CN111290096A - Packaging device for miniaturized high-performance reflection-type device - Google Patents
Packaging device for miniaturized high-performance reflection-type device Download PDFInfo
- Publication number
- CN111290096A CN111290096A CN201811500358.5A CN201811500358A CN111290096A CN 111290096 A CN111290096 A CN 111290096A CN 201811500358 A CN201811500358 A CN 201811500358A CN 111290096 A CN111290096 A CN 111290096A
- Authority
- CN
- China
- Prior art keywords
- lens
- pipe cap
- base
- miniaturized high
- mems chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 1
- 230000007774 longterm Effects 0.000 abstract description 4
- 239000003292 glue Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Micromachines (AREA)
- Led Device Packages (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
The invention discloses a packaging device of a miniaturized high-performance reflection-type device, which comprises a TO pipe cap, a TO base, a lens, a window sheet and an MEMS chip, wherein the TO base is provided with a PIN PIN; the top wall of the TO pipe cap is provided with a through hole, and the window sheet is fixed on the inner side of the top wall of the TO pipe cap in a welding mode through glass solders; the lens corresponds the through-hole setting and through sticky and TO pipe cap roof fixed connection. By adopting the structure, the packaging structure of the MEMS chip adopts an airtight design, and the long-term reliability is high; in addition, the bonding area of the lens and the glue is small, so that the stress borne by the lens is very small, and the PDL brought to the whole light path by the stress is effectively reduced.
Description
Technical Field
The invention relates to the field of optical communication devices, in particular to a packaging device of a miniaturized high-performance reflection type device.
Background
At present, MEMS of a common VOA device is not subjected to airtight packaging, and an MEMS chip belongs to an element sensitive to water vapor, so that the long-term reliability of the conventional VOA device without airtight packaging is not good.
Disclosure of Invention
The invention aims to provide a packaging device of a miniaturized high-performance reflection type device with high long-term reliability and small PDL.
In order to achieve the purpose, the invention adopts the following technical scheme:
a packaging device for a miniaturized high-performance reflective device comprises a TO pipe cap, a TO base, a lens, a window sheet and an MEMS chip, wherein the TO base is provided with a PIN PIN, the MEMS chip is connected TO the TO base and electrically connected with the PIN PIN, the bottom of the TO pipe cap is connected with the TO base into a whole through current welding, a sealed cavity is formed inside the TO pipe cap, and the MEMS chip is packaged in the sealed cavity; the top wall of the TO pipe cap is provided with a through hole, and the window sheet is fixed on the inner side of the top wall of the TO pipe cap in a welding mode through glass solders; the lens corresponds the through-hole setting and through sticky and TO pipe cap roof fixed connection.
The lower part of the lens is fixedly sleeved on the hole wall of the through hole through gluing.
The thickness of TO pipe cap roof is 0.5~1 mm.
The lens external fixation cover is equipped with the glass pipe, and the lower terminal surface of glass pipe passes through sticky top surface fixed connection with the TO pipe cap.
The lens is a spherical lens, an aspheric lens or a self-focusing lens with a cylindrical or square side wall.
By adopting the technical scheme, the packaging structure of the MEMS chip adopts an airtight design, so that the long-term reliability is high; in addition, the bonding area of the lens and the glue is small, so that the stress borne by the lens is very small, and the PDL brought to the whole light path by the stress is effectively reduced.
Drawings
The invention is described in further detail below with reference to the following figures and detailed description:
FIG. 1 is a schematic view of example 1 of the present invention;
fig. 2 is a schematic view of embodiment 2 of the present invention.
Detailed Description
As shown in fig. 1 or fig. 2, the packaging device of a miniaturized high-performance reflective device of the present invention includes a TO cap 1, a TO base 2, a lens 3, a window sheet 4 and an MEMS chip 5, wherein the TO base 2 has a PIN, the MEMS chip 5 is connected TO the TO base 2 and electrically connected TO the PIN, the bottom of the TO cap 1 is connected TO the TO base 2 by current welding TO form a whole and form a sealed cavity inside, and the MEMS chip 5 is packaged in the sealed cavity; the top wall of the TO pipe cap 1 is provided with a through hole, and the window sheet 4 is fixed on the inner side of the top wall of the TO pipe cap 1 through glass solder in a welding way; the lens 3 corresponds the through-hole setting and through sticky and TO cap 1 roof fixed connection.
The lens 3 may be a spherical lens, an aspherical lens or a self-focusing lens having a cylindrical or square sidewall.
In embodiment 1, as shown in fig. 1, the lower portion of the lens 3 is fixed on the wall of the through hole by adhesive, and the length of the adhesive between the lens 3 and the TO cap 1 is as short as possible TO support the lens 3. In order TO effectively fix the lens 3, the thickness of the top wall of the TO cap 1 is relatively thick, preferably 0.5-1 mm.
The process of example 1 is as follows: firstly, welding a window sheet 4 on a TO pipe cap 1 by using glass welding, and then welding the TO pipe cap 1 and a TO base 2 provided with an MEMS chip 5 by using current welding, so that the formed assembly has better air tightness; in the second step, a short part of the lower part of the lens 3 was glued TO the through hole of the TO cap 1.
Example 2, as shown in fig. 2, a glass tube 6 is fixedly sleeved outside the lens 3, and the lower end surface of the glass tube 6 is fixedly connected with the top surface of the TO cap 1 by gluing. Such an embodiment can reduce the bonding area between the lens 3 and the adhesive as much as possible, thereby effectively reducing the PDL caused by the stress of the adhesive to the entire optical path.
The process of example 2 is as follows: firstly, welding a window sheet 4 on a TO pipe cap 1 by using glass welding, and then welding the TO pipe cap 1 and a TO base 2 provided with an MEMS chip 5 by using current welding, so that the formed assembly has better air tightness; and secondly, gluing the lower end face of the glass tube outside the lens 3 on the top face of the TO tube cap 1.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. The utility model provides a packaging hardware of miniaturized high performance reflective device, includes TO pipe cap, TO base, lens, window piece and MEMS chip, the TO base has the PIN foot, and the MEMS chip is connected on the TO base and is connected its characterized in that with the PIN foot electricity: the bottom of the TO pipe cap is connected with the TO base through current welding TO form a whole, a sealed cavity is formed inside the TO pipe cap, and the MEMS chip is packaged in the sealed cavity; the top wall of the TO pipe cap is provided with a through hole, and the window sheet is fixed on the inner side of the top wall of the TO pipe cap in a welding mode through glass solders; the lens corresponds the through-hole setting and through sticky and TO pipe cap roof fixed connection.
2. The package for miniaturized high performance reflective devices of claim 1, wherein: the lower part of the lens is fixedly sleeved on the hole wall of the through hole through gluing.
3. The package for miniaturized high performance reflective devices of claim 2, wherein: the thickness of TO pipe cap roof is 0.5~1 mm.
4. The package for miniaturized high performance reflective devices of claim 1, wherein: the lens external fixation cover is equipped with the glass pipe, and the lower terminal surface of glass pipe passes through sticky top surface fixed connection with the TO pipe cap.
5. The package for miniaturized high performance reflective devices of claim 1, wherein: the lens is a spherical lens, an aspheric lens or a self-focusing lens with a cylindrical or square side wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811500358.5A CN111290096A (en) | 2018-12-07 | 2018-12-07 | Packaging device for miniaturized high-performance reflection-type device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811500358.5A CN111290096A (en) | 2018-12-07 | 2018-12-07 | Packaging device for miniaturized high-performance reflection-type device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111290096A true CN111290096A (en) | 2020-06-16 |
Family
ID=71028812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811500358.5A Pending CN111290096A (en) | 2018-12-07 | 2018-12-07 | Packaging device for miniaturized high-performance reflection-type device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111290096A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106154540A (en) * | 2016-06-30 | 2016-11-23 | 武汉光迅科技股份有限公司 | A kind of rotary mirror type MEMS variable optical attenuator |
-
2018
- 2018-12-07 CN CN201811500358.5A patent/CN111290096A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106154540A (en) * | 2016-06-30 | 2016-11-23 | 武汉光迅科技股份有限公司 | A kind of rotary mirror type MEMS variable optical attenuator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102645820A (en) | Camera module | |
| WO2005098945A2 (en) | Top finger having a groove and semiconductor device having the same | |
| CN111290096A (en) | Packaging device for miniaturized high-performance reflection-type device | |
| CN108459383B (en) | Optical coupling module and optical fiber connector | |
| CN201656243U (en) | Semiconductor laser with optical fiber coupled output | |
| CN105161975A (en) | All fiber coupled air-tight packaged small non-planar ring single frequency laser | |
| CN205879980U (en) | Quartz flexible accelerometer assembly | |
| CN111290081A (en) | Miniaturized high-performance variable attenuator | |
| CN209280949U (en) | Sensor module based on infrared proximity photoinduction | |
| CN207611173U (en) | A kind of high-speed light receiving unit of light path optimization design | |
| CN210838436U (en) | TO packaged semiconductor laser with built-in isolator capable of emitting light in parallel | |
| CN211858661U (en) | Chip packaging structure | |
| CN209417361U (en) | A kind of optical device packaging structure | |
| CN209296913U (en) | The automobile-used ultrasonic sensor of contact pin type | |
| CN207884885U (en) | Test the device of voice coil motor performance | |
| CN201050760Y (en) | Explosion-proof small-sized high voltage halogen streamer lamp | |
| CN202735593U (en) | Micro-electro-mechanical system variable optical attenuator (MEMS VOA) | |
| CN205787247U (en) | A kind of inner blocking type optical communication microsphere pipe cap | |
| CN105137741A (en) | Vibration-proof CSAC (chip-scale atomic clock) physical system | |
| JP2016122783A (en) | Vacuum-sealed module and manufacturing method thereof | |
| CN106252340B (en) | A kind of package of optical device device and packaging method | |
| CN215069928U (en) | Chip packaging structure | |
| CN112462476B (en) | Mini type refrigerationless short-wave SLD light source for micro optical fiber gyroscope | |
| JP3002833U (en) | Semiconductor laser | |
| CN209963080U (en) | Anti high-voltage rectifier diode packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200616 |
|
| RJ01 | Rejection of invention patent application after publication |