CN111313655A

CN111313655A - Voltage regulation module

Info

Publication number: CN111313655A
Application number: CN201910900102.1A
Authority: CN
Inventors: 熊雅红; 金达; 宿清华
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2018-12-12
Filing date: 2019-09-23
Publication date: 2020-06-19
Anticipated expiration: 2039-09-23
Also published as: CN111313655B

Abstract

The invention provides a voltage regulating module, which comprises a first printed circuit board assembly and a magnetic core assembly. The first printed circuit board assembly comprises a first printed circuit board, a plurality of switch circuits and a plastic package layer, wherein the switch circuits are arranged on the first surface of the first printed circuit board, and the plastic package layer is arranged on the first surface and covers the switch circuits; the magnetic core assembly is adjacent to the second surface of the first printed circuit board and comprises a magnetic core part and at least one first U-shaped copper column, the magnetic core part is provided with a plurality of holes, the at least one first U-shaped copper column penetrates through the corresponding two holes to form at least two inductors, and the first end of each inductor is connected with the corresponding switch circuit in series to form a phase circuit.

Description

Voltage regulation module

Technical Field

The present invention relates to a voltage regulation module, and more particularly, to a voltage regulation module capable of reducing loss, increasing heat dissipation efficiency, increasing voltage resistance, providing more output capacitors, and/or reducing size.

Background

Referring to fig. 1A and 1B, fig. 1A is a schematic structural diagram of an electronic device according to a first prior art, and fig. 1B is a schematic structural diagram of a voltage regulation module shown in fig. 1A. As shown in fig. 1A and 1B, a first electronic device 1 of the prior art includes a Central Processing Unit (CPU) 11, a voltage regulating module 12 and a system board 13. The voltage regulating module 12 is configured to convert the received input voltage into a regulated voltage and provide the regulated voltage to the central processing unit 11, and the voltage regulating module 12 and the central processing unit 11 are both disposed on the first surface of the system board 13, and in addition, in order to meet the requirement of dynamic switching of the load, an output end of the voltage regulating module 12 is close to a power supply input end of the central processing unit 11.

In addition, the voltage regulation module 12 further includes an output capacitor 14, a printed circuit board (pcb) 15, and a magnetic component 16. The output capacitor 14 is disposed on a second surface of the system board 13 opposite to the first surface, and is adjacent to a power supply input terminal of the cpu 11. The magnetic assembly 16 is disposed on the printed circuit board 15, and a switch assembly may be disposed in a gap between the printed circuit board 15 and the magnetic assembly 16. The printed circuit board 15 is disposed on the first surface of the system board 13, so that the heat generated by the voltage regulating module 12 can be transmitted to the system board 13 through the printed circuit board 15, and then dissipated by a heat dissipating system (not shown) of the system board 13.

However, as the current required by the cpu 11 is larger and smaller, the size of the electronic device is smaller and smaller, and the cpu 11 and the voltage regulation module 12 shown in fig. 1A cannot meet the requirement of dynamic load switching. Please refer to fig. 2, which is a schematic structural diagram of an electronic device according to a second prior art. As shown in the figure, in order to reduce the volume of the electronic device and effectively improve the dynamic switching performance of the voltage regulating module, the second electronic device 1' of the prior art changes the voltage regulating module 12 to be disposed on the second surface of the system board 13, that is, the output capacitor 14 is originally placed at the position of fig. 1A, so that the voltage regulating module 12 and the cpu 11 are located on the opposite surface of the system board 13, and accordingly, the arrangement of the internal components of the voltage regulating module 12 is also adjusted, so that the output capacitor is disposed in the voltage regulating module 12 instead of the second surface where the system board 13 is originally disposed, and thus, the volume of the electronic device 1' can be effectively reduced, and because the output capacitor 14 is placed at the output end of the voltage regulation module 12 and the power supply input end of the central processing unit 11, the dynamic switching performance of the voltage regulation module 12 can be effectively improved.

Although the voltage regulation module of the second prior art electronic device can effectively improve the dynamic switching performance of the voltage regulation module 12, there are still many problems to be overcome. First, the first problem and the second problem are that the first side of the voltage regulating module needs to be welded to the system board, and the second side of the voltage regulating module is fixed to the casing of the electronic device through the heat sink, the spring screw, and the like, so that the voltage regulating module faces the first problem, that is, the heat energy cannot be effectively transmitted to the casing of the electronic device to be dissipated by the casing, and furthermore, the second problem that the voltage regulating module faces the second problem, that is, the pressure of the heat sink and the spring screw on the voltage regulating module cannot be effectively increased. The third problem is that because the output capacitor is disposed in the voltage regulating module instead, and the printed circuit board of the voltage regulating module usually includes a plurality of ball grid arrays, the reliability of the product is affected by the fact that the ball grid arrays may crack or drop tin due to uneven stress, so that a larger space needs to be provided on the surface of the printed circuit board of the voltage regulating module to improve the stress condition of the ball grid arrays, and thus, the setting space of the output capacitor is limited, and the voltage regulating module cannot set more output capacitors according to actual requirements. The fourth problem is that there are components for transmitting signals in the voltage regulating module, such as a signal connection portion composed of a plurality of conductive pins, wherein the plurality of conductive pins of the signal connection portion are inserted on the printed circuit board of the voltage regulating module, but because the spacing between the conductive pins of the signal connection portion is large, the number of conductive pins that can be placed on the same area is small, so the distribution density of the conductive pins is small, and because the sectional area of each conductive pin is small, the reliability of the conductive pins in the process of insertion is poor, and in addition, the tin connection between the conductive pins is also easy to short circuit.

Therefore, there is a need to develop a voltage regulation module to solve the problems of the prior art.

Disclosure of Invention

The present invention is directed to a voltage regulation module, which can effectively transfer heat energy to a casing of an electronic device to dissipate heat via the casing, and effectively improve the ability of the voltage regulation module to bear pressure from a heat sink and a spring screw.

It is still another object of the present invention to provide a voltage regulating module, which can provide space for disposing output capacitors effectively when a ball grid array is disposed on a printed circuit board, so as to dispose more capacitors.

Another objective of the present invention is to provide a voltage regulation module, which utilizes a conductive printed circuit board and conductive fingers disposed on the conductive printed circuit board to replace the conductive pins used for transmitting signals in the prior art, so that the distribution density of the pins formed by the conductive fingers can be increased, thereby reducing the size of the voltage regulation module, increasing the power density of the voltage regulation module, and obtaining more space for placing other discrete devices.

To achieve the above objective, a preferred embodiment of the present invention provides a voltage regulating module, which includes a first printed circuit board assembly and a magnetic core assembly. The first printed circuit board assembly comprises a first printed circuit board, a plurality of switch circuits and a plastic package layer, wherein the switch circuits are arranged on the first surface of the first printed circuit board, and the plastic package layer is arranged on the first surface and covers the switch circuits. The magnetic core assembly is adjacent to the second surface of the first printed circuit board and comprises a magnetic core part and at least one first U-shaped copper column, the magnetic core part is provided with a plurality of holes, the at least one first U-shaped copper column penetrates through the corresponding two holes to form at least two inductors, and the first end of each inductor is connected with the corresponding switch circuit in series to form a phase circuit.

The voltage regulation module has the advantages and positive effects that: the invention provides a voltage regulating module, which forms an inductor by a first U-shaped copper column penetrating through a magnetic core part, and the copper column has good supporting force and thermal conductivity, so that the capacity of the voltage regulating module for bearing the pressure from a shell of an electronic device is improved, and the heat generated by the inductor is quickly and effectively conducted by utilizing the good thermal conductivity of copper, so that the thermal resistance in a heat conduction path can be reduced.

On the other hand, the output capacitor of the voltage regulating module is embedded in the second printed circuit board or arranged on the second printed circuit board in a plastic package mode, so that the area of a bonding pad on the second printed circuit board component welded with the magnetic core component can be increased, the ball grid array on the second printed circuit board is uniformly stressed, the reliability of a product is improved, and meanwhile, more output capacitors can be arranged.

On the other hand, because the signal connecting part of the voltage regulating module comprises the printed circuit board for conducting connection with a plurality of conductive fingers and a plurality of surface pins, when the signal connecting part is welded with the welding pad of the first printed circuit board assembly or the second printed circuit board assembly, soldering tin can climb tin through the side routing, the possibility that the soldering tin spreads to the adjacent pins is avoided, the short circuit of the two pins with the tin is effectively avoided, the space between the adjacent pins of the signal connecting part can be reduced, the distribution density of the pins can be improved, the volume of the whole voltage regulating module is further reduced, and the power density of the voltage regulating module is improved.

Drawings

FIG. 1A is a schematic structural diagram of a first prior art electronic device;

FIG. 1B is a schematic diagram of the voltage regulation module shown in FIG. 1A;

FIG. 2 is a schematic structural diagram of an electronic device according to a second prior art;

FIG. 3A is a schematic structural diagram of a voltage regulation module according to a first preferred embodiment of the present invention;

FIG. 3B is a schematic diagram of another view of the voltage regulation module shown in FIG. 3A;

FIG. 3C is a cross-sectional view of the first printed circuit board layer shown in FIGS. 3A and 3B;

FIG. 3D is a partial schematic view of the components of the first surface of the first PCB shown in FIGS. 3A and 3B;

FIG. 4 is an equivalent circuit diagram of the voltage regulation module shown in FIG. 3A;

FIG. 5 is a schematic cross-sectional view of the second PCB with the output capacitor of FIG. 4 embedded therein;

fig. 6 is a schematic cross-sectional structure view of the second printed circuit board when the output capacitor shown in fig. 4 is disposed on the second printed circuit board in a plastic package manner;

FIG. 7 is a schematic cross-sectional view of a second PCB with the output capacitor of FIG. 4 embedded therein;

FIG. 8 is a schematic structural view of the magnetic core shown in FIGS. 3A and 3B;

FIG. 9A is a schematic structural diagram of a voltage regulation module according to a second preferred embodiment of the present invention;

FIG. 9B is a schematic diagram of another view of the voltage regulation module shown in FIG. 9A;

fig. 10 is an enlarged schematic plan view of the signal connection portion shown in fig. 3A.

The reference numbers are as follows:

1. 1' electronic device

11 central processing unit

12. 3: voltage regulation module

13 system board

14 output capacitance

15 printed circuit board

16 magnetic component

30 driver MOSFET unit

L is output inductance

Cin input capacitance

Cout output capacitance

SW first terminal

Positive input terminal of Vin +

Vin-negative input terminal

Vo + positive output end

Vo negative output terminal

40 control circuit

PWM1, PWM2, PWM3, PWM4 pulse width control signal

50 first printed circuit board assembly

60 magnetic core assembly

70 second printed circuit board assembly

501 first printed circuit board

502 first plastic packaging layer

50a first surface

503 outer surface

P1 first pad

P2 second pad

SW1, SW2, SW3, SW4, SW5, SW6, SW7, SW8

511 a through hole

512 blind hole

610 magnetic core part

621. 623, 625 and 627, a first U-shaped copper column

703 second printed circuit board

P4 fourth pad

P5 fifth pad

P6a, P6b, P6c, P6d sixth pad

711 blind hole

B ball grid array

70a first surface

70b second surface

723 substrate

724 interfacial layer

731 first plating layer

732 second electroplated layer

733 plural first insulating layers

734. multiple second insulating layers

727 bonding pad

725. 725' first conductive via

726' second conductive via

771 copper block

704 second plastic packaging layer

611. 613, 615 and 617 magnetic core unit

811. 813, 815, 817 holes

641. 642, 643, 644, 645, 646, 647, 648 top surface

651. 653, 655, 657 bottom face

831. 832, 833 oblique line region

841. 842, 843, 844 second magnetic force line overlapping region

801. 802, 803, 804 non-magnetic line of force overlap region

821. 822, 823, 824, 825, 826, 827, 828 air gap

602 third U-shaped copper

603 the second U-shaped copper column

601 signal connection part

662 printed circuit board for connecting

561. 761 bonding pad

663 conducting finger

664 feet-sticking on surface

Detailed Description

Some exemplary embodiments that embody features and advantages of the invention will be described in detail in the description that follows. It is to be understood that the invention is capable of modification in various ways without departing from the scope of the invention, and that the description and drawings are to be regarded as illustrative in nature and not as restrictive.

Referring to fig. 3A, fig. 3B and fig. 4, wherein fig. 3A is a schematic structural diagram of a voltage regulation module according to a first preferred embodiment of the present invention, fig. 3B is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 3A, and fig. 4 is an equivalent circuit diagram of the voltage regulation module shown in fig. 3A. As shown in the figure, the voltage regulation module 3 of the present embodiment can be applied in an electronic device, wherein in order to meet the large current requirement of a central processing unit in the electronic device, the voltage regulation module 3 can be, for example, a multi-phase buck conversion circuit, so as to effectively increase the output current capability of the voltage regulation module 3. In the circuit structure, the voltage regulation module 3 includes a plurality of switch circuits, such as a Driver and Metal-Oxide-Semiconductor Field-Effect Transistor (dr) unit 30 (hereinafter referred to as dr. mos30), a plurality of output inductors L, at least one input capacitor Cin, and at least one output capacitor Cout.

Each of the dr, mos30 is connected in series to the first end SW of the corresponding inductor L to form a one-phase Buck circuit, so as shown in fig. 4, since the voltage regulation module 3 includes a first-phase Buck circuit to an eighth-phase Buck circuit from top to bottom, the number of the dr, mos30 and the inductor L is eight, the first ends of the eight-phase Buck circuits are electrically connected in parallel and then electrically connected to the input capacitor Cin of the voltage regulation module 3 to form the input end (including the positive input end Vin + and the negative input end Vin-) of the voltage regulation module 3, and the second ends of the eight-phase Buck circuits (i.e., the second ends of each of the inductors L) are electrically connected in parallel and then electrically connected to the output capacitor Cout to form the output end (including the positive output end Vo + and the negative output end Vo-, wherein the negative input end Vin-is short-circuited with the negative output end Vo-) of the voltage regulation module 3. A first terminal of the output capacitor Cout may constitute a positive output Vo + of the voltage regulating module 3, and a second terminal of the output capacitor Cout may constitute a negative output Vo-of the voltage regulating module 3. The first end of the input capacitor Cin is electrically connected to the positive input terminal Vin + of the voltage regulation module 3, and the second end of the input capacitor Cin is electrically connected to the negative input terminal Vin-of the voltage regulation module 3.

In some embodiments, the dr.mos30 includes a transistor switch and a driver for driving the transistor switch, and the dr.mos30 includes a heat dissipation surface for single-sided heat dissipation. In addition, the voltage regulating module 3 further includes a control circuit 40, the control circuit 40 generates four sets of pulse width control signals PWM1, PWM2, PWM3 and PWM4 by sampling the output voltage of the voltage regulating module 3 and the output current of each phase Buck circuit, wherein two adjacent sets of pulse width control signals are out of phase by 90 degrees, each set of pulse width control signals controls the adjacent two-phase Buck circuit, such as the pulse width control signal PWM1 is used to control the first phase Buck circuit and the second phase Buck circuit, the pulse width control signal PWM2 is used to control the third phase Buck circuit and the fourth phase Buck circuit, the pulse width control signal PWM3 is used to control the fifth phase Buck circuit and the sixth phase Buck circuit, and the pulse width control signal PWM4 is used to control the seventh phase Buck circuit and the eighth phase Buck circuit.

In practical structure, in order to enhance the ability of the voltage regulating module 3 to bear the chassis pressure from the electronic device and to enable the voltage regulating module 3 to effectively conduct heat energy to the chassis or the heat sink of the electronic device, the voltage regulating module 3 may include a three-layer structure of more than two layers, such as the first printed circuit board assembly 50, the magnetic core assembly 60 and the second printed circuit board assembly 70 shown in fig. 3A and 3B. The first printed circuit board assembly 50 includes a first printed circuit board 501 and a first molding layer 502. The first surface 50a of the first printed circuit board 501 is configured for all dr.mos30 and all input capacitors Cin to be disposed by solder or by conductive adhesive (as shown in fig. 3D), wherein the heat dissipation surface of the dr.mos30 is disposed on the first surface 50a of the first printed circuit board 501. The first plastic package layer 502 is disposed on the first surface 50a of the first printed circuit board 501, and is configured to mold the first surface 50a of the first printed circuit board 501, all dr.mos30 and all input capacitors Cin into a whole by using a plastic molding method, wherein the outer surface 503 of the first plastic package layer 502 is a plane, the outer surface 503 can be attached to and fixedly connected to a chassis or a heat sink of an electronic device, and the outer surface 503 is a plane, so that the contact area with the chassis or the heat sink is increased, which is not only beneficial to reducing heat dissipation resistance and improving the heat dissipation capability of the voltage adjusting module 3, but also can evenly distribute the pressure from the chassis, and enhance the pressure resistance of the first printed circuit board assembly 50.

In some embodiments, as shown in fig. 3B, the second surface 50B of the first pcb 501 further comprises two first pads P1, four pairs of second pads P2, an even number of third pads, a plurality of through holes 511, and at least one blind via 512. The first pad P1 may be electrically connected to the positive input terminal Vin + of the voltage regulating module 3. The second pad P2 may be electrically connected to the negative output Vo-of the voltage regulating module 3. Each of an even number of third pads, for example, eight third pads SW1, SW2, SW3, SW4, SW5, SW6, SW7, and SW8, may be electrically connected to the first end SW of the corresponding inductor L. The through hole 511 penetrates the first printed circuit board 501. The blind hole 512 does not penetrate the first printed circuit board 501.

Please refer to fig. 3C, which is a schematic diagram of a layer cross-sectional structure of the first printed circuit board shown in fig. 3A and 3B. As shown in the drawings, in some embodiments, each dr.mos30 may instead include two opposite heat dissipation surfaces (referred to as a first heat dissipation surface and a second heat dissipation surface) for performing bilateral heat dissipation, where the first heat dissipation surface is disposed on the first surface 50a of the first printed circuit board 501, and further, after the first plastic package layer 502 plastic-packages the first surface 50a of the first printed circuit board 501, all dr.mos30 and the input capacitor Cin, the outer surface 503 of the first plastic package layer 502 may be polished, so that the second heat dissipation surface of each dr.mos30 is exposed out of the outer surface 503 of the first plastic package layer 502, and may be further attached to the chassis of the electronic device through a heat sink or directly, which is beneficial to further reducing the thermal resistance and enhancing the heat dissipation effect.

Please refer to fig. 3D, which is a partial diagram of components on the first surface of the first pcb shown in fig. 3A and 3B. As shown, in some embodiments, the eight dr.mos30 are equally divided into a first row and a second row and disposed on the first surface 50a of the first printed circuit board 501, the arrangement direction of all the dr.mos30 in each row is the same, and the arrangement direction of the dr.mos30 in the first row is opposite to that of the dr.mos30 in the second row, thereby making the routing between the eight dr.mos30 and the first end SW of the corresponding inductor L shorter. The input capacitance Cin is uniformly arranged around dr.

Referring to fig. 3A and 3B, in the present embodiment, the magnetic core assembly 60 is disposed adjacent to the first printed circuit board assembly 50, for example, disposed below the first printed circuit board assembly 50 and adjacent to the second surface 50B of the first printed circuit board 501, and includes a magnetic core portion 610 and at least one first U-shaped copper pillar, where each first U-shaped copper pillar penetrates through the magnetic core portion 610 to form two inductors by using two single-sided pillars of the first U-shaped copper pillar, so that when the voltage regulating module 3 is an eight-phase Buck circuit and has eight inductors L, the magnetic core assembly 60 includes four first

U-shaped copper pillars

621, 623, 625, and 627 as shown in fig. 3A and 3B, where the single-sided pillar of each of the four first

U-shaped copper pillars

621, 623, 625, and 627 forms a winding of the corresponding inductor L of the eight inductors L.

As can be seen from the above, the voltage regulation module 3 of the present invention forms at least two inductors L by at least one first U-shaped copper pillar penetrating through the magnetic core 610, so that eight inductors L only need four first U-shaped copper pillars, thereby saving the number of the first U-shaped copper pillars. In addition, since the copper pillar has good supporting force and thermal conductivity, the first U-shaped copper pillar can be supported between the first pcb assembly 50 and the second pcb assembly 70, thereby improving the ability of the voltage regulating module 3 to bear the pressure from the chassis of the electronic device, and utilizing the good thermal conductivity of copper to conduct the heat generated by the inductor L rapidly and effectively, so as to reduce the thermal resistance in the thermal conduction path. And due to the low resistivity of copper, the on-resistance of the inductor can be better reduced, and the on-loss of the inductor is further reduced, so that the conversion efficiency of the voltage regulation module 3 is improved.

Referring to fig. 3A, fig. 3B and fig. 4, in the present embodiment, the second printed circuit board assembly 70 includes a second printed circuit board 703 and at least one output capacitor Cout. The at least one output capacitor Cout may be, but is not limited to being, embedded in the second pcb 703. The second printed circuit board 703 includes a fourth pad P4, four fifth pads P5, four sixth pads P6a, P6B, P6c, P6d, a plurality of blind vias 711 and a plurality of Ball Grid Arrays (BGA) B, wherein the fourth pad P4, the four fifth pads P5, the four sixth pads P6a, P6B, P6c, P6d and the plurality of blind vias 711 are disposed on the first surface 70a of the second printed circuit board 703 (i.e., on the side of the second printed circuit board 70 adjacent to the core element 60), and the fourth pad P4 is electrically connected to the positive input terminal of the voltage regulating module 3 +, and the four fifth pads P5 are electrically connected to the negative output terminal Vo-, the sixth pad P6a, P6B, P6 Vo 6c, P6d + of the voltage regulating module 3. The ball grid arrays B are disposed on the second surface 70B of the second printed circuit board 703 for electrically connecting with the ball grid arrays of the cpu of the electronic device disposed on the system board, wherein the ball grid arrays B on the second surface 70B of the second printed circuit board 703 correspond to the ball grid arrays on the system board in pitch and network. The plurality of ball grid arrays B are electrically connected to the plurality of pads on the first surface 70a of the second pcb 703 through internal routing of the second pcb 703.

When the voltage adjustment module is pressed by the electronic device due to locking, each of the ball grid arrays B on the second surface 70B of the second printed circuit board 703 is uniformly pressed by the first surface 70a of the second printed circuit board 703. However, when the ball grid array B is stressed unevenly, the ball grid array B stressed excessively can cause tin cracking or tin dropping, which affects the reliability of the product. In this case, it is necessary to increase the area of the pad on the first surface 70a of the second printed circuit board assembly 70 soldered to the core assembly 60, but increasing the area of the pad reduces the area for placing the output capacitor Cout. Therefore, in the present invention, the voltage regulation module 3 adopts the embedded output capacitor Cout or the plastic-sealed output capacitor Cout to solve the above problem, which will be described below.

Please refer to fig. 5, which is a schematic cross-sectional structure diagram of the second printed circuit board when the output capacitor shown in fig. 4 is embedded in the second printed circuit board. As shown in the figure, first, only one output capacitor Cout is embedded in the second pcb 703 in fig. 5. The second printed circuit board 703 includes a substrate 723, an interface layer 724, a first plating layer 731, a second plating layer 732, a plurality of first insulating layers 733, and a plurality of second insulating layers 734. The substrate 723 includes a plurality of pads 727 for soldering the output capacitor Cout, so that the output capacitor Cout is fixed on the substrate 723 via the pads 727. An interface layer 724, such as an epoxy insulating Film (ABF), covers the substrate 723 and the first surface of the output capacitor Cout, and is baked at a certain temperature, for example, 180 ℃ for 30 minutes, and then the interface layer 724 is cured to form an insulating layer. The first plating layer 731 is formed on the upper surface of the interfacial layer 724 and the second surface of the substrate 723 by copper plating and pressing, and has a thickness of about 3 OZ. In fig. 5, two positions of the interface layer 724 and the substrate 723 are punched from the upper direction and the lower direction of the second pcb assembly 70, and electroplating is performed, wherein the positions of the two through holes of the interface layer 724 and the positions of the two through holes of the substrate 723 correspond to the two pads 727, so that the two through holes of the interface layer 724 and the two through holes of the substrate 723 are connected to the two pads 727 soldered to the output capacitor Cout. On the basis, the first insulating layer 733 is added on the substrate 723 and on the first electroplated layer 731 of the interface layer 724 from the upper and lower directions of the second printed circuit board assembly 70, and the surfaces of the two first insulating layers 733 are electroplated with copper and pressed to form the second electroplated layer 732 with a thickness of 3 OZ. Then, two positions of the first insulating layer 733 are punched again in two directions, i.e., up and down, of the second printed circuit board assembly 70, and electroplating is performed, wherein the two through holes of the first insulating layer 733 correspond to the two through holes of the two pads 727 and the interface layer 724, and the two through holes of the first insulating layer 733 are connected to the two pads 727 soldered to the output capacitor Cout and the two through holes of the interface layer 724. Next, second insulating layers 734 are formed on the first insulating layers 733 in the two upper and lower directions of the second printed circuit board assembly 70, and plating layers with a thickness of 3OZ are formed by electroplating copper on the two surfaces of the two second insulating layers 734 and pressing, so as to form the first surface 70a and the second surface 70b of the second printed circuit board 703. However, two positions of the second insulating layer 734 are punched from the upper and lower directions of the second printed circuit board assembly 70 and plated, so that two through holes of the second insulating layer 734 are connected to the two pads 727 soldered to the output capacitor Cout, two through holes of the interface layer 724, and two through holes of the first insulating layer 733, wherein one through hole of the second insulating layer 734, one through hole of the interface layer 724, and one through hole of the first insulating layer 733 in the upper half of the second printed circuit board assembly 70 are communicated to form a first conductive through hole 725, one through hole of the interface layer 724 in the lower half of the second printed circuit board assembly 70 and one through hole of the first insulating layer 733 are communicated to form a first conductive through hole 725', the other through hole of the second insulating layer 734, the other through hole of the interface layer 724, and the other through hole of the first insulating layer 733 in the upper half of the second printed circuit board assembly 70 are communicated to form a second conductive through hole 726, another through hole of the interface layer 724 located at the lower portion of the second printed circuit board assembly 70 is connected to another through hole of the first insulating layer 733 to form a second conductive via 726'. The first conductive vias 725 and 725 'are electrically connected to the first end (positive output terminal Vo +) of the output capacitor Cout, the second plating layer 732, and the first surface 70a and the second surface 70b of the second printed circuit board 703, and the second conductive vias 726 and 726' are electrically connected to the second end (negative output terminal Vo-) of the output capacitor Cout, the first plating layer 731, and the first surface 70a and the second surface 70b of the second printed circuit board 703. By embedding the output capacitor Cout in the second pcb 703, more placement positions for the output capacitor Cout can be provided without being affected by other devices connected to the second pcb 703.

Please refer to fig. 6, which is a schematic cross-sectional structure diagram of the second printed circuit board when the output capacitor shown in fig. 4 is disposed on the second printed circuit board in a plastic package manner. As shown in the figure, in some embodiments, the output capacitor Cout may be disposed on the second printed circuit board 703 in a plastic molding manner instead, and further, the output capacitor Cout is soldered and fixed on the first surface 70a of the second printed circuit board 703, and the second printed circuit board assembly 70 further includes a plurality of copper blocks 771 and a second plastic molding layer 704. The copper block 771 is soldered to the first surface 70a of the second pcb 703 for supporting the same. The second molding layer 704 is used to mold the first surface 70a of the second printed circuit board 703, all the output capacitors Cout and the plurality of copper blocks 771 into a whole by a molding method.

In some embodiments, each copper block 771 may be a rectangular structure. Furthermore, the second molding compound layer 704 may be naturally exposed or polished to expose the upper surfaces of the copper blocks 771 on the surface of the second molding compound layer 704, and each fourth pad P4 is formed on the upper surface 70a of the second molding compound layer 704 by electroplating and is in conductive connection with the corresponding copper block 771 of the exposed second molding compound layer 704. In addition, the height of the plurality of copper blocks 771 is higher than that of the output capacitor Cout, so that the upper surfaces of the plurality of copper blocks 771 are fully exposed on the surface of the second plastic package layer 704 after plastic package and natural exposure or polishing. Of course, the fourth pad P4, the fourth pad P5, and the fourth pad P6a, P6b, P6c, and P6d of the second pcb assembly 70 can be implemented by pre-embedding copper blocks, exposing the upper surfaces of the pre-embedded copper blocks after plastic molding, and forming pads by electroplating.

Please refer to fig. 7, which is a schematic cross-sectional structure diagram of a variation of the second printed circuit board when the output capacitor shown in fig. 4 is molded on the second printed circuit board. As shown in the drawings, in some embodiments, the copper bumps 771 may also be trapezoidal, and the surface of each copper bump 771 with a smaller area is soldered and fixed to the first surface 70a of the second printed circuit board 703, while the surfaces of the copper bumps 771 with a larger area are exposed to the surface of the second molding layer 704 after molding through natural exposure or polishing after molding, and the positions of the copper bumps 771 exposed to the surface of the second molding layer 704 may be plated to form the required pads, such as the fourth pad P4 and/or the fifth pad P5 and/or the sixth pad P6a, P6b, P6c, and P6 d.

In addition, in consideration of the solder pad area and producibility, in the embodiment shown in fig. 6 or fig. 7, the area of the copper block 771 exposed to the surface of the second molding layer 704 needs to be more than 1.3 times the area of the first surface 70a of the second printed circuit board 703 to which the copper block 771 is solder-fixed. Furthermore, in the embodiment shown in fig. 6 or fig. 7, the output capacitor Cout is molded to form a plane on the surface of the second printed circuit board assembly 70, and a large-area pad may be disposed on the plane to increase the contact area between the second printed circuit board assembly 70 and the magnetic core assembly 60, so that the stressed area of the second printed circuit board assembly 70 is increased, and the uniform stress degree of the ball grid array B on the second surface 70B of the second printed circuit board 703 is increased, thereby improving the reliability of the product.

Referring to fig. 3A, fig. 3B and fig. 8, fig. 8 is a schematic structural diagram of the magnetic core shown in fig. 3A and fig. 3B. As shown in the figure, in some embodiments, the magnetic core portion 610 includes four

magnetic core units

611, 613, 615, and 617 whose edges are nested with each other, and the four

magnetic core units

611, 613, 615, and 617 may be square with four corners having a circular arc shape, such as shown in fig. 8, but not limited thereto, and may also be circular. Each magnetic core unit has a set of two parallel

square holes

811, 813, 815, 817 at the center, each set of

holes

811, 813, 815, 817 has a size and a shape matching the size and the shape of the single-sided column of the corresponding first

U-shaped copper column

621, 623, 625, 627, and the four first

U-shaped copper columns

621, 623, 625, 627 may respectively pass through the corresponding holes of the

holes

811, 813, 815, 817 to form an inductance L, for example, the first U-shaped copper column 621 passes through the two holes 811 and then forms the inductance L of the first phase Buck circuit and the inductance L of the second phase Buck circuit together with the magnetic core unit 611, and so on.

The first U-shaped copper pillar 621 includes two

top surfaces

641 and 642 and a bottom surface 651, the two

top surfaces

641 and 642 are soldered and electrically connected to the two corresponding third pads SW1 and SW2 on the second surface 50b of the first pcb 501, and the bottom surface 651 is soldered and electrically connected to the sixth pad P6a of the second pcb assembly 70. The first U-shaped copper post 623 includes two

top surfaces

643 and 644 and a bottom surface 653, the two

top surfaces

643 and 644 are soldered and electrically connected to the corresponding two third pads SW3 and SW4 on the second surface 50b of the first printed circuit board 501, and the bottom surface 653 is soldered and electrically connected to the sixth pad P6b of the second printed circuit board assembly 70. The first U-shaped copper pillar 625 includes two

top surfaces

645 and 646 and a bottom surface 655, the two

top surfaces

645 and 646 are soldered and electrically connected to the corresponding two pads SW5 and SW6 on the second surface 50b of the first printed circuit board 501, and the bottom surface 655 is soldered and electrically connected to the sixth pad P6c of the second printed circuit board assembly 70. The first U-shaped copper pillar 627 comprises two

top surfaces

647 and 648 and a bottom surface 657, the two

top surfaces

647 and 648 are soldered to and electrically connected to the corresponding two pads SW7 and SW8 on the second surface 50b of the first printed circuit board 501, and the bottom surface 657 is soldered to and electrically connected to the sixth pad P6d of the second printed circuit board assembly 70.

In the magnetic core portion 610, magnetic lines of force of two adjacent magnetic core units overlap each other to form a first magnetic line overlapping region, such as the

oblique line regions

831, 832 and 833 shown in fig. 8, and in each magnetic core unit, magnetic lines of force between two inductors also overlap each other to form second magnetic

line overlapping regions

841, 842, 843, 844, and each second magnetic line overlapping region is located in a region between two holes of the corresponding magnetic core unit. In the three first magnetic flux

line overlapping regions

831, 832, and 833 shown, the direct current magnetic fluxes cancel each other and the alternating current magnetic fluxes are superimposed. In the illustrated second magnetic-line-overlapped

regions

841, 842, 843, 844, both the dc magnetic flux and the ac magnetic flux cancel each other out, but actually, since the device parameters and parasitic parameters in the two-phase Buck circuit using the same pulse width control signal are not completely the same, in the second magnetic-line-overlapped

regions

841, 842, 843, 844, the dc magnetic flux and the ac magnetic flux cannot be completely cancelled out, and a small amount of the dc magnetic flux and the ac magnetic flux exists. In some embodiments, the area of each of the first magnetic line-of-

flux overlapping regions

831, 832, and 833 is less than 2 times the area of the corresponding non-magnetic line-of-

flux overlapping region

801, 802, 803, 804 on each core element. And the area of each second magnetic

line overlapping region

841, 842, 843, 844 is less than 0.5 times the area of the corresponding non-magnetic

line overlapping region

801, 802, 803, 804 on each core unit. However, the overlap region shown in fig. 8 is for illustration only and does not represent the shape of the true magnetic flux overlap region.

Each

core unit

611, 613, 615, and 617 includes two air gaps, i.e., core unit 611 includes

air gaps

821, 822, core unit 613 includes

air gaps

823, 824, core unit 615 includes

air gaps

825, 826, and core unit 617 includes

air gaps

827, 828, as shown in FIG. 8. The air gaps are distributed on two sides of the

holes

811, 813, 815 and 817 pairwise symmetrically, and share the magnetic pressure equally. In addition, the magnetic core portion 610 may be an integrally formed magnetic core, and is integrally bonded to the four first

U-shaped copper pillars

621, 623, 625, 627, and then installed between the first printed circuit board assembly 50 and the second printed circuit board assembly 70.

In addition, as shown in fig. 3A and 3B, the magnetic core assembly 60 further includes a second U-shaped copper pillar 603 and a third U-shaped copper pillar 602. The top surfaces of the third U-shaped copper pillar 602 are electrically connected and fixed to the first pads P1 of the second surface 50b of the first printed circuit board 501 by soldering, while the bottom surface of the third U-shaped copper pillar 602 is electrically connected and fixed to the fourth pad P4 of the second printed circuit board assembly 70 by soldering. The top surfaces of each of the second U-shaped copper pillars 603 are electrically connected and fixed to the corresponding two second pads P2 on the second surface 50b of the first printed circuit board 501 by soldering, and the bottom surface of each of the second U-shaped copper pillars 603 is electrically connected and fixed to the fifth pad P5 of the second printed circuit board assembly 70 by soldering. In addition, the heights of the third U-shaped copper pillar 602, the second U-shaped copper pillar 603 and the first

U-shaped copper pillars

621, 623, 625 and 627 are the same or approximately the same, the inner walls of the third U-shaped copper pillar 602 and the second U-shaped copper pillar 603 are shaped to fit the shape of the core portion 610, and the outer walls of the third U-shaped copper pillar 602 and the second U-shaped copper pillar 603 are flat. The third U-shaped copper pillar 602, the second U-shaped copper pillar 603, and the first

U-shaped copper pillars

621, 623, 625, 627 are supported between the first pcb assembly 50 and the second pcb assembly 70, thereby improving the ability of the voltage regulating module 3 to bear the pressure from the chassis of the electronic device, and utilizing the good thermal conductivity of copper to quickly and effectively conduct the heat generated by the inductor L to the second pcb assembly 70, reducing the thermal resistance in the thermal conduction path. In addition, since the third U-shaped copper pillar 602, the second U-shaped copper pillar 603, and the first

U-shaped copper pillars

621, 623, 625, 627 have good supporting capability, the height of the magnetic core portion 610 can be slightly lower than the heights of the third U-shaped copper pillar 602, the second U-shaped copper pillar 603, and the first

U-shaped copper pillars

621, 623, 625, 627, so that the pressure borne by the magnetic core portion 610 can be reduced, and the magnetic core portion 610 is prevented from being broken when being subjected to an excessive pressure.

In addition, the magnetic core assembly 60 is formed by disposing the third U-shaped copper pillar 602, the second U-shaped copper pillar 603, and the first

U-shaped copper pillars

621, 623, 625, 627 with their top surfaces facing upward, dispensing the adhesive on the inner surfaces of the U-shaped bottoms of the third U-shaped copper pillar 602, the second U-shaped copper pillar 603, and the first

U-shaped copper pillars

621, 623, 625, 627, and then fastening the adhesive on the magnetic core portion 610, thereby conveniently assembling the magnetic core assembly 60. And the assembled magnetic core assembly 60 can be integrally welded with the first printed circuit board assembly 50 and the second printed circuit board assembly 70, thereby simplifying the production process flow. Since the shapes of the first

U-shaped copper pillars

621, 623, 625, 627, the second U-shaped copper pillar 603, and the third U-shaped copper pillar 602 are similar to the shape of a U-shaped magnetic core commonly used in a magnetic assembly, the shapes of the U-shaped copper pillars are not particularly shown in the drawings.

Furthermore, as shown in fig. 3A and 3B, the voltage regulating module 3 further includes a signal connecting portion 601, the signal connecting portion 601 includes a plurality of conductive pins, wherein a first end of a portion of the conductive pins is fixed in the through hole 511 of the first printed circuit board 501 by soldering, first ends of the other conductive pins are fixed in the blind hole 512 of the first printed circuit board 501 by soldering, a second end of each conductive pin is fixed in the blind hole 711 of the second printed circuit board 703 by soldering, the signal connecting portion 601 is used to transmit a control signal between the first printed circuit board assembly 50 and the second printed circuit board assembly 70, wherein the signal connecting portion 601 can be better fixed by using the through hole 511, and the blind hole 512 can save discrete devices such as an input capacitor Cin and the like placed on the first surface 50a of the first printed circuit board 501, so that the voltage regulating module 3 can meet the requirement of high power density, the blind via 711 can save space on the second surface 70B of the second pcb 703 for placing a plurality of ball grid arrays B, and also can save space embedded in the second pcb 703 for placing more discrete devices, such as the output capacitor Cout.

Referring to fig. 9A, 9B and 10, fig. 9A is a schematic structural diagram of a voltage regulation module according to a second preferred embodiment of the present invention, fig. 9B is a schematic structural diagram of another view angle of the voltage regulation module shown in fig. 9A, and fig. 10 is an enlarged plan structural diagram of a signal connection portion shown in fig. 3A. As shown in the figure, the voltage regulation module 3 of the present embodiment has a structure and a function similar to those of the voltage regulation module 3 shown in fig. 3A, and therefore, the same symbols are used for identification, and further description is omitted. However, the signal connection unit 661 of the voltage regulating module of the present embodiment does not have a conductive pin, but instead includes a conductive printed circuit board 662. In addition, the second surface 50B of the first printed circuit board 501 does not have the through hole 511 and the blind hole 512 as shown in fig. 3B, but instead includes a plurality of conductive pads 561, and the second printed circuit board 703 does not have the blind hole 711 as shown in fig. 3A, but instead includes a plurality of conductive pads 761.

The conductive pcb 662 includes a plurality of conductive fingers 663 and a plurality of surface studs 664. The conductive fingers 663 are respectively formed on the first side surface and the second side surface of the conductive printed circuit board 662, the arrangement position of each conductive finger 663 on the first side surface of the conductive printed circuit board 662 corresponds to the arrangement position of one conductive finger 663 on the second side surface, and the conductive fingers 663 may be the same electrical network, but not limited to this, different electrical networks may be used, and in addition, the conductive fingers 663 may be formed in a manner of gold plating or tin plating, for example. The surface mount feet 664 are formed on the opposite top and bottom surfaces of the conductive printed circuit board 662 between the first and second side surfaces in an electroplating manner, a first end of each conductive finger 663 is connected with the corresponding surface mount foot 664 on the top surface for conduction, and a second end of each conductive finger 663 is connected with the corresponding surface mount foot 664 on the bottom surface for conduction, wherein when any conductive finger 663 on the first side surface of the conductive printed circuit board 662 and the corresponding conductive finger 663 on the second side surface are different electrical networks, the two surface mount feet 664 connected with one conductive finger 663 of the different electrical networks are not electrically connected with the two surface mount feet 664 connected with the other conductive finger 663, and the state is a disconnected state.

In the present embodiment, the signal connecting portion 661 is vertically disposed between the first pcb assembly 50 and the second pcb assembly 70, and the signal connecting portion 661 is soldered to and electrically connected to the first pcb assembly 50 through the conductive pad 561 and the corresponding surface mount 664, and soldered to and electrically connected to the second pcb assembly 70 through the conductive pad 761 and the corresponding surface mount 664. Compared with the signal connection part of the voltage regulation module in the prior art, which is a missing part because a plurality of conducting pins are used as components for transmitting signals, when the signal connection part 661 of the voltage regulation module 3 of the present embodiment is welded with the pad of the first printed circuit board assembly 50 or the second printed circuit board assembly 70, the solder can climb the solder through the side routing, thereby avoiding the possibility that the solder can spread to the adjacent pins, and effectively avoiding the short circuit of the two pins (the pins 664 attached to the surface), so that the space between the adjacent pins of the signal connection part 661 can be reduced, the distribution density of the pins can be improved, further reducing the volume of the whole voltage regulation module 3, and further improving the power density of the voltage regulation module 3. In addition, in the present embodiment, by utilizing the feature that the thickness of the printed circuit board of the signal connection portion 661 is small, the size of the signal connection portion 661 can be further reduced to reduce the size of the whole voltage regulating module 3, and more space is obtained for placing other discrete devices, such as the output capacitor Cout. In another embodiment, the signal connecting portion 661 can also electrically connect the first printed circuit board assembly 50 and the second printed circuit board assembly 70 through a single-sided wiring or a wiring through an inner layer of the printed circuit board.

In another embodiment, the signal connection portion 661 can be bonded to at least one of the core portion 610 or the third U-shaped copper pillar 602, the second U-shaped copper pillar 603 and the first

U-shaped copper pillars

621, 623, 625, 627 to form a module, thereby directly assembling the module between the first pcb assembly 50 and the second pcb assembly 70, and since the signal connection portion 661 is fixed by bonding to the core portion 610 or the U-shaped copper pillar, there is no need for fixing through holes or blind holes, it is possible to effectively prevent the occurrence of tilting in the soldering process with the first pcb assembly 50 and the second pcb assembly 70, while reducing the size of the voltage adjustment module 3 and simplifying the production flow and cycle. In addition, since the height of the conductive printed circuit board 662 of the vertically disposed signal connection portion 661 can be precisely controlled, it is more advantageous to achieve the flatness of the contact surfaces of the magnetic core assembly 60 with the first and second printed

circuit board assemblies

50 and 70.

In addition, in the embodiment, the second surface 70B of the second printed circuit board 703 needs to be placed with the ball grid array B, and the first surface 70a of the second printed circuit board 703 (or the surface of the second printed circuit board assembly 70 adjacent to the core assembly 60) needs to be soldered to the core assembly 60. In the traditional production process, the flow of double-sided reflow soldering comprises the steps of brushing tin paste on the first surface, placing components, performing reflow soldering, brushing tin paste on the second surface, placing components, and performing reflow soldering. When the second surface is subjected to reflow soldering, the welding spots on the first surface are heated again, so that the welding spots on the first surface are easily melted, and the components fall off, therefore, the components with small volume and weight can be prevented from falling off by generally depending on the holding force of the welding spots, and the temperature of the reflow soldering area on the second surface is generally set to be 5 degrees lower than that of the reflow soldering area on the first surface for the components with large weight, so that the first surface components can be prevented from falling off when the second surface is soldered. However, for this embodiment, the second surface 50B of the first printed circuit board 501 is an internal soldering surface, the first surface 70a of the second printed circuit board 703 is also an internal soldering surface (or a surface of the second printed circuit board assembly 70 adjacent to the magnetic core assembly 60), and the assembled voltage regulating module 3 needs to be soldered to the system board again through the plurality of ball grid arrays B on the second surface 70B of the second printed circuit board 703, so that the solder points inside the voltage regulating module 3 are reflowed twice, and the device may be displaced. Meanwhile, since the voltage regulation module 3 and the cpu are located on two opposite sides of the system board, when the cpu is soldered by turning over the system board after the voltage regulation module 3 is soldered to the system board, the voltage regulation module is heated again, and since the voltage regulation module has a heavy weight, the solder joints on the ball grid array B, the first surface 70a of the second pcb 703, or the second surface 50B of the first pcb 501 are easily melted again, which results in separation and detachment of the internal devices of the voltage regulation module 3. Therefore, in order to prevent this problem, in some embodiments, the magnetic core assembly 60 and the second pcb assembly 70 or the first pcb assembly 50 are bonded by a conductive adhesive, and the conductive adhesive is cured by heating, so that the problem of component falling or component displacement caused by welding with the system can be effectively solved by utilizing the characteristic that the conductive adhesive is not melted or deformed when being heated again after being cured, and the reliability and convenience of product assembly of the voltage regulating module 3 are enhanced. Meanwhile, solder is modified into conductive adhesive, the reflow soldering frequency is greatly reduced, and the product reliability is improved.

In other embodiments, the voltage regulating module 3 shown in fig. 3A and 3B and the voltage regulating module 3 shown in fig. 9A and 9B may not have the second printed circuit board assembly 70, but only include the first printed circuit board assembly 50 and the magnetic core assembly 60, in which case the output capacitor Cout is placed on the system board of the electronic device, and the bottoms of all U-shaped copper pillars of the magnetic core assembly 60 are directly soldered or electrically connected to corresponding pads on the system board by using a conductive adhesive, in other words, similar to the second printed circuit board assembly 70 directly formed by the system board as shown in fig. 3A, 3B, 9A and 9B.

In summary, the present invention provides a voltage regulating module, wherein a first U-shaped copper pillar penetrates through a magnetic core to form an inductor, and the first U-shaped copper pillar can be supported between a first printed circuit board assembly and a second printed circuit board assembly due to the good supporting force and thermal conductivity of the copper pillar, so as to improve the capability of the voltage regulating module to bear the pressure from the chassis of the electronic device, and the good thermal conductivity of the copper is utilized to quickly and effectively conduct the heat generated by the inductor, thereby reducing the thermal resistance in the thermal conduction path. In addition, the output capacitor of the voltage regulating module is embedded in the second printed circuit board or arranged on the second printed circuit board in a plastic package mode, so that the area of a bonding pad on the second printed circuit board component welded with the magnetic core component can be increased, the ball grid array on the second printed circuit board is uniformly stressed, the reliability of a product is improved, and meanwhile, more output capacitors can be arranged. Furthermore, because the signal connection part of the voltage regulation module comprises the printed circuit board for conducting connection with a plurality of conductive fingers and a plurality of surface pins, when the signal connection part is welded with the welding pad of the first printed circuit board assembly or the second printed circuit board assembly, the soldering tin can climb tin through the side routing, the possibility that the soldering tin spreads to the adjacent pins is avoided, and the short circuit of the two pins with the tin is effectively avoided, so that the space between the adjacent pins of the signal connection part can be reduced, the distribution density of the pins can be improved, the volume of the whole voltage regulation module is further reduced, and the power density of the voltage regulation module is improved.

Claims

1. A voltage regulation module, comprising:

the first printed circuit board assembly comprises a first printed circuit board, a plurality of switch circuits and a first plastic package layer, wherein the switch circuits are arranged on a first surface of the first printed circuit board, and the first plastic package layer is arranged on the first surface and covers the switch circuits; and

and the magnetic core assembly is arranged adjacent to a second surface of the first printed circuit board and comprises a magnetic core part and at least one first U-shaped copper column, the magnetic core part is provided with a plurality of holes, at least one first U-shaped copper column penetrates through two corresponding holes to form at least two inductors, and a first end of each inductor is connected with the corresponding switch circuit in series to form a phase circuit.

2. The voltage regulation module of claim 1, further comprising a second printed circuit board assembly disposed adjacent to the magnetic core assembly such that the magnetic core assembly is positioned between the first printed circuit board assembly and the second printed circuit board assembly, the second printed circuit board assembly comprising a second printed circuit board and at least one output capacitor, a first surface of the second printed circuit board adjacent to the magnetic core assembly opposite a second surface of the second printed circuit board.

3. The voltage regulation module of claim 2 wherein the second printed circuit board assembly is a system board.

4. The voltage regulation module of claim 2 wherein the magnetic core assembly further comprises at least a second U-shaped copper pillar and a third U-shaped copper pillar, the magnetic core having a height less than the first U-shaped copper pillar, the second U-shaped copper pillar and the third U-shaped copper pillar.

5. The voltage regulation module of claim 4, the second surface of the first printed circuit board further comprising two first pads and at least one pair of second pads, the second printed circuit board assembly further comprising a fourth pad and at least one fifth pad, wherein the first pad and the fourth pad are electrically connected to a positive input terminal of the voltage adjustment module, the second bonding pad and the fifth bonding pad are electrically connected with a negative output end of the voltage regulating module, the third U-shaped copper column is welded, fixed and electrically connected with the first bonding pad and the fourth bonding pad, each second U-shaped copper column is welded, fixed and electrically connected with a corresponding group of paired second bonding pads and corresponding fifth bonding pads, and the first U-shaped copper column, the second U-shaped copper column and the third U-shaped copper column also support the first printed circuit board assembly and the second printed circuit board assembly.

6. The voltage regulation module of claim 2 wherein the second surface of the first printed circuit board further comprises an even number of third pads, the second printed circuit assembly further comprises at least one sixth pad, each of the third pads is electrically connected to the corresponding first end of the inductor, each of the sixth pads is electrically connected to a positive output terminal of the voltage regulation module, and each of the first U-shaped copper posts is soldered to and electrically connected to a corresponding two of the third pads and the corresponding sixth pads.

7. The voltage regulation module of claim 6 wherein each first U-shaped copper pillar comprises two top surfaces and a bottom surface, the two top surfaces are soldered to and electrically connected to the corresponding two third pads, and the bottom surface is soldered to and electrically connected to the corresponding sixth pad.

8. The voltage regulation module of claim 2, wherein the output capacitor is embedded in the second printed circuit board, and the second printed circuit board further comprises a plurality of ball grid array surfaces disposed on the second surface of the second printed circuit board.

9. The voltage regulation module of claim 2, wherein the output capacitor is disposed on the first surface of the second printed circuit board in a plastic package manner, and the second printed circuit board further comprises a plurality of ball grid array surfaces disposed on the second surface of the second printed circuit board.

10. The voltage regulation module of claim 9, wherein the second printed circuit board assembly further comprises a plurality of copper blocks and a second plastic molding layer, the copper blocks are soldered and fixed on the first surface of the second printed circuit board for providing a supporting function, the second plastic molding layer is used for molding the first surface of the second printed circuit board, the output capacitor and the plurality of copper blocks into a whole by plastic molding, wherein an upper surface of each copper block is exposed on the surface of the second plastic molding layer.

11. The voltage regulation module of claim 10 wherein each of the copper blocks is rectangular.

12. The voltage regulation module of claim 10 wherein each copper block is trapezoidal, and the smaller surface of each copper block is soldered to a second pcb, and the larger surface of each copper block is exposed to the surface of the second plastic package and plated to form a pad.

13. The voltage regulation module of claim 12, wherein the area of each of the copper blocks exposed to the surface of the second molding layer is greater than 1.3 times the area of the first surface of the second pcb to which the copper blocks are soldered.

14. The voltage regulation module of claim 2, wherein the first printed circuit board further comprises a plurality of through holes and at least one blind hole on the second surface, the second printed circuit board comprises a plurality of blind holes on the first surface, and the voltage regulation module further comprises a signal connection portion having a plurality of conductive pins, wherein a first end of a portion of the conductive pins is fixedly disposed in the through holes of the first printed circuit board by soldering, the first ends of the remaining conductive pins are fixedly disposed in the blind holes of the first printed circuit board by soldering, a second end of each conductive pin is fixedly disposed in the blind hole of the second printed circuit board by soldering, and the signal connection portion is configured to transmit the control signal between the first printed circuit board assembly and the second printed circuit board assembly.

15. The voltage regulation module of claim 2, wherein the first printed circuit board comprises a plurality of conductive pads on the second surface, the second printed circuit board assembly further comprises a plurality of conductive pads, the voltage regulation module further comprises a signal connection portion, the signal connection portion comprises a conductive printed circuit board, the conductive printed circuit board comprises a plurality of conductive fingers and a plurality of surface pads, the plurality of conductive fingers are formed on at least one side surface of the conductive printed circuit board, the plurality of surface pads are formed on a top surface and a bottom surface of the conductive printed circuit board in an electroplating manner, a first end of each conductive finger is connected to the corresponding surface pad on the top surface for conductive connection, a second end of each conductive finger is connected to the corresponding surface pad on the bottom surface for conductive connection, and the signal connection portion is vertically disposed between the first printed circuit board assembly and the second printed circuit board assembly, the signal connecting part is welded, fixed and electrically connected with the first printed circuit board assembly through the plurality of conducting bonding pads of the first printed circuit board and the corresponding surface pins, and is welded, fixed and electrically connected with the second printed circuit board assembly through the plurality of conducting bonding pads of the second printed circuit board assembly and the corresponding surface pins, and the signal connecting part is used for transmitting control signals between the first printed circuit board assembly and the second printed circuit board assembly.

16. The voltage regulation module of claim 1 wherein the magnetic core assembly is bonded to the first printed circuit board assembly with a conductive adhesive.

17. The voltage regulation module of claim 2, wherein the magnetic core assembly is bonded between the second printed circuit board assembly and the first printed circuit board assembly with a conductive adhesive.

18. The voltage regulation module of claim 1, further comprising an input capacitor disposed on the first surface of the first printed circuit board and covered by the first molding layer, wherein a first end of the input capacitor is electrically connected to a positive input terminal of the voltage regulation module, and a second end of the input capacitor is electrically connected to a negative input terminal of the voltage regulation module.

19. The voltage regulation module of claim 1 wherein an outer surface of the first molding layer is planar.

20. The voltage regulation module of claim 19 wherein each of the switch circuits is formed by a driver mosfet cell, and each of the driver mosfet cells includes a first heat dissipation surface and a second heat dissipation surface opposite to each other, the first heat dissipation surface being disposed on the first surface of the first pcb, and the second heat dissipation surface being exposed to the outer surface of the first plastic package layer.