CN111267276A - Curing parameter optimization method and device, thin film curing system and computer equipment - Google Patents
Curing parameter optimization method and device, thin film curing system and computer equipment Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
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Abstract
The application relates to a curing parameter optimization method, a curing parameter optimization device, a thin film curing system and computer equipment. The method comprises the following steps: acquiring initial film temperature information and first curing parameters of a film curing system; inputting the initial temperature information and the first curing parameter into a temperature solving model to obtain the film temperature under the first curing parameter; and obtaining a second curing parameter according to the film temperature and the preset film curing temperature. By adopting the method, the initial temperature information of the film curing system and the first curing parameter can be obtained; inputting the initial temperature information and the first curing parameter into a temperature solving model to obtain the film temperature under the first curing parameter; and obtaining a second curing parameter according to the film temperature and the preset film curing temperature, and controlling the film to cure according to the second curing parameter, so that the corresponding thermosetting process parameter can be obtained, the method can be used for the production of a standardized thermosetting process, and the efficiency and the quality of the thermosetting process for coating the functional film are improved.
Description
Technical Field
The application relates to the technical field of production processes of coating functional films, in particular to a curing parameter optimization method, a curing parameter optimization device, a film curing system and computer equipment.
Background
The functional coating film has special functions and can be applied to film products in special industries, the functions of the functional coating film are mainly determined by coating layers in the film products, and the forming quality of the coating layers directly determines whether the functions of the film products can be realized. The hot curing is a key process link for coating layer forming, in the process, a coating layer needs to pass through a plurality of sections of hot curing boxes with different temperature settings at a certain conveying speed, so the setting of hot curing process parameters, such as the conveying speed of a film, the temperature of the curing boxes, the number of the required curing boxes and the like, directly influences the forming effect of the coating layer, and is a key technology for coating functional film production.
At present, the parameters of the thermal curing process are mostly determined by a large number of trial experimental means and depending on production experience. However, the trial and experience parameter determination technology has the defects of inaccurate heat curing process parameters, low product yield and low production efficiency.
Disclosure of Invention
In view of the above, it is necessary to provide a curing parameter optimization method, a curing parameter optimization device, a film curing system, and a computer device, which can improve the yield and the production efficiency of the film.
A method of curing parameter optimization, the method comprising:
acquiring initial film temperature information and first curing parameters of a film curing system;
inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and obtaining a second curing parameter according to the film temperature and a preset film curing temperature.
In one embodiment, the film initial temperature information includes the temperature of the film without entering the curing oven;
the curing parameters include film transfer speed, number of curing boxes, and ambient temperature within the curing boxes.
In one embodiment, the step of inputting the initial temperature information of the film and the first curing parameter into a temperature solution model to obtain the temperature of the film under the first curing parameter comprises:
acquiring heat transfer parameters and coating parameters of the film;
establishing a first equation based on an energy conservation law according to the heat transfer parameter;
and establishing a temperature solving model according to the first equation, the coating layer parameters and the heat transfer parameters.
In one embodiment, the obtaining a second curing parameter according to the film temperature and a preset film curing temperature includes:
taking the absolute value of the difference value between the film temperature and the preset film curing temperature as a target function;
and if the target function is converged, taking the curing parameter corresponding to the film temperature as a second curing parameter.
In one embodiment, the obtaining a second curing parameter according to the film temperature and a preset film curing temperature further includes:
and if the target function is not converged, adjusting the curing parameters, acquiring the film temperature again until the target function is converged, and taking the curing parameters corresponding to the film temperature when the target function is converged as second curing parameters.
In one embodiment, the obtaining the second curing parameter according to the film temperature and the preset film curing temperature includes:
generating a corresponding process parameter control instruction according to the second curing parameter;
and controlling the film to be solidified according to the process parameter control instruction.
In one embodiment, the controlling the film to be cured according to the process parameter control instruction includes:
the process parameter control instruction comprises an ambient temperature control instruction in the curing box and a film transmission speed control instruction;
adjusting the transmission speed of the film according to the film transmission speed control instruction;
and controlling the number of the curing boxes in the working state and the ambient temperature in the curing boxes according to the ambient temperature control instruction in the curing boxes.
A curing parameter optimization device, comprising:
the information acquisition module is used for acquiring initial temperature information and first curing parameters of the film curing system;
the temperature calculation module is used for inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and the parameter calculation module is used for obtaining a second curing parameter according to the temperature difference value between the film temperature and the preset film curing temperature.
A thin film curing system comprising: the device comprises a curing module, an information acquisition module, a processing module, a control module and an adjusting module;
the curing module is used for heating and curing the film;
the information acquisition module is connected with the curing module and is used for acquiring initial temperature information of the film and first curing parameters of the curing module;
the processing module is respectively connected with the information acquisition module and the control module and is used for receiving the initial film temperature information and the first curing parameter of the information acquisition module, obtaining a second curing parameter according to the initial film temperature information and the first curing parameter and sending the second curing parameter to the control module;
the control module is connected with the adjusting module and used for generating a process parameter control instruction according to the second curing parameter and sending the process parameter control instruction to the adjusting module;
and the adjusting module is used for adjusting the transmission speed of the film in the curing module, the number of curing boxes of the curing module and the ambient temperature in the boxes according to the process parameter control instruction.
In one embodiment, the information collecting module further includes: the system comprises a film initial temperature acquisition unit, a curing box internal environment temperature acquisition unit, a film transmission speed acquisition unit and a collection unit;
the film initial temperature acquisition unit is connected with the collection unit and used for acquiring initial temperature information of the film and sending the initial temperature information to the collection unit;
the curing box internal environment temperature acquisition unit is connected with the collection unit and is used for acquiring curing box internal environment temperature information of the curing module, judging the number of curing boxes in a working state according to the curing box internal environment temperature information and sending the curing box internal environment temperature information and the curing box number information in the working state to the collection unit;
the film transmission speed acquisition unit is connected with the collection unit and used for acquiring film transmission speed information and sending the film transmission speed information to the collection unit;
the collecting unit is connected with the processing module and used for collecting the initial temperature information, the environment temperature information in the curing box, the curing box quantity information in the working state and the film transmission speed information and sending the initial temperature information, the environment temperature information in the curing box, the curing box quantity information in the working state and the film transmission speed information to the processing module.
In one embodiment, the processing module includes a temperature solving unit and a parameter optimizing unit, and the temperature solving unit is connected to the parameter optimizing unit and configured to obtain a film temperature under a first curing parameter according to the initial temperature information and the first curing parameter, and send the film temperature to the parameter optimizing unit;
the parameter optimization unit is connected with the control module and used for obtaining a second curing parameter according to the film temperature and a preset film curing temperature.
In one embodiment, the adjusting module comprises a driving unit and a heating unit,
the driving unit is connected with the control module and used for adjusting the transmission speed of the film in the curing module according to the process parameter control instruction;
and the heating unit is connected with the control module and used for adjusting the number of the curing boxes of the curing module in the working state and the ambient temperature in the curing boxes according to the process parameter control instruction.
A computer device comprising a memory and a processor, the memory storing a computer program, the processor implementing the following steps when executing the computer program:
acquiring initial film temperature information and first curing parameters of a film curing system;
inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and obtaining a second curing parameter according to the temperature difference between the film temperature and the preset film curing temperature.
A computer-readable storage medium, on which a computer program is stored which, when executed by a processor, carries out the steps of:
acquiring initial film temperature information and first curing parameters of a film curing system;
inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and obtaining a second curing parameter according to the temperature difference between the film temperature and the preset film curing temperature.
According to the curing parameter optimization method, the curing parameter optimization device, the film curing system and the computer equipment, the initial film temperature information and the first curing parameter of the film curing system are obtained; inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter; and obtaining a second curing parameter according to the film temperature and the preset film curing temperature, and controlling the film to be cured according to the second curing parameter, so that the corresponding thermosetting process parameter can be obtained, the method can be used for the production of a standardized thermosetting process, and the efficiency and the quality of the thermosetting process of the coating functional film are improved.
Drawings
FIG. 1 is a schematic block diagram of a thin film curing system in one embodiment;
FIG. 2 is a diagram of an exemplary thin film curing system;
FIG. 3 is a schematic flow chart diagram of a curing parameter optimization method in one embodiment;
FIG. 4 is a schematic illustration of film parameters in one embodiment;
FIG. 5 is a schematic flow chart of a curing parameter optimization method in another embodiment;
FIG. 6 is a schematic process flow diagram of the curing parameter optimization method of FIG. 5;
FIG. 7 is a block diagram of a curing parameter optimizing apparatus according to an embodiment;
FIG. 8 is a diagram illustrating an internal structure of a computer device according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The functional film coating is to coat chemicals capable of changing and improving the surface characteristics of the film and enhancing the functions of the film on the surface of a base film material with a certain conveying speed, then to realize the curing and forming of the coating material through a plurality of thermocuring boxes, and finally to produce a film product with specific functions and applicable to special purposes through quality detection and slitting procedures.
The thermosetting refers to curing and shaping by heating or at a certain temperature to cause physical/chemical reaction of substances in the coating layer. Because the coating functional film is easy to generate thermal shock and other problems of reducing the curing quality in the high-temperature gradient curing process, a temperature control mode of sectional temperature rise/fall is adopted for thermal curing.
At present, the parameters of the thermal curing process are mostly determined by a large number of trial experimental means and depending on production experience. However, there are many disadvantages to this trial and experience parameter determination technique, which are mainly expressed as: a) corresponding thermosetting process parameters cannot be accurately acquired, and the trial thermosetting process parameter determination technology cannot ensure that the thermosetting process parameters reach the optimum values, so that the yield of products is inevitably reduced, and material and energy are wasted; b) the thermosetting process parameters are obtained exhaustively, a large amount of heavy trial work needs to be carried out in order to obtain a coating layer with high molding quality, the method wastes manpower and time, and more importantly, the production efficiency of the product is reduced; c) the method is not suitable for different types of films, the experience of the existing thermosetting process parameter determination technology is usually specific to a certain coating functional film and is not suitable for the production of various types of film products, the process of producing novel coating functional films by enterprises is seriously hindered, and the research and development period of new products is prolonged; d) the standardization of the process flow is low, the standardized process flow is difficult to form in the prior art, and the process stability of the product is very unfavorable.
Aiming at the defects of the existing coating functional film thermosetting process parameter determination technology, the actual working condition in the coating layer thermosetting process is considered, and the initial temperature information and the first curing parameter of the film curing system are obtained; inputting the initial temperature information and the first curing parameter into a temperature solving model to obtain the film temperature under the first curing parameter; and obtaining a second curing parameter according to the film temperature and the preset curing temperature, and controlling the film to be cured according to the second curing parameter, so that the corresponding thermosetting process parameter can be obtained, the method can be used for the production of a standardized thermosetting process, and the efficiency and the quality of the thermosetting process for coating the functional film are improved.
As shown in fig. 1 to 2, the curing parameter optimization method provided by the present application can be applied to the application environments shown in fig. 1 to 2.
The thin film curing system comprises: a curing module 110, an information acquisition module 120, a processing module 130, a control module 140, and an adjustment module 150. Specifically, the curing module 110 is used for heating and curing the film. The information collecting module 120 is connected to the curing module 110, and is configured to collect initial temperature information of the film and a first curing parameter of the curing module 110. The processing module 130 is connected to the information collecting module 120 and the control module 140, and configured to receive the initial temperature information of the film and the first curing parameter of the information collecting module, obtain a second curing parameter according to the initial temperature information of the film and the first curing parameter, and send the second curing parameter to the control module 140. The control module 140 is connected to the adjusting module 150, and configured to generate a process parameter control instruction according to the second curing parameter, and send the process parameter control instruction to the adjusting module 150. And the adjusting module 150 is used for adjusting the transmission speed of the film in the curing module 110 and the curing temperature of the curing module 110 according to the process parameter control instruction. In this embodiment, the curing module 110 is an electrically heated curing box, and a heater is disposed inside the curing box for heating the film.
Optionally, the information collecting module 120 further includes: a film initial temperature acquisition unit 121, an ambient temperature acquisition unit 122 in the curing oven, a film transfer speed acquisition unit 123 and a collection unit 124. Specifically, the film initial temperature collecting unit 121 is connected to the collecting unit 124, and is configured to collect initial temperature information of the film and send the initial temperature information to the collecting unit 124. The curing box internal environment temperature acquisition unit 122 is connected to the collection unit 124, and is configured to acquire curing box internal environment temperature information of the curing module 110 and the number of curing boxes in the operating state, and send the curing box internal environment temperature information and the number of curing boxes in the operating state to the collection unit 124. The film transmission speed acquisition unit 123 is connected to the collection unit 124, and is configured to acquire the transmission speed of the film in the curing box, and send the film transmission speed information to the collection unit 124. The collecting unit 124 is connected to the processing module 130, and configured to collect initial temperature information of the film, environment temperature information in the curing box, the number of curing boxes in the working state, and the film transmission speed, and send the initial temperature information, the environment temperature information in the curing box, the number of curing boxes in the working state, and the film transmission speed to the processing module 130. In this embodiment, the film initial temperature collecting unit 121 is a thermal infrared temperature sensor, the ambient temperature collecting unit 122 in the curing box is a thermocouple temperature sensor, the film transmission speed collecting unit 123 is a displacement sensor, and the collecting unit 124 is a temperature/speed collector. The thermal infrared temperature sensor is located at the entrance of the curing module 110 and detects initial temperature information of the film. A thermocouple temperature sensor is located within the curing module 110 to detect the curing temperature at which the film is cured within the curing module 110. The displacement sensor is connected with the film transmission device and used for detecting the film transmission speed.
Optionally, the processing module 130 includes a temperature solving unit 132 and a parameter optimizing unit 131. Specifically, the temperature solving unit 132 is connected to the parameter optimizing unit 131 and the collecting unit 124, respectively, and is configured to obtain the film temperature under the first curing parameter according to the initial temperature information of the film and the first curing parameter, and send the film temperature to the parameter optimizing unit 131. The parameter optimizing unit 131 is connected to the control module 140, and configured to obtain a second curing parameter according to the film temperature and a preset film curing temperature. In this embodiment, the temperature solving unit 132 is a temperature solver, and the temperature solver obtains the film temperature under the first curing parameter according to the initial temperature information of the film and the first curing parameter; the parameter optimization unit 131 is a parameter optimizer, and the parameter optimizer obtains a second curing parameter according to the film temperature calculated by the temperature solver and a preset film curing temperature.
Optionally, the control module 140 is connected to the adjusting module 150, and configured to generate a process parameter control instruction according to the second curing parameter, and send the process parameter control instruction to the adjusting module 150. In the present embodiment, the control module 140 is a programmable controller.
Optionally, the adjustment module 150 comprises a drive unit 151 and a heating unit 152. Specifically, the driving unit 151 is connected to the control module 140 for adjusting the transmission speed of the film in the curing module 110 according to the process parameter control command, and the heating unit 152 is connected to the control module 140 for adjusting the curing temperature of the film in the curing module 110 according to the process parameter control command. In this embodiment, the driving unit 151 is a film transmission shaft driven by a servo motor, and drives the film to move in the curing module 110. In another embodiment, the driving unit 151 is two rollers disposed at two ends of the curing module 110, the film penetrates through the curing module 110 and is wound around the rollers respectively, and the rollers rotate to drive the film to move in the curing module 110.
In one embodiment, as shown in fig. 3, a curing parameter optimization method is provided, which is exemplified by the application of the method to the system in fig. 1, and comprises the following steps:
Wherein the film initial temperature information comprises the temperature of the film when the film does not enter the curing box; the first curing parameters include film transport speed, number of curing oven, and ambient temperature within the curing oven.
Specifically, the initial temperature information of the film and the first curing parameter acquired by the information acquisition module are acquired.
And 204, inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter.
Wherein the film temperature is the coating layer temperature of the film.
Specifically, the initial temperature information, the film transmission speed, the number of curing boxes and the ambient temperature inside the curing boxes are input into a temperature solving model:
and obtaining the film temperature under the first curing parameter. Wherein, T0Is the initial temperature of the film, v is the film transport speed, m is the number of curing boxes,
the ambient temperature in the curing oven, T is the film temperature. In this embodiment, the ambient temperature in the curing oven may be the same or different in different regions of the curing ovenAnd (3) temperature.
Inputting the initial temperature information of the film and the first curing parameter into a temperature solving model, and obtaining the film temperature under the first curing parameter comprises the following steps: acquiring heat transfer parameters and coating parameters of the film; establishing a first equation based on the energy conservation law according to the heat transfer parameters; and establishing a temperature solution model according to the first equation, the coating layer parameters and the heat transfer parameters.
Specifically, as shown in fig. 4, the heat transfer process of the film passing through the heat curing box is retrieved from the film database according to the specific type of the film, and the heat transfer parameter and the coating layer parameter corresponding to the film are obtained: thermal convection Q existing between coating layer and curing boxe-adh(ii) a Evaporative heat dissipation Q of liquid components in coating layerliq(ii) a Heat exchange Q between coating and substrate layersadh-subAnd Qsub-adh(ii) a Thermal convection Q between substrate layer and curing boxe-sub(ii) a Through the heat transfer, the internal energy of the coating layer and the substrate layer respectively changes QadhAnd Qsub. Based on energy conservation, a first equation is established:
establishing a temperature solution model according to a first equation, coating layer parameters and heat transfer parameters:
for calculating the coating layer temperature of the film.
Wherein the heat transfer parameter kx、ky、kzRepresenting the thermal conductivity of the coating material in three directions in space. The parameters of the coating layer comprise density rho, specific heat capacity c, curing time t and curing reaction heat release rate q of the coating layer.
And step 206, obtaining a second curing parameter according to the film temperature and the preset film curing temperature.
In particular, according to the film temperatureT and the preset film curing temperature TmFor comparison, the comparative equation is as follows:
and obtaining a corresponding second curing parameter according to the absolute value of the temperature difference.
Obtaining a second curing parameter according to the film temperature and the preset film curing temperature comprises: taking the absolute value of the difference value between the film temperature and the preset film curing temperature as a target function S; and if the target function is converged, taking the curing parameter corresponding to the film temperature as a second curing parameter.
Specifically, if the target function S does not converge, the curing parameters are adjusted, the film temperature is obtained again until the target function converges, and the curing parameters corresponding to the film temperature when the target function converges are used as the second curing parameters. Preferably, the second curing parameter corresponding to the minimum value of the objective function is an optimal second curing parameter.
If the temperature difference is within the preset convergence range, generating a process parameter control command according to the second curing parameter comprises: generating a corresponding process parameter control instruction according to the second curing parameter; and controlling the film to be solidified according to the process parameter control instruction.
The process parameter control instruction comprises an ambient temperature control instruction in the curing box and a film transmission speed control instruction.
Specifically, the conveying speed of the film is adjusted according to a film conveying speed control instruction; controlling the curing temperature of the curing box according to the ambient temperature control instruction in the curing box, and adjusting the transmission speed of the film in the curing module by the driving unit 151 according to the process parameter control instruction; the heating unit 152 adjusts the number of curing boxes in the curing module and the ambient temperature inside the curing boxes according to the process parameter control instructions.
In one embodiment, as shown in fig. 5, a curing parameter optimization method is provided, which is exemplified by the application of the method to the system in fig. 1, and comprises the following steps:
obtaining film transfer speedV, number m of curing boxes, temperatures corresponding to different zones of the curing boxes
Inputting the initial temperature information of the film and the ambient temperature in the curing box as initial conditions and boundary conditions into a temperature solver to obtain the temperature T of the film. The film temperature T and the preset film curing temperature T are comparedmThe absolute value of the difference value is used as a target function, whether the target function is converged is judged, and if the target function is converged, the curing parameter corresponding to the temperature of the film is used as a second curing parameter; and if the target function is not converged, adjusting the curing parameters, acquiring the film temperature again until the target function is converged, and taking the curing parameters corresponding to the film temperature when the target function is converged as second curing parameters. And the second curing parameter is the optimal thermal curing process parameter.
As shown in fig. 6, fig. 6 is a schematic process flow diagram of the curing parameter optimization method in fig. 5.
The process flow of the curing parameter optimization method is applied to a film curing system, the information acquisition module acquires initial temperature information of a film and a first curing parameter of the curing module, and the initial temperature information, the first curing parameter and the heat transfer characteristic of the coating functional film are input to the processing module. Wherein, the heat transfer characteristic of the coating functional film is a heat transfer parameter and a coating layer parameter.
And a temperature solver in the processing module establishes a temperature solving model according to the heat transfer characteristics of the coated functional film, inputs the initial temperature information and the first curing parameter into the temperature solving model to obtain the film temperature under the first curing parameter, and inputs the film temperature into a parameter optimizer. The parameter optimizer takes the absolute value of the difference between the film temperature and the preset film curing temperature as a target function; and if the target function is converged, taking the curing parameter corresponding to the film temperature as a second curing parameter. And if the target function is not converged, adjusting the curing parameters, acquiring the film temperature again until the target function is converged, and taking the curing parameters corresponding to the film temperature when the target function is converged as second curing parameters. Preferably, the second curing parameter corresponding to the minimum value of the objective function is the optimal second curing parameter, that is, the optimal thermal curing process parameter.
And inputting the optimal thermal curing process parameters into a programmable controller, wherein the programmable controller generates corresponding process parameter control instructions according to the optimal thermal curing process parameters, and the process parameter control instructions comprise an environment temperature control instruction in a curing box and a film transmission speed control instruction. The programmable controller sends the film transmission speed control instruction to the driving unit, and the driving unit regulates and controls the transmission speed of the film according to the film transmission speed control instruction. And the programmable controller sends the curing box internal environment temperature control instruction to the curing module, and the curing module regulates and controls the working quantity of the curing box and the internal environment temperature according to the curing box internal environment temperature control instruction to complete the production of the coating functional film thermocuring process.
In the curing parameter optimization method, the initial temperature information of the film curing system and a first curing parameter are obtained; inputting the initial temperature information and the first curing parameter into a temperature solving model to obtain the film temperature under the first curing parameter; and obtaining a second curing parameter according to the film temperature and the preset film curing temperature, controlling the film to cure according to the second curing parameter, obtaining a corresponding thermosetting process parameter, being used for the production of a standardized thermosetting process, improving the efficiency and quality of the thermosetting process of the coating functional film, and having wide application range.
It should be understood that although the various steps in the flow charts of fig. 3-6 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 3-6 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performing the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.
In one embodiment, as shown in fig. 7, there is provided a curing parameter optimizing apparatus comprising: an information acquisition module 610, a temperature calculation module 620, and a parameter calculation module 630, wherein:
the information acquiring module 610 is configured to acquire initial temperature information of the film curing system and a first curing parameter.
And the temperature calculation module 620 is configured to input the initial temperature information of the film and the first curing parameter into the temperature solving model, so as to obtain the temperature of the film under the first curing parameter.
The parameter calculating module 630 is configured to obtain a second curing parameter according to a temperature difference between the film temperature and a preset film curing temperature.
The temperature calculation module 620 is further configured to obtain heat transfer parameters and coating parameters of the film; establishing a first equation based on the energy conservation law according to the heat transfer parameters; and establishing a temperature solution model according to the first equation, the coating layer parameters and the heat transfer parameters.
The parameter calculation module 630 is further configured to use an absolute value of a difference between the film temperature and a preset film curing temperature as a target function; and if the target function is converged, taking the curing parameter corresponding to the film temperature as a second curing parameter.
The parameter calculating module 630 is further configured to adjust the curing parameter if the target function is not converged, obtain the film temperature again until the target function is converged, and use the curing parameter corresponding to the film temperature when the target function is converged as the second curing parameter.
The parameter calculating module 630 is further configured to generate a corresponding process parameter control instruction according to the second curing parameter; and controlling the film to be solidified according to the process parameter control instruction.
The parameter calculating module 630 is further configured to generate a corresponding process parameter control instruction according to the second curing parameter, where the process parameter control instruction includes an ambient temperature control instruction in the curing box and a film transmission speed control instruction; adjusting the transmission speed of the film according to the film transmission speed control instruction; and controlling the working quantity of the curing box and the ambient temperature in the curing box according to the ambient temperature control instruction in the curing box.
For the specific definition of the curing parameter optimization device, reference may be made to the above definition of the curing parameter optimization method, which is not described herein again. The various modules in the curing parameter optimization device described above may be implemented in whole or in part by software, hardware, and combinations thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 8. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a curing parameter optimization method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 8 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory and a processor, the memory having a computer program stored therein, the processor implementing the following steps when executing the computer program:
acquiring initial film temperature information and first curing parameters of a film curing system;
inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and obtaining a second curing parameter according to the film temperature and the preset film curing temperature.
In one embodiment, the processor, when executing the computer program, further performs the steps of: the film initial temperature information comprises the temperature of the film when the film does not enter the curing box;
the curing parameters include film transfer speed, number of curing oven, and ambient temperature within the curing oven.
In one embodiment, the processor, when executing the computer program, further performs the steps of: acquiring heat transfer parameters and coating parameters of the film;
establishing a first equation based on the energy conservation law according to the heat transfer parameters;
and establishing a temperature solution model according to the first equation, the coating layer parameters and the heat transfer parameters.
In one embodiment, the processor, when executing the computer program, further performs the steps of: taking the absolute value of the difference value between the film temperature and the preset film curing temperature as a target function;
and if the target function is converged, taking the curing parameter corresponding to the film temperature as a second curing parameter.
In one embodiment, the processor, when executing the computer program, further performs the steps of: and if the target function is not converged, adjusting the curing parameters, acquiring the film temperature again until the target function is converged, and taking the curing parameters corresponding to the film temperature when the target function is converged as second curing parameters.
In one embodiment, the processor, when executing the computer program, further performs the steps of: generating a corresponding process parameter control instruction according to the second curing parameter;
and controlling the film to be solidified according to the process parameter control instruction.
In one embodiment, the processor, when executing the computer program, further performs the steps of: the process parameter control instruction comprises an ambient temperature control instruction in the curing box and a film transmission speed control instruction;
adjusting the transmission speed of the film according to the film transmission speed control instruction;
and controlling the working quantity of the curing box and the ambient temperature in the curing box according to the ambient temperature control instruction in the curing box.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, which when executed by a processor, performs the steps of:
acquiring initial temperature information and first curing parameters of a film curing system;
inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and obtaining a second curing parameter according to the film temperature and the preset film curing temperature.
In one embodiment, the computer program when executed by the processor further performs the steps of: the film initial temperature information comprises the temperature of the film when the film does not enter the curing box;
the curing parameters include film transfer speed, number of curing oven, and ambient temperature within the curing oven.
In one embodiment, the computer program when executed by the processor further performs the steps of: acquiring heat transfer parameters and coating parameters of the film;
establishing a first equation based on the energy conservation law according to the heat transfer parameters;
and establishing a temperature solution model according to the first equation, the coating layer parameters and the heat transfer parameters.
In one embodiment, the computer program when executed by the processor further performs the steps of: taking the absolute value of the difference value between the film temperature and the preset film curing temperature as a target function;
and if the target function is converged, taking the curing parameter corresponding to the film temperature as a second curing parameter.
In one embodiment, the computer program when executed by the processor further performs the steps of: and if the target function is not converged, adjusting the curing parameters, acquiring the film temperature again until the target function is converged, and taking the curing parameters corresponding to the film temperature when the target function is converged as second curing parameters.
In one embodiment, the computer program when executed by the processor further performs the steps of: generating a corresponding process parameter control instruction according to the second curing parameter;
and controlling the film to be solidified according to the process parameter control instruction.
In one embodiment, the computer program when executed by the processor further performs the steps of: the process parameter control instruction comprises an ambient temperature control instruction in the curing box and a film transmission speed control instruction;
adjusting the transmission speed of the film according to the film transmission speed control instruction;
and controlling the quantity of the curing boxes and the ambient temperature in the curing boxes according to the ambient temperature control command in the curing boxes.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware related to instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), Programmable ROM (PROM), Electrically Programmable ROM (EPROM), Electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDRSDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus Direct RAM (RDRAM), direct bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (14)
1. A method of curing parameter optimization, the method comprising:
acquiring initial film temperature information and first curing parameters of a film curing system;
inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and obtaining a second curing parameter according to the film temperature and a preset film curing temperature.
2. The method of claim 1,
the film initial temperature information comprises the temperature of the film when the film does not enter the curing box;
the curing parameters include film transfer speed, number of curing boxes, and ambient temperature within the curing boxes.
3. The method of claim 1, wherein the inputting the initial film temperature information and the first curing parameter into a temperature solution model to obtain the film temperature at the first curing parameter comprises:
acquiring heat transfer parameters and coating parameters of the film;
establishing a first equation based on an energy conservation law according to the heat transfer parameter;
and establishing a temperature solving model according to the first equation, the coating layer parameters and the heat transfer parameters.
4. The method of claim 1, wherein obtaining a second curing parameter based on the film temperature and a predetermined film curing temperature comprises:
taking the absolute value of the difference value between the film temperature and the preset film curing temperature as a target function;
and if the target function is converged, taking the curing parameter corresponding to the film temperature as a second curing parameter.
5. The method of claim 4, wherein obtaining second curing parameters based on the film temperature and a predetermined film curing temperature further comprises:
and if the target function is not converged, adjusting the curing parameters, acquiring the film temperature again until the target function is converged, and taking the curing parameters corresponding to the film temperature when the target function is converged as second curing parameters.
6. The method according to any one of claims 4 or 5, wherein the obtaining of the second curing parameter according to the film temperature and the preset film curing temperature comprises:
generating a corresponding process parameter control instruction according to the second curing parameter;
and controlling the film to be solidified according to the process parameter control instruction.
7. The method of claim 6, wherein controlling the film to cure according to the process parameter control instructions comprises:
the process parameter control instruction comprises an ambient temperature control instruction in the curing box and a film transmission speed control instruction;
adjusting the transmission speed of the film according to the film transmission speed control instruction;
and controlling the number of the curing boxes in the working state and the ambient temperature in the curing boxes according to the ambient temperature control instruction in the curing boxes.
8. A curing parameter optimization device, comprising:
the information acquisition module is used for acquiring initial temperature information and first curing parameters of the film curing system;
the temperature calculation module is used for inputting the initial temperature information of the film and the first curing parameter into a temperature solving model to obtain the temperature of the film under the first curing parameter;
and the parameter calculation module is used for obtaining a second curing parameter according to the temperature difference value between the film temperature and the preset film curing temperature.
9. A thin film curing system, comprising: the device comprises a curing module, an information acquisition module, a processing module, a control module and an adjusting module;
the curing module is used for heating and curing the film;
the information acquisition module is connected with the curing module and is used for acquiring initial temperature information of the film and first curing parameters of the curing module;
the processing module is respectively connected with the information acquisition module and the control module and is used for receiving the initial film temperature information and the first curing parameter of the information acquisition module, obtaining a second curing parameter according to the initial film temperature information and the first curing parameter and sending the second curing parameter to the control module;
the control module is connected with the adjusting module and used for generating a process parameter control instruction according to the second curing parameter and sending the process parameter control instruction to the adjusting module;
and the adjusting module is used for adjusting the transmission speed of the film in the curing module, the number of curing boxes of the curing module and the ambient temperature in the boxes according to the process parameter control instruction.
10. The system of claim 9, wherein the information collection module further comprises: the system comprises a film initial temperature acquisition unit, a curing box internal environment temperature acquisition unit, a film transmission speed acquisition unit and a collection unit;
the film initial temperature acquisition unit is connected with the collection unit and used for acquiring initial temperature information of the film and sending the initial temperature information to the collection unit;
the curing box internal environment temperature acquisition unit is connected with the collection unit and is used for acquiring curing box internal environment temperature information of the curing module, judging the number of curing boxes in a working state according to the curing box internal environment temperature information and sending the curing box internal environment temperature information and the curing box number information in the working state to the collection unit;
the film transmission speed acquisition unit is connected with the collection unit and used for acquiring film transmission speed information and sending the film transmission speed information to the collection unit;
the collecting unit is connected with the processing module and used for collecting the initial temperature information, the environment temperature information in the curing box, the curing box quantity information in the working state and the film transmission speed information and sending the initial temperature information, the environment temperature information in the curing box, the curing box quantity information in the working state and the film transmission speed information to the processing module.
11. The system of claim 9, wherein the processing module comprises a temperature solving unit and a parameter optimization unit,
the temperature solving unit is connected with the parameter optimizing unit and used for obtaining the film temperature under the first curing parameter according to the initial temperature information and the first curing parameter and sending the film temperature to the parameter optimizing unit;
the parameter optimization unit is connected with the control module and used for obtaining a second curing parameter according to the film temperature and a preset film curing temperature.
12. The system of claim 9, wherein the adjustment module comprises a drive unit and a heating unit,
the driving unit is connected with the control module and used for adjusting the transmission speed of the film in the curing module according to the process parameter control instruction;
and the heating unit is connected with the control module and used for adjusting the number of the curing boxes of the curing module in the working state and the ambient temperature in the curing boxes according to the process parameter control instruction.
13. A computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor implements the steps of the method of any one of claims 1 to 7 when executing the computer program.
14. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 7.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112083702A (en) * | 2020-09-27 | 2020-12-15 | 江苏恒宝智能系统技术有限公司 | Carbon fiber composite material curing process monitoring and management method and system |
| CN113427802A (en) * | 2021-06-21 | 2021-09-24 | 南京贝迪新材料科技股份有限公司 | Method and device for estimating influence of LCP film production parameters on quality |
| CN118003530A (en) * | 2024-04-08 | 2024-05-10 | 山东义沃包装科技有限公司 | Cooling control system and method for degradable film production line |
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2020
- 2020-01-22 CN CN202010073934.3A patent/CN111267276A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112083702A (en) * | 2020-09-27 | 2020-12-15 | 江苏恒宝智能系统技术有限公司 | Carbon fiber composite material curing process monitoring and management method and system |
| CN112083702B (en) * | 2020-09-27 | 2021-08-17 | 江苏恒宝智能系统技术有限公司 | Carbon fiber composite material curing process monitoring and management method and system |
| CN113427802A (en) * | 2021-06-21 | 2021-09-24 | 南京贝迪新材料科技股份有限公司 | Method and device for estimating influence of LCP film production parameters on quality |
| CN118003530A (en) * | 2024-04-08 | 2024-05-10 | 山东义沃包装科技有限公司 | Cooling control system and method for degradable film production line |
| CN118003530B (en) * | 2024-04-08 | 2024-06-11 | 山东义沃包装科技有限公司 | Cooling control system and method for degradable film production line |
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