone 14 is in contact with the lower end of the lifting block 24, the conical surface of the cone 14 drives the lifting block 24 to slide upwards under the guide of the guide rod 25 and stretch the spring I26, and when the lifting block 24 moves upwards, the cutting blade 23 is driven to move towards the front end through the matching of the guide inclined plane and the inclined plane I29 and stretch the spring II 27. The electrode wire 7 is stripped from the heat sink 31 when the cutting blade 23 moves towards the front end, so that the electrode wire 7 is stripped by just driving the cutting blade 23 to move forwards when the connecting rod 12 moves leftwards, namely the die strip 6 stops moving. When the connecting rod 12 moves to the right, the spring I26 pulls the lifting block 24 to move downwards, and the spring II 27 simultaneously drives the cutting blade 23 to retreat back to the initial position.
Example 3:
the power system can be of a structure comprising a motor 8 arranged on the base 1, an eccentric wheel 9 arranged on the motor 8 and a connecting rod 10, wherein one end of the connecting rod 10 is hinged with a connecting rod 12 through a pin shaft I11, the other end of the connecting rod 10 is hinged with the eccentric wheel 9 through a pin shaft I11, and the hinged connection point of the connecting rod 10 and the eccentric wheel 9 is eccentrically arranged relative to the circle center of the eccentric wheel 9. The motor 8 rotates to drive the eccentric wheel 9 to rotate, and since the pin shaft I11 of the connecting rod 10 is hinged with the eccentric wheel 9 under the condition of eccentricity, the other end of the connecting rod 10 drives the connecting rod 12 to slide back and forth in the left-right direction through the pin shaft I11 when the connecting rod 10 rotates along with the eccentric wheel 9.
Example 4:
preferably, the lower end of the lifting block 24 is provided with a circular arc-shaped protrusion 40. Because the bulge 40 is in the circular arc structure, the contact area is effectively reduced when the bulge is in contact with the cone 14, and the reliability and the smoothness of the operation of the equipment are improved.
Example 5:
the lower end of the base 1 is provided with a plurality of foot pads 2, the left end and the right end of the clamping groove 33 are respectively provided with an opening 34, and the width of the opening 34 is smaller than that of the clamping groove 33. Through filling up foot 2 not only conveniently adjust the height of base 1, conveniently adjust base 1 to the horizontality simultaneously, can conveniently hold between the fingers heat sink 31 from opening 34 through setting up opening 34 in the left and right sides both ends of mould strip 6 simultaneously, make things convenient for getting of heat sink 31 to put, further improve the convenience of operation and use.
Example 6:
further, a cutting head 30 having a triangular cross section is provided at the head end of the cutting blade 23. The head end of the cutting head 30 is of a sharp-angled structure, so that the electrode wire 7 on the insulation sheet 32 can be more effectively shoveled down, and the electrode wire 7 can be smoothly peeled off.
Example 7:
and the device also comprises a support 20 which is arranged on the workbench 4 and is positioned at the rear end of the positioning groove 19, a roller 21 is rotatably arranged on the support 20, and the lower end of the roller 21 is in rolling friction contact with the upper end surface of the mould strip 6. The upper end of the die strip 6 is pressed down by the roller 21 while the die strip 6 horizontally slides along the positioning groove 19, preventing the cutting blade 23 from being separated from the positioning groove 19 due to the lateral force received by the die strip 6 when pushing the electrode wire 7.
Example 8:
the device also comprises a switch 15 arranged at the upper end of the workbench 4, and the motor 8 is connected with a power supply through the switch 15. The start and stop of the motor 8 can be conveniently controlled through the switch 15, and the convenience of operation is further improved.
The invention also relates to a method for recycling the electrode wire, which is characterized by comprising the following steps:
a) inserting heat sinks 31 of a plurality of lasers into clamping grooves 33 in the mold strip 6;
b) inserting the mould strip 6 into a positioning groove 19 in the workbench 4;
c) starting the electric heating rod 16, and heating and melting the indium layer on the surface of each heat sink 31 by the electric heating rod 16;
d) the die strip driving mechanism is started, and drives the die strip 6 to move from left to right along the positioning groove 19 until the electrode wires 7 are positioned right in front of the cutting sheet 23;
e) the cutting blade driving mechanism drives the cutting blade 23 to move forwards, the cutting blade 23 pushes the electrode wire 7 to be stripped from the insulating sheet 32 on the heat sink 31, and the stripped electrode wire 7 is pushed forwards by the cutting blade 23 until the electrode wire falls into the storage box 5;
f) and repeating the steps d) to e) until all the electrode wires 7 on the heat sinks 31 in the mold strips 6 are stripped off and fall into the storage box 5.
The method realizes stripping and recycling of the electrode wires 7 on the heat sinks 31 at one time, has high production efficiency, convenient operation and high automation degree, does not need manual contact, and avoids scalding.
Claims (10)
1. A semiconductor laser electrode wire recovery device is characterized by comprising:
the upper end of the base (1) is vertically provided with a plurality of upright posts (3);
the workbench (4) is horizontally arranged at the top end of each upright post (3), and a positioning groove (19) is arranged above the workbench (4) along the length direction of the workbench;
the laser module comprises a die strip (6), wherein a clamping groove (33) is formed in the die strip (6) along the length direction, the width of the clamping groove (33) is matched with the width of a heat sink (31) of a laser, a plurality of heat sinks (31) are inserted into the clamping groove (33) side by side, the width of the die strip (6) is matched with the width of a positioning groove (19), and the die strip (6) is inserted into the positioning groove (19) in a horizontal sliding mode;
the cutting blade (23) is horizontally arranged at the upper end of the workbench (4), the cutting blade (23) is positioned at the rear end of the positioning groove (19), and the cutting blade driving mechanism is arranged on the workbench (4) and used for driving the cutting blade (23) to move in the front-back direction;
the storage box (5) is arranged on the workbench (4) and is positioned at the front end of the positioning groove (19);
an electric heating rod (16) arranged on the workbench (4) and used for heating and melting the indium layer on the surface of each heat sink (31) in the die strip (6) and
mould strip actuating mechanism, its drive mould strip (6) is just to cutting piece (23) along constant head tank (19) from left right side motion, and when a plurality of heat sinks (31) on mould strip (6) were just to cutting piece (23), cutting piece actuating mechanism drive cutting piece (23) move forward, and cutting piece (23) promote to peel off and fall into in receiver (5) through adnexed electrode line (7) of insulating piece (32) on corresponding heat sink (31).
2. The semiconductor laser electrode wire recycling device according to claim 1, wherein: the die strip driving mechanism comprises a connecting rod (12) horizontally and slidably mounted on a base (1), a fixing rod (13) vertically mounted on the connecting rod (12), a pusher dog (18) rotatably mounted at the head end of the fixing rod (13) through a rotating shaft (36) and a power system for driving the connecting rod (12) to reciprocate left and right, a long hole I (17) is formed in a positioning groove (19), a head end long hole I (17) of the pusher dog (18) extends out, the length of the long hole I (17) is larger than the distance between the left and right movement of the connecting rod (12) in the horizontal direction, an inclined plane II (39) is arranged at the left end of the pusher dog (18), a stop block (38) and a clamping arm spring (37) are arranged on the fixing rod (13), one end of the clamping arm spring (37) is connected with the fixing rod (13), the other end of the clamping arm spring is connected with the pusher dog (18), and a plurality, when the connecting rod (12) moves rightwards and the shifting claw (18) is inserted into the round hole (35) and is in a vertical state, the shifting claw (18) is in contact with the stop block (38), when the connecting rod (12) moves leftwards, under the guidance of the inclined plane II (39), the shifting claw (18) rotates to be separated from the round hole (35) through the rotating shaft (36), and the shifting claw (18) compresses the clamping arm spring (37).
3. The semiconductor laser electrode wire recycling device according to claim 2, wherein: the cutting blade driving mechanism comprises a guide rod (25) vertically arranged on a base (1), a lifting block (24) slidably sleeved on the guide rod (25), a support (22) arranged at the upper end of a workbench (4) and a spring I (26) sleeved on the guide rod (25), one end of the spring I (26) is connected with the base (1), the other end of the spring I is connected with the lifting block (24), a conical cone (14) is arranged on a connecting rod (12), the cone (14) is positioned under the lifting block (24), the left end and the right end of the support (22) are respectively and horizontally provided with a long hole II (41) along the front-back direction, the left end and the right end of the cutting blade (23) are respectively provided with a pin shaft II (28), the pin shaft II (28) is slidably inserted in the long hole II (41) corresponding to the same side, the spring II (27) is arranged in the long hole II (41), and one end of the, the other end of the lifting block is connected with a support (22), the upper end face of the lifting block (24) is a guide inclined face, the lower end face of the cutting blade is an inclined face I (29), the inclined face I (29) is in sliding friction contact with the guide inclined face, when the connecting rod (12) moves leftwards to the lower end of the cone (14) and the lifting block (24), the conical face of the cone (14) drives the lifting block (24) to slide upwards under the guide of the guide rod (25) and stretch the spring I (26), and when the lifting block (24) moves upwards, the cutting blade (23) is driven to move forwards through the guide inclined face and the inclined face I (29) and stretch the spring II (27).
4. The semiconductor laser electrode wire recycling device according to claim 2, wherein: the power system comprises a motor (8) arranged on a base (1), an eccentric wheel (9) arranged on the motor (8) and a connecting rod (10), wherein one end of the connecting rod (10) is hinged to a connecting rod (12) through a pin shaft I (11), the other end of the connecting rod (10) is hinged to the eccentric wheel (9) through a pin shaft I (11), and the hinged connection point of the connecting rod (10) and the eccentric wheel (9) is eccentrically arranged relative to the circle center of the eccentric wheel (9).
5. The semiconductor laser electrode wire recycling device according to claim 2, wherein: the lower end of the lifting block (24) is provided with a circular arc-shaped bulge (40).
6. The semiconductor laser electrode wire recycling device according to claim 1, wherein: the lower end of the base (1) is provided with a plurality of foot pads (2), openings (34) are respectively arranged at the left end and the right end of the clamping groove (33), and the width of each opening (34) is smaller than that of the clamping groove (33).
7. The semiconductor laser electrode wire recycling device according to claim 1, wherein: the head end of the cutting blade (23) is provided with a cutting head (30) with a triangular cross section.
8. The semiconductor laser electrode wire recycling device according to claim 1, wherein: still including installing support (20) on workstation (4) and being located constant head tank (19) rear end, rotate on support (20) and install gyro wheel (21), the lower extreme of gyro wheel (21) and the up end rolling friction contact of mould strip (6).
9. The semiconductor laser electrode wire recycling device according to claim 1, wherein: the automatic welding machine is characterized by further comprising a switch (15) arranged at the upper end of the workbench (4), and the motor (8) is connected to a power supply through the switch (15).
10. A method for recycling an electrode wire of a semiconductor laser device by using the electrode wire recycling device of claim 1, which is characterized by comprising the following steps:
a) inserting heat sinks (31) of a plurality of lasers into clamping grooves (33) in the die strip (6);
b) inserting the mould strip (6) into a positioning groove (19) in the workbench (4);
c) starting the electric heating rod (16), and heating and melting the indium layers on the surfaces of the heat sinks (31) by the electric heating rod (16);
d) the die strip driving mechanism is started, and drives the die strips (6) to move from left to right along the positioning grooves (19) until the electrode wires (7) are positioned right in front of the cutting sheets (23);
e) the cutting blade driving mechanism drives the cutting blade (23) to move forwards, the cutting blade (23) pushes the electrode wire (7) to be stripped from an insulating sheet (32) on the heat sink (31), and the stripped electrode wire (7) is pushed forwards by the cutting blade (23) until the electrode wire falls into the storage box (5);
f) and repeating the steps d) to e) until all the electrode wires (7) on the heat sinks (31) in the mould strips (6) are stripped and fall into the storage box (5).
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