CN111274096B - Many I2C passageway temperature monitoring module and server - Google Patents

Many I2C passageway temperature monitoring module and server Download PDF

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Publication number
CN111274096B
CN111274096B CN202010154751.4A CN202010154751A CN111274096B CN 111274096 B CN111274096 B CN 111274096B CN 202010154751 A CN202010154751 A CN 202010154751A CN 111274096 B CN111274096 B CN 111274096B
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switch chip
temperature sensor
selection
bmc
smbus
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CN111274096A (en
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韩瑞龙
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Suzhou Inspur Intelligent Technology Co Ltd
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Suzhou Inspur Intelligent Technology Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/0796—Safety measures, i.e. ensuring safe condition in the event of error, e.g. for controlling element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)

Abstract

The invention provides a multi-I2C channel temperature monitoring module and a server, wherein the module comprises: the temperature sensor comprises a first temperature sensor and a second temperature sensor, wherein a first controllable resistor and a second controllable resistor are arranged between the sensors; BMC, BMC first SMBUS connected to the first temperature sensor via third and fourth controllable resistors; the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of the second SMBUS of the BMC through a fifth controllable resistor, and the first selection end of the second switch chip is connected to the other end of the second SMBUS of the BMC through a sixth controllable resistor; and the first SMBUS of the CPLD is connected to the second selection end of the first switch chip, and the second SMBUS of the CPLD is connected to the second selection end of the second switch chip. The scheme of the invention can solve the problem that the temperature monitoring value cannot be acquired due to different faults of the BMC.

Description

Many I2C passageway temperature monitoring module and server
Technical Field
The field relates to the field of computers, and more particularly to a multiple I2C channel temperature monitoring module and server.
Background
With the development of cloud computing and big data technology, the resource demand of a server system is improved, and a processor supplier realizes the integral upgrade of system resources by means of the improvement of the computing capacity of a processor and the upgrade of a multi-path processor platform, thereby greatly improving the data processing capacity of the whole system. The increase of the performance and the number of the processors improves the system resources and simultaneously increases the device density and the whole power consumption of the single board, and the heat dissipation capacity of the fan and the air duct design determine the rationality of the thermal design of the high-density board card. In order to meet the heat dissipation requirement, each chip on the board card is covered by radiators with different shapes, cables with various functions in the case further extrude the space of the case, the layout space of the device is reserved for rapid compression, and the distance between heat-generating devices is reduced.
Firstly, thermal simulation analysis of heat dissipation performance is necessary in the server design stage, and input parameters include the ambient temperature of the air inlet of the case, the wind speed, the thermal power consumption coefficient of a corresponding area and the like. The wind speed can be adjusted by regulating the rotating speed of the cooling fan, the thermal power consumption coefficient can be obtained in a chip data manual, and it is important to ensure that the set ambient temperature of the air inlet is consistent with the real condition in thermal simulation, namely, it is very critical to eliminate the influence of the temperature change of a heat-generating device on a board on a temperature sensor. Secondly, the temperature is monitored by an SMBUS (system management bus) bus temperature sensor which is commonly used at present, the bus hang-up condition is possibly caused by a single-channel BMC (substrate management controller) SMBUS, and the problems can be effectively solved by the design of a multi-channel SMBUS temperature monitoring circuit and a BMC monitoring mechanism.
Disclosure of Invention
In view of this, an embodiment of the present invention provides a multiple I2C channel temperature monitoring module and a server, and by using the module of the present invention, the problem that a temperature monitoring value cannot be obtained due to different faults of a BMC can be solved, the sampling precision of temperature monitoring at an air inlet can be further improved, and the functions of managing, controlling and avoiding the over-temperature protection risk of the server can be realized.
In view of the above object, an aspect of an embodiment of the present invention provides a multi I2C channel temperature monitoring module, including:
the temperature sensor comprises a first temperature sensor and a second temperature sensor, wherein a first controllable resistor and a second controllable resistor are arranged between the first temperature sensor and the second temperature sensor;
BMC, BMC first SMBUS connected to the first temperature sensor via third and fourth controllable resistors;
the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of the second SMBUS of the BMC through a fifth controllable resistor, and the first selection end of the second switch chip is connected to the other end of the second SMBUS of the BMC through a sixth controllable resistor;
and the CPLD (complex programmable logic device), wherein a first SMBUS of the CPLD is connected to the second selection end of the first switch chip, and a second SMBUS of the CPLD is connected to the second selection end of the second switch chip.
According to one embodiment of the invention, the controllable resistance is configured to be selectively connected to or disconnected from the module depending on the BMC state.
According to one embodiment of the invention, the first switch chip and the second switch chip are single pole double throw switch chips.
According to one embodiment of the invention, the first temperature sensor and the second temperature sensor are TS temperature sensors, model TMP112.
According to one embodiment of the invention, the control terminal of the CPLD is connected to the selection control terminals of the first switch chip and the second switch chip and configured to send a control signal to the selection control terminals so that the first switch chip and the second switch chip select the first selection terminal or the second selection terminal.
In another aspect of the embodiments of the present invention, there is also provided a server including a temperature monitoring module, the temperature monitoring module including:
the temperature sensor comprises a first temperature sensor and a second temperature sensor, wherein a first controllable resistor and a second controllable resistor are arranged between the first temperature sensor and the second temperature sensor;
BMC, BMC first SMBUS connected to the first temperature sensor via third and fourth controllable resistors;
the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of the second SMBUS of the BMC through a fifth controllable resistor, and the first selection end of the second switch chip is connected to the other end of the second SMBUS of the BMC through a sixth controllable resistor;
and the first SMBUS of the CPLD is connected to the second selection end of the first switch chip, and the second SMBUS of the CPLD is connected to the second selection end of the second switch chip.
According to one embodiment of the invention, the controllable resistance is configured to be selectively connected to or disconnected from the module depending on the BMC state.
According to one embodiment of the invention, the first switch chip and the second switch chip are single pole double throw switch chips.
According to one embodiment of the present invention, the first temperature sensor and the second temperature sensor are TS temperature sensors, model TMP112.
According to one embodiment of the invention, the control terminal of the CPLD is connected to the selection control terminals of the first switch chip and the second switch chip and configured to send a control signal to the selection control terminals so that the first switch chip and the second switch chip select the first selection terminal or the second selection terminal.
The invention has the following beneficial technical effects: according to the multi-I2C-channel temperature monitoring module provided by the embodiment of the invention, the first temperature sensor and the second temperature sensor are arranged, and the first controllable resistor and the second controllable resistor are arranged between the first sensor and the second temperature sensor; BMC, BMC first SMBUS connected to the first temperature sensor via third and fourth controllable resistances; the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of the second SMBUS of the BMC through the fifth controllable resistor, and the first selection end of the second switch chip is connected to the other end of the second SMBUS of the BMC through the sixth controllable resistor; CPLD, CPLD first SMBUS is connected to the second of first switch chip and selects the end, and CPLD second SMBUS is connected to the technical scheme of the second of second switch chip and selects the end, can solve the problem that BMC different degree trouble leads to unable acquisition temperature monitoring value, can further improve air intake temperature monitoring sampling precision, can realize the function of server excess temperature protection risk management and control and evade.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic circuit diagram of a multi I2C channel temperature monitoring module according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
In view of the above objects, a first aspect of embodiments of the present invention proposes an embodiment of a multiple I2C channel temperature monitoring module. Fig. 1 shows a circuit schematic of the module.
As shown in fig. 1, the module includes:
the temperature control device comprises a first temperature sensor and a second temperature sensor, wherein controllable resistors 1 and 2 are arranged between the first temperature sensor and the second temperature sensor, the first temperature sensor and the second temperature sensor can be of the same structure or different structures, each sensor is provided with two input ends and can be respectively connected to two lines of an SMBUS (system management bus);
the BMC is provided with a plurality of SMBUS modules, each module is provided with a plurality of channels, and the first SMBUS refers to one channel;
the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of the second SMBUS of the BMC through the controllable resistor 5, the first selection end of the second switch chip is connected to the other end of the second SMBUS of the BMC through the controllable resistor 6, and the temperature chips are monitored when the BMC fails through different selections of the two switch chips;
and when the BMC is abnormal, the CPLD sends corresponding selection signals to select different paths so as to realize monitoring on the temperature sensor.
By using the technical scheme of the invention, the problem that the temperature monitoring value cannot be obtained due to different faults of the BMC can be solved, the temperature monitoring sampling precision of the air inlet can be further improved, and the functions of managing, controlling and avoiding the over-temperature protection risk of the server can be realized.
In a preferred embodiment of the invention, the controllable resistance is configured to be selectively connected to or disconnected from the module depending on the BMC state. The controllable resistor may be a resistor selection chip, or a circuit with a selection function.
In a preferred embodiment of the present invention, the first switch chip and the second switch chip are single pole double throw switch chips. Other switch chips with selection functions may also be used.
In a preferred embodiment of the present invention, the first temperature sensor and the second temperature sensor are TS temperature sensors, model TMP112.
In a preferred embodiment of the present invention, the control terminal of the CPLD is connected to the selection control terminals of the first switch chip and the second switch chip and configured to send a control signal to the selection control terminals so that the first switch chip and the second switch chip select the first selection terminal or the second selection terminal. When the BMC has a fault, the circuit connected with the switch chip is selected according to specific conditions so as to complete monitoring of the temperature sensor.
Examples
As shown in fig. 1, the module of the present invention is mainly applied to the following 3 cases:
1. the server BMC SMBUS module is normal, the dual-channel SMBUS is normal, two independent SMBUSs on the BMC are used for respectively acquiring the temperature information of 2 TSs on the Sensor board, and the average value of two temperature values is recorded in the BMC to serve as a temperature sampling value; in this scenario, the resistors R1, R2 are not connected into the circuit, the SEL of the SPDT (switching chip) is pulled high by the CPLD control, and at this time, the BMC _ I2C _ B channel is connected to the two SPDT gates B2 as SMBUS and output by a, and the temperature information of the TMP112 (I2C address OX 9A) is acquired via SDA _1, SCL _ 1. BMC _ I2C _ A is connected to SDA _0, SCL _0 to obtain temperature information of TMP112 (I2C address OX 90). And taking the average value of the two temperature information through BMC bios as a basis for regulating and controlling the rotating speed of the fan and the CPU frequency.
2. When the server BMC SMBUS module is normal and the server BMC single-path SMBUS has the problem of hang-up, another SMBUS channel on the BMC is used for respectively acquiring the temperature information of 2 TSs on the Sensor board, and the average value of two temperature values is recorded in the BMC to be used as a temperature sampling value; taking BMC _ I2C _ a single hang-up as an example, in this scenario, resistors R1 and R2 are connected into the circuit, resistors R5 and R6 are not connected into the circuit, the SEL of the SPDT is pulled up by the CPLD control, at this time, the BMC _ I2C _ B channel is connected to two SPDT gates B2 as SMBUS, and is output by a, and temperature information of 2 TSs (I2C addresses OX9A and OX 90) is acquired via SDA _1, SCL _1, SDA _0, and SCL _ 0. And taking the average value of the two temperature information through BMC bios as a basis for regulating and controlling the rotating speed of the fan and the CPU frequency.
3. SMBUS module function failure (all SMBUS access are abnormal) of server BMC, CPLD sends out signal and separately obtains temperature information of 2 TSs on the Sensor board through single channel of single-pole double-throw gating CPLD SMBUS, records average value of two temperature values in CPLD as temperature sampling value, and provides temperature information to BMC through SGPMI interface between CPLD and BMC. In this scenario, resistors R1, R2 are connected into the circuit, resistors R3, R4, R5 and R6 are not connected into the circuit, the SEL of the SPDT is pulled low by the CPLD control, at which time the CPLD _ I2C _ SDA and SCL channels are connected as SMBUS to the two SPDT gates B1 and output by a, acquiring temperature information of 2 TSs via SDA _1, SCL _1 and SDA _0, SCL _0 (I2C addresses OX9A and OX 90). And then, providing the temperature information to the BMC through an SGPMI interface between the CPLD and the BMC, and taking the average value of the two temperature information through the BMC bios to serve as a basis for regulating and controlling the rotating speed of the fan and the frequency of the CPU.
By the technical scheme, the problem that the temperature monitoring value cannot be acquired due to faults of the BMC in different degrees can be solved, the temperature monitoring sampling precision of the air inlet can be further improved, and the functions of managing, controlling and avoiding the over-temperature protection risk of the server can be realized.
It should be noted that, as will be understood by those skilled in the art, all or part of the processes in the methods of the above embodiments may be implemented by instructing relevant hardware through a computer program, and the above programs may be stored in a computer-readable storage medium, and when executed, the programs may include the processes of the embodiments of the methods as described above. The storage medium may be a magnetic disk, an optical disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), or the like. The embodiments of the computer program may achieve the same or similar effects as any of the above-described method embodiments.
Furthermore, the method disclosed according to an embodiment of the present invention may also be implemented as a computer program executed by a CPU, and the computer program may be stored in a computer-readable storage medium. The computer program, when executed by the CPU, performs the above-described functions defined in the method disclosed in the embodiments of the present invention.
In view of the above object, according to a second aspect of the embodiments of the present invention, there is provided a server, including a temperature monitoring module, the temperature monitoring module including:
the temperature control device comprises a first temperature sensor and a second temperature sensor, wherein controllable resistors 1 and 2 are arranged between the first temperature sensor and the second temperature sensor;
BMC, BMC first SMBUS is connected to a first temperature sensor via controllable resistors 3 and 4;
the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of a second SMBUS of the BMC through a controllable resistor 5, and the first selection end of the second switch chip is connected to the other end of the second SMBUS of the BMC through a controllable resistor 6;
and the first SMBUS of the CPLD is connected to the second selection end of the first switch chip, and the second SMBUS of the CPLD is connected to the second selection end of the second switch chip.
In a preferred embodiment of the invention, the controllable resistance is configured to be selectively connected to or disconnected from the module depending on the BMC state.
In a preferred embodiment of the present invention, the first switch chip and the second switch chip are single pole double throw switch chips.
In a preferred embodiment of the present invention, the first temperature sensor and the second temperature sensor are TS temperature sensors, model TMP112.
In a preferred embodiment of the present invention, the control terminal of the CPLD is connected to the selection control terminals of the first switch chip and the second switch chip and configured to send a control signal to the selection control terminals so that the first switch chip and the second switch chip select the first selection terminal or the second selection terminal.
It should be particularly noted that the embodiment of the system described above employs the embodiment of the method described above to specifically describe the working process of each module, and those skilled in the art can easily think that the modules are applied to other embodiments of the method described above.
Further, the above-described method steps and system elements or modules may also be implemented using a controller and a computer-readable storage medium for storing a computer program for causing the controller to implement the functions of the above-described steps or elements or modules.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as software or hardware depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosed embodiments of the present invention.
The embodiments described above, particularly any "preferred" embodiments, are possible examples of implementations and are presented merely to clearly understand the principles of the invention. Many variations and modifications may be made to the above-described embodiments without departing from the spirit and principles of the technology described herein. All such modifications are intended to be included within the scope of this disclosure and protected by the following claims.

Claims (10)

1. A multiple I2C channel temperature monitoring module, comprising:
the temperature sensor comprises a first temperature sensor and a second temperature sensor, wherein a first controllable resistor and a second controllable resistor are arranged between the first temperature sensor and the second temperature sensor;
a BMC, the BMC first SMBUS connected to the first temperature sensor via third and fourth controllable resistances;
the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of the second BMC SMBUS through a fifth controllable resistor, and the first selection end of the second switch chip is connected to the other end of the second BMC SMBUS through a sixth controllable resistor;
and the first SMBUS of the CPLD is connected to the second selection end of the first switch chip, and the second SMBUS of the CPLD is connected to the second selection end of the second switch chip.
2. The multi I2C channel temperature monitoring module of claim 1, wherein the controllable resistance is configured to be selectively connected to or disconnected from the module depending on the BMC state.
3. The multiple I2C channel temperature monitoring module of claim 1, wherein the first switch chip and the second switch chip are single pole double throw switch chips.
4. The multiple I2C channel temperature monitoring module of claim 1, wherein the first temperature sensor and the second temperature sensor are TS temperature sensors, model TMP112.
5. The multi-I2C-channel temperature monitoring module according to claim 1, wherein the control end of the CPLD is connected to the selection control ends of the first switch chip and the second switch chip, the control end of the CPLD is configured to send a control signal to the selection control end of the first switch chip so that the first switch chip selects the first selection end or the second selection end, and the control end of the CPLD is further configured to send a control signal to the selection control end of the second switch chip so that the second switch chip selects the first selection end or the second selection end.
6. A server comprising a temperature monitoring module, wherein the temperature monitoring module comprises:
the temperature control circuit comprises a first temperature sensor and a second temperature sensor, wherein a first controllable resistor and a second controllable resistor are arranged between the first temperature sensor and the second temperature sensor;
a BMC, the BMC first SMBUS connected to the first temperature sensor via third and fourth controllable resistances;
the output end of the first switch chip is connected to the first input end of the second temperature sensor, the output end of the second switch chip is connected to the second input end of the second temperature sensor, the first selection end of the first switch chip is connected to one end of the second BMC SMBUS through a fifth controllable resistor, and the first selection end of the second switch chip is connected to the other end of the second BMC SMBUS through a sixth controllable resistor;
and the first SMBUS of the CPLD is connected to the second selection end of the first switch chip, and the second SMBUS of the CPLD is connected to the second selection end of the second switch chip.
7. The server of claim 6, wherein the controllable resistance is configured to be selectively connected to or disconnected from the module based on the BMC state.
8. The server of claim 6, wherein the first switch chip and the second switch chip are single pole double throw switch chips.
9. The server of claim 6, wherein the first temperature sensor and the second temperature sensor are TS temperature sensors, model TMP112.
10. The server according to claim 6, wherein the control terminal of the CPLD is connected to the selection control terminals of the first switch chip and the second switch chip, the control terminal of the CPLD is configured to send a control signal to the selection control terminal of the first switch chip so that the first switch chip selects the first selection terminal or the second selection terminal, and the control terminal of the CPLD is further configured to send a control signal to the selection control terminal of the second switch chip so that the second switch chip selects the first selection terminal or the second selection terminal.
CN202010154751.4A 2020-03-08 2020-03-08 Many I2C passageway temperature monitoring module and server Active CN111274096B (en)

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