CN111310403A - PCB pad intelligent modification technology - Google Patents
PCB pad intelligent modification technology Download PDFInfo
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- CN111310403A CN111310403A CN201811407455.XA CN201811407455A CN111310403A CN 111310403 A CN111310403 A CN 111310403A CN 201811407455 A CN201811407455 A CN 201811407455A CN 111310403 A CN111310403 A CN 111310403A
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Abstract
The invention discloses a PCB pad intelligent modification technology, which is characterized in that a pad is identified according to the existing rules in a system by analyzing a Gerber file of a PCB steel mesh to be modified, so that specific elements such as 0201 resistor and capacitor elements, 0402 resistor and capacitor elements, IC elements with four-side pins, BGA, PGA and other packaged chip ICs are identified. Then, the corresponding pad for replacement is found according to the rule, and the current position of the element is replaced by the pad specified in the rule. The method has the advantages of simple operation, rapid analysis, automatic modification and accurate data, and greatly improves the efficiency and reduces the operation difficulty and the learning cost of operators compared with the traditional modification method.
Description
Technical Field
The invention relates to the technical field of intelligent modification, in particular to a PCB pad intelligent modification technology.
Background
Before the PCB is used for mounting electronic components, solder paste is printed on a PCB bonding pad, the shape of a solder paste printing area is equal to that of the PCB bonding pad, and the solder paste printing area is realized by hollowing out a bonding pad area through a steel mesh. After a PCB design company sends a designed PCB pad as an independent layer to a steel mesh manufacturing company in a Gerber file form, the steel mesh manufacturing company edits and modifies the shape of the pad according to the production process of steel mesh manufacturing equipment and the requirement of electrical performance optimization, so that the electrical performance of the shape of a solder paste area is more reliable after the solder paste area is welded with an electronic element. At present, the steel mesh manufacturing company edits the bonding pad by adopting CAM software of a foreign software company, the software is expensive, and service fee is collected according to the quantity of steel mesh production every year, so that most of profit is given to the foreign company. The current CAM software requires operators to have certain electronic technical knowledge and CAM software use experience, so that the technical requirements and workload of pad modifying personnel and PCB design engineers are not greatly different, and a steel mesh manufacturing company has long training time for workers and high cost.
Disclosure of Invention
The invention aims to provide a PCB pad intelligent modification technology to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the intelligent PCB pad modifying technology includes establishing modifying rule and utilizing the rule to modify pad automatically; the method is characterized in that: the establishment of the modification rule comprises the steps of manually adding the rule and machine learning to add the rule; selecting all bonding pads of a certain element in a PCB preview area by using a mouse frame, clicking a right button, selecting and creating the element in a popup menu, identifying the bonding pads as the same element, analyzing the graphic characteristics of the bonding pads and storing the graphic characteristics as a basis for searching the type of element in a new PCB at a later stage; selecting a new bonding pad for replacing the bonding pad of the current element in a drop-down list of the candidate bonding pads; clicking the 'new rule', prompting the system to input a new rule name, and finishing the creation of the rule; the machine learning addition rule comprises the steps that software analyzes the steel mesh files edited by the steel mesh of a steel mesh manufacturing company and extracts the rule; the first step is to open a learning rule interface; opening an original steel mesh Gerber file of a PCB design company; opening a Gerber file edited by a steel mesh manufacturing company on an original steel mesh; and fourthly, clicking 'start learning'.
Firstly, software utilizes the existing rule of a system to identify pads which are possibly suitable for the existing rule in an original steel mesh, the pads are filtered out and are not compared, and the remaining pads are compared with the original steel mesh file and the graph of the edited steel mesh file to change back and forth, so that the pads with differences are found out; analyzing the differential pads in the steel mesh file after being edited by a steel mesh manufacturing company, so as to identify which pads the element consists of and the position relation between the pads; finding the corresponding bonding pads in the current element and the edited steel mesh file in the original steel mesh file, analyzing the graphic characteristics of the bonding pads and recording the characteristics to be characterized as a basis for identifying the current element in the new steel mesh file at a later stage; extracting the shape of a bonding pad of the current element in a steel mesh file edited by a steel mesh manufacturing company, and only recording the pattern of the left bonding pad to generate a new rule of the current element; filtering out the bonding pads corresponding to the elements with the same type as the current element in the original steel mesh file by using the generated new rule, and preventing the same element from repeatedly creating the rule; and repeating the steps until all the bonding pads are analyzed.
A certain number of pads are available as candidates in the system, and if the required pad system is not available, the pads can be added or boxed in the target file display area of the learning rule interface with the graphic editor and the "import pad" below clicked.
The right bonding pad of the element can be obtained by mirror image, the upper bonding pad and the lower bonding pad can be obtained by left rotation 90 degrees and right rotation 90 degrees, and the bonding pad of the IC element has no upper, lower, left and right parts, so that the bonding pad is only recorded as a left bonding pad.
And opening the steel mesh file to be modified, wherein the system identifies the elements of the existing bonding pads of the steel mesh file system, the bonding pads stored in the rule are used as modification candidate bonding pads to be sent to an operator, and after all the bonding pads are analyzed, the system displays the identified elements and the identified number in a rule identification result list. If the operator confirms that the rule is correct, the operator clicks the 'execution recognition result', and the system automatically replaces and modifies the recognized bonding pads of the elements by the corresponding bonding pads in the rule.
Compared with the prior art, the invention has the beneficial effects that:
the PCB pad intelligent modification technology is characterized in that a pad is identified according to existing rules in a system by analyzing a Gerber file of a PCB steel mesh to be modified, so that specific elements such as 0201 resistor and capacitor elements, 0402 resistor and capacitor elements, IC elements with four-side pins, BGA, PGA and other packaged chip ICs are identified. Then, the corresponding pad for replacement is found according to the rule, and the pad in the rule is used for replacement at the current position of the element. The method has the advantages of simple operation, rapid analysis, automatic modification and accurate data, and greatly improves the efficiency and reduces the operation difficulty and the learning cost of operators compared with the traditional modification method.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The intelligent PCB pad modifying technology includes establishing modifying rule and utilizing the rule to modify pad automatically; the method is characterized in that: the establishment of the modification rule comprises the steps of manually adding the rule and machine learning to add the rule; selecting all bonding pads of a certain element in a PCB preview area by using a mouse frame, clicking a right button, selecting and creating the element in a popup menu, identifying the bonding pads as the same element, analyzing the graphic characteristics of the bonding pads and storing the graphic characteristics as a basis for searching the type of element in a new PCB at a later stage; selecting a new bonding pad for replacing the bonding pad of the current element in a drop-down list of the candidate bonding pads; clicking the 'new rule', prompting the system to input a new rule name, and finishing the creation of the rule; the machine learning addition rule comprises the steps that software analyzes the steel mesh files edited by the steel mesh of a steel mesh manufacturing company and extracts the rule; the first step is to open a learning rule interface; opening an original steel mesh Gerber file of a PCB design company; opening a Gerber file edited by a steel mesh manufacturing company on an original steel mesh; and fourthly, clicking 'start learning'.
Firstly, software utilizes the existing rule of a system to identify pads which are possibly suitable for the existing rule in an original steel mesh, the pads are filtered out and are not compared, and the remaining pads are compared with the original steel mesh file and the graph of the edited steel mesh file to change back and forth, so that the pads with differences are found out; analyzing the differential pads in the steel mesh file after being edited by a steel mesh manufacturing company, so as to identify which pads the element consists of and the position relation between the pads; finding the corresponding bonding pads in the current element and the edited steel mesh file in the original steel mesh file, analyzing the graphic characteristics of the bonding pads and recording the characteristics to be characterized as a basis for identifying the current element in the new steel mesh file at a later stage; extracting the shape of a bonding pad of the current element in a steel mesh file edited by a steel mesh manufacturing company, and only recording the pattern of the left bonding pad to generate a new rule of the current element; filtering out the bonding pads corresponding to the elements with the same type as the current element in the original steel mesh file by using the generated new rule, and preventing the same element from repeatedly creating the rule; and repeating the steps until all the bonding pads are analyzed.
A certain number of pads are available as candidates in the system, and if the required pad system is not available, the pads can be added or boxed in the target file display area of the learning rule interface with the graphic editor and the "import pad" below clicked.
The right bonding pad of the element can be obtained by mirror image, the upper bonding pad and the lower bonding pad can be obtained by left rotation 90 degrees and right rotation 90 degrees, and the bonding pad of the IC element has no upper, lower, left and right parts, so that the bonding pad is only recorded as a left bonding pad.
And opening the steel mesh file to be modified, wherein the system identifies the elements of the existing bonding pads of the steel mesh file system, the bonding pads stored in the rule are used as modification candidate bonding pads to be sent to an operator, and after all the bonding pads are analyzed, the system displays the identified elements and the identified number in a rule identification result list. If the operator confirms that the rule is correct, the operator clicks the 'execution recognition result', and the system automatically replaces and modifies the recognized bonding pads of the elements by the corresponding bonding pads in the rule.
The PCB pad intelligent modification technology is characterized in that a pad is identified according to existing rules in a system by analyzing a Gerber file of a PCB steel mesh to be modified, so that specific elements such as 0201 resistor and capacitor elements, 0402 resistor and capacitor elements, IC elements with four-side pins, BGA, PGA and other packaged chip ICs are identified. Then, the corresponding pad for replacement is found according to the rule, and the pad in the rule is used for replacement at the current position of the element. The method has the advantages of simple operation, rapid analysis, automatic modification and accurate data, and greatly improves the efficiency and reduces the operation difficulty and the learning cost of operators compared with the traditional modification method.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The intelligent PCB pad modifying technology includes establishing modifying rule and utilizing the rule to modify pad automatically; the method is characterized in that: the establishment of the modification rule comprises the steps of manually adding the rule and machine learning to add the rule; selecting all bonding pads of a certain element in a PCB preview area by using a mouse frame, clicking a right button, selecting and creating the element in a popup menu, identifying the bonding pads as the same element, analyzing the graphic characteristics of the bonding pads and storing the graphic characteristics as a basis for searching the type of element in a new PCB at a later stage; selecting a new bonding pad for replacing the bonding pad of the current element in a drop-down list of the candidate bonding pads; clicking the 'new rule', prompting the system to input a new rule name, and finishing the creation of the rule; the machine learning addition rule comprises the steps that software analyzes steel mesh files stored by a steel mesh manufacturing company before and extracts rules; the first step is to open a learning rule interface; opening an original steel mesh Gerber file of a PCB design company; opening a Gerber file edited by a steel mesh manufacturing company on an original steel mesh; and fourthly, clicking to start learning, and analyzing the original steel mesh file and the edited file and extracting rules by the system.
2. The PCB pad intelligent modification technique of claim 1, wherein: firstly, software utilizes the existing rule of a system to identify pads which are possibly suitable for the existing rule in an original steel mesh, the pads are filtered out and are not compared, and the remaining pads are compared with the original steel mesh file and the graph of the edited steel mesh file to change back and forth, so that the pads with differences are found out; analyzing the differential pads in the steel mesh file after being edited by a steel mesh manufacturing company, so as to identify which pads the element consists of and the position relation between the pads; finding the corresponding bonding pads in the current element and the edited steel mesh file in the original steel mesh file, analyzing the graphic characteristics of the bonding pads and recording the characteristics to be characterized as a basis for identifying the current element in the new steel mesh file at a later stage; extracting the shape of a bonding pad of the current element in a steel mesh file edited by a steel mesh manufacturing company, and only recording the pattern of the bonding pad on the left side of the element to generate a new rule of the current element; filtering out the bonding pads corresponding to the elements with the same type as the current element in the original steel mesh file by using the generated new rule, and preventing the same element from repeatedly creating the rule; and repeating the steps until all the bonding pads are analyzed.
3. The PCB pad intelligent modification technique of claim 1, wherein: a certain number of pads are available as candidates in the system, and if the required pad system is not available, the pads can be added or boxed in the target file display area of the learning rule interface with the graphic editor and the "import pad" below clicked.
4. The PCB pad intelligent modification technique of claim 1, wherein: the right bonding pad of the element can be obtained by mirror image, the upper bonding pad and the lower bonding pad can be obtained by left rotation 90 degrees and right rotation 90 degrees, and the bonding pad of the IC element has no upper, lower, left and right parts, so that the bonding pad is only recorded as a left bonding pad.
5. The PCB pad intelligent modification technique of claim 1, wherein: opening a steel mesh file to be modified, wherein the system identifies the elements of the steel mesh file by using existing bonding pads of the system, and uses the bonding pads stored in the rules as modification candidate bonding pads to an operator, and after all the bonding pads are analyzed, the system displays the applicable rules in a rule identification result list and identifies the elements and the number of the elements by each rule; if the operator confirms that the rule is correct, the operator clicks the 'execution recognition result', and the system automatically replaces and modifies the recognized bonding pads of the elements by the corresponding bonding pads in the rule.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811407455.XA CN111310403A (en) | 2018-11-23 | 2018-11-23 | PCB pad intelligent modification technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811407455.XA CN111310403A (en) | 2018-11-23 | 2018-11-23 | PCB pad intelligent modification technology |
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| CN111310403A true CN111310403A (en) | 2020-06-19 |
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| CN201811407455.XA Pending CN111310403A (en) | 2018-11-23 | 2018-11-23 | PCB pad intelligent modification technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076772A (en) * | 2020-08-19 | 2022-02-22 | 万润科技股份有限公司 | Circuit board checking equipment and layer editing and repairing teaching method thereof |
| CN115758793A (en) * | 2022-12-06 | 2023-03-07 | 惠州市乐亿通科技有限公司 | Method for evaluating manufacturability of PCB (printed Circuit Board) pad based on gerber file |
| CN117473941A (en) * | 2023-12-28 | 2024-01-30 | 广东美创希科技有限公司 | Drawing processing method and device, electronic equipment and storage medium |
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