CN111313937A - Communication module and communication system - Google Patents
Communication module and communication system Download PDFInfo
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- CN111313937A CN111313937A CN201811519263.8A CN201811519263A CN111313937A CN 111313937 A CN111313937 A CN 111313937A CN 201811519263 A CN201811519263 A CN 201811519263A CN 111313937 A CN111313937 A CN 111313937A
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- 238000004891 communication Methods 0.000 title claims abstract description 186
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 6
- 230000010355 oscillation Effects 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
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Abstract
The application discloses communication module, communication module includes: a substrate; a communication chip disposed on the substrate; the first communication interface and the second communication interface are positioned at the edge of the substrate, the data pins and the control pins of the first communication interface and the second communication interface are correspondingly and electrically connected with the data pins and the control pins of the communication chip, the power supply pin of the second communication interface is electrically connected with the power supply pin of the communication chip, and the first communication interface or the second communication interface is connected with processors of different types of interfaces to control the communication chip to receive or transmit signals.
Description
Technical Field
The present application relates to the field of communications technologies, and in particular, to a communication module and a communication system.
Background
With the development of the internet and intelligent hardware, a wide variety of intelligent hardware products are available in the market, such as: echo sound, intelligent boxes, smart homes, and the like; WIFI and Bluetooth technologies are used for the products, but WIFI/Bluetooth modules in the market are different, communication interfaces are different, and therefore users are different in scheme configuration performance.
Disclosure of Invention
The technical problem that this application mainly solved provides a communication module and communication system to make the miniaturization of module volume, integrated level height, function comprehensive, interface abundant and save the cost.
In order to solve the technical problem, the application adopts a technical scheme that:
there is provided a communication module for connecting processors of different types of interfaces, the communication module comprising:
a substrate;
the communication chip is arranged on the substrate and comprises a data pin, a control pin and a power supply pin;
a plurality of first communication interfaces and a plurality of second communication interfaces, wherein each first communication interface comprises a data pin and a control pin, each second communication interface comprises a data pin, a control pin and a power pin, the first communication interfaces are arranged close to and at the edge of the substrate, the second communication interfaces are arranged close to and at the edge of the substrate, the data pins of the first and second communication interfaces are correspondingly and electrically connected with the data pins of the communication chip, the control pins of the first and second communication interfaces are electrically connected with the control pin of the communication chip correspondingly, the power pin of the second communication interface is electrically connected with the power pin of the communication chip, and the processor of different types of interfaces is connected through the first communication interface or the second communication interface so as to control the communication chip to receive or transmit signals through the processor.
In order to solve the above technical problem, another technical solution adopted by the present application is:
the communication module is electrically connected with the processor, and the processor outputs a control signal to control the communication module to communicate with the Bluetooth unit and the WIFI unit.
The beneficial effect of this application is: be different from prior art, this application makes through setting up a plurality of first communication interfaces and a plurality of second communication interface at the edge of the base plate that carries communication chip first communication interface with communication chip's data pin, control pin correspond the electricity and connect, second communication interface with communication chip's data pin, control pin and power pin correspond the electricity and connect, through first communication interface or the treater of second communication interface connection different grade type interface, with pass through processor control communication chip receives or transmits signal, and then realizes the purpose that the module volume is miniaturized, the integrated level is high, the function is comprehensive, the interface is abundant and save cost.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of a communication module of the present invention;
fig. 2 is a schematic structural diagram of a second embodiment of the communication module of the present invention;
fig. 3 is a schematic structural diagram of a third embodiment of a communication module of the present invention;
fig. 4 is a schematic diagram of the architecture of the communication system of the present invention.
Detailed Description
In order to make the purpose, technical solution and technical effects of the present application more clear and clearer, the present application is further described in detail below, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Please refer to fig. 1, which is a schematic structural diagram of a communication module according to a first embodiment of the present invention. The communication module 100 includes:
a substrate 10;
the communication chip 20 is disposed on the substrate 10, and the communication chip 20 includes a plurality of data pins 21, a plurality of control pins 22, and a plurality of power pins 23, only some of which are shown in this application;
a plurality of first communication interfaces 31 and a plurality of second communication interfaces 32, each first communication interface 31 includes a plurality of data pins 311 and a plurality of control pins 312, only some data pins and control pins are shown in the present application, each second communication interface 32 includes a plurality of data pins 321, a plurality of control pins 322 and a plurality of power pins 323, only some data pins and control pins are shown in the present application, the plurality of first communication interfaces 31 are disposed near and at the edge of the substrate 10, the plurality of second communication interfaces 32 are disposed near and at the edge of the substrate 10, the data pins 311 of the first communication interfaces 31 and the data pins 321 of the second communication interfaces 32 are electrically connected with the data pins 21 of the communication chip 20 correspondingly, the control pins 312 of the first communication interfaces 31 and the control pins 322 of the second communication interfaces 32 are electrically connected with the control pins 22 of the communication chip 20 correspondingly, the power pin 323 of the second communication interface 32 is electrically connected to the power pin 23 of the communication chip 20, and the processor 40 of different types of interfaces is connected through the first communication interface 31 or the second communication interface 32, so as to control the communication chip 20 to receive or transmit signals through the processor 40.
The communication chip 20 is an integrated chip integrating a WIFI function and a bluetooth function, the WIFI function conforms to the 802.11b/g/n1T1R protocol, the bluetooth function conforms to the 2.1/4.2 protocol, and the communication chip 20 is located at the central position of the substrate 10.
In this embodiment, the communication chip 20 adopts an integrated chip integrating WIFI and bluetooth, and the integration level is high, so that the communication chip 20 occupies a smaller space on the substrate 10.
Wherein, first communication interface 31 is the UART interface, second communication interface 32 is PCM interface and SDIO interface, the UART interface is high-speed HS-UART interface, the SDIO interface is SDIO1.1 or 2.0 interface, in this embodiment, the UART interface is located the left edge of base plate 10, the PCM interface is located the top edge of base plate 10, SDIO is located the right edge of base plate 10.
The communication module 100 supports SDIO 1.1/2.0 interfaces, the clock rate is up to 100MHz (SDR50/DDR50), the configurable baud rate of HS-UART interfaces is supported, a baseband physical layer, a CMOS MAC address, an 802.11n protocol is supported, a 2.4GHz frequency band is provided, the physical transceiving rate under a 20MHz bandwidth is 72Mbps, the physical transceiving rate under a 40MHz bandwidth is 150Mbps, an 802.11b/g/n/e mode is supported, 802.11i (WPA, WPA2) shared keys and paired identity authentication services are supported, Bluetooth 2.1+ EDR and 4.2 are supported, Bluetooth 4.0 UART with low power consumption is supported, a high-speed HS-interface is supported, and a PCM interface is supported.
In this embodiment, the substrate 10 has a size of 20.5 × 12mm, and the substrate 10 is a printed circuit board.
In this embodiment, the communication module 100 uses the communication chip 10 as a core, and by extracting common hardware function points of the processor 40 on the market, main stream interfaces such as SDIO, UART, and PCM are reserved on the substrate 10 of the communication module 100, so as to meet the standard that most users select the interface of the processor 40, so that the communication module 100 is standardized, rich in interfaces, comprehensive in functions, and cost-saving, and the interfaces are arranged in a layout plan, and the same types of interfaces are arranged together and directly connected with the WIFI/bluetooth integrated chip correspondingly, so that the functions of the communication chip 10 are integrated on a PCBA substrate with a size of 20.5 × 12mm, thereby simplifying the circuit design on the PCBA substrate, saving space, and facilitating subsequent external connection of the communication module 100, and realizing the miniaturization of the module.
In the communication module 100 in this embodiment, SDIO, UART and PCM interfaces are reserved on a substrate 10, and the same type of interfaces are arranged together, specifically, the UART interfaces are all arranged at the left edge of the substrate 10, the PCM interfaces are all arranged at the upper edge of the substrate 10, the SDIO interfaces are all arranged at the right edge of the substrate 10, and interfaces with the same pins are adjacently arranged, for example, the SDIO interfaces and the PCM interfaces are adjacently arranged, and are arranged at positions close to corresponding pins in the communication chip 20, so that the corresponding pins are connected, as shown in fig. 1, a data pin 311 of the UART interface is electrically connected with a data pin 21 of the communication chip 20, and a control pin 312 of the UART interface is electrically connected with a control pin 22 of the communication chip 20; the data pins 321 of the SDIO interface and the PCM interface are electrically connected with the data pins 21 of the communication chip 20, the control pins 322 of the SDIO interface and the PCM interface are electrically connected with the control pins 22 of the communication chip 20, the power pins 323 of the SDIO interface and the PCM interface are electrically connected with the power pins 23 of the communication chip 20, the SDIO interface and the PCM interface are correspondingly arranged at positions close to the pins of the communication chip 20, the pins of the SDIO interface and the PCM interface are correspondingly and directly electrically connected with the pins of the communication chip 20, so that wiring is simplified, space is saved, meanwhile, different types of interfaces can be respectively connected with different processors 40, and thus, the communication module 100 can realize connection aiming at different processors 40, and the use of the module is expanded.
The communication module 100 further includes a crystal oscillation unit 50, the communication chip 20 further includes a pulse pin 24, and the crystal oscillation unit 50 is electrically connected to the pulse pin 24 of the communication chip 20, and is configured to receive a pulse signal from the crystal oscillation unit 50.
Please refer to fig. 2, which is a schematic structural diagram of a communication module according to a second embodiment of the present invention. Compared to the first embodiment (fig. 1), the communication module 100 of the present embodiment further includes:
and a power conversion unit 26 in the communication chip 20 for converting a voltage received from an external circuit into a voltage required by the communication chip 20 and converting a voltage of the communication chip 20 into a voltage required by the external circuit.
The communication module 100 further includes a power filter unit 60 electrically connected to the power pin 323 of the second communication interface 32 and the power pin 23 of the communication chip 20, the power pin 23 of the communication chip 20 is internally connected to the voltage conversion unit 26, a voltage received from an external circuit is converted into a voltage required by the communication chip 20 through the voltage conversion unit 26 after passing through the unit filter unit 60, and the voltage of the communication chip 20 is converted into a voltage required by the external circuit after passing through the power filter unit 60 by the voltage conversion unit 26.
In this embodiment, the power conversion unit 26 has a power conversion function, so that strict requirements are required for layout and wiring of the corresponding power filter unit 60 on a peripheral circuit of the communication module 100, and the power filter unit 60 is electrically connected to the power pins 323 of the PCM interface and the SDIO interface and the power pins 23 of the communication chip 20 to transmit power signals, and the layout and wiring of the power filter unit 60 are also planned after the power filter unit 60 is correspondingly connected to the PCM interface and the SDIO interface through layout design of the arrangement of the PCM interface and the SDIO interface, so that the communication module 100 is miniaturized.
On the basis of the first embodiment (fig. 1) of the communication module 100 of the present application, the power filter unit 60 is disposed near the interface with power pins, that is, disposed near the PCM interface and the SDIO interface, and the power filter unit 60 is electrically connected to the PCM interface and the power pin 323 of the SDIO interface, so as to simplify the wiring design by setting the manner of direct connection nearby, thereby reducing the occupied space on the substrate 10 and realizing the miniaturized design of the communication module 100.
Please refer to fig. 3, which is a schematic structural diagram of a communication module according to a third embodiment of the present invention. Compared to the second embodiment (fig. 2), the communication module 100 of the present embodiment further includes:
an on-board antenna 70, the communication chip 20 further comprises an input/output pin 27, the on-board antenna 70 is electrically connected with the input/output pin 27 of the communication chip 20, and the on-board antenna 70 is located at the bottom edge of the substrate 10.
In this embodiment communication module 100 highly integrates WIFI, bluetooth in an organic whole, reserves interfaces such as SDIO and UART, PCM, sets up the interface of the same type together, if set up PCM interface and SDIO interface together, because they all include data pin, control pin and power pin, need not the extension of complicated peripheral hardware circuit, and the interface of institute different grade type corresponds with WIFI bluetooth integrated chip and directly links, through simple configuration, realizes WIFI bluetooth integrated chip and peripheral circuit's interconnected function, and integrate on the base plate 10 board-mounted antenna 70 optimizes layout design on the base plate 10 is in order to promote communication module 100's working property, further makes communication module 100 miniaturizes.
Please refer to fig. 4, which is a schematic structural diagram of a communication system according to the present invention. The communication system 200 includes a bluetooth unit 80, a WIFI unit 90, a processor 40 and the communication module 100 according to any of the above embodiments, the communication module 100 is electrically connected to the processor 40, and the processor 40 outputs a control signal to control the communication module 100 to communicate with the bluetooth unit 80 and the WIFI unit 90.
The bluetooth unit 80 is wirelessly connected to the communication chip 20, and is configured to transmit signals according to a bluetooth protocol; the WIFI unit 90 is wirelessly connected to the communication chip 20, and is configured to transmit signals through a wireless network. In the present application, the communication module 20 is a wireless communication module having a bluetooth function and a WIFI function, and can be applied to any electronic device that needs to realize wireless communication through bluetooth and WIFI, so as to communicate with the electronic device provided with the bluetooth unit 80 and the WIFI unit.
Different from the prior art, the WIFI/Bluetooth integrated chip comprises a plurality of first communication interfaces and a plurality of second communication interfaces which are arranged at the edge of a substrate loaded with the WIFI/Bluetooth integrated chip, the WIFI/Bluetooth integrated chip further comprises a power supply conversion unit, the first communication interfaces are correspondingly and electrically connected with data pins and control pins of the WIFI/Bluetooth integrated chip, the second communication interfaces are correspondingly and electrically connected with data pins, control pins and power pins of the WIFI/Bluetooth integrated chip, the power supply filtering unit is electrically connected with the WIFI/Bluetooth integrated chip and power pins of the second interface, the first communication interfaces or the second communication interfaces are connected with processors of different types of interfaces, so that the processors control the WIFI/Bluetooth integrated chip to receive or transmit signals, and a board-mounted antenna is integrated on the substrate to further realize miniaturization of a communication module, High integration level, comprehensive functions, rich interfaces and cost saving.
The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. A communication module for interfacing processors of different types of interfaces, the communication module comprising:
a substrate;
the communication chip is arranged on the substrate and comprises a data pin, a control pin and a power supply pin;
a plurality of first communication interfaces and a plurality of second communication interfaces, wherein each first communication interface comprises a data pin and a control pin, each second communication interface comprises a data pin, a control pin and a power pin, the first communication interfaces are arranged close to and at the edge of the substrate, the second communication interfaces are arranged close to and at the edge of the substrate, the data pins of the first and second communication interfaces are correspondingly and electrically connected with the data pins of the communication chip, the control pins of the first and second communication interfaces are electrically connected with the control pin of the communication chip correspondingly, the power pin of the second communication interface is electrically connected with the power pin of the communication chip, and the processor of different types of interfaces is connected through the first communication interface or the second communication interface so as to control the communication chip to receive or transmit signals through the processor.
2. A telecommunications module according to claim 1, wherein the substrate has a size of 20.5 x 12 mm.
3. The communication module of claim 1, wherein the communication chip is an integrated chip integrating a WIFI function and a bluetooth function, the WIFI function conforms to the 802.11b/g/n1T1R protocol, the bluetooth function conforms to the 2.1/4.2 protocol, and the communication chip is located at a central position of the substrate.
4. The communication module of claim 1, wherein the first communication interface is a UART interface, the second communication interface is a PCM interface and/or an SDIO interface, the UART interface is a high-speed HS-UART interface, the SDIO interface is an SDIO1.1 or 2.0 interface, the UART interface is located at a left edge of the substrate, the PCM interface is located at an upper edge of the substrate, and the SDIO is located at a right edge of the substrate.
5. The communication module of claim 4, further comprising a crystal oscillation unit, wherein the communication chip further comprises a pulse pin, and wherein the crystal oscillation unit is electrically connected to the pulse pin of the communication chip for receiving a pulse signal from the crystal oscillation unit.
6. The communication module according to claim 2, wherein the communication chip includes a power conversion unit for converting a voltage received from an external circuit into a voltage required by the communication chip and converting the voltage of the communication chip into a voltage required by the external circuit.
7. The communication module of claim 6, further comprising a power filter unit electrically connected to the power pin of the second communication interface and the power pin of the communication chip.
8. The communication module of claim 1, further comprising an on-board antenna, wherein the communication chip further comprises input and output pins, wherein the on-board antenna is electrically connected to the input and output pins of the communication chip, and wherein the on-board antenna is located at a bottom edge of the substrate.
9. The communication module of claim 1, wherein the substrate is a printed circuit board.
10. A communication system, comprising a Bluetooth unit, a WIFI unit, a processor and the communication module of any one of claims 1 to 9, wherein the communication module is electrically connected with the processor, and the processor outputs a control signal to control the communication module to communicate with the Bluetooth unit and the WIFI unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811519263.8A CN111313937A (en) | 2018-12-12 | 2018-12-12 | Communication module and communication system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811519263.8A CN111313937A (en) | 2018-12-12 | 2018-12-12 | Communication module and communication system |
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| CN111313937A true CN111313937A (en) | 2020-06-19 |
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| CN201811519263.8A Pending CN111313937A (en) | 2018-12-12 | 2018-12-12 | Communication module and communication system |
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| CN202798691U (en) * | 2012-06-25 | 2013-03-13 | 青岛海信移动通信技术股份有限公司 | Modular structure of WiFi (wireless fidelity) circuit and mobile terminal |
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Application publication date: 20200619 |