CN111277739A - Photosensitive assembly, lens module and electronic equipment - Google Patents
Photosensitive assembly, lens module and electronic equipment Download PDFInfo
- Publication number
- CN111277739A CN111277739A CN202010093031.1A CN202010093031A CN111277739A CN 111277739 A CN111277739 A CN 111277739A CN 202010093031 A CN202010093031 A CN 202010093031A CN 111277739 A CN111277739 A CN 111277739A
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- China
- Prior art keywords
- photosensitive
- telescopic layer
- lens
- layer
- chip
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The application discloses sensitization chip, camera lens module and electronic equipment. Wherein, photosensitive chip includes: circuit board, flexible layer and sensitization chip. The circuit board includes a first surface including a mounting area. The telescopic layer is arranged in the mounting area. The photosensitive chip is located on the surface of the telescopic layer, which is far away from the mounting area. The telescopic layer is configured to generate elastic deformation under the action of voltage so as to change the distance between the photosensitive chip and the lens group. Consequently, the flexible layer and the sensitization chip direct contact of this application to accessible elastic deformation is in order to change the interval between sensitization chip and the mirror group, so that the image distance of the fingerprint module after the equipment is in the theoretical value, thereby promotes the recognition rate of fingerprint module and improves the unblock rate of fingerprint module.
Description
Technical Field
The application relates to the technical field of biological identification, in particular to a photosensitive assembly, a lens module and an electronic device.
Background
The fingerprint module is the vital subassembly on the electronic equipment, and it is used for accomplishing the collection and the discernment work of fingerprint. At present, a fingerprint module comprises a lens barrel, a lens, an optical filter, a photosensitive chip and a circuit board, wherein the current fingerprint module is in fixed focus, namely, the object distance from a fingerprint to be identified to the lens and the image distance from the lens to the photosensitive chip are fixed values. However, in the assembling process of the fingerprint module, because the photosensitive chip, the lens barrel and the lens all have installation errors, so that the actual object distance and the image distance of the fingerprint module all have deviation from the theoretical value, thereby causing the image formed by the fingerprint on the photosensitive chip to be unclear, and causing the problems of poor recognition effect and low unlocking rate of the fingerprint module, and affecting the user experience.
Content of application
The application provides a sensitization chip, camera lens module and electronic equipment can effectively solve the poor and low problem of unblock rate of fingerprint module identification effect.
According to a first aspect of the present application, there is provided a photosensitive assembly comprising:
a circuit board comprising a first surface, the first surface comprising a mounting area;
the telescopic layer is arranged in the mounting area;
the photosensitive chip is positioned on the surface of the telescopic layer, which is far away from the mounting area;
the telescopic layer is configured to generate elastic deformation under the action of voltage so as to change the distance between the photosensitive chip and the lens group.
Optionally, in a direction perpendicular to the first surface, an orthogonal projection formed by the telescopic layer on the first surface completely covers an orthogonal projection formed by the photosensitive chip on the first surface.
Optionally, the circuit board comprises a second surface opposite the first surface; the photosensitive assembly further comprises a reinforcing plate, and the reinforcing plate is connected with the second surface.
Optionally, the photosensitive assembly further includes a filter, and the filter is located on a surface of the photosensitive chip away from the telescopic layer.
Optionally, in a direction perpendicular to the first surface, an orthogonal projection formed by the filter on the first surface is completely located within an orthogonal projection formed by the photosensitive chip on the first surface.
Optionally, the material of the elastic layer is an electroactive polymer.
According to a second aspect of the present application, there is provided a lens module, comprising:
the photosensitive assembly of any one of the above;
the lens cone comprises an image side end, the image side end is connected with the surface of the circuit board, which is provided with the telescopic layer, the lens cone and the circuit board jointly define an internal cavity, and the telescopic layer, the photosensitive chip and the optical filter are all positioned in the internal cavity; the lens barrel further comprises an object side end opposite to the image side end, and the object side end comprises a light inlet for allowing light to pass through the light inlet and irradiate the optical filter.
Optionally, the telescopic layer is circular; the lens cone limits an optical path axis, the optical path axis passes through the circle center of the telescopic layer, and the telescopic layer is attached to the first surface.
According to a third aspect of the present application, there is provided an electronic device comprising: the lens module is provided.
Optionally, the electronic device further includes a display screen, which is located on an object-side end of the lens and covers the light inlet; wherein, the display screen includes places the district with the fingerprint that goes into the light mouth and correspond to be used for the camera lens module to be used for gathering the light that carries fingerprint information.
The application provides a sensitization subassembly, including circuit board, flexible layer and sensitization chip. The circuit board includes a first surface including a mounting area. The telescopic layer is arranged in the mounting area. The photosensitive chip is located on the surface of the telescopic layer, which is far away from the mounting area. The telescopic layer is configured to generate elastic deformation under the action of voltage so as to change the distance between the photosensitive chip and the lens group. Consequently, the flexible layer and the sensitization chip direct contact of this application to accessible elastic deformation is in order to change the interval between sensitization chip and the mirror group, so that the image distance of the fingerprint module after the equipment is in the theoretical value, thereby promotes the recognition rate of fingerprint module and improves the unblock rate of fingerprint module.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a cross-sectional view of a lens module in the prior art;
FIG. 2 is a cross-sectional view of a photosensitive assembly according to a first embodiment of the present application, wherein the relative positions between the stretchable layer and the circuit board and between the stretchable layer and the photosensitive chip are illustrated;
FIG. 3 is a cross-sectional view of a photosensitive assembly according to a second embodiment of the present application, in which the relative positional relationship between a circuit board and a reinforcing plate is illustrated;
FIG. 4 is a cross-sectional view of a photosensitive assembly according to a third embodiment of the present application, wherein the relative position relationship between the filter and the photosensitive chip is shown;
fig. 5 is a cross-sectional view of a lens module according to a fourth embodiment of the present application.
The attached drawings indicate the following:
100a, a lens module, 100, a photosensitive assembly, 110, a circuit board, 111, a first surface, 112, a second surface, 120, a telescopic layer, 130, a photosensitive chip, 140, a reinforcing plate, 150, a filter, 200, a lens module, 210, a lens barrel, 211, an internal cavity, 212 and a light inlet.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
As shown in fig. 1, a lens module 100a in the prior art includes a circuit board 110, a photo sensor chip 120, a filter 130, a lens barrel 140 and a lens assembly 150. The light sensing chip 120 is located on one surface of the circuit board 110, the optical filter 130 is located on a surface of the light sensing chip 120 away from the circuit board 110, the lens barrel 140 is connected to the surface of the circuit board 110 where the light sensing chip 120 is located, the lens barrel 140 and the circuit board 110 jointly define an inner cavity 141, and the lens group 150, the light sensing chip 120 and the optical filter 130 are located in the inner cavity 141. The object distance and the image distance of the lens module 100a are fixed focus, that is, the object distance between the fingerprint to be recognized and the lens assembly 150 and the image distance between the lens assembly 150 and the photo sensor chip 120 are fixed values.
However, in the assembling process of the lens module 100a, since the photo sensor chip 120, the lens barrel 140 and the lens group 150 all have installation errors, so that the actual object distance and the image distance of the lens module 100a all have deviations from the theoretical values, the image formed by the fingerprint on the photo sensor chip 120 is unclear, and the problems of poor recognition effect and low unlocking rate of the fingerprint module are caused, thereby affecting the user experience.
In view of the above technical problem, as shown in fig. 2, the present embodiment provides a photosensitive assembly 100. The photosensitive assembly 100 includes a circuit board 110, a flexible layer 120, and a photosensitive chip 130. The circuit board 110 includes a first surface 111, and the first surface 111 includes a mounting area (not shown). The telescopic layer 120 is disposed at the installation area. It should be noted that the mounting area may be understood as a dedicated area reserved on the first surface 111 for disposing the telescopic layer 120, and the mounting area does not conflict with other areas of the first surface 111. The photosensitive chip 130 is located on a surface of the telescopic layer 120 facing away from the mounting area. The stretchable layer 120 is configured to elastically deform under the action of a voltage to change a distance between the photo sensor chip 130 and the mirror assembly (not shown). In this embodiment, the distance between the photo sensor chip 130 and the lens assembly can be understood as the image distance of the fingerprint to be recognized.
In this embodiment, flexible layer 120 and photosensitive chip 130 direct contact, just flexible layer 120 accessible circuit board 110 gives the voltage and takes place elastic deformation, and the elastic deformation of flexible layer 120 promotes photosensitive chip 130 and moves on the thickness direction of flexible layer 120 to change the interval between photosensitive chip 130 and the mirror group, and make the image distance that mirror group and photosensitive chip 130 formed be in the theoretical value, thereby promote fingerprint module's the recognition rate and improve fingerprint module's unblock rate.
The levelness between the stretchable layer 120 and the photosensitive chip 130 relates to the identification rate of the fingerprint module, and in this embodiment, in the direction perpendicular to the first surface 111, the orthographic projection of the stretchable layer 120 on the first surface 111 can completely cover the orthographic projection of the photosensitive chip 130 on the first surface 111.
The orthographic projection corresponding to the telescopic layer 120 completely covers the orthographic projection corresponding to the photosensitive chip 130, so that the surface area of the telescopic layer 120 is larger than or equal to the surface area of the photosensitive chip 130, and the surface area of the telescopic layer 120 is larger than the surface area of the photosensitive chip 130, so that the photosensitive chip 130 is completely positioned on the telescopic layer 120. Therefore, the telescopic layer 120 in this embodiment can also ensure that the levelness of each region of the photosensitive chip 130 is consistent, thereby improving the recognition rate of the fingerprint module.
In order to enhance the structural strength of the photosensitive assembly 100, as shown in fig. 3, in the second embodiment of the present application, the circuit board 110 includes a second surface 112 opposite to the first surface 111. And the photosensitive assembly 100 may further include a reinforcing plate 140, the reinforcing plate 140 being connected to the second surface 112. The reinforcing plate 140 and the second surface 112 of the circuit board 110 can be bonded, and the bonding manner can be double-sided adhesive bonding or glue dispensing. The material of the reinforcing plate 140 may be steel, and it should be understood that the reinforcing plate 140 may also be other materials, and the embodiment illustrates the reinforcing plate 140 made of steel only for illustrative purposes, and the specific material of the reinforcing plate 140 is not limited.
In this embodiment, the second surface 112 of the circuit board 110 is provided with the reinforcing plate 140 made of steel, and the steel has the characteristics of high structural strength and good wear resistance, so that the circuit board 110 can be provided with excellent protection performance, and the circuit board 110 can be reliably positioned, thereby improving the reliability of the photosensitive assembly 100.
As shown in fig. 4, in the third embodiment of the present application, the photosensitive assembly 100 may further include an optical filter 150, and the optical filter 150 is located on a surface of the photosensitive chip 130 away from the stretchable layer 120. In a direction perpendicular to the first surface 111, an orthogonal projection formed by the filter 150 on the first surface 111 is completely located within an orthogonal projection formed by the photosensitive chip 130 on the first surface 111.
In the above embodiment, the front projection corresponding to the optical filter 150 is completely located in the front projection corresponding to the light sensing chip 130, so that the surface area of the optical filter 150 is indirectly defined to be smaller than the surface area of the light sensing chip 130, and the surface area of the optical filter 150 is smaller than the surface area of the light sensing chip 130, so that the light transmitted through the optical filter 150 can completely irradiate on the light sensing chip 130. In addition, the optical filter 150 of the present embodiment can filter the optical interference to improve the fingerprint recognition rate of the photosensitive assembly 100.
The elastic layer 120 is made of Electroactive Polymers (EAP), which is a polymer material capable of changing its shape or size under the action of an electric field, and typically can be deformed greatly while maintaining a large force. It is understood that the elastic layer 120 may be other electrostrictive materials, for example, the elastic layer 120 may be lead zirconate titanate ceramic, etc. The specific material of the stretchable layer 120 is not limited in this embodiment.
As shown in fig. 5, in a fourth embodiment of the present application, a lens module 200 is provided, where the lens module 200 includes the photosensitive element 100, the lens barrel 210 and the lens group 220 of the above embodiments. The lens barrel 210 includes an image side end, the image side end is connected to the surface of the circuit board 110 on which the retractable layer 120 is disposed, the lens barrel 210 and the circuit board 110 together define an inner chamber 211, and the lens group 220, the retractable layer 120, the light sensing chip 130 and the optical filter 150 are disposed in the inner chamber 211. The lens barrel 210 further includes an object side end opposite to the image side end, and the object side end includes a light inlet 212, so that the light passes through the light inlet 212 and irradiates the optical filter 150. In this embodiment, a side of the lens barrel 210 facing the object is an object side end, and a side of the lens barrel 210 away from the object is an image side end.
In this embodiment, the lens module 200 provided with the telescopic layer 120 can significantly improve the fingerprint identification rate and the fingerprint unlocking rate, and improve the equipment reliability and the user experience.
The stretchable layer 120 may have any shape, and in this embodiment, the stretchable layer 120 may have a circular shape. The lens barrel 210 defines a light path axis 213, the light path axis 213 passes through a center of the telescopic layer 120, and the telescopic layer 120 is attached to the first surface 111. But not limited thereto, the flexible layer 120 may also be soldered to the circuit board 110, so that the flexible layer 120 is electrically connected to the circuit board 110. The specific connection manner between the stretchable layer 120 and the circuit board 110 is not limited in this embodiment, and the reason is the same as that in the above embodiments.
The optical path axis 213 passes through the center of the telescopic layer 120, so that the installation accuracy of the telescopic layer 120 can be ensured. The retractable layer 120 is electrically connected to the circuit board 110, and when the lens module 200 is in an operating state, the circuit board 110 provides a voltage to the retractable layer 120 to deform the retractable layer 120 and push the photosensitive chip 130 to move, so as to change an image distance of the lens module 200 and present a clear fingerprint image on the photosensitive chip 130. Therefore, the lens module 200 of the present embodiment can improve the fingerprint recognition rate.
The embodiment further provides an electronic device including the lens module 200. The electronic device provided by the embodiment can be any electronic product, including but not limited to the following categories: a television, a notebook computer, a desktop display, a tablet computer, a digital camera, a mobile phone, smart glasses, a vehicle-mounted display, a medical device, an industrial control device, etc., which is not particularly limited in this embodiment.
The electronic device further includes a display screen located on the object side of the lens and covering the light inlet 212. The display screen includes a fingerprint placement area corresponding to the light inlet 212 for collecting light rays carrying fingerprint information by the lens module 200.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the above terms will be understood by those skilled in the art according to the specific situation.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A photosensitive assembly, comprising:
a circuit board comprising a first surface, the first surface comprising a mounting area;
a telescopic layer arranged in the mounting area;
the photosensitive chip is positioned on the surface of the telescopic layer, which is far away from the mounting area;
the telescopic layer is configured to generate elastic deformation under the action of voltage so as to change the distance between the photosensitive chip and the lens group.
2. A photosensitive assembly according to claim 1,
in the direction perpendicular to the first surface, the orthographic projection formed by the telescopic layer on the first surface completely covers the orthographic projection formed by the photosensitive chip on the first surface.
3. A photosensitive assembly according to claim 1,
the circuit board comprises a second surface opposite to the first surface;
the photosensitive assembly further comprises a reinforcing plate, and the reinforcing plate is connected with the second surface.
4. A photosensitive assembly according to claim 1,
the photosensitive assembly further comprises an optical filter, and the optical filter is located on the surface, deviating from the telescopic layer, of the photosensitive chip.
5. A photosensitive assembly according to claim 4,
in the direction perpendicular to the first surface, the orthographic projection of the optical filter on the first surface is completely positioned in the orthographic projection of the photosensitive chip on the first surface.
6. A photosensitive assembly according to claim 1,
the material of the telescopic layer is electroactive polymer.
7. A lens module is characterized by comprising;
the photosensitive assembly of any one of claims 1-6;
the lens cone comprises an image side end, the image side end is connected with the surface of the circuit board, which is provided with the telescopic layer, the lens cone and the circuit board jointly define an inner cavity, and the telescopic layer, the photosensitive chip and the optical filter are all positioned in the inner cavity;
the lens barrel further comprises an object side end opposite to the image side end, and the object side end comprises a light inlet for light to pass through and irradiate the optical filter.
8. The electronic device of claim 7,
the telescopic layer is circular;
the lens barrel limits a light path axis, the light path axis passes through the circle center of the telescopic layer, and the telescopic layer is attached to the first surface.
9. An electronic device, comprising:
the lens module of claim 8.
10. The electronic device of claim 9,
the electronic equipment further comprises a display screen, wherein the display screen is positioned on the side of the object side of the lens and covers the light inlet;
the display screen comprises a fingerprint placing area corresponding to the light inlet, and the lens module is used for collecting light rays carrying fingerprint information.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010093031.1A CN111277739A (en) | 2020-02-14 | 2020-02-14 | Photosensitive assembly, lens module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010093031.1A CN111277739A (en) | 2020-02-14 | 2020-02-14 | Photosensitive assembly, lens module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111277739A true CN111277739A (en) | 2020-06-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010093031.1A Pending CN111277739A (en) | 2020-02-14 | 2020-02-14 | Photosensitive assembly, lens module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111277739A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108351966A (en) * | 2015-09-18 | 2018-07-31 | 辛纳普蒂克斯公司 | Optical fingerprint sensor encapsulates |
| CN108875622A (en) * | 2018-06-08 | 2018-11-23 | 维沃移动通信有限公司 | A kind of optical finger print recognizer component and terminal |
| CN110365890A (en) * | 2019-08-19 | 2019-10-22 | 珠海格力电器股份有限公司 | A kind of zoom camera mould group and mobile terminal |
-
2020
- 2020-02-14 CN CN202010093031.1A patent/CN111277739A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108351966A (en) * | 2015-09-18 | 2018-07-31 | 辛纳普蒂克斯公司 | Optical fingerprint sensor encapsulates |
| CN108875622A (en) * | 2018-06-08 | 2018-11-23 | 维沃移动通信有限公司 | A kind of optical finger print recognizer component and terminal |
| CN110365890A (en) * | 2019-08-19 | 2019-10-22 | 珠海格力电器股份有限公司 | A kind of zoom camera mould group and mobile terminal |
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Application publication date: 20200612 |
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