CN111312854A - Magnesium-doped copper-zinc-tin-sulfur thin film solar cell and preparation method thereof - Google Patents
Magnesium-doped copper-zinc-tin-sulfur thin film solar cell and preparation method thereof Download PDFInfo
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- WILFBXOGIULNAF-UHFFFAOYSA-N copper sulfanylidenetin zinc Chemical compound [Sn]=S.[Zn].[Cu] WILFBXOGIULNAF-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000010409 thin film Substances 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000010408 film Substances 0.000 claims abstract description 50
- 239000002243 precursor Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 25
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000010521 absorption reaction Methods 0.000 claims abstract description 14
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims abstract description 14
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims abstract description 12
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 claims abstract description 7
- 235000011285 magnesium acetate Nutrition 0.000 claims abstract description 7
- 239000011654 magnesium acetate Substances 0.000 claims abstract description 7
- 229940069446 magnesium acetate Drugs 0.000 claims abstract description 7
- 235000005074 zinc chloride Nutrition 0.000 claims abstract description 7
- 239000011592 zinc chloride Substances 0.000 claims abstract description 7
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract description 6
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 6
- 235000011150 stannous chloride Nutrition 0.000 claims abstract description 6
- 239000001119 stannous chloride Substances 0.000 claims abstract description 6
- 239000011777 magnesium Substances 0.000 claims description 18
- 238000004544 sputter deposition Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 238000004528 spin coating Methods 0.000 claims description 10
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical group OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 6
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 238000004073 vulcanization Methods 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 7
- 239000011148 porous material Substances 0.000 abstract description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 10
- 229910052749 magnesium Inorganic materials 0.000 description 10
- 239000013078 crystal Substances 0.000 description 8
- 238000001237 Raman spectrum Methods 0.000 description 6
- 150000001768 cations Chemical class 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002535 CuZn Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- LHQLJMJLROMYRN-UHFFFAOYSA-L cadmium acetate Chemical compound [Cd+2].CC([O-])=O.CC([O-])=O LHQLJMJLROMYRN-UHFFFAOYSA-L 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical group O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0321—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 characterised by the doping material
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- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
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Abstract
The invention discloses a magnesium-doped copper-zinc-tin-sulfur thin film solar cell and a preparation method thereof, and belongs to the field of solar cells. The preparation method comprises the following steps: preparing a Mo electrode on a glass substrate; coating a magnesium-doped copper-zinc-tin-sulfur precursor solution on the Mo electrode to prepare a precursor film; preparing an absorption layer by vulcanizing the precursor film at high temperature; preparing a buffer layer on the absorption layer; preparing a transparent conductive window layer on the buffer layer; a top electrode is prepared on the window layer. Wherein the absorption layer is a magnesium-doped copper-zinc-tin-sulfur film; the precursor solution is obtained by fully dissolving copper chloride, magnesium acetate, zinc chloride, stannous chloride and thiourea in dimethylformamide and performing centrifugal treatment. The preparation method is safe and simple to operate, the metal source is rich in storage, the method is environment-friendly and low in cost, and the prepared magnesium-doped copper-zinc-tin-sulfur thin film solar cell is good in crystalline grain appearance, few in pores, high in carrier mobility, strong in charge collection capacity and few in defects.
Description
Technical Field
The invention relates to the field of solar cells, in particular to a magnesium-doped copper-zinc-tin-sulfur thin film solar cell and a preparation method thereof.
Background
Fossil energy reserves are decreasing day by day, and it is imperative to seek other energy sources as supplements. In view of the situation of high consumption and high pollution of the traditional energy, clean, rich and environment-friendly novel energy becomes a non-choice for energy supplement. The solar energy is a perfect novel clean energy completely conforming to the heart of people, is purely natural, has no pollution and is rich in resources. The development and utilization of solar energy are undoubtedly a viable path for alleviating environmental pollution and energy crisis, and have profound scientific significance and practical effects.
The silicon-based solar cell is used as a traditional photoelectric conversion device, the technical application is mature, the scientific research significance is not great, and the research of novel photoelectric materials becomes the first major of the majority of researchers. Copper Zinc Tin Sulfide (CZTS) is a direct band gap semiconductor material and has a kesterite structure, the forbidden band width is 1.45 eV-1.50 eV, and the light absorption coefficient exceeds 104cm-1Only 1.5-2.5 μm is needed to absorb most of visible light wavelength. Compared with the same type of copper indium gallium selenide, the copper zinc tin sulfide has rich and nontoxic components and lower preparation cost. Compared with a perovskite solar cell, the copper-zinc-tin-sulfur solar cell has better stability. Therefore, the CZTS becomes a novel photoelectric material with the most prospect, low cost and environmental friendliness.
Up to now, the maximum recorded photoelectric conversion efficiency of the CZTS thin film solar cell in the laboratory is 12.62%, which is far from the theoretical limit value. The main reason for the low efficiency is the open circuit voltage (V)oc) The reason for the low open-circuit voltage is as follows: i) higher non-radiative recombination; ii) the diffusion length is lower; iii) severe band-tail effects; iiii) inversion defects are more abundant. In recent years, cationic doping has attracted much attention as a viable solution to suppress these problems. However, common doping metal cations (Ag and Cd) are not ideal due to their scarcity and toxicity. Other transition metals (such as Mn, Fe, Co or Ni) are multivalent and may form harmful deep defects.
Disclosure of Invention
The invention aims to provide a magnesium-doped copper-zinc-tin-sulfur thin film solar cell and a preparation method thereof, and aims to solve the problems that the material performance of the existing copper-zinc-tin-sulfur thin film cation doping is poor, such as low carrier mobility, poor charge collection capability and more inversion defects, and finally the photoelectric conversion efficiency of the cell is low.
The technical solution for realizing the purpose of the invention is as follows: a magnesium-doped copper-zinc-tin-sulfur thin film solar cell and a preparation method thereof comprise the following specific steps:
(1) preparing a Mo electrode on a glass substrate;
(2) preparing a precursor film on the Mo electrode by using a magnesium-doped copper-zinc-tin-sulfur precursor solution and adopting a spin-coating method;
(3) vulcanizing the precursor film at high temperature to prepare an absorption layer;
(4) preparing a buffer layer on the absorption layer;
(5) preparing a transparent conductive window layer on the buffer layer;
(6) a top electrode is prepared on the window layer.
Preferably, in the step (1), the Mo electrode has a double-layer structure, and includes a high-resistance layer and a low-resistance layer Mo thin film, the thicknesses of the Mo thin film are 250nm and 1250nm, respectively, and the Mo thin film is obtained by a direct current sputtering method.
Preferably, in the step (2), copper chloride, magnesium acetate, zinc chloride and stannous chloride are used as metal sources, thiourea is used as a sulfur source, dimethylformamide is used as a solvent, and a magnesium-doped copper-zinc-tin-sulfur precursor solution is prepared, wherein the concentrations of copper chloride and stannous chloride in the precursor solution are respectively 0.6mol/L and 0.36 mol/L, the total concentration of magnesium acetate and zinc chloride is 0.44mol/L, the atomic molar ratio Mg/(Mg + Zn) = 4-6%, and the concentration of thiourea is 2.8 mol/L.
Specifically, in the step (2), the preparation process of the magnesium-doped copper-zinc-tin-sulfur precursor solution is as follows: dissolving a metal source in a solvent, sealing, and stirring in a water bath at 50 ℃ for 15 minutes; adding thiourea, and continuously sealing the water bath at 50 ℃ and stirring for 50 minutes; and after the reaction is finished, carrying out centrifugal treatment at the centrifugal rotation speed of 8000 rpm for 5 minutes to obtain the magnesium-doped copper-zinc-tin-sulfur precursor solution.
Preferably, in the step (2), the number of spin coating is 10-15.
Specifically, in the step (2), the spin coating process is as follows: uniformly coating the magnesium-doped copper-zinc-tin-sulfur precursor solution on a Mo electrode, starting a spin coater to spin at a low speed of 700 rpm for 5 seconds; and (3) performing high speed of 3000 r/min for 25 seconds, preheating at 300 ℃ for 3min, cooling at room temperature for 3min, and repeating the coating, preheating and cooling at room temperature for 10-15 times.
Preferably, in the step (3), the thickness of the absorption layer is 1 to 1.5 μm; the vulcanizing temperature is 650-655 ℃, the vulcanizing time is 30-40 minutes, and the working gas N2And the gas flow rate is 30 sccm.
Specifically, in the step (3), the high-temperature vulcanization process is as follows: setting the initial temperature of the vulcanization temperature to be 45-55 ℃, the heating rate to be 10 ℃/min, the final temperature to be 650-655 ℃ and the temperature in N2And (3) preserving heat and vulcanizing for 30-40 minutes in the atmosphere, ventilating at a flow rate of 30sccm, and naturally cooling to room temperature after the ventilation is finished.
Preferably, in the step (4), the buffer layer is cadmium sulfide (CdS) with a thickness of 50-60 nm and is obtained by deposition through a chemical water bath method.
Preferably, in the step (5), the transparent conductive window layer is an i-ZnO and ITO double-layer film, the thicknesses of the i-ZnO and ITO double-layer film are 35-55 nm and 400-500 nm in sequence, and the transparent conductive window layer is obtained by a radio frequency sputtering method.
Preferably, in step (6), the top electrode is made of silver alloy and is obtained by electron beam thermal evaporation.
Compared with the prior art, the invention has the following advantages: (1) the invention provides a safe, nontoxic and stable-valence-state preparation method of a cation-doped copper-zinc-tin-sulfur thin film solar cell, which is safe and simple to operate, rich in metal sources, environment-friendly and low in cost, and a saturated, uniform and stable precursor solution is obtained by heating in a water bath, stirring and centrifuging in the preparation process, and can be stored for one month; (2) the prepared magnesium-doped copper-zinc-tin-sulfur thin film solar cell has good crystal grain appearance, few pores, high carrier mobility, strong charge collection capacity and few defects.
Drawings
The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. Embodiments of various aspects of the present invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic structural diagram of a CMZTS thin film solar cell according to the present invention.
FIG. 2 is a schematic flow chart of the preparation method of the present invention.
FIG. 3 is an X-ray diffraction spectrum of a CMZTS film prepared in example 1 of the present invention.
FIG. 4 shows a Raman spectrum of a CMZTS film prepared in example 1 of the present invention.
FIG. 5 is a scanning electron microscope surface image of a CMZTS film prepared in example 1 of the present invention.
FIG. 6 is a scanning electron microscope cross-sectional view of a CMZTS film prepared in example 1 of the present invention.
FIG. 7 is an X-ray diffraction spectrum of a CMZTS film prepared in example 2 of the present invention.
FIG. 8 shows a Raman spectrum of a CMZTS film prepared in example 2 of the present invention.
FIG. 9 is a scanning electron microscope surface image of a CMZTS film prepared in example 2 of the present invention.
FIG. 10 is a scanning electron microscope cross-sectional view of a CMZTS film prepared in example 2 of the present invention.
Detailed Description
In order that the deposition sequence and the like of the present invention may be more clearly understood, the present invention will be described in further detail with reference to specific embodiments thereof, taken in conjunction with the accompanying drawings.
In order to better dope the cations, the invention uses a solution method, has simple preparation, low cost and good uniformity and can better control the doping amount of the cations. By optimizing the optimal doping amount, the problems of more inversion defects, poor carrier transmission performance and the like are solved, and finally the high-performance CZTS photoelectric device is prepared.
The preparation process of the magnesium-doped copper-zinc-tin-sulfur film (CMZTS) absorbing layer comprises the following three steps: first, preparing a precursor solution. And secondly, coating the solution on a Mo glass substrate by adopting a spin-coating method to prepare a precursor film. And thirdly, vulcanizing the precursor in a tubular vulcanizing furnace at high temperature to prepare the magnesium-doped copper-zinc-tin-sulfur (CMZTS) absorbing layer. The method is characterized in that the magnesium doping of the copper, zinc, tin and sulfur is realized by adopting a simple solution spin-coating method, and the method has the advantages of low cost, environmental protection, safety, no toxicity, stable and rich raw materials and the like. In addition, the doping of magnesium has a significant beneficial effect on the morphological and structural defects of the copper zinc tin sulfide thin film.
Referring to fig. 1, the CMZTS thin film solar cell of the present invention has a six-layer structure. The method comprises the following specific steps:
(1) the glass substrate is made of soda-lime glass and is about 2mm thick;
(2) the back electrode is a double-layer Mo film with the thickness of 1 μm;
(3) the CMZTS absorption layer is a magnesium-doped copper-zinc-tin-sulfur film, and the thickness of the film is 1-1.5 mu m;
(4) the buffer layer is a CdS film with the thickness of 50-60 nm;
(5) the transparent conductive window layer is an i-ZnO and ITO film, and the thickness of the transparent conductive window layer is 35-55 nm and 400-500 nm;
(6) the top electrode is an evaporated silver electrode.
The principle of the invention is as follows:
the magnesium-doped copper-zinc-tin-sulfur film not only solves the problem of doping cation Ag in the mainstream+,Cd+The thin film has larger crystal grains and less pores, which is beneficial to the carrier transmission. Magnesium substituted partial zinc reduces CuZnAcceptor defects and the presence of secondary phases is directly reduced due to the solution instability of MgS.
Example 1
The preparation method of the CMZTS thin film solar cell with the structure shown in FIG. 1 is given by the flow chart shown in FIG. 2.
In step T1, a double-layer Mo electrode was prepared on a glass substrate by a dc sputtering method, in which the high resistance layer was 250nm thick and the low resistance layer was 1250nm thick. Firstly, putting a glass substrate into a magnetron sputtering chamber, and vacuumizing to 5 multiplied by 10-4Pa; then 5.1sccm of high-purity argon gas is introduced as working gas, and the rotating speed of the substrate table is set to be 8.0 rpm. The first layer is a high-resistance layer Mo film sputtered with the sputtering power of 200W and the working gas pressure of 1.2Pa for 15 min; the second layer is sputtered with a low resistance layer Mo film, the sputtering power is 250W, the working air pressure is 0.3Pa, and the sputtering time is 100 min.
In the step T2, firstly, according to the concentration of each metal source and sulfur source in the prepared precursor solution, 0.6mol/L of copper chloride, 0.022 mol/L of magnesium acetate, 0.418 mol/L of zinc chloride and 0.36 mol/L of stannous chloride are weighed, dissolved in 20ml of dimethylformamide solvent, and then the mixture is sealed and stirred in water bath at 50 ℃ for 15 minutes; then adding 2.8 mol/L thiourea, and continuing sealing and stirring in water bath at 50 ℃ for 50 minutes; and after the reaction is finished, carrying out centrifugal treatment at the centrifugal rotation speed of 8000 rpm for 5 minutes to obtain a light yellow or almost transparent magnesium-doped copper-zinc-tin-sulfur precursor solution. Then, uniformly coating a proper amount of precursor solution on a Mo electrode of a glass substrate, starting a spin coater for spin coating, and carrying out low-speed rotation at 700 rpm for 5 seconds; high speed 3000 r/min for 25s to obtain wet precursor film; then transferring the wet precursor film to a hot plate for heating, wherein the temperature of the hot plate is 300 ℃, and the heating and cooling time is 3 minutes, thus obtaining a dry precursor film after the end; the processes of coating, preheating and cooling at room temperature are repeated for 10 times (namely the spin coating times are 10 times), and the magnesium-doped copper-zinc-tin-sulfur precursor film with the thickness of 1 mu m can be obtained.
In step T3, the mg-doped znsn precursor film is high-temperature vulcanized to prepare the absorption layer, which comprises the following steps: sublimed sulfur powder is weighed according to 0.23 gram liter of sulfur powder (excessive) of each sample, the sublimed sulfur powder is evenly spread at the bottom of the graphite boat, and then a precursor film sample is taken and placed in the graphite boat. Setting the initial temperature of the vulcanization temperature to be 50 ℃, the heating rate to be 10 ℃/min and the final temperature to be 650 ℃ and keeping the temperature at N2And (3) preserving the heat and vulcanizing for 30 minutes in the atmosphere, ventilating for 30sccm, and pushing the furnace body to naturally cool after the ventilation is finished to obtain the magnesium-doped copper-zinc-tin-sulfur film (CMZTS) absorption layer.
In the step T4, a chemical water bath method is adopted to prepare a cadmium sulfide (CdS) film on the CMZTS absorption layer as a buffer layer, and the thickness is 50-60 nm. Adding 10mL of 0.01mol/L cadmium acetate, 12mL of 1mol/L thiourea, 8mL of 1mol/L ammonium acetate and 15mL of 25-28% ammonia water into 400mL of deionized water, heating to 80-85 ℃, and keeping for 12 min; the sample was then removed and dried in a drying oven.
In the step T5, firstly preparing an i-ZnO film with the thickness of 55nm on the buffer layer by adopting a radio frequency sputtering method; and sputtering a layer of ITO film with the thickness of 450nm to be used as a transparent conductive window layer. Wherein the sputtering power of the i-ZnO film is 70-80W, the working air pressure is 0.5Pa, and the sputtering time is 20 min; the sputtering power of the ITO film is 70-80W, the working air pressure is 0.3Pa, and the sputtering time is 50 min.
In step T6, a silver electrode is prepared as a top electrode on the transparent conductive window layer using an electron beam evaporation method. When the silver film is evaporated, the deposition rate is controlled to be 0.5-0.8 nm/s, the oxygen charging amount is controlled to be 20-25 sccm, the ion beam voltage is 115-145V, the ion beam current is controlled to be 3-7A, and the deposition time is controlled.
FIG. 3 is an X-ray diffraction pattern of the CMZTS absorber film described in example 1, from which it can be seen that a diffraction peak of molybdenum appears at a diffraction angle of 40.46 deg.. Wherein the diffraction peak of the CMZTS is consistent with the standard peak of kesterite (JCPDS: 26-0575), which indicates that the prepared CMZTS film is zincA cassiterite structure. The figure clearly shows that the crystal grains preferentially grow on the (112), (220) and (312) crystal planes, which indicates that the diffraction peak position of CZTS is not greatly changed by a small amount of magnesium doping, and the diffraction peak is higher, the half-height width is narrower, and the crystallinity is good. FIG. 4 is a Raman spectrum of the CMZTS absorbing film of example 1. As can be seen from the figure, at a wavenumber of 251cm-1、287 cm-1、335 cm-1、366 cm-1The appearance of a characteristic scattering peak is approximately consistent with the Raman spectrum characteristic peak of the CZTS film, and no ZnS scattering peak appears, which indicates that the CMZTS film obtained after doping a small amount of magnesium is single-phase. As can be seen from fig. 3 and 4, no peak positions of Mg and MgS appear, indicating that Mg atoms are well incorporated into the lattice of CZTS. FIGS. 5 and 6 are a surface view and a cross-sectional view, respectively, of a field emission scanning electron microscope of the CMZTS film prepared in example 1. The surface plot of fig. 5 and the cross-sectional plot of fig. 6 show that the CMZTS film prepared in example 1 has a dense morphology, no cracks, no pores, less secondary phases, larger grain size, and fewer fine grains, which helps to improve the carrier transport properties.
Example 2
In example 2, the steps T1 and T3-T6 are the same as those in example 1, the main difference is that in example 2, the concentration of magnesium acetate in the T2 step is 0.0264mol/L, the concentration of zinc chloride is 0.4136mol/L, and the rest are the same. The present example is intended to illustrate that, without changing other conditions, a CMZTS thin-film solar cell with a large crystal grain size, few voids, good crystal quality, and a large carrier mobility can be obtained by only appropriately changing the doping concentration of magnesium (here, the atomic molar ratio Mg/(Mg + Zn) = 4-6%). When the doping amount of magnesium is less than the doping range of the embodiment, the doping effect is not ideal, and the performance improvement is not obvious; when the doping amount of magnesium is larger than the doping range of this embodiment, the grain size and the crystalline quality of the absorption layer will gradually deteriorate and the delamination is severe with the increase of the doping amount; when magnesium completely replaces zinc, a kesterite structure cannot be formed; this fully demonstrates that only a modest amount of magnesium doping has a gain effect on the copper zinc tin sulfide thin film solar cell.
Comparing the X-ray diffraction spectra of FIG. 7 and FIG. 3As can be seen, the diffraction peak of CMZTS of example 2 is consistent with the standard peaks of examples 1 and kesterite (JCPDS: 26-0575), and the crystal grains preferentially grow on the (112), (220) and (312) crystal planes, and the diffraction peak is high, the half height width is narrow, indicating that the crystallinity is good. As can be seen from the Raman spectrum of FIG. 8, example 2 is at 284 cm-1、335 cm-1、366 cm-1The diffraction peak was slightly shifted from the Raman spectrum of example 1, and no ZnS scattering peak was observed, and the CMZTS film was a single phase. The surface diagram of fig. 9 and the cross-sectional diagram of fig. 10 show that the CMZTS film prepared in example 2 has substantially uniform surface grains, no cracks, no pores, less secondary phases, denser cross-sectional grains, less fine grains, and more favorable improvement in carrier transport properties than example 1.
The above embodiments are further described in detail to illustrate the objects, technical solutions and advantages of the present invention, and it should be understood that the above embodiments are only exemplary of the present invention and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A preparation method of a magnesium-doped copper-zinc-tin-sulfur thin film solar cell is characterized by comprising the following specific steps:
preparing a Mo electrode on a glass substrate;
on the Mo electrode, preparing a magnesium-doped copper-zinc-tin-sulfur precursor film by adopting a precursor solution and adopting a spin-coating method;
vulcanizing the precursor film at high temperature to prepare an absorption layer;
preparing a buffer layer on the absorption layer;
preparing a transparent conductive window layer on the buffer layer;
a top electrode is prepared on the window layer.
2. The method of claim 1, wherein in the step (1), the Mo electrode has a double-layer structure including Mo thin films of a high resistance layer and a low resistance layer, whose thicknesses are 250nm and 1250nm, respectively, obtained by a dc sputtering method.
3. The method of claim 1, wherein in the step (2), copper chloride, magnesium acetate, zinc chloride and stannous chloride are used as metal sources, thiourea is used as a sulfur source, dimethylformamide is used as a solvent, and a magnesium-doped copper-zinc-tin-sulfur precursor solution is prepared, wherein the concentrations of the copper chloride and the stannous chloride in the precursor solution are respectively 0.6mol/L and 0.36 mol/L, the total concentration of the magnesium acetate and the zinc chloride is 0.44mol/L, the atomic molar ratio Mg/(Mg + Zn) = 4-6%, and the concentration of the thiourea is 2.8 mol/L.
4. The method of claim 1, wherein in step (2), the precursor solution is prepared as follows: dissolving a metal source in a solvent, sealing, and stirring in a water bath at 50 ℃ for 15 minutes; adding thiourea, and continuously sealing the water bath at 50 ℃ and stirring for 50 minutes; and after the reaction is finished, carrying out centrifugal treatment at the centrifugal rotation speed of 8000 rpm for 5 minutes to obtain the precursor solution.
5. The method according to claim 1, wherein the number of spin-coating in step (2) is 10 to 15.
6. The method of claim 1, wherein the spin coating process in step (2) is as follows: uniformly coating the magnesium-doped copper-zinc-tin-sulfur precursor solution on a Mo electrode, starting a spin coater to spin at a low speed of 700 rpm for 5 seconds; high speed 3000 r/min for 25s, preheating at 300 deg.C for 3min, and cooling at room temperature for 3 min.
7. The method according to claim 1, wherein in the step (3), the thickness of the absorption layer is 1 to 1.5 μm; the vulcanizing temperature is 650-655 ℃, the vulcanizing time is 30-40 minutes, and the working gas N2And the gas flow rate is 30 sccm.
8. The method of claim 1The method is characterized in that in the step (3), the high-temperature vulcanization process is as follows: setting the initial temperature of the vulcanization temperature to be 45-55 ℃, the heating rate to be 10 ℃/min, the final temperature to be 650-655 ℃ and the temperature in N2And (3) preserving heat and vulcanizing for 30-40 minutes in the atmosphere, ventilating at a flow rate of 30sccm, and naturally cooling to room temperature after the ventilation is finished.
9. The method of claim 1, wherein in the step (4), the buffer layer is cadmium sulfide with a thickness of 50-60 nm and is obtained by chemical water bath deposition.
10. The method of claim 1, wherein in the step (5), the transparent conductive window layer is a double-layer film of i-ZnO and ITO having a thickness of 35 to 55nm and a thickness of 400 to 500nm in this order, and is obtained by a radio frequency sputtering method.
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