CN111254394B

CN111254394B - Surface metallization diamond composite particle

Info

Publication number: CN111254394B
Application number: CN201811468849.6A
Authority: CN
Inventors: 邱瑜铭; 董书山
Original assignee: Jiangsu Fengtai Tools Co ltd
Current assignee: Jiangsu Fengtai Tools Co ltd
Priority date: 2018-12-03
Filing date: 2018-12-03
Publication date: 2022-03-04
Anticipated expiration: 2038-12-03
Also published as: CN111254394A

Abstract

The invention relates to surface metallization diamond composite particles, and belongs to the technical field of surface coating. The surface-metalized diamond composite particles comprise diamond particle base materials subjected to plasma etching treatment, wherein a Ti alloy layer containing primary TiC is formed on the surface of the diamond particle base materials through a vapor deposition process, and the surface of the Ti alloy layer is coated with a Fe-Cu pre-alloy powder layer. The diamond composite particles of the invention obviously improve the holding property of the diamond-impregnated matrix to the abrasive particles by forming metallurgical bonding and surface metallization, and can greatly improve the effective utilization rate of the diamond particles when being used as a diamond-impregnated tool.

Description

Surface metallization diamond composite particle

Technical Field

The present invention relates to the field of surface coating technology, and more particularly to a surface metallized diamond composite particle for diamond-impregnated tools.

Background

The diamond-impregnated tool is a main type of diamond tool, comprises various drill bits, circular saw blades and the like, and is characterized in that diamond particles are distributed on the surface and inside of a metal or hard alloy matrix. Because the diamond and the metal or the alloy have high interface energy, the surface of the diamond can not be infiltrated by the common metal or the alloy, so that the cutting height of the diamond in the working process is low, the falling rate is high, and the diamond particles do not exert excellent mechanical property and have a premature falling phenomenon. Because the surface of the diamond is hard and smooth and has strong chemical inertness, the bonding agent components are difficult to perform effective wetting and chemical combination action on the diamond, so that the diamond is difficult to be effectively consolidated and held, and the performance of the diamond product is greatly hindered. How to effectively improve the consolidation holding power of the bonding agent to the diamond is a common technical difficulty in the diamond product industry at home and abroad.

The technology of pretreatment and coating of the diamond surface can be traced back to 60 years in the 20 th century at the earliest, six british elements and GE in the united states in 1966 successively develop diamond particle base material products with copper and nickel plated on the surface, the coating technology mainly comprises the processes of chemical plating, electroplating, PVD and the like, although a chemical bonding layer can be formed on the diamond surface through the CVD process and the like, the formed Ti, Cr and the like are easily oxidized, so that the metallurgical bonding capacity of the formed Ti, Cr and the like and a matrix bonding agent are insufficient, the matrix cannot effectively hold the diamond, all the factors influence the effective consolidation of the bonding agent to the diamond, and the utilization rate of the diamond is generally lower than 30%. In view of the above, the prior art also discloses a multi-layer coating patent technology, CN85100286A (university of beijing) discloses a diamond surface metallization technology in 27.8.1986, which is a method of coating a metal carbide film, an alloy layer and an electroplated metal skin layer on the surface of diamond by deposition, electroplating or metallurgical chemical coating, wherein the strength of the diamond sintered body impregnated with the surface metallization is significantly improved. The bonding and mosaic strength of the diamond particle base material by the alloy matrix are obviously improved compared with that of the common untreated diamond, and the technology is not industrially popularized and applied due to higher preparation cost. CN101680076A (six british elements company) discloses on 24.3.2010 a coated diamond coated with a primary carbide layer of carbide forming elements, the primary layer being coated with a secondary layer of a refractory metal selected from W, Mo, Cr, Ni, Ta, Au, Pt, Pd or any combination or alloy thereof; and coating the secondary layer with an overcoat of Ag, Ni, Cu, Au, Pd, Pt, Rh, Os, Ir, Re. However, the diamond impregnated tool contains a large amount of noble metals, so that the cost is too high, and the diamond impregnated tool is difficult to popularize and apply.

Disclosure of Invention

In view of the above-mentioned problems in the prior art, it is an object of the present invention to provide surface-metalized diamond composite particles for diamond-impregnated tools.

In order to achieve the above object, the present invention provides a surface-metalized diamond composite particle.

The surface-metallized diamond composite particles of the present invention are characterized in that: the diamond particle base material is subjected to plasma etching treatment, a Ti alloy layer containing primary TiC is formed on the surface of the diamond particle base material through an evaporation process, and a Fe-Cu pre-alloy powder layer is coated on the surface of the Ti alloy layer.

Wherein the plasma etching adopts Ar and CH₄As an etching gas.

Wherein the particle size of the diamond particle base material is 0.10-0.60 mm.

Wherein the thickness of the Fe-Cu prealloying powder layer is 10-100 mu m.

Wherein the Fe-Cu prealloying powder contains 30-65 wt% of Cu and 10-60 wt% of Fe.

Wherein the Fe-Cu prealloyed powder contains 5.0-25.0 wt% of Co.

Wherein the Fe-Cu prealloying powder contains 0-10% Sn and 0-12 wt% Ni.

Wherein the average grain diameter of the Fe-Cu prealloyed powder is 3-10 mu m.

The invention also relates to a diamond-impregnated tool, which is characterized by adopting abrasive particles containing the surface metalized diamond composite particles.

Compared with the prior art, the surface metallization diamond composite particle has the following beneficial effects:

the diamond composite particles of the invention obviously improve the holding property of the diamond-impregnated matrix to the abrasive particles by forming metallurgical bonding and surface metallization, and can greatly improve the effective utilization rate of the diamond particles when being used as a diamond-impregnated tool.

Drawings

FIG. 1 is a schematic illustration of plasma etching of a diamond surface in accordance with the present invention.

Fig. 2 is a schematic view of the structure of the surface-metalized diamond composite particle in the present invention.

Detailed Description

The surface-metalized diamond composite particles of the present invention will be further described with reference to the following specific examples to provide those skilled in the art with a more complete, accurate and thorough understanding of the inventive concepts and technical solutions of the present invention.

The specification of diamond particles in a commonly used diamond-impregnated tool (a drill bit and a saw blade) is usually 30 meshes to 140 meshes, and the converted particle size is about 0.10 mm to 0.6 mm. Therefore, the particle diameter of the diamond particle base material used in the diamond composite particle of the present invention is 0.10 to 0.60 mm. The diamond particle substrate adopts artificial diamond. Before surface treatment of artificial diamondSubjected to a cleaning process (e.g., an oxidation process and/or an etching process with a chemical solution). In the present invention, the diamond particle base material is subjected to plasma etching treatment before surface treatment. Plasma etching is conducted in a plasma etch reactor, illustratively, a plasma etch reactor as shown in FIG. 1 includes two plate electrodes 10 disposed opposite each other within a vacuum chamber 100, wherein the plate electrodes are powered by an RF power source 20. One of the plate electrodes is provided with an inlet 30 for supplying an etching gas, the other plate electrode is provided with a stage on which a diamond particle substrate to be etched can be set by a carrier plate 50 or the like (in which a vibrator may be provided), and the etching gas is introduced from the inlet 30 and then forms a plasma processing space between the two plate electrodes under the action of a high-frequency electric field applied thereto. Specifically, in the present invention, the RF power source provides energy at a frequency of 13.56MHz and a power of 1.2kw, and the etching gases are Ar and CH₄The pressure is 1.0 to 20Pa, the flow rate of Ar is 50 to 120sccm, CH₄The flow rate of (2) is 5-30 sccm; and after etching, heating at 500-800 ℃ for 3-5 min. By containing CH₄The surface-metallized diamond composite particles exhibit better insert force and higher throw-off height in diamond-impregnated tools.

Firstly, a Ti alloy layer is formed on the surface of a diamond particle substrate subjected to plasma etching by adopting a vacuum evaporation process, the vacuum evaporation process can be carried out in a quartz crucible for example, the diamond particle substrate and titanium alloy powder are mixed and placed in the quartz crucible, the quartz crucible is placed in a vacuum chamber for vacuumizing, then the vacuum chamber is heated to 720-750 ℃ for reaction for 0.5-10 h, the Ti alloy layer can be formed on the surface of the diamond particle substrate, and the characteristic peaks of TiC (111), (200) and (220) surfaces can be observed by an XRD (X-ray diffraction) pattern, and compared with the condition that plasma etching is not carried out or Ar plasma etching is only adopted, the characteristic diffraction peak of TiC in the Ti alloy layer obtained by the vacuum evaporation process is more obvious. The Ti alloy layer contains 5.0-30.0 wt% of a first alloy component, and the first alloy is Cu and/or Ni; preferably, the content of the first alloy component is 7.5-25.0 wt%, and the addition of the first alloy component is favorable for preventing the oxidation of Ti and improving the adhesion with the prealloyed powder layer. The Ti alloy layer may further contain 0 to 10.0 wt% of a second alloy component, the second alloy component being W, Mo, Cr and/or Ag, preferably the second alloy component is contained in an amount of 0 to 5.0 wt%. The second alloy component can further promote the formation of metal carbide, improve the binding force between diamond particles and a matrix, or improve an adhesion layer between the diamond particles and a pre-alloy powder layer. A titanium alloy layer having a thickness of about 0.5 μm was obtained by vacuum deposition for about 1 hour. In the present invention, the Ti alloy layer has a thickness of 0.10 to 3.0 μm, preferably 0.3 to 2.0 μm. When the thickness of the Ti alloy layer is less than 0.10 μm, there is a limit to improvement of the bonding force between the diamond particles and the matrix, and when the thickness of the Ti alloy layer exceeds 3.0 μm, the evaporation time is excessively long, which is economically unacceptable.

And coating the Fe-Cu prealloying powder layer on the surface of the Ti alloy layer through a bonding agent. The Fe-Cu pre-alloy powder layer can be prepared by mixing an alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 0.5-1.0% as a binder with Fe-Cu pre-alloy powder, coating the mixture on the surface of a Ti alloy layer, and drying the mixture, or performing heating treatment at the temperature lower than 200 ℃. Besides polyvinylpyrrolidone, polyacrylic acid ammonium salt, polyvinyl alcohol and the like can be used as the binder, and besides an alcohol solution as a solvent, polyethylene glycol, acetone and the like can be used.

The thickness of the Ti alloy layer and the Fe-Cu prealloying powder layer formed on the surface of the diamond particle substrate through the process is 10-100 mu m, and preferably 15-50 mu m. The diamond tool can realize good metallurgical bonding between the diamond interface and the matrix in the sintering molding of the diamond-impregnated tool (such as a drill bit, a cutter head of a circular saw blade and the like), greatly improve the effective holding capacity of the tool matrix to the diamond and improve the comprehensive efficiency of the diamond tool. In the invention, the Fe-Cu prealloyed powder contains 30-65 wt% of Cu and 10-60 wt% of Fe. When the diamond impregnated tool is applied to high-temperature occasions, such as occasions needing to cut or drill medium-hardness or high-hardness rocks or refractory materials, the holding force of the matrix to the diamond can be further improved by adding 5.0-25.0 wt% of Co, and the stability of the diamond impregnated tool is improved. For thin-wall drill or circular saw blade head applications, the Fe-Cu prealloyed powder may contain 0-10% Sn, 0-12 wt% Ni.

Fig. 2 is a schematic structural view of the surface-metalized diamond composite particle of the present invention, which is composed of a diamond particle substrate 1, a Ti alloy layer 2 grown on the surface of the diamond particle substrate 1, and a Fe-Cu pre-alloy powder layer coated on the surface of the Ti alloy layer 2.

Example 1

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, roughening, and washing with water to neutrality), introducing Ar and CH into the plasma etching reaction chamber₄Performing plasma etching under the pressure of 10Pa, Ar flow rate of 60sccm, and CH₄The flow rate of (2) is 12 sccm; heating at 700 deg.C for 5min after etching; then, Ti alloy powder (28 wt% of Cu, 72 wt% of Ti) with an average particle size of 10 μm was mixed with the diamond particle substrate after the plasma etching treatment and placed in a quartz crucible, and placed in a vacuum chamber to be evacuated, and then heated to 750 ℃ to react for 1 hour, a Ti-Cu alloy layer with a thickness of about 0.5 μm was deposited on the surface of the diamond particle substrate, and the Ti-Cu alloy layer was found to contain primary TiC by XRD analysis. 65% Cu-25% Fe-10% Co was selected as the prealloyed powder with an oxygen content of < 2000ppm and an average particle size of about 5 μm. Mixing the pre-alloyed powder with alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 1% according to the weight ratio of 10: 1, uniformly coating the mixed pre-alloyed powder on the surface of the diamond particle substrate deposited with the Ti-Cu alloy layer in coating equipment, naturally drying, and heating at 150 ℃ for 1 hour to obtain a pre-alloyed powder layer with the thickness of 50 mu m. The surface-metallized diamond composite particles of the present example were thus prepared.

Example 2

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, roughening, and washing with water to neutrality), introducing Ar and CH into the plasma etching reaction chamber₄Performing plasma etching under the pressure of 10Pa, Ar flow rate of 60sccm, and CH₄The flow rate of (2) is 12 sccm; heating at 700 deg.C for 5min after etching; then, Ti alloy powder (10 wt% of Cu, 90 wt% of Ti) with an average particle size of 10 μm was mixed with the diamond particle substrate after the plasma etching treatment and placed in a quartz crucible, and placed in a vacuum chamber to be evacuated, and then heated to 750 ℃ to react for 1 hour, a Ti-Cu alloy layer with a thickness of about 0.5 μm was deposited on the surface of the diamond particle substrate, and the Ti-Cu alloy layer was found to contain primary TiC by XRD analysis. 30% Cu-50% Fe-20% Co was chosen as the prealloyed powder, with a powder oxygen content < 2000ppm and an average particle size of about 5 μm. Mixing the pre-alloyed powder with alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 1% according to the weight ratio of 10: 1, uniformly coating the mixed pre-alloyed powder on the surface of the diamond particle substrate deposited with the Ti-Cu alloy layer in coating equipment, naturally drying, and heating at 150 ℃ for 1 hour to obtain a pre-alloyed powder layer with the thickness of 50 mu m. The surface-metallized diamond composite particles of the present example were thus prepared.

Example 3

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, roughening, and washing with water to neutrality), introducing Ar and CH into the plasma etching reaction chamber₄Performing plasma etching under the pressure of 10Pa, Ar flow rate of 100sccm, and CH₄The flow rate of (2) is 20 sccm; heating at 750 deg.C for 5min after etching; then will beTi alloy powder (25 wt% of Ni and 75 wt% of Ti) with an average particle size of 10 μm is mixed with the diamond particle substrate after the plasma etching treatment and placed in a quartz crucible, and placed in a vacuum chamber to be vacuumized, and then heated to 750 ℃ to react for 1 hour, a Ti-Ni alloy layer with a thickness of about 0.5 μm is deposited on the surface of the diamond particle substrate, and the Ti-Ni alloy layer is analyzed by XRD and contains primary TiC. 65% Cu-25% Fe-10% Co was selected as the prealloyed powder with an oxygen content of < 2000ppm and an average particle size of about 5 μm. Mixing the pre-alloyed powder with alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 1% according to the weight ratio of 10: 1, uniformly coating the mixed pre-alloyed powder on the surface of the diamond particle substrate deposited with the Ti-Ni alloy layer in coating equipment, naturally drying, and heating at 150 ℃ for 1 hour to obtain a pre-alloyed powder layer with the thickness of 50 mu m. The surface-metallized diamond composite particles of the present example were thus prepared.

Example 4

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, roughening, and washing with water to neutrality), introducing Ar and CH into the plasma etching reaction chamber₄Performing plasma etching under the pressure of 10Pa, Ar flow rate of 100sccm, and CH₄The flow rate of (2) is 20 sccm; heating at 750 deg.C for 5min after etching; then, Ti alloy powder (15 wt% Ni, 85 wt% Ti) with an average particle size of 10 μm was mixed with the diamond particle substrate after the plasma etching treatment and placed in a quartz crucible, and placed in a vacuum chamber to be evacuated, and then heated to 750 ℃ to react for 1 hour, a Ti-Ni alloy layer with a thickness of about 0.5 μm was deposited on the surface of the diamond particle substrate, and the Ti-Ni alloy layer was found to contain primary TiC by XRD analysis. 30% Cu-50% Fe-20% Co was chosen as the prealloyed powder, with a powder oxygen content < 2000ppm and an average particle size of about 5 μm. Mixing the prealloyed powder with 1% alcohol solution of polyvinylpyrrolidone K90 by massMixing in a weight ratio of 10: 1, uniformly coating the mixed pre-alloyed powder on the surface of the diamond particle substrate deposited with the Ti-Ni alloy layer in a coating device, naturally drying, and heating at 150 ℃ for 1 hour to obtain a pre-alloyed powder layer with the thickness of 50 mu m. The surface-metallized diamond composite particles of the present example were thus prepared.

Comparative example 1

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, performing coarsening treatment, and washing to be neutral) for later use; ti alloy powder (28 wt% of Cu and 72 wt% of Ti) with the average grain diameter of 10 mu m is mixed with the diamond particle base material after the cleaning and coarsening treatment, the mixture is placed in a quartz crucible, and is placed in a vacuum chamber for vacuumizing, then the mixture is heated to 750 ℃ for reaction for 1 hour, a Ti-Cu alloy layer with the thickness of about 0.5 mu m is deposited on the surface of the diamond particle base material, and the Ti-Cu alloy layer contains primary TiC through XRD analysis. 65% Cu-25% Fe-10% Co was selected as the prealloyed powder with an oxygen content of < 2000ppm and an average particle size of about 5 μm. Mixing the pre-alloyed powder with alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 1% according to the weight ratio of 10: 1, uniformly coating the mixed pre-alloyed powder on the surface of the diamond particle substrate deposited with the Ti-Cu alloy layer in coating equipment, naturally drying, and heating at 150 ℃ for 1 hour to obtain a pre-alloyed powder layer with the thickness of 50 mu m. Thereby producing surface-metallized diamond composite particles.

Comparative example 2

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, roughening, and washing with water to neutrality), introducing Ar into the plasma etching reaction chamber for plasma etching, wherein the pressure of the etching gas is 12Pa, and the flow rate of Ar is 80 sccm; after etching, heat treatment is carried out at 700 ℃ in the presence of a catalystThe time is 5 min; then, Ti alloy powder (10 wt% of Cu, 90 wt% of Ti) with an average particle size of 10 μm was mixed with the diamond particle substrate after the plasma etching treatment and placed in a quartz crucible, and placed in a vacuum chamber to be evacuated, and then heated to 750 ℃ to react for 1 hour, a Ti-Cu alloy layer with a thickness of about 0.5 μm was deposited on the surface of the diamond particle substrate, and the Ti-Cu alloy layer was found to contain primary TiC by XRD analysis. 30% Cu-50% Fe-20% Co was chosen as the prealloyed powder, with a powder oxygen content < 2000ppm and an average particle size of about 5 μm. Mixing the pre-alloyed powder with alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 1% according to the weight ratio of 10: 1, uniformly coating the mixed pre-alloyed powder on the surface of the diamond particle substrate deposited with the Ti-Cu alloy layer in coating equipment, naturally drying, and heating at 150 ℃ for 1 hour to obtain a pre-alloyed powder layer with the thickness of 50 mu m. Thereby producing surface-metallized diamond composite particles.

Comparative example 3

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, roughening, and washing with water to neutrality), introducing Ar and CH into the plasma etching reaction chamber₄Performing plasma etching under the pressure of 10Pa, Ar flow rate of 100sccm, and CH₄The flow rate of (2) is 20 sccm; heating at 750 deg.C for 5min after etching; then, Ti powder with the average grain diameter of 10 μm is mixed with the diamond particle base material after the plasma etching treatment, the mixture is placed in a quartz crucible, the quartz crucible is placed in a vacuum chamber for vacuumizing, the vacuum chamber is heated to 750 ℃ for reaction for 1 hour, a Ti film with the thickness of about 0.5 μm is deposited on the surface of the diamond particle base material, and the Ti film contains primary TiC through XRD analysis. 65% Cu-25% Fe-10% Co was selected as the prealloyed powder with an oxygen content of < 2000ppm and an average particle size of about 5 μm. Mixing the prealloyed powder with alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 1% according to the weight ratio of 10: 1, and depositing in a coating deviceThe surface of the diamond particle substrate with the Ti film is uniformly coated with the mixed pre-alloyed powder, then the pre-alloyed powder is naturally dried and is heated and treated for 1 hour at 150 ℃ to obtain a pre-alloyed powder layer with the thickness of 50 mu m. Thereby producing surface-metallized diamond composite particles.

Comparative example 4

Starting with a diamond particle substrate of 40/45 mesh strength D60 as the starting particles, cleaning and roughening (5 wt% NaOH, ultrasonic cleaning and then water washing; 3 wt% HCl cleaning and then water washing to neutrality; 10 wt% HNO₃Boiling for 10min, roughening, and washing with water to neutrality), introducing Ar and CH into the plasma etching reaction chamber₄Performing plasma etching under the pressure of 10Pa, Ar flow rate of 100sccm, and CH₄The flow rate of (2) is 20 sccm; heating at 750 deg.C for 5min after etching; then, Ti powder with the average grain diameter of 10 microns is mixed with the diamond particle base material after the plasma etching treatment, the mixture is placed in a quartz crucible, the quartz crucible is placed in a vacuum chamber for vacuumizing, the vacuum chamber is heated to 750 ℃ for reaction for 1 hour, a Ti film with the thickness of about 0.5 microns is deposited on the surface of the diamond particle base material, and the Ti film contains primary TiC through XRD analysis. 30% Cu-50% Fe-20% Co was chosen as the prealloyed powder, with a powder oxygen content < 2000ppm and an average particle size of about 5 μm. Mixing the pre-alloyed powder with alcohol solution of polyvinylpyrrolidone K90 with the mass concentration of 1% according to the weight ratio of 10: 1, uniformly coating the mixed pre-alloyed powder on the surface of the diamond particle substrate deposited with the Ti film in coating equipment, naturally drying, and heating at 150 ℃ for 1 hour to obtain a pre-alloyed powder layer with the thickness of 50 mu m. The surface-metallized diamond composite particles of the present example were thus prepared.

The impregnated engineering drill bit is prepared by adopting the surface metallized diamond composite particles prepared in the above examples and comparative examples, the matrix formula is that WC is used as a framework, Cu-based alloy is used as a binder (the HRC hardness after sintering is 30-35), the addition amount of the surface metallized diamond composite particles is 2.0 wt% of the matrix weight, the prepared drill bit is used for carrying out drilling experiment on granite (the rotating speed is 1000r/min, the drilling pressure is 2500N), the edge appearance of the diamond particles on the grinding surface is detected by adopting a microscope quasi-focusing method after 10 minutes, the average value of the diamond particles with the edge height larger than 110 mu m and the proportion of the diamond particles occupying the whole edge are counted, and the result is shown in table 1.

TABLE 1

It should be understood by those skilled in the art that the embodiments are merely exemplary for describing the present invention, and the specific implementation of the present invention is not limited to the exemplary embodiments, and the present invention is within the protection scope of the present invention as long as various insubstantial modifications are made to the technical idea and technical solution of the present invention, which are included in the claims of the present invention, or the technical idea and technical solution of the present invention are directly applied to other occasions without being modified.

Claims

1. A surface-metalized diamond composite particle, comprising: the diamond particle base material is subjected to plasma etching treatment, a Ti alloy layer containing primary TiC is formed on the surface of the diamond particle base material through a vapor deposition process, and a Fe-Cu pre-alloy powder layer is coated on the surface of the Ti alloy layer; the plasma etching adopts Ar and CH₄As an etching gas.

2. The surface-metalized diamond composite particle of claim 1, wherein: the particle size of the diamond particle base material is 0.10-0.60 mm.

3. The surface-metalized diamond composite particle of claim 1, wherein: the Ti alloy layer contains 5.0-30.0 wt% of a first alloy component and 0-10.0 wt% of a second alloy component; wherein the first alloy is Cu and/or Ni, and the second alloy component is W, Mo, Cr and/or Ag.

4. The surface-metalized diamond composite particle of claim 1, wherein: the thickness of the Ti alloy layer is 0.10-3.0 μm.

5. The surface-metalized diamond composite particle of claim 1, wherein: the thickness of the Fe-Cu pre-alloy powder layer is 10-100 mu m.

6. The surface-metalized diamond composite particle of claim 1, wherein: the Fe-Cu prealloyed powder contains 30-65 wt% of Cu and 10-60 wt% of Fe.

7. The surface-metalized diamond composite particle of claim 1, wherein: the Fe-Cu prealloying powder contains 5.0-25.0 wt% of Co, 0-10 wt% of Sn and 0-12 wt% of Ni.

8. The surface-metalized diamond composite particle of claim 1, wherein: the average grain diameter of the Fe-Cu prealloyed powder is 3-10 mu m.