CN111263575B - Heat dissipation system - Google Patents
Heat dissipation system Download PDFInfo
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- CN111263575B CN111263575B CN202010207524.3A CN202010207524A CN111263575B CN 111263575 B CN111263575 B CN 111263575B CN 202010207524 A CN202010207524 A CN 202010207524A CN 111263575 B CN111263575 B CN 111263575B
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- heat
- sealing
- heat dissipation
- phase
- sealing edge
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Abstract
The invention provides a heat dissipation system, an electronic device and a manufacturing method of the electronic device, wherein the heat dissipation system comprises: a heat sink; the phase-change metal heat conducting fin is attached to the first surface of the heat dissipation device and is used for being in contact with the heating device so as to conduct heat of the heating device to the heat dissipation device. The invention can improve the heat dissipation efficiency.
Description
Technical Field
The present invention relates to heat dissipation device technologies, and in particular, to a heat dissipation system, an electronic device, and a method for manufacturing an electronic device.
Background
With the development of scientific technology and the progress of society, the application of electronic equipment is more and more extensive, and the user has higher and higher requirements for the use experience of the electronic equipment, and the heat dissipation of the electronic equipment becomes an important element influencing the use experience of the user.
The existing heat dissipation system of the electronic equipment comprises a heat dissipation device and a heating element, wherein the heat dissipation device is connected with the heating element through a silicon-based material, and the heat conductivity coefficient of the silicon-based material is low, so that the heat dissipation efficiency of the heat dissipation system is reduced.
Disclosure of Invention
The invention provides a heat dissipation system, an electronic device and a manufacturing method of the electronic device, which aim to improve the heat dissipation efficiency.
One aspect of the present invention provides a heat dissipating system, comprising:
a heat sink;
the phase-change metal heat conducting fin is attached to the first surface of the heat dissipation device and is used for being in contact with the heating device so as to conduct heat of the heating device to the heat dissipation device.
In another aspect, the invention provides an electronic device, which includes a heat generating device and the heat dissipating system provided in the invention, wherein the heat generating device is in contact with the sealing member, the sealing edge, and the phase-change metal heat conducting sheet.
Yet another aspect of the present invention provides a method of manufacturing an electronic device, including:
attaching the phase-change metal heat-conducting fin to the first surface of the heat dissipation device;
arranging a sealing edge on the first surface of the heat dissipation device, and enabling the sealing edge to be in sealing connection with the first surface of the heat dissipation device and to surround the periphery of the phase-change metal heat conducting sheet;
arranging a sealing element on the first surface of the heat dissipation device, and enabling the sealing element to be in sealing connection with the first surface of the heat dissipation device and to surround the periphery of the sealing edge;
and connecting the heating device with the sealing piece, the sealing edge and the phase-change metal heat conducting sheet so as to seal the phase-change metal heat conducting sheet among the sealing edge, the heat dissipation device and the heating device and seal the sealing edge and the phase-change metal heat conducting sheet among the sealing edge, the heat dissipation device and the heating device.
Based on the above, the heat dissipation system provided by the invention can connect the heating device with the phase-change metal heat conducting strip when in use, and the phase-change metal heat conducting strip has better heat conducting property, so that the heat of the heating device can be better conducted to the heat dissipation device for dissipation, and the heat dissipation efficiency is improved.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing an electronic device according to an embodiment of the present invention.
Reference numerals:
101: a heat sink; 102: a phase change metal heat conducting sheet;
103: sealing the edges; 104: a groove;
105: an adhesive layer; 106: a seal member;
201: a heat generating device; 202: a high temperature adhesive tape;
203: a base; 204: a raised portion.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, an embodiment of the invention provides a heat dissipation system, including: a heat sink 101; the phase-change metal heat conduction sheet 102 is attached to the first surface of the heat dissipation device 101, and the phase-change metal heat conduction sheet 102 is used for contacting with the heat generation device 201 so as to conduct heat of the heat generation device 201 to the heat dissipation device 101.
The heat dissipation system in this embodiment can connect the heat generating device 201 and the phase-change metal heat conducting strip 102 when in use, and because the phase-change metal heat conducting strip 102 has better heat conductivity, the heat of the heat generating device 201 can be better conducted to the heat dissipation device 101 for dissipation, thereby improving the heat dissipation efficiency.
In this embodiment, the heat dissipation system further includes a sealing edge 103, the sealing edge 103 is connected to the first surface of the heat dissipation device 101 in a sealing manner and is disposed around the periphery of the phase-change metal heat conducting strip 102, and the sealing edge 103 is configured to contact the heat generation device 201 to seal the phase-change metal heat conducting strip 102 among the sealing edge 103, the heat dissipation device 101, and the heat generation device 201. Therefore, after the heating device 201 is connected with the phase-change metal heat conducting strip 102, the sealing edge 103 is in contact with the heating device 201, so that the phase-change metal heat conducting strip 102 is sealed among the sealing edge 103, the heat dissipation device 101 and the heating device 201, and the phase-change metal heat conducting strip 102 can be changed into a liquid state when being heated, so that the phase-change metal heat conducting strip 102 can be effectively prevented from flowing out after being changed into the liquid state through the sealing edge 103, and the use reliability of the heat dissipation system is improved. The thickness of the sealing edge 103 is about 0.5 mm, and the thickness of the sealing edge 103 can be reduced as much as possible under the condition that the sealing effect can be achieved.
In this embodiment, the heat dissipation device 101 is provided with a groove 104, the first surface is a bottom surface of the groove 104, and the phase-change metal heat-conducting fin 102 and the sealing edge 103 are located in the groove 104. Therefore, the surrounding side walls of the groove 104 can surround and support the metal heat conducting sheet and the sealing edge 103, and the improvement of the connection stability of the metal heat conducting sheet and the sealing edge 103 with the heat dissipation device 101 is facilitated.
In this embodiment, the phase-change metal heat conducting sheet 102 is attached to the first surface through the adhesive layer 105. Thereby facilitating the connection of the phase-change metal heat-conducting sheet 102 with the heat sink 101,
in this embodiment, the thickness of the adhesive layer 105 is greater than or equal to 0.01 mm and less than or equal to 0.1 mm. Therefore, the connection stability can be ensured, and the heat conduction effect cannot be influenced.
In this embodiment, the melting point of the phase-change metal heat conduction sheet 102 is greater than or equal to 54 degrees and less than or equal to 60 degrees. Therefore, the heat conduction effect is improved.
In this embodiment, the heat dissipation device 101 is a copper block. Therefore, the radiating effect is improved.
In this embodiment, the sealing edge 103 is a heat-resistant elastic room temperature curing silicone sealing edge 103, and the heat-resistant elastic room temperature curing silicone sealing edge 103 has no filler or has filler particles with a diameter smaller than 10 μm. This is advantageous in improving the sealing performance of the sealing edge 103.
Example two
On the basis of the first embodiment, the heat dissipation system further includes a sealing member 106, the sealing member 106 is connected to the first surface of the heat dissipation device 101 in a sealing manner and is disposed around the sealing edge 103, and the sealing member 106 is configured to contact the heat generation device 201 to seal the sealing edge 103 and the phase-change metal heat conduction sheet 102 between the sealing edge 103, the heat dissipation device 101 and the heat generation device 201. Therefore, after the heat generating device 201 is connected with the phase-change metal heat conducting sheet 102, the sealing member 106 is in contact with the heat generating device 201, so that the sealing edge 103 and the phase-change metal heat conducting sheet 102 are sealed among the sealing edge 103, the heat sink 101 and the heat generating device 201, and the sealing effect is further improved.
In this embodiment, the sealing member 106 is foam. This is advantageous in further improving the sealing effect.
The embodiment of the invention provides an electronic device, which comprises a heat generating device 201 and the heat dissipating system described in the second embodiment of the invention, wherein the heat generating device 201 is in contact with the sealing member 106, the sealing edge 103 and the phase-change metal heat conducting sheet 102.
In the electronic device in this embodiment, since the phase-change metal heat-conducting strip 102 has a good heat-conducting property, the heat of the heat-generating device 201 can be better conducted to the heat-dissipating device 101 for dissipation, and the heat-dissipating efficiency is improved. In addition, because the sealing edge 103 is in contact with the heating device 201, the phase-change metal heat conducting sheet 102 is sealed among the sealing edge 103, the heat dissipation device 101 and the heating device 201, and the sealing member 106 is in contact with the heating device 201, so that the sealing edge 103 and the phase-change metal heat conducting sheet 102 are sealed among the sealing edge 103, the heat dissipation device 101 and the heating device 201, the sealing effect on the phase-change metal heat conducting sheet 102 is good, the phase-change metal heat conducting sheet 102 can be effectively prevented from flowing out after being heated into a liquid state, and the use reliability of the electronic device is improved.
In this embodiment, a high temperature adhesive tape 202 is attached to the heat generating device 201, and the high temperature adhesive tape 202 is in sealing contact with the sealing member 106. Therefore, the sealing effect is improved.
In this embodiment, the heat generating device 201 is a chip, the chip includes a base 203 and a protrusion 204, the protrusion 204 is protruded on the top surface of the base 203, the high temperature adhesive tape 202 is attached to the top surface of the base 203 and is disposed around the protrusion 204, and the top surface of the protrusion 204 is in contact with the sealing edge 103 and the phase-change metal heat conducting strip 102. Therefore, the sealing effect is improved.
Referring to fig. 2, an embodiment of the invention provides a method for manufacturing an electronic device, including:
step S101, the phase change metal heat conduction sheet 102 is attached to the first surface of the heat dissipation device 101.
The phase-change metal heat-conducting plate 102 and the heat dissipation device 101 are positioned relatively, which facilitates the subsequent steps.
Step S102, a sealing edge 103 is disposed on the first surface of the heat dissipation device 101, and the sealing edge 103 is hermetically connected to the first surface of the heat dissipation device 101 and surrounds the phase-change metal heat conduction sheet 102.
Thereby, preparation is made for sealing of the phase-change metal heat-conductive sheet 102. The sealing edge 103 can be a heat-resistant elastic room temperature curing silicone sealing edge 103, and the diameter of filler-free or filler particles in the heat-resistant elastic room temperature curing silicone sealing edge 103 is less than 10 micrometers, so that the sealing effect can be improved.
The thickness of the sealing edge 103 is about 0.5 mm, and the thickness of the sealing edge 103 can be reduced as much as possible under the condition that the sealing effect can be achieved.
The sealing edge 103 may be formed by dispensing, and a 0.11 mm or 0.16 mm needle may be used for dispensing.
Step S103, disposing a sealing member 106 on the first surface of the heat sink 101, and sealing the sealing member 106 and the first surface of the heat sink 101 and surrounding the sealing edge 103;
thereby, preparation is made for sealing of the phase-change metal heat-conductive sheet 102.
The seal 106 may be foam to facilitate improved sealing.
Step S104, connecting the heat generating device 201 with the sealing member 106, the sealing edge 103 and the phase-change metal heat conducting sheet 102, so that the phase-change metal heat conducting sheet 102 is sealed between the sealing edge 103, the heat dissipating device 101 and the heat generating device 201, and the sealing edge 103 and the phase-change metal heat conducting sheet 102 are sealed between the sealing edge 103, the heat dissipating device 101 and the heat generating device 201.
Because the phase-change metal heat-conducting strip 102 has good heat-conducting property, the heat of the heating device 201 can be better conducted to the heat-radiating device 101 for radiation, and the heat-radiating efficiency is improved. In addition, because the sealing edge 103 is in contact with the heating device 201, the phase-change metal heat conducting sheet 102 is sealed among the sealing edge 103, the heat dissipation device 101 and the heating device 201, and the sealing member 106 is in contact with the heating device 201, so that the sealing edge 103 and the phase-change metal heat conducting sheet 102 are sealed among the sealing edge 103, the heat dissipation device 101 and the heating device 201, the sealing effect on the phase-change metal heat conducting sheet 102 is better, the phase-change metal heat conducting sheet 102 can be effectively prevented from flowing out after being heated into a liquid state, and the use reliability of the electronic device is improved.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (6)
1. A heat dissipation system, comprising:
a heat sink;
the phase-change metal heat conducting sheet is attached to the first surface of the heat dissipation device through an adhesive layer and is used for being in contact with a heating device so as to conduct heat of the heating device to the heat dissipation device;
the heat dissipation device comprises a phase-change metal heat conducting sheet, a heat dissipation device and a sealing edge, wherein the phase-change metal heat conducting sheet is arranged on the first surface of the heat dissipation device; the sealing edge is a heat-resistant elastic room-temperature curing organic silica gel sealing edge;
the heat dissipation device comprises a heat dissipation device and is characterized by further comprising a sealing element, wherein the sealing element is connected with the first surface of the heat dissipation device in a sealing mode and arranged around the periphery of the sealing edge, and the sealing element is used for being in contact with the heat generation device so as to seal the sealing edge and the phase-change metal heat conduction sheet among the sealing edge, the heat dissipation device and the heat generation device; the sealing element is foam;
the heating device is attached with a high-temperature adhesive tape, and the high-temperature adhesive tape is in sealing contact with the sealing piece.
2. The heat dissipating system of claim 1, wherein the heat dissipating device has a groove, the first surface is a bottom surface of the groove, and the phase-change metal heat conducting strip and the sealing edge are disposed in the groove.
3. The heat dissipating system of claim 1, wherein:
the thickness of the adhesive layer is greater than or equal to 0.01 mm and less than or equal to 0.1 mm;
the melting point of the phase-change metal heat conducting sheet is greater than or equal to 54 degrees and less than or equal to 60 degrees;
the heat dissipation device is a copper block; the diameter of the filler-free or filler particles in the heat-resistant elastic room-temperature curing organic silica gel sealing edge is less than 10 micrometers.
4. An electronic device comprising a heat generating device and the heat dissipating system of claim 1, wherein the heat generating device is in contact with the sealing member, the sealing edge, and the phase change metal heat conductive sheet;
the heating device is attached with a high-temperature adhesive tape, and the high-temperature adhesive tape is in sealing contact with the sealing piece.
5. The electronic device of claim 4, wherein the heat generating device is a chip, the chip comprises a base and a protrusion, the protrusion is protruded on the top surface of the base, the high temperature adhesive tape is attached to the top surface of the base and disposed around the protrusion, and the top surface of the protrusion is in contact with the sealing edge and the phase-change metal heat conducting sheet.
6. A method of manufacturing an electronic device, comprising:
attaching the phase-change metal heat-conducting fin to the first surface of the heat dissipation device;
arranging a sealing edge on the first surface of the heat dissipation device, and enabling the sealing edge to be in sealing connection with the first surface of the heat dissipation device and to surround the periphery of the phase-change metal heat conducting sheet;
arranging a sealing element on the first surface of the heat dissipation device, and enabling the sealing element to be in sealing connection with the first surface of the heat dissipation device and to surround the periphery of the sealing edge;
and connecting the heating device with the sealing piece, the sealing edge and the phase-change metal heat conducting sheet so as to seal the phase-change metal heat conducting sheet among the sealing edge, the heat dissipation device and the heating device and seal the sealing edge and the phase-change metal heat conducting sheet among the sealing edge, the heat dissipation device and the heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010207524.3A CN111263575B (en) | 2020-03-23 | 2020-03-23 | Heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010207524.3A CN111263575B (en) | 2020-03-23 | 2020-03-23 | Heat dissipation system |
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| Publication Number | Publication Date |
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| CN111263575A CN111263575A (en) | 2020-06-09 |
| CN111263575B true CN111263575B (en) | 2021-04-16 |
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| CN202010207524.3A Active CN111263575B (en) | 2020-03-23 | 2020-03-23 | Heat dissipation system |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304799A (en) * | 2016-09-29 | 2017-01-04 | 努比亚技术有限公司 | The encapsulating method of a kind of conducting-heat elements and mobile terminal |
| CN206686497U (en) * | 2017-03-14 | 2017-11-28 | 苏州天脉导热科技有限公司 | A kind of heat abstractor based on metal phase change thermal conductivity |
| CN207866075U (en) * | 2018-02-09 | 2018-09-14 | 苏州天脉导热科技股份有限公司 | phase-change metal radiator |
-
2020
- 2020-03-23 CN CN202010207524.3A patent/CN111263575B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106304799A (en) * | 2016-09-29 | 2017-01-04 | 努比亚技术有限公司 | The encapsulating method of a kind of conducting-heat elements and mobile terminal |
| CN206686497U (en) * | 2017-03-14 | 2017-11-28 | 苏州天脉导热科技有限公司 | A kind of heat abstractor based on metal phase change thermal conductivity |
| CN207866075U (en) * | 2018-02-09 | 2018-09-14 | 苏州天脉导热科技股份有限公司 | phase-change metal radiator |
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| CN111263575A (en) | 2020-06-09 |
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